JP7853431B2 - プローブカード用プローブ - Google Patents
プローブカード用プローブInfo
- Publication number
- JP7853431B2 JP7853431B2 JP2024547998A JP2024547998A JP7853431B2 JP 7853431 B2 JP7853431 B2 JP 7853431B2 JP 2024547998 A JP2024547998 A JP 2024547998A JP 2024547998 A JP2024547998 A JP 2024547998A JP 7853431 B2 JP7853431 B2 JP 7853431B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- deformation
- metal layer
- region
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/035190 WO2024062561A1 (ja) | 2022-09-21 | 2022-09-21 | プローブカード用プローブ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024062561A1 JPWO2024062561A1 (https=) | 2024-03-28 |
| JPWO2024062561A5 JPWO2024062561A5 (https=) | 2025-05-27 |
| JP7853431B2 true JP7853431B2 (ja) | 2026-04-28 |
Family
ID=90454047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024547998A Active JP7853431B2 (ja) | 2022-09-21 | 2022-09-21 | プローブカード用プローブ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260104437A1 (https=) |
| JP (1) | JP7853431B2 (https=) |
| KR (1) | KR102874365B1 (https=) |
| CN (1) | CN119895273A (https=) |
| TW (1) | TWI880346B (https=) |
| WO (1) | WO2024062561A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026007066A1 (zh) * | 2024-07-04 | 2026-01-08 | 普乐贝斯半导体(无锡)有限公司 | 探针及探针卡 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006511804A (ja) | 2002-12-23 | 2006-04-06 | フォームファクター,インコーポレイテッド | 微小電子接触構造体 |
| WO2014087906A1 (ja) | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
| WO2016156002A1 (en) | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications |
| WO2024062558A1 (ja) | 2022-09-21 | 2024-03-28 | 日本電子材料株式会社 | プローブカード用プローブ |
| JP7470860B2 (ja) | 2021-03-16 | 2024-04-18 | 日本電子材料株式会社 | プローブカード用プローブおよびその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3316103C2 (de) * | 1983-05-03 | 1991-12-12 | Nixdorf Computer Ag, 4790 Paderborn | Prüfnadel für ein Prüfgerät zum Prüfen von Leiterplatten |
| JP2012042330A (ja) | 2010-08-19 | 2012-03-01 | Micronics Japan Co Ltd | プローブカードの製造方法 |
| EP4501108A1 (fr) * | 2023-08-01 | 2025-02-05 | Berkem Developpement | Systeme de detection d'insectes nuisibles et procede associe |
-
2022
- 2022-09-21 KR KR1020257008797A patent/KR102874365B1/ko active Active
- 2022-09-21 JP JP2024547998A patent/JP7853431B2/ja active Active
- 2022-09-21 US US19/113,783 patent/US20260104437A1/en active Pending
- 2022-09-21 WO PCT/JP2022/035190 patent/WO2024062561A1/ja not_active Ceased
- 2022-09-21 CN CN202280100288.2A patent/CN119895273A/zh active Pending
-
2023
- 2023-09-13 TW TW112134920A patent/TWI880346B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006511804A (ja) | 2002-12-23 | 2006-04-06 | フォームファクター,インコーポレイテッド | 微小電子接触構造体 |
| WO2014087906A1 (ja) | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
| WO2016156002A1 (en) | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications |
| JP7470860B2 (ja) | 2021-03-16 | 2024-04-18 | 日本電子材料株式会社 | プローブカード用プローブおよびその製造方法 |
| WO2024062558A1 (ja) | 2022-09-21 | 2024-03-28 | 日本電子材料株式会社 | プローブカード用プローブ |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI880346B (zh) | 2025-04-11 |
| KR20250050103A (ko) | 2025-04-14 |
| CN119895273A (zh) | 2025-04-25 |
| US20260104437A1 (en) | 2026-04-16 |
| JPWO2024062561A1 (https=) | 2024-03-28 |
| TW202429091A (zh) | 2024-07-16 |
| WO2024062561A1 (ja) | 2024-03-28 |
| KR102874365B1 (ko) | 2025-10-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250228 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250228 |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20260407 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20260416 |