TWI879824B - 攝像裝置、其工作方法及電子裝置 - Google Patents

攝像裝置、其工作方法及電子裝置 Download PDF

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Publication number
TWI879824B
TWI879824B TW109138339A TW109138339A TWI879824B TW I879824 B TWI879824 B TW I879824B TW 109138339 A TW109138339 A TW 109138339A TW 109138339 A TW109138339 A TW 109138339A TW I879824 B TWI879824 B TW I879824B
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TW
Taiwan
Prior art keywords
transistor
circuit
layer
node
wiring
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TW109138339A
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English (en)
Chinese (zh)
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TW202139689A (zh
Inventor
米田誠一
井上広樹
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日商半導體能源研究所股份有限公司
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/47—Image sensors with pixel address output; Event-driven image sensors; Selection of pixels to be read out based on image data
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/707—Pixels for event detection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/709—Circuitry for control of the power supply
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/30—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Thin Film Transistor (AREA)
TW109138339A 2019-11-07 2020-11-04 攝像裝置、其工作方法及電子裝置 TWI879824B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-202403 2019-11-07
JP2019202403 2019-11-07

Publications (2)

Publication Number Publication Date
TW202139689A TW202139689A (zh) 2021-10-16
TWI879824B true TWI879824B (zh) 2025-04-11

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Family Applications (1)

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TW109138339A TWI879824B (zh) 2019-11-07 2020-11-04 攝像裝置、其工作方法及電子裝置

Country Status (6)

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US (2) US11917318B2 (https=)
JP (2) JP7663507B2 (https=)
KR (1) KR20220093138A (https=)
CN (1) CN114641987A (https=)
TW (1) TWI879824B (https=)
WO (1) WO2021090110A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11917318B2 (en) * 2019-11-07 2024-02-27 Semiconductor Energy Laboratory Co., Ltd. Imaging device, operation method thereof, and electronic device
US20240279455A1 (en) 2021-10-22 2024-08-22 Lg Chem, Ltd. Thermoplastic resin composition, method of preparing the same, and molded article manufactured using the same
US12610147B2 (en) * 2023-08-08 2026-04-21 Qualcomm Incorporated Automatic exposure control

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TW201705755A (zh) * 2015-03-30 2017-02-01 佳能股份有限公司 光電轉換裝置及光電轉換系統
JP2017041878A (ja) * 2015-08-19 2017-02-23 株式会社半導体エネルギー研究所 撮像装置およびその動作方法、ならびに電子機器
WO2017158478A1 (ja) * 2016-03-18 2017-09-21 株式会社半導体エネルギー研究所 撮像装置および電子機器
TW201826779A (zh) * 2016-09-27 2018-07-16 美商豪威科技股份有限公司 用於雙重斜波類比至數位轉換器之比較器

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JP5651982B2 (ja) 2010-03-31 2015-01-14 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、及び電子機器
JP2015119018A (ja) * 2013-12-18 2015-06-25 ソニー株式会社 固体撮像素子および電子機器
KR102205702B1 (ko) * 2014-07-30 2021-01-21 삼성전자주식회사 이미지 센서 및 이미지 센서를 구동하는 방법, 그리고 이를 이용한 영상 촬영 장치
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JP2019176335A (ja) * 2018-03-28 2019-10-10 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
WO2020075009A1 (ja) * 2018-10-11 2020-04-16 株式会社半導体エネルギー研究所 センサ装置および半導体装置
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TW201705755A (zh) * 2015-03-30 2017-02-01 佳能股份有限公司 光電轉換裝置及光電轉換系統
US20160356645A1 (en) * 2015-06-08 2016-12-08 Semiconductor Energy Laboratory Co., Ltd. Imaging device, operation method thereof, and electronic device
JP2017041878A (ja) * 2015-08-19 2017-02-23 株式会社半導体エネルギー研究所 撮像装置およびその動作方法、ならびに電子機器
WO2017158478A1 (ja) * 2016-03-18 2017-09-21 株式会社半導体エネルギー研究所 撮像装置および電子機器
TW201826779A (zh) * 2016-09-27 2018-07-16 美商豪威科技股份有限公司 用於雙重斜波類比至數位轉換器之比較器

Also Published As

Publication number Publication date
JPWO2021090110A1 (https=) 2021-05-14
CN114641987A (zh) 2022-06-17
JP7825762B2 (ja) 2026-03-06
JP2025100583A (ja) 2025-07-03
JP7663507B2 (ja) 2025-04-16
WO2021090110A1 (ja) 2021-05-14
US20230247331A1 (en) 2023-08-03
US20240196117A1 (en) 2024-06-13
US12294805B2 (en) 2025-05-06
TW202139689A (zh) 2021-10-16
US11917318B2 (en) 2024-02-27
KR20220093138A (ko) 2022-07-05

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