TWI898450B - 陶瓷、探針引導零件、探針卡及封裝檢查用插座 - Google Patents
陶瓷、探針引導零件、探針卡及封裝檢查用插座Info
- Publication number
- TWI898450B TWI898450B TW113107010A TW113107010A TWI898450B TW I898450 B TWI898450 B TW I898450B TW 113107010 A TW113107010 A TW 113107010A TW 113107010 A TW113107010 A TW 113107010A TW I898450 B TWI898450 B TW I898450B
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- Prior art keywords
- ceramic
- mass
- expressed
- probe
- content
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/486—Fine ceramics
- C04B35/488—Composites
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
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- C04B35/6455—Hot isostatic pressing
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- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
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- G—PHYSICS
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
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- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023031963 | 2023-03-02 | ||
| JP2023-031963 | 2023-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202442611A TW202442611A (zh) | 2024-11-01 |
| TWI898450B true TWI898450B (zh) | 2025-09-21 |
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ID=92589826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113107010A TWI898450B (zh) | 2023-03-02 | 2024-02-27 | 陶瓷、探針引導零件、探針卡及封裝檢查用插座 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4656616A1 (https=) |
| JP (1) | JPWO2024181459A1 (https=) |
| KR (1) | KR20250152077A (https=) |
| CN (1) | CN120826382A (https=) |
| TW (1) | TWI898450B (https=) |
| WO (1) | WO2024181459A1 (https=) |
Citations (3)
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| TW201841865A (zh) * | 2017-03-30 | 2018-12-01 | 日本商出光興產股份有限公司 | 石榴石化合物、氧化物燒結體、氧化物半導體薄膜、薄膜電晶體、電子機器、及影像感測器 |
| CN110382440A (zh) * | 2016-11-07 | 2019-10-25 | 科罗拉多大学董事会 | 改进技术级陶瓷的性能 |
| TW202212290A (zh) * | 2020-04-10 | 2022-04-01 | 日商飛羅得材料科技股份有限公司 | 陶瓷、探針導引零件、探針卡及封裝體檢查用插座 |
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| JPS59157558A (ja) * | 1983-02-26 | 1984-09-06 | Nisshin Steel Co Ltd | 酸素ブロ−ブ用固体電解質 |
| JPH0440351A (ja) * | 1990-06-05 | 1992-02-10 | Nitsukatoo:Kk | 溶融材料中の酸素量測定センサ用固体電解質 |
| FR2777882B1 (fr) * | 1998-04-22 | 2000-07-21 | Produits Refractaires | Nouveaux materiaux frittes produits a partir de zircon et de zircone |
| JP4089261B2 (ja) * | 2002-03-27 | 2008-05-28 | 住友金属工業株式会社 | 快削性セラミックスとその製造方法およびプローブ案内部品 |
| JP4400360B2 (ja) * | 2003-09-25 | 2010-01-20 | 株式会社フェローテックセラミックス | 快削性セラミックスとその製造方法およびプローブ案内部品 |
| JP4776439B2 (ja) * | 2005-11-28 | 2011-09-21 | 京セラ株式会社 | ジルコニア焼結体 |
| EP3689838A4 (en) * | 2017-11-10 | 2021-06-23 | Ferrotec Material Technologies Corporation | CERAMICS, PROBE GUIDE COMPONENTS, PROBE CARD AND PACKAGING TEST SOCKET |
| NL2019905B1 (en) | 2017-11-14 | 2019-05-20 | Mat | Systems and methods for segmenting images |
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| CN110382440A (zh) * | 2016-11-07 | 2019-10-25 | 科罗拉多大学董事会 | 改进技术级陶瓷的性能 |
| TW201841865A (zh) * | 2017-03-30 | 2018-12-01 | 日本商出光興產股份有限公司 | 石榴石化合物、氧化物燒結體、氧化物半導體薄膜、薄膜電晶體、電子機器、及影像感測器 |
| TW202212290A (zh) * | 2020-04-10 | 2022-04-01 | 日商飛羅得材料科技股份有限公司 | 陶瓷、探針導引零件、探針卡及封裝體檢查用插座 |
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| CN120826382A (zh) | 2025-10-21 |
| KR20250152077A (ko) | 2025-10-22 |
| JPWO2024181459A1 (https=) | 2024-09-06 |
| TW202442611A (zh) | 2024-11-01 |
| EP4656616A1 (en) | 2025-12-03 |
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