KR102874365B1 - 프로브 카드용 프로브 - Google Patents

프로브 카드용 프로브

Info

Publication number
KR102874365B1
KR102874365B1 KR1020257008797A KR20257008797A KR102874365B1 KR 102874365 B1 KR102874365 B1 KR 102874365B1 KR 1020257008797 A KR1020257008797 A KR 1020257008797A KR 20257008797 A KR20257008797 A KR 20257008797A KR 102874365 B1 KR102874365 B1 KR 102874365B1
Authority
KR
South Korea
Prior art keywords
probe
deformation
metal layer
probe card
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020257008797A
Other languages
English (en)
Korean (ko)
Other versions
KR20250050103A (ko
Inventor
노리유키 후쿠시마
Original Assignee
재팬 일렉트로닉 메트리얼스 코오포레이숀
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 재팬 일렉트로닉 메트리얼스 코오포레이숀 filed Critical 재팬 일렉트로닉 메트리얼스 코오포레이숀
Publication of KR20250050103A publication Critical patent/KR20250050103A/ko
Application granted granted Critical
Publication of KR102874365B1 publication Critical patent/KR102874365B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020257008797A 2022-09-21 2022-09-21 프로브 카드용 프로브 Active KR102874365B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/035190 WO2024062561A1 (ja) 2022-09-21 2022-09-21 プローブカード用プローブ

Publications (2)

Publication Number Publication Date
KR20250050103A KR20250050103A (ko) 2025-04-14
KR102874365B1 true KR102874365B1 (ko) 2025-10-21

Family

ID=90454047

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257008797A Active KR102874365B1 (ko) 2022-09-21 2022-09-21 프로브 카드용 프로브

Country Status (6)

Country Link
US (1) US20260104437A1 (https=)
JP (1) JP7853431B2 (https=)
KR (1) KR102874365B1 (https=)
CN (1) CN119895273A (https=)
TW (1) TWI880346B (https=)
WO (1) WO2024062561A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026007066A1 (zh) * 2024-07-04 2026-01-08 普乐贝斯半导体(无锡)有限公司 探针及探针卡

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4486896B2 (ja) 2002-12-23 2010-06-23 フォームファクター， インコーポレイテッド 微小電子接触構造体
JP2012042330A (ja) 2010-08-19 2012-03-01 Micronics Japan Co Ltd プローブカードの製造方法
WO2016156002A1 (en) 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications
WO2022196399A1 (ja) 2021-03-16 2022-09-22 日本電子材料株式会社 プローブカード用プローブおよびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3316103C2 (de) * 1983-05-03 1991-12-12 Nixdorf Computer Ag, 4790 Paderborn Prüfnadel für ein Prüfgerät zum Prüfen von Leiterplatten
WO2014087906A1 (ja) * 2012-12-04 2014-06-12 日本電子材料株式会社 電気的接触子
JP7847658B2 (ja) * 2022-09-21 2026-04-17 日本電子材料株式会社 プローブカード用プローブ
EP4501108A1 (fr) * 2023-08-01 2025-02-05 Berkem Developpement Systeme de detection d'insectes nuisibles et procede associe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4486896B2 (ja) 2002-12-23 2010-06-23 フォームファクター， インコーポレイテッド 微小電子接触構造体
JP2012042330A (ja) 2010-08-19 2012-03-01 Micronics Japan Co Ltd プローブカードの製造方法
WO2016156002A1 (en) 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications
WO2022196399A1 (ja) 2021-03-16 2022-09-22 日本電子材料株式会社 プローブカード用プローブおよびその製造方法

Also Published As

Publication number Publication date
TWI880346B (zh) 2025-04-11
KR20250050103A (ko) 2025-04-14
CN119895273A (zh) 2025-04-25
US20260104437A1 (en) 2026-04-16
JPWO2024062561A1 (https=) 2024-03-28
TW202429091A (zh) 2024-07-16
WO2024062561A1 (ja) 2024-03-28
JP7853431B2 (ja) 2026-04-28

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