TWI878995B - 配線基板及使用該配線基板之安裝構造體 - Google Patents

配線基板及使用該配線基板之安裝構造體 Download PDF

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Publication number
TWI878995B
TWI878995B TW112128179A TW112128179A TWI878995B TW I878995 B TWI878995 B TW I878995B TW 112128179 A TW112128179 A TW 112128179A TW 112128179 A TW112128179 A TW 112128179A TW I878995 B TWI878995 B TW I878995B
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TW
Taiwan
Prior art keywords
layer
conductor
insulating layer
grain size
crystal grain
Prior art date
Application number
TW112128179A
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English (en)
Chinese (zh)
Other versions
TW202415158A (zh
Inventor
清水大地
Original Assignee
日商京瓷股份有限公司
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Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202415158A publication Critical patent/TW202415158A/zh
Application granted granted Critical
Publication of TWI878995B publication Critical patent/TWI878995B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW112128179A 2022-07-27 2023-07-27 配線基板及使用該配線基板之安裝構造體 TWI878995B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-119305 2022-07-27
JP2022119305 2022-07-27

Publications (2)

Publication Number Publication Date
TW202415158A TW202415158A (zh) 2024-04-01
TWI878995B true TWI878995B (zh) 2025-04-01

Family

ID=89706586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112128179A TWI878995B (zh) 2022-07-27 2023-07-27 配線基板及使用該配線基板之安裝構造體

Country Status (3)

Country Link
JP (1) JPWO2024024878A1 (https=)
TW (1) TWI878995B (https=)
WO (1) WO2024024878A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101027431A (zh) * 2004-09-24 2007-08-29 揖斐电株式会社 电镀方法及电镀装置
US20220197583A1 (en) * 2013-11-15 2022-06-23 Semiconductor Energy Laboratory Co., Ltd. Display panel and electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324968A (ja) * 2001-04-24 2002-11-08 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2013089910A (ja) * 2011-10-21 2013-05-13 Fujikura Ltd フレキシブルプリント基板及びその製造方法
JP7097139B2 (ja) * 2018-07-26 2022-07-07 京セラ株式会社 配線基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101027431A (zh) * 2004-09-24 2007-08-29 揖斐电株式会社 电镀方法及电镀装置
US20220197583A1 (en) * 2013-11-15 2022-06-23 Semiconductor Energy Laboratory Co., Ltd. Display panel and electronic device

Also Published As

Publication number Publication date
WO2024024878A1 (ja) 2024-02-01
TW202415158A (zh) 2024-04-01
JPWO2024024878A1 (https=) 2024-02-01

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