TWI873706B - 鈀鈷氧化物薄膜、赤鐵礦型氧化物薄膜、具有赤鐵礦型氧化物薄膜之蕭特基電極、鈀鈷氧化物薄膜之製造方法及赤鐵礦型氧化物薄膜之製造方法 - Google Patents

鈀鈷氧化物薄膜、赤鐵礦型氧化物薄膜、具有赤鐵礦型氧化物薄膜之蕭特基電極、鈀鈷氧化物薄膜之製造方法及赤鐵礦型氧化物薄膜之製造方法 Download PDF

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TWI873706B
TWI873706B TW112125619A TW112125619A TWI873706B TW I873706 B TWI873706 B TW I873706B TW 112125619 A TW112125619 A TW 112125619A TW 112125619 A TW112125619 A TW 112125619A TW I873706 B TWI873706 B TW I873706B
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thin film
palladium
film
cobalt oxide
oxide
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TW112125619A
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Chinese (zh)
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TW202409318A (zh
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原田尚之
政広泰
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國立研究開發法人物質 材料研究機構
日商田中貴金屬工業股份有限公司
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TW112125619A 2022-07-11 2023-07-10 鈀鈷氧化物薄膜、赤鐵礦型氧化物薄膜、具有赤鐵礦型氧化物薄膜之蕭特基電極、鈀鈷氧化物薄膜之製造方法及赤鐵礦型氧化物薄膜之製造方法 TWI873706B (zh)

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WO2025183057A1 (ja) * 2024-03-01 2025-09-04 国立研究開発法人物質・材料研究機構 半導体装置とその製造方法
CN120089461A (zh) * 2025-04-28 2025-06-03 中国科学院合肥物质科学研究院 一种金属型铜铁矿PdRhO2薄膜及其制备方法

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TW200639269A (en) * 2005-02-15 2006-11-16 Rohm & Haas Elect Mat Plating method

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WO2020090491A1 (ja) 2018-11-01 2020-05-07 住友ベークライト株式会社 パワーデバイス封止用樹脂組成物およびパワーデバイス

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200639269A (en) * 2005-02-15 2006-11-16 Rohm & Haas Elect Mat Plating method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
網路文獻 原田 尚之 デラフォサイト型層状酸化物PdCoO2の極薄膜化と物性 第79回応用物理学会秋季学術講演会 2018 *

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