JP6623988B2 - 容器収納設備 - Google Patents
容器収納設備 Download PDFInfo
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- JP6623988B2 JP6623988B2 JP2016176984A JP2016176984A JP6623988B2 JP 6623988 B2 JP6623988 B2 JP 6623988B2 JP 2016176984 A JP2016176984 A JP 2016176984A JP 2016176984 A JP2016176984 A JP 2016176984A JP 6623988 B2 JP6623988 B2 JP 6623988B2
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- 238000003860 storage Methods 0.000 title claims description 160
- 239000012530 fluid Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 119
- 238000010926 purge Methods 0.000 description 31
- 230000032258 transport Effects 0.000 description 20
- 239000000428 dust Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 238000000746 purification Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01B—MACHINES OR ENGINES, IN GENERAL OR OF POSITIVE-DISPLACEMENT TYPE, e.g. STEAM ENGINES
- F01B25/00—Regulating, controlling, or safety means
- F01B25/02—Regulating or controlling by varying working-fluid admission or exhaust, e.g. by varying pressure or quantity
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
- F01D11/00—Preventing or minimising internal leakage of working-fluid, e.g. between stages
Description
複数の前記収納部のそれぞれにおいて、収納されたそれぞれの前記容器に接続されて当該容器に前記浄化気体を吐出する吐出部と、
前記浄化気体の供給流量を制御する気体供給装置と、
前記気体供給装置に接続されて、前記気体供給装置から出力される前記浄化気体が通流する主配管と、
前記主配管から分岐して、それぞれの前記吐出部と接続される分岐配管と、を備え、
前記吐出部は、前記収納部に前記容器が収納されているか否かに拘わらず、前記浄化気体を吐出し、
前記気体供給装置は、複数の前記収納部における前記容器の収納状態の情報を取得し、前記収納部に収納されている前記容器の総数が少ないほど多くなるように、前記浄化気体の前記供給流量を前記収納部に収納されている前記容器の総数に応じて制御する。
FL = (N/n)・Fa+Fb
となるように、前記供給流量を制御すると好適である。
以下、その他の実施形態について説明する。尚、以下に説明する各実施形態の構成は、それぞれ単独で適用されるものに限られず、矛盾が生じない限り、他の実施形態の構成と組み合わせて適用することも可能である。
2 :吐出部
3 :気体供給装置
4 :主配管
5 :分岐配管
7 :給気口
31 :マスフローコントローラ(気体供給装置)
33 :パージコントローラ(気体供給装置)
51 :塵埃フィルタ(流体抵抗体)
55 :オリフィス(流体抵抗体)
100 :容器収納設備
101 :収納部
101B :第2収納部(収納部)
W :容器
Z :鉛直方向
Claims (4)
- 容器を収納する複数の収納部を有し、前記収納部のそれぞれにおいて、収納された前記容器の内部に浄化気体を供給する容器収納設備であって、
複数の前記収納部のそれぞれにおいて、収納されたそれぞれの前記容器に接続されて当該容器に前記浄化気体を吐出する吐出部と、
前記浄化気体の供給流量を制御する気体供給装置と、
前記気体供給装置に接続されて、前記気体供給装置から出力される前記浄化気体が通流する主配管と、
前記主配管から分岐して、それぞれの前記吐出部と接続される分岐配管と、を備え、
前記吐出部は、前記収納部に前記容器が収納されているか否かに拘わらず、前記浄化気体を吐出し、
前記気体供給装置は、複数の前記収納部における前記容器の収納状態の情報を取得し、前記収納部に収納されている前記容器の総数が少ないほど多くなるように、前記浄化気体の前記供給流量を前記収納部に収納されている前記容器の総数に応じて制御する、容器収納設備。 - 前記分岐配管を介して前記主配管に接続される前記吐出部の総数をNとし、
前記収納部に収納されている前記容器の総数をnとし、
前記気体供給装置から出力される前記浄化気体の基準流量をFaとし、
前記気体供給装置から出力される前記浄化気体のオフセット値を示すオフセット流量をFbとし、
前記気体供給装置から出力される前記浄化気体の前記供給流量をFLとして、
前記気体供給装置は、
FL = (N/n)・Fa+Fbとなるように、前記供給流量を制御する、請求項1に記載の容器収納設備。 - 前記吐出部は、前記容器の給気口に接続され、
前記分岐配管のそれぞれには、前記給気口から前記容器へ前記浄化気体を流入させる際の抵抗成分である流入抵抗よりも大きい抵抗値を有する流体抵抗体が設けられている、請求項1又は2に記載の容器収納設備。 - 複数の前記収納部は、鉛直方向に沿った方向に見て重複するように、鉛直方向に並べて配置され、前記気体供給装置は、鉛直方向に沿った方向に見て前記収納部と重複せず、鉛直方向において前記収納部よりも下方に配置されている、請求項1から3の何れか一項に記載の容器収納設備。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016176984A JP6623988B2 (ja) | 2016-09-09 | 2016-09-09 | 容器収納設備 |
TW106127787A TWI713779B (zh) | 2016-09-09 | 2017-08-16 | 容器收納設備 |
US15/697,834 US10354897B2 (en) | 2016-09-09 | 2017-09-07 | Container storage facility |
CN201710806832.6A CN107808844B (zh) | 2016-09-09 | 2017-09-08 | 容器容纳设备 |
KR1020170115002A KR102346977B1 (ko) | 2016-09-09 | 2017-09-08 | 용기 수납 설비 |
