TWI872847B - 鹼性顯影型樹脂組合物、其光硬化性的乾膜及其硬化物以及使用其而形成的印刷電路板 - Google Patents

鹼性顯影型樹脂組合物、其光硬化性的乾膜及其硬化物以及使用其而形成的印刷電路板 Download PDF

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Publication number
TWI872847B
TWI872847B TW112147245A TW112147245A TWI872847B TW I872847 B TWI872847 B TW I872847B TW 112147245 A TW112147245 A TW 112147245A TW 112147245 A TW112147245 A TW 112147245A TW I872847 B TWI872847 B TW I872847B
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TW
Taiwan
Prior art keywords
resin composition
alkaline developing
glass powder
developing resin
manufactured
Prior art date
Application number
TW112147245A
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English (en)
Chinese (zh)
Other versions
TW202429195A (zh
Inventor
王玉彬
姚國榮
董思原
加藤賢治
王平清
羅景義
Original Assignee
大陸商太陽油墨（蘇州）有限公司
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Publication of TW202429195A publication Critical patent/TW202429195A/zh
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Publication of TWI872847B publication Critical patent/TWI872847B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
TW112147245A 2022-12-28 2023-12-05 鹼性顯影型樹脂組合物、其光硬化性的乾膜及其硬化物以及使用其而形成的印刷電路板 TWI872847B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211699738.2A CN118259549A (zh) 2022-12-28 2022-12-28 碱性显影型树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
CN2022116997382 2022-12-28

Publications (2)

Publication Number Publication Date
TW202429195A TW202429195A (zh) 2024-07-16
TWI872847B true TWI872847B (zh) 2025-02-11

Family

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Family Applications (1)

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TW112147245A TWI872847B (zh) 2022-12-28 2023-12-05 鹼性顯影型樹脂組合物、其光硬化性的乾膜及其硬化物以及使用其而形成的印刷電路板

Country Status (4)

Country Link
JP (4) JP7763407B2 (https=)
CN (5) CN118259549A (https=)
TW (1) TWI872847B (https=)
WO (1) WO2024140805A1 (https=)

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US20040001961A1 (en) * 2002-06-28 2004-01-01 Takao Ono Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film
TW200911523A (en) * 2007-08-16 2009-03-16 Jsr Corp Dry film, micro-lens and manufacturing method thereof as well as liquid crystal display element with micro-lens
TW201943759A (zh) * 2018-04-18 2019-11-16 日商三菱化學股份有限公司 乾膜抗蝕劑用聚酯膜及其製造方法、以及感光性積層體
WO2021157282A1 (ja) * 2020-02-03 2021-08-12 太陽インキ製造株式会社 硬化性組成物、そのドライフィルムおよび硬化物
WO2021210570A1 (ja) * 2020-04-14 2021-10-21 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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JPH05311097A (ja) * 1992-05-11 1993-11-22 Toray Ind Inc 感光性絶縁ペ−スト
JPH10279363A (ja) * 1997-03-31 1998-10-20 Toray Ind Inc セラミックス・グリーンシート
JP3920449B2 (ja) * 1998-03-13 2007-05-30 太陽インキ製造株式会社 アルカリ現像型光硬化性組成物及びそれを用いて得られる焼成物パターン
JP2000090738A (ja) * 1998-09-14 2000-03-31 Taiyo Ink Mfg Ltd 感光性ガラスペースト組成物及びそれを用いた焼成物パターン形成方法
JP4639530B2 (ja) * 2000-06-01 2011-02-23 パナソニック株式会社 感光性ペーストおよびプラズマディスプレイ
JP4697031B2 (ja) * 2006-04-21 2011-06-08 Ｊｓｒ株式会社 無機粒子含有感光性樹脂組成物、感光性フィルムおよび無機パターン形成方法
KR100787450B1 (ko) * 2006-06-20 2007-12-26 삼성에스디아이 주식회사 감광성 페이스트 조성물 이를 이용하여 제조된 플라즈마디스플레이 패널의 격벽 및 이를 포함하는 플라즈마디스플레이 패널
KR100895352B1 (ko) * 2006-11-15 2009-04-29 다이요 잉키 세이조 가부시키가이샤 흑색 페이스트 조성물, 및 그것을 이용한 블랙 매트릭스패턴의 형성 방법, 및 그 블랙 매트릭스 패턴
TW200844660A (en) * 2006-11-15 2008-11-16 Taiyo Ink Mfg Co Ltd Alkali development type paste composition, method for conductive pattern and black matrix pattern formation using the same, and the conductive pattern and the black matrix pattern
CN103045015B (zh) * 2013-01-25 2016-05-11 深圳市万佳原丝印器材有限公司 液态感光成像碱显影抗阳极氧化油墨及其制备方法
CN103969947B (zh) * 2013-01-31 2016-05-04 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
JP5507023B1 (ja) * 2013-08-28 2014-05-28 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6491417B2 (ja) * 2014-03-10 2019-03-27 互応化学工業株式会社 ソルダーレジスト用樹脂組成物、マーキングインク用樹脂組成物、硬化物及びプリント配線板
JP7007792B2 (ja) * 2015-09-30 2022-01-25 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
CN106338887A (zh) * 2016-09-20 2017-01-18 深圳市容大感光科技股份有限公司 一种光致抗蚀剂组合物及其用途
JP6759323B2 (ja) * 2018-03-28 2020-09-23 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板
CN116830039A (zh) * 2021-02-01 2023-09-29 东丽株式会社 感光性树脂组合物、感光性树脂片、固化物、中空结构体、电子部件及弹性波滤波器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040001961A1 (en) * 2002-06-28 2004-01-01 Takao Ono Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film
TW200911523A (en) * 2007-08-16 2009-03-16 Jsr Corp Dry film, micro-lens and manufacturing method thereof as well as liquid crystal display element with micro-lens
TW201943759A (zh) * 2018-04-18 2019-11-16 日商三菱化學股份有限公司 乾膜抗蝕劑用聚酯膜及其製造方法、以及感光性積層體
WO2021157282A1 (ja) * 2020-02-03 2021-08-12 太陽インキ製造株式会社 硬化性組成物、そのドライフィルムおよび硬化物
WO2021210570A1 (ja) * 2020-04-14 2021-10-21 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
TW202523783A (zh) 2025-06-16
JP2025503074A (ja) 2025-01-30
TW202523785A (zh) 2025-06-16
CN120044758A (zh) 2025-05-27
WO2024140805A1 (zh) 2024-07-04
CN119987137B (zh) 2025-11-25
CN118259549A (zh) 2024-06-28
JP2026016443A (ja) 2026-02-03
CN119987136A (zh) 2025-05-13
CN119987137A (zh) 2025-05-13
JP2025188165A (ja) 2025-12-25
CN120044758B (zh) 2025-11-25
CN118591772A (zh) 2024-09-03
CN119987136B (zh) 2025-11-18
TW202429195A (zh) 2024-07-16
CN118591772B (zh) 2025-03-18
JP7763407B2 (ja) 2025-11-04
JP2025188164A (ja) 2025-12-25
TW202523784A (zh) 2025-06-16

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