JP7440498B2 - 組成物 - Google Patents

組成物 Download PDF

Info

Publication number
JP7440498B2
JP7440498B2 JP2021516005A JP2021516005A JP7440498B2 JP 7440498 B2 JP7440498 B2 JP 7440498B2 JP 2021516005 A JP2021516005 A JP 2021516005A JP 2021516005 A JP2021516005 A JP 2021516005A JP 7440498 B2 JP7440498 B2 JP 7440498B2
Authority
JP
Japan
Prior art keywords
group
mass
component
organic electroluminescent
electroluminescent display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021516005A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020218065A1 (https=
Inventor
一平 ▲高▼崎
泰則 石田
健司 深尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2020218065A1 publication Critical patent/JPWO2020218065A1/ja
Application granted granted Critical
Publication of JP7440498B2 publication Critical patent/JP7440498B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP2021516005A 2019-04-23 2020-04-13 組成物 Active JP7440498B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019082053 2019-04-23
JP2019082053 2019-04-23
PCT/JP2020/016313 WO2020218065A1 (ja) 2019-04-23 2020-04-13 組成物

Publications (2)

Publication Number Publication Date
JPWO2020218065A1 JPWO2020218065A1 (https=) 2020-10-29
JP7440498B2 true JP7440498B2 (ja) 2024-02-28

Family

ID=72942040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021516005A Active JP7440498B2 (ja) 2019-04-23 2020-04-13 組成物

Country Status (3)

Country Link
JP (1) JP7440498B2 (https=)
TW (1) TWI874385B (https=)
WO (1) WO2020218065A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024195593A1 (ja) * 2023-03-17 2024-09-26 デンカ株式会社 組成物、硬化体、表示装置及び表示装置の製造方法
JPWO2024195590A1 (https=) * 2023-03-17 2024-09-26

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007137926A (ja) 2005-11-15 2007-06-07 Toshiba Tec Corp 光カチオン硬化性インクジェットインクおよび印刷物
WO2008111283A1 (ja) 2007-03-09 2008-09-18 Daicel Chemical Industries, Ltd. 光硬化性樹脂組成物
JP2008266308A (ja) 2007-03-23 2008-11-06 Daicel Chem Ind Ltd オキセタン環含有ビニルエーテル化合物、及び重合性組成物
JP2011122076A (ja) 2009-12-11 2011-06-23 Konica Minolta Holdings Inc 活性光線硬化型インク組成物およびインクジェット記録方法
JP2014225380A (ja) 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
WO2015111525A1 (ja) 2014-01-23 2015-07-30 株式会社ダイセル 封止用組成物
WO2015199092A1 (ja) 2014-06-27 2015-12-30 株式会社ダイセル モノマー組成物、及びそれを含む硬化性組成物
WO2015199091A1 (ja) 2014-06-27 2015-12-30 株式会社ダイセル モノマー組成物、及びそれを含む硬化性組成物
JP2017115073A (ja) 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
JP2017115072A (ja) 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
JP2017115074A (ja) 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
WO2018194410A1 (ko) 2017-04-21 2018-10-25 주식회사 엘지화학 유기전자소자 봉지용 조성물
WO2020067046A1 (ja) 2018-09-26 2020-04-02 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2020196669A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 組成物

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007137926A (ja) 2005-11-15 2007-06-07 Toshiba Tec Corp 光カチオン硬化性インクジェットインクおよび印刷物
WO2008111283A1 (ja) 2007-03-09 2008-09-18 Daicel Chemical Industries, Ltd. 光硬化性樹脂組成物
JP2008266308A (ja) 2007-03-23 2008-11-06 Daicel Chem Ind Ltd オキセタン環含有ビニルエーテル化合物、及び重合性組成物
JP2011122076A (ja) 2009-12-11 2011-06-23 Konica Minolta Holdings Inc 活性光線硬化型インク組成物およびインクジェット記録方法
JP2014225380A (ja) 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
WO2015111525A1 (ja) 2014-01-23 2015-07-30 株式会社ダイセル 封止用組成物
WO2015199092A1 (ja) 2014-06-27 2015-12-30 株式会社ダイセル モノマー組成物、及びそれを含む硬化性組成物
WO2015199091A1 (ja) 2014-06-27 2015-12-30 株式会社ダイセル モノマー組成物、及びそれを含む硬化性組成物
JP2017115073A (ja) 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
JP2017115072A (ja) 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
JP2017115074A (ja) 2015-12-25 2017-06-29 株式会社ダイセル 立体造形用硬化性組成物
WO2018194410A1 (ko) 2017-04-21 2018-10-25 주식회사 엘지화학 유기전자소자 봉지용 조성물
WO2020067046A1 (ja) 2018-09-26 2020-04-02 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2020196669A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 組成物

Also Published As

Publication number Publication date
TWI874385B (zh) 2025-03-01
WO2020218065A1 (ja) 2020-10-29
JPWO2020218065A1 (https=) 2020-10-29
TW202104316A (zh) 2021-02-01

Similar Documents

Publication Publication Date Title
JP7397151B2 (ja) 組成物
JP6578339B2 (ja) 樹脂組成物
JP7270635B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP7123943B2 (ja) 有機エレクトロルミネッセンス素子用封止剤
JP6560985B2 (ja) 樹脂組成物
JP7385722B2 (ja) 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び装置の製造方法
JP7440498B2 (ja) 組成物
JP7269323B2 (ja) 組成物
WO2025220565A1 (ja) 光電変換素子用封止材、ダム材、フィル材、ダム材を用いた装置の製造方法、およびフィル材を用いた装置の製造方法
JP2025164333A (ja) 光電変換素子用封止材、ダム材、およびダム材を用いた装置の製造方法
JP2025164342A (ja) 光電変換素子用封止材、フィル材、およびフィル材を用いた装置の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230530

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230731

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231017

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231129

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240123

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240215

R150 Certificate of patent or registration of utility model

Ref document number: 7440498

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150