TWI884253B - 雙液加成硬化型矽酮膠組成物 - Google Patents

雙液加成硬化型矽酮膠組成物 Download PDF

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Publication number
TWI884253B
TWI884253B TW110113376A TW110113376A TWI884253B TW I884253 B TWI884253 B TW I884253B TW 110113376 A TW110113376 A TW 110113376A TW 110113376 A TW110113376 A TW 110113376A TW I884253 B TWI884253 B TW I884253B
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TW
Taiwan
Prior art keywords
component
composition
curing
parts
alkenyl
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TW110113376A
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English (en)
Chinese (zh)
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TW202212478A (zh
Inventor
原立榮
加藤野步
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日商信越化學工業股份有限公司
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Publication of TW202212478A publication Critical patent/TW202212478A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW110113376A 2020-05-26 2021-04-14 雙液加成硬化型矽酮膠組成物 TWI884253B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020091225A JP7627549B2 (ja) 2020-05-26 2020-05-26 二液付加硬化型シリコーンゴム組成物
JP2020-091225 2020-05-26

Publications (2)

Publication Number Publication Date
TW202212478A TW202212478A (zh) 2022-04-01
TWI884253B true TWI884253B (zh) 2025-05-21

Family

ID=78744360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110113376A TWI884253B (zh) 2020-05-26 2021-04-14 雙液加成硬化型矽酮膠組成物

Country Status (7)

Country Link
US (1) US20230203253A1 (enExample)
EP (1) EP4159814A4 (enExample)
JP (1) JP7627549B2 (enExample)
KR (1) KR20230015919A (enExample)
CN (1) CN115667408A (enExample)
TW (1) TWI884253B (enExample)
WO (1) WO2021241036A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7630892B2 (ja) * 2021-12-21 2025-02-18 信越化学工業株式会社 付加硬化型液状シリコーンゴム組成物及び電子写真式画像形成部材
WO2024024503A1 (ja) * 2022-07-26 2024-02-01 信越化学工業株式会社 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート
JP7669429B2 (ja) * 2023-07-31 2025-04-28 旭化成ワッカーシリコーン株式会社 ２液型付加硬化性組成物キット及び該組成物キットの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5104919A (en) * 1989-03-16 1992-04-14 Shin-Etsu Chemical Co., Ltd. Curable silicone composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006056986A (ja) * 2004-08-19 2006-03-02 Shin Etsu Chem Co Ltd 二液硬化型シリコーン組成物
JP4463117B2 (ja) * 2005-01-06 2010-05-12 信越化学工業株式会社 難燃性・熱伝導性シリコーン成形体およびその製造方法
KR101497157B1 (ko) * 2008-09-11 2015-02-27 신에쓰 가가꾸 고교 가부시끼가이샤 경화성 실리콘 수지 조성물, 그의 경화물 및 상기 조성물로 이루어지는 차광성 실리콘 접착 시트
JP2012207192A (ja) * 2011-03-30 2012-10-25 Dow Corning Toray Co Ltd ２液型シリコーンゴム組成物
CN102676113B (zh) * 2012-04-28 2013-11-06 烟台德邦先进硅材料有限公司 一种led封装硅胶及其制备方法
JP5867383B2 (ja) 2012-12-21 2016-02-24 信越化学工業株式会社 付加硬化型自己接着性シリコーンゴム組成物
CN103881393A (zh) 2014-03-20 2014-06-25 东莞优邦材料科技有限公司 双组分加成型有机聚硅氧烷组合物及其制备方法及应用
CN105368068B (zh) * 2015-11-27 2019-05-17 浙江新安化工集团股份有限公司 一种用于套管的耐高温高击穿电压无填料的有机硅橡胶
JP2019031601A (ja) * 2017-08-07 2019-02-28 信越化学工業株式会社 付加硬化型シリコーン組成物及びシリコーンゴム硬化物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5104919A (en) * 1989-03-16 1992-04-14 Shin-Etsu Chemical Co., Ltd. Curable silicone composition

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Publication number Publication date
US20230203253A1 (en) 2023-06-29
JP2021187877A (ja) 2021-12-13
EP4159814A1 (en) 2023-04-05
WO2021241036A1 (ja) 2021-12-02
JP7627549B2 (ja) 2025-02-06
KR20230015919A (ko) 2023-01-31
CN115667408A (zh) 2023-01-31
TW202212478A (zh) 2022-04-01
EP4159814A4 (en) 2024-07-10

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