TWI880346B - 用於探針卡之探針 - Google Patents

用於探針卡之探針 Download PDF

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Publication number
TWI880346B
TWI880346B TW112134920A TW112134920A TWI880346B TW I880346 B TWI880346 B TW I880346B TW 112134920 A TW112134920 A TW 112134920A TW 112134920 A TW112134920 A TW 112134920A TW I880346 B TWI880346 B TW I880346B
Authority
TW
Taiwan
Prior art keywords
probe
aforementioned
deformation
metal layer
probe card
Prior art date
Application number
TW112134920A
Other languages
English (en)
Chinese (zh)
Other versions
TW202429091A (zh
Inventor
福嶋則之
Original Assignee
日商日本電子材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電子材料股份有限公司 filed Critical 日商日本電子材料股份有限公司
Publication of TW202429091A publication Critical patent/TW202429091A/zh
Application granted granted Critical
Publication of TWI880346B publication Critical patent/TWI880346B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW112134920A 2022-09-21 2023-09-13 用於探針卡之探針 TWI880346B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/035190 WO2024062561A1 (ja) 2022-09-21 2022-09-21 プローブカード用プローブ
WOPCT/JP2022/035190 2022-09-21

Publications (2)

Publication Number Publication Date
TW202429091A TW202429091A (zh) 2024-07-16
TWI880346B true TWI880346B (zh) 2025-04-11

Family

ID=90454047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112134920A TWI880346B (zh) 2022-09-21 2023-09-13 用於探針卡之探針

Country Status (6)

Country Link
US (1) US20260104437A1 (https=)
JP (1) JP7853431B2 (https=)
KR (1) KR102874365B1 (https=)
CN (1) CN119895273A (https=)
TW (1) TWI880346B (https=)
WO (1) WO2024062561A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026007066A1 (zh) * 2024-07-04 2026-01-08 普乐贝斯半导体(无锡)有限公司 探针及探针卡

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006511804A (ja) * 2002-12-23 2006-04-06 フォームファクター，インコーポレイテッド 微小電子接触構造体
TW201443441A (zh) * 2012-12-04 2014-11-16 Japan Electronic Materials 電性接觸子
WO2016156002A1 (en) * 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3316103C2 (de) * 1983-05-03 1991-12-12 Nixdorf Computer Ag, 4790 Paderborn Prüfnadel für ein Prüfgerät zum Prüfen von Leiterplatten
JP2012042330A (ja) 2010-08-19 2012-03-01 Micronics Japan Co Ltd プローブカードの製造方法
WO2022196399A1 (ja) * 2021-03-16 2022-09-22 日本電子材料株式会社 プローブカード用プローブおよびその製造方法
JP7847658B2 (ja) * 2022-09-21 2026-04-17 日本電子材料株式会社 プローブカード用プローブ
EP4501108A1 (fr) * 2023-08-01 2025-02-05 Berkem Developpement Systeme de detection d'insectes nuisibles et procede associe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006511804A (ja) * 2002-12-23 2006-04-06 フォームファクター，インコーポレイテッド 微小電子接触構造体
TW201443441A (zh) * 2012-12-04 2014-11-16 Japan Electronic Materials 電性接觸子
TW201812313A (zh) * 2012-12-04 2018-04-01 日商日本電子材料股份有限公司 電性接觸子
WO2016156002A1 (en) * 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications

Also Published As

Publication number Publication date
KR20250050103A (ko) 2025-04-14
CN119895273A (zh) 2025-04-25
US20260104437A1 (en) 2026-04-16
JPWO2024062561A1 (https=) 2024-03-28
TW202429091A (zh) 2024-07-16
WO2024062561A1 (ja) 2024-03-28
KR102874365B1 (ko) 2025-10-21
JP7853431B2 (ja) 2026-04-28

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