TWI880837B - 引線接合機上的接合引線及接合位置之間的接合檢測方法 - Google Patents

引線接合機上的接合引線及接合位置之間的接合檢測方法 Download PDF

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Publication number
TWI880837B
TWI880837B TW113130680A TW113130680A TWI880837B TW I880837 B TWI880837 B TW I880837B TW 113130680 A TW113130680 A TW 113130680A TW 113130680 A TW113130680 A TW 113130680A TW I880837 B TWI880837 B TW I880837B
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Taiwan
Prior art keywords
bonding
wire
lead
characteristic
bonded
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TW113130680A
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English (en)
Chinese (zh)
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TW202449936A (zh
Inventor
蓋瑞 Ｓ 吉洛帝
拉切利 赫斯科維特
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美商庫利克和索夫工業公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

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  • Wire Bonding (AREA)
TW113130680A 2019-06-04 2020-06-03 引線接合機上的接合引線及接合位置之間的接合檢測方法 TWI880837B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962857027P 2019-06-04 2019-06-04
US62/857,027 2019-06-04

Publications (2)

Publication Number Publication Date
TW202449936A TW202449936A (zh) 2024-12-16
TWI880837B true TWI880837B (zh) 2025-04-11

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TW113130680A TWI880837B (zh) 2019-06-04 2020-06-03 引線接合機上的接合引線及接合位置之間的接合檢測方法
TW109118695A TWI853032B (zh) 2019-06-04 2020-06-03 引線接合機上的接合引線及接合位置之間的接合檢測方法

Family Applications After (1)

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Country Status (6)

Country Link
US (2) US11581285B2 (enExample)
JP (2) JP7579280B2 (enExample)
KR (1) KR102788904B1 (enExample)
CN (1) CN113939901B (enExample)
TW (2) TWI880837B (enExample)
WO (1) WO2020247424A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7165449B2 (ja) * 2020-08-04 2022-11-04 ヤマハロボティクスホールディングス株式会社 ワイヤ接合状態判定方法及びワイヤ接合状態判定装置
CN117337485A (zh) * 2021-05-20 2024-01-02 库利克和索夫工业公司 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机
CN120548608A (zh) * 2023-01-20 2025-08-26 库利克和索夫工业公司 焊线机操作中过程错误的自动恢复方法
KR20260035274A (ko) * 2023-07-11 2026-03-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 반도체 요소에서 크랙을 검출하는 방법, 및 관련 와이어 본딩 시스템
KR20250015211A (ko) * 2023-07-24 2025-02-03 주식회사 엘엑스세미콘 SiC 반도체 소자의 정션 프로파일 관찰 방법
WO2025264926A1 (en) * 2024-06-21 2025-12-26 Kulicke And Soffa Industries, Inc. Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system
CN121358308B (zh) * 2025-12-18 2026-04-17 广东阿达半导体设备股份有限公司 一种焊线机的偏焊预防与自动纠准方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
US20050133566A1 (en) * 2003-12-23 2005-06-23 Variyam Manjula N. Wire bonding simulation
TW200631112A (en) * 2005-02-24 2006-09-01 Shinkawa Kk Wire bonding method
US20140131425A1 (en) * 2012-11-09 2014-05-15 Asm Technology Singapore Pte Ltd Method of detecting wire bonding failures

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6189765B1 (en) * 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
JP3567884B2 (ja) * 2000-11-22 2004-09-22 松下電器産業株式会社 超音波ボンディング方法
JP4434623B2 (ja) * 2003-05-12 2010-03-17 パナソニック株式会社 ボンディング装置およびボンディング方法
US8302840B2 (en) * 2007-05-16 2012-11-06 Kulicke And Soffa Industries, Inc. Closed loop wire bonding methods and bonding force calibration
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP4397408B2 (ja) * 2007-09-21 2010-01-13 株式会社新川 半導体装置及びワイヤボンディング方法
JP4275724B1 (ja) * 2008-07-16 2009-06-10 株式会社新川 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
KR20110129170A (ko) 2010-05-25 2011-12-01 삼성전기주식회사 와이어 본딩 장치 및 방법
US20120032354A1 (en) 2010-08-06 2012-02-09 National Semiconductor Corporation Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds
CN202169438U (zh) * 2011-06-03 2012-03-21 长春光华微电子设备工程中心有限公司 全自动超声波铝丝压焊机送丝装置
SG11201503764YA (en) * 2012-11-16 2015-06-29 Shinkawa Kk Wire-bonding apparatus and method of wire bonding
TWI518814B (zh) 2013-04-15 2016-01-21 新川股份有限公司 半導體裝置以及半導體裝置的製造方法
KR102254026B1 (ko) 2014-08-18 2021-05-20 삼성전자주식회사 반도체 패키지의 제조 방법
JP6575161B2 (ja) * 2015-06-16 2019-09-18 富士電機株式会社 良否判断装置、ワイヤボンダ装置及び良否判断方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
KR102365682B1 (ko) * 2017-11-13 2022-02-21 삼성전자주식회사 반도체 패키지
CN112400226B (zh) 2018-06-29 2024-07-30 库利克和索夫工业公司 焊接线材与焊线机上的焊接位置之间的焊接的检测方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
US20050133566A1 (en) * 2003-12-23 2005-06-23 Variyam Manjula N. Wire bonding simulation
TW200631112A (en) * 2005-02-24 2006-09-01 Shinkawa Kk Wire bonding method
US20140131425A1 (en) * 2012-11-09 2014-05-15 Asm Technology Singapore Pte Ltd Method of detecting wire bonding failures

Also Published As

Publication number Publication date
TW202449936A (zh) 2024-12-16
CN113939901A (zh) 2022-01-14
JP2024161600A (ja) 2024-11-19
TWI853032B (zh) 2024-08-21
US12255172B2 (en) 2025-03-18
US20200388589A1 (en) 2020-12-10
JP2022534782A (ja) 2022-08-03
JP7579280B2 (ja) 2024-11-07
US11581285B2 (en) 2023-02-14
KR102788904B1 (ko) 2025-03-31
WO2020247424A1 (en) 2020-12-10
US20230170325A1 (en) 2023-06-01
KR20220005102A (ko) 2022-01-12
CN113939901B (zh) 2025-04-25
TW202114008A (zh) 2021-04-01

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