TWI874385B - 有機電致發光顯示元件用密封劑 - Google Patents

有機電致發光顯示元件用密封劑 Download PDF

Info

Publication number
TWI874385B
TWI874385B TW109113247A TW109113247A TWI874385B TW I874385 B TWI874385 B TW I874385B TW 109113247 A TW109113247 A TW 109113247A TW 109113247 A TW109113247 A TW 109113247A TW I874385 B TWI874385 B TW I874385B
Authority
TW
Taiwan
Prior art keywords
component
sealant
group
mass
parts
Prior art date
Application number
TW109113247A
Other languages
English (en)
Chinese (zh)
Other versions
TW202104316A (zh
Inventor
髙崎一平
石田泰則
深尾健司
Original Assignee
日商電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW202104316A publication Critical patent/TW202104316A/zh
Application granted granted Critical
Publication of TWI874385B publication Critical patent/TWI874385B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW109113247A 2019-04-23 2020-04-21 有機電致發光顯示元件用密封劑 TWI874385B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-082053 2019-04-23
JP2019082053 2019-04-23

Publications (2)

Publication Number Publication Date
TW202104316A TW202104316A (zh) 2021-02-01
TWI874385B true TWI874385B (zh) 2025-03-01

Family

ID=72942040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109113247A TWI874385B (zh) 2019-04-23 2020-04-21 有機電致發光顯示元件用密封劑

Country Status (3)

Country Link
JP (1) JP7440498B2 (https=)
TW (1) TWI874385B (https=)
WO (1) WO2020218065A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024195593A1 (ja) * 2023-03-17 2024-09-26 デンカ株式会社 組成物、硬化体、表示装置及び表示装置の製造方法
JPWO2024195590A1 (https=) * 2023-03-17 2024-09-26

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844124A (en) * 2007-03-09 2008-11-16 Daicel Chem Photo-hardening resin composition
TW201533144A (zh) * 2014-01-23 2015-09-01 Daicel Corp 密封用組成物
TW201605998A (zh) * 2014-06-27 2016-02-16 大賽璐股份有限公司 單體組成物及含有該單體組成物之硬化性組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4262238B2 (ja) 2005-11-15 2009-05-13 東芝テック株式会社 光カチオン硬化性インクジェットインクおよび印刷物
JP5330717B2 (ja) * 2007-03-23 2013-10-30 株式会社ダイセル オキセタン環含有ビニルエーテル化合物、及び重合性組成物
JP5625343B2 (ja) * 2009-12-11 2014-11-19 コニカミノルタ株式会社 活性光線硬化型インク組成物およびインクジェット記録方法
JP6200203B2 (ja) 2013-05-16 2017-09-20 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
US10392473B2 (en) * 2014-06-27 2019-08-27 Daicel Corporation Monomer composition and curable composition containing same
JP6673694B2 (ja) * 2015-12-25 2020-03-25 株式会社ダイセル 立体造形用硬化性組成物
JP2017115072A (ja) 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
JP2017115073A (ja) * 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
KR102118365B1 (ko) 2017-04-21 2020-06-04 주식회사 엘지화학 유기전자소자 봉지용 조성물
CN112470551B (zh) 2018-09-26 2024-05-14 电化株式会社 有机电致发光显示元件用密封剂
WO2020196669A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844124A (en) * 2007-03-09 2008-11-16 Daicel Chem Photo-hardening resin composition
TW201533144A (zh) * 2014-01-23 2015-09-01 Daicel Corp 密封用組成物
TW201605998A (zh) * 2014-06-27 2016-02-16 大賽璐股份有限公司 單體組成物及含有該單體組成物之硬化性組成物

Also Published As

Publication number Publication date
WO2020218065A1 (ja) 2020-10-29
JP7440498B2 (ja) 2024-02-28
JPWO2020218065A1 (https=) 2020-10-29
TW202104316A (zh) 2021-02-01

Similar Documents

Publication Publication Date Title
TWI839389B (zh) 有機電致發光顯示元件用密封劑
JP6578339B2 (ja) 樹脂組成物
CN113272383B (zh) 组合物
CN110999537B (zh) 有机电致发光元件用密封剂
CN113227169B (zh) 密封剂、固化体、有机电致发光显示装置及装置的制造方法
KR20210078573A (ko) 수지 조성물
TWI874385B (zh) 有機電致發光顯示元件用密封劑
CN113227159A (zh) 组合物
WO2025220565A1 (ja) 光電変換素子用封止材、ダム材、フィル材、ダム材を用いた装置の製造方法、およびフィル材を用いた装置の製造方法
JP2025164342A (ja) 光電変換素子用封止材、フィル材、およびフィル材を用いた装置の製造方法
JP2025164333A (ja) 光電変換素子用封止材、ダム材、およびダム材を用いた装置の製造方法
CN116249722A (zh) 组合物、固化体及有机el显示装置