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JP2016176984A JP6623988B2 (ja) | 2016-09-09 | 2016-09-09 | 容器収納設備 |
Publications (2)
Publication Number | Publication Date |
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JP2018041926A JP2018041926A (ja) | 2018-03-15 |
JP6623988B2 true JP6623988B2 (ja) | 2019-12-25 |
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Country Status (5)
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US (1) | US10354897B2 (ja) |
JP (1) | JP6623988B2 (ja) |
KR (1) | KR102346977B1 (ja) |
CN (1) | CN107808844B (ja) |
TW (1) | TWI713779B (ja) |
Families Citing this family (5)
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CN106415812B (zh) * | 2014-06-16 | 2019-01-11 | 村田机械株式会社 | 清洗装置、清洗系统、清洗方法以及清洗系统中的控制方法 |
JP6414525B2 (ja) * | 2015-09-02 | 2018-10-31 | 株式会社ダイフク | 保管設備 |
US10583983B2 (en) * | 2016-03-31 | 2020-03-10 | Daifuku Co., Ltd. | Container storage facility |
US10703563B2 (en) * | 2017-11-10 | 2020-07-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker |
KR102080015B1 (ko) * | 2018-07-16 | 2020-02-21 | 주식회사 에이케이테크 | 사이드 스토리지의 웨이퍼 수용 카세트용 가스 분지 유로 구조 |
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FR2791809B1 (fr) * | 1999-04-01 | 2001-06-15 | Air Liquide | Procede et dispositif de traitement d'articles stockes dans des conteneurs et appareil de stockage dote d'un tel dispositif |
JP5236518B2 (ja) * | 2009-02-03 | 2013-07-17 | 株式会社ダン・タクマ | 保管システムおよび保管方法 |
JP5598728B2 (ja) * | 2011-12-22 | 2014-10-01 | 株式会社ダイフク | 不活性ガス注入装置 |
JP5527624B2 (ja) * | 2012-01-05 | 2014-06-18 | 株式会社ダイフク | 保管棚用の不活性ガス注入装置 |
JP5598734B2 (ja) * | 2012-01-06 | 2014-10-01 | 株式会社ダイフク | 物品保管設備 |
JP5888287B2 (ja) * | 2013-06-26 | 2016-03-16 | 株式会社ダイフク | 処理設備 |
CN105593141B (zh) * | 2013-09-30 | 2017-06-23 | 村田机械株式会社 | 保管库 |
US10239101B2 (en) * | 2014-01-29 | 2019-03-26 | Murata Machinery, Ltd. | Purge device and method of diffusing gas including purge gas |
CN105917458B (zh) * | 2014-04-28 | 2019-04-23 | 村田机械株式会社 | 净化装置以及净化方法 |
KR101865091B1 (ko) * | 2014-06-16 | 2018-06-07 | 무라다기카이가부시끼가이샤 | 퍼지 스토커 및 퍼지 방법 |
CN106415812B (zh) | 2014-06-16 | 2019-01-11 | 村田机械株式会社 | 清洗装置、清洗系统、清洗方法以及清洗系统中的控制方法 |
WO2016013536A1 (ja) * | 2014-07-25 | 2016-01-28 | 信越ポリマー株式会社 | 基板収納容器 |
WO2016129170A1 (ja) * | 2015-02-12 | 2016-08-18 | 村田機械株式会社 | パージ装置、パージストッカ、及びパージ異常検出方法 |
WO2017022330A1 (ja) * | 2015-08-04 | 2017-02-09 | 村田機械株式会社 | パージ装置、パージストッカ、及びパージガスの供給方法 |
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2016
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2017
- 2017-08-16 TW TW106127787A patent/TWI713779B/zh active
- 2017-09-07 US US15/697,834 patent/US10354897B2/en active Active
- 2017-09-08 CN CN201710806832.6A patent/CN107808844B/zh active Active
- 2017-09-08 KR KR1020170115002A patent/KR102346977B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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CN107808844B (zh) | 2023-06-06 |
TW201812962A (zh) | 2018-04-01 |
US20180076055A1 (en) | 2018-03-15 |
CN107808844A (zh) | 2018-03-16 |
JP2018041926A (ja) | 2018-03-15 |
US10354897B2 (en) | 2019-07-16 |
TWI713779B (zh) | 2020-12-21 |
KR20180028971A (ko) | 2018-03-19 |
KR102346977B1 (ko) | 2022-01-03 |
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