TWI892578B - 使用半導體元件的記憶裝置 - Google Patents
使用半導體元件的記憶裝置Info
- Publication number
- TWI892578B TWI892578B TW113113400A TW113113400A TWI892578B TW I892578 B TWI892578 B TW I892578B TW 113113400 A TW113113400 A TW 113113400A TW 113113400 A TW113113400 A TW 113113400A TW I892578 B TWI892578 B TW I892578B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- semiconductor region
- conductive layer
- region
- gate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/20—DRAM devices comprising floating-body transistors, e.g. floating-body cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4096—Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Databases & Information Systems (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| WOPCT/JP2023/014698 | 2023-04-11 | ||
| PCT/JP2023/014698 WO2024214180A1 (ja) | 2023-04-11 | 2023-04-11 | 半導体素子を用いたメモリ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202450432A TW202450432A (zh) | 2024-12-16 |
| TWI892578B true TWI892578B (zh) | 2025-08-01 |
Family
ID=93016351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113113400A TWI892578B (zh) | 2023-04-11 | 2024-04-10 | 使用半導體元件的記憶裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12588186B2 (https=) |
| JP (1) | JPWO2024214180A1 (https=) |
| KR (1) | KR20250162811A (https=) |
| TW (1) | TWI892578B (https=) |
| WO (1) | WO2024214180A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060192249A1 (en) * | 2004-09-20 | 2006-08-31 | Samsung Electronics Co., Ltd. | Field effect transistors with vertically oriented gate electrodes and methods for fabricating the same |
| TW202310410A (zh) * | 2021-08-30 | 2023-03-01 | 南韓商三星電子股份有限公司 | 半導體裝置 |
| WO2023032193A1 (ja) * | 2021-09-06 | 2023-03-09 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体素子を用いたメモリ装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2703970B2 (ja) | 1989-01-17 | 1998-01-26 | 株式会社東芝 | Mos型半導体装置 |
| JP3808763B2 (ja) | 2001-12-14 | 2006-08-16 | 株式会社東芝 | 半導体メモリ装置およびその製造方法 |
| DE102006016550B4 (de) * | 2005-04-09 | 2010-04-29 | Samsung Electronics Co., Ltd., Suwon-si | Feldeffekttransistoren mit vertikal ausgerichteten Gate-Elektroden und Verfahren zum Herstellen derselben |
| JP5078338B2 (ja) * | 2006-12-12 | 2012-11-21 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
| US7919800B2 (en) * | 2007-02-26 | 2011-04-05 | Micron Technology, Inc. | Capacitor-less memory cells and cell arrays |
| KR102529073B1 (ko) * | 2015-04-29 | 2023-05-08 | 제노 세미컨덕터, 인크. | 백바이어스를 이용한 드레인 전류가 향상된 트랜지스터 및 메모리 셀 |
| WO2023148799A1 (ja) * | 2022-02-01 | 2023-08-10 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体素子を用いたメモリ装置 |
-
2023
- 2023-04-11 WO PCT/JP2023/014698 patent/WO2024214180A1/ja not_active Ceased
- 2023-04-11 JP JP2025513541A patent/JPWO2024214180A1/ja active Pending
- 2023-04-11 KR KR1020257032939A patent/KR20250162811A/ko active Pending
-
2024
- 2024-04-02 US US18/624,515 patent/US12588186B2/en active Active
- 2024-04-10 TW TW113113400A patent/TWI892578B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060192249A1 (en) * | 2004-09-20 | 2006-08-31 | Samsung Electronics Co., Ltd. | Field effect transistors with vertically oriented gate electrodes and methods for fabricating the same |
| TW202310410A (zh) * | 2021-08-30 | 2023-03-01 | 南韓商三星電子股份有限公司 | 半導體裝置 |
| WO2023032193A1 (ja) * | 2021-09-06 | 2023-03-09 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体素子を用いたメモリ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024214180A1 (https=) | 2024-10-17 |
| TW202450432A (zh) | 2024-12-16 |
| US20240349482A1 (en) | 2024-10-17 |
| KR20250162811A (ko) | 2025-11-19 |
| WO2024214180A1 (ja) | 2024-10-17 |
| US12588186B2 (en) | 2026-03-24 |
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