TWI899334B - 放射線圖像攝影裝置的製造方法及搬運治具 - Google Patents

放射線圖像攝影裝置的製造方法及搬運治具

Info

Publication number
TWI899334B
TWI899334B TW110135307A TW110135307A TWI899334B TW I899334 B TWI899334 B TW I899334B TW 110135307 A TW110135307 A TW 110135307A TW 110135307 A TW110135307 A TW 110135307A TW I899334 B TWI899334 B TW I899334B
Authority
TW
Taiwan
Prior art keywords
substrate
transport jig
imaging device
manufacturing
radiation imaging
Prior art date
Application number
TW110135307A
Other languages
English (en)
Chinese (zh)
Other versions
TW202212863A (zh
Inventor
牛倉信一
藤原久男
谷本達教
赤松圭一
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202212863A publication Critical patent/TW202212863A/zh
Application granted granted Critical
Publication of TWI899334B publication Critical patent/TWI899334B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/139—Manufacture or treatment of devices covered by this subclass using temporary substrates
    • H10F71/1395—Manufacture or treatment of devices covered by this subclass using temporary substrates for thin-film devices

Landscapes

  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
TW110135307A 2020-09-25 2021-09-23 放射線圖像攝影裝置的製造方法及搬運治具 TWI899334B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-161416 2020-09-25
JP2020161416A JP7261777B2 (ja) 2020-09-25 2020-09-25 放射線画像撮影装置の製造方法及び搬送治具

Publications (2)

Publication Number Publication Date
TW202212863A TW202212863A (zh) 2022-04-01
TWI899334B true TWI899334B (zh) 2025-10-01

Family

ID=80821480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110135307A TWI899334B (zh) 2020-09-25 2021-09-23 放射線圖像攝影裝置的製造方法及搬運治具

Country Status (3)

Country Link
US (1) US12027564B2 (https=)
JP (1) JP7261777B2 (https=)
TW (1) TWI899334B (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160172414A1 (en) * 2013-09-26 2016-06-16 Canon Kabushiki Kaisha Radiation imaging apparatus, method of manufacturing the same, and radiation inspection apparatus
US20180313962A1 (en) * 2017-03-22 2018-11-01 Fujifilm Corporation Radiation detector and radiographic imaging apparatus
TW202032160A (zh) * 2018-11-22 2020-09-01 日商富士軟片股份有限公司 放射線檢測器、放射線圖像攝影裝置及製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295713B2 (ja) * 2004-11-30 2009-07-15 芝浦メカトロニクス株式会社 表示装置の組み立て装置及び表示装置の組み立て方法
TWI833894B (zh) * 2019-02-08 2024-03-01 日商富士軟片股份有限公司 放射線檢測器的製造方法及放射線圖像攝影裝置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160172414A1 (en) * 2013-09-26 2016-06-16 Canon Kabushiki Kaisha Radiation imaging apparatus, method of manufacturing the same, and radiation inspection apparatus
US20180313962A1 (en) * 2017-03-22 2018-11-01 Fujifilm Corporation Radiation detector and radiographic imaging apparatus
TW202032160A (zh) * 2018-11-22 2020-09-01 日商富士軟片股份有限公司 放射線檢測器、放射線圖像攝影裝置及製造方法

Also Published As

Publication number Publication date
TW202212863A (zh) 2022-04-01
JP7261777B2 (ja) 2023-04-20
US12027564B2 (en) 2024-07-02
US20220102399A1 (en) 2022-03-31
JP2022054302A (ja) 2022-04-06

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