TWI856301B - 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法 - Google Patents

低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法 Download PDF

Info

Publication number
TWI856301B
TWI856301B TW111110828A TW111110828A TWI856301B TW I856301 B TWI856301 B TW I856301B TW 111110828 A TW111110828 A TW 111110828A TW 111110828 A TW111110828 A TW 111110828A TW I856301 B TWI856301 B TW I856301B
Authority
TW
Taiwan
Prior art keywords
low dielectric
resin composition
film
laminated substrate
dielectric material
Prior art date
Application number
TW111110828A
Other languages
English (en)
Chinese (zh)
Other versions
TW202306770A (zh
Inventor
大石好行
芝﨑祐二
塚本匡
Original Assignee
國立大學法人岩手大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 國立大學法人岩手大學 filed Critical 國立大學法人岩手大學
Publication of TW202306770A publication Critical patent/TW202306770A/zh
Application granted granted Critical
Publication of TWI856301B publication Critical patent/TWI856301B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW111110828A 2021-03-24 2022-03-23 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法 TWI856301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021050547 2021-03-24
JP2021-050547 2021-03-24

Publications (2)

Publication Number Publication Date
TW202306770A TW202306770A (zh) 2023-02-16
TWI856301B true TWI856301B (zh) 2024-09-21

Family

ID=83397312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110828A TWI856301B (zh) 2021-03-24 2022-03-23 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法

Country Status (5)

Country Link
US (1) US20240209148A1 (https=)
JP (1) JP7849888B2 (https=)
CN (1) CN117062876A (https=)
TW (1) TWI856301B (https=)
WO (1) WO2022202886A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118620500B (zh) * 2024-04-28 2025-02-14 大连理工大学 一种耐高温防腐用含苯基均三嗪环聚芳醚涂层及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001503077A (ja) * 1996-09-16 2001-03-06 バイエル・アクチエンゲゼルシヤフト トリアジン重合体そして電界発光装置におけるそれの使用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5322528A (en) * 1992-03-30 1994-06-21 Texaco Inc. Composition of matter for high temperature phenolphthalein-, phenolphmalide-, fluorene-, xanthane-, and anthrone-s-triazines that are soluble in diesel fuel
JPH06184300A (ja) * 1992-12-17 1994-07-05 Idemitsu Kosan Co Ltd 芳香族ポリエーテル及びその製造方法並びにトリアジン化合物
JP3205848B2 (ja) * 1993-10-21 2001-09-04 科学技術振興事業団 ポリエ−テル樹脂及びその製造方法
JPWO2011155528A1 (ja) * 2010-06-11 2013-08-01 Jsr株式会社 スルホン酸基を有する芳香族系共重合体、ならびにその用途
CN106589349B (zh) * 2016-11-03 2019-01-08 大连理工大学 主链含三芳基均三嗪结构的双邻苯二甲腈树脂及其制备方法
CN106589348B (zh) * 2016-11-03 2019-01-08 大连理工大学 主链含双苯基芴与三芳基均三嗪结构的聚芳醚及其制备方法
CN106905529A (zh) * 2017-03-17 2017-06-30 大连理工大学 含氰基和芴基双马来酰亚胺树脂及其制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001503077A (ja) * 1996-09-16 2001-03-06 バイエル・アクチエンゲゼルシヤフト トリアジン重合体そして電界発光装置におけるそれの使用

Also Published As

Publication number Publication date
JP7849888B2 (ja) 2026-04-22
CN117062876A (zh) 2023-11-14
US20240209148A1 (en) 2024-06-27
JPWO2022202886A1 (https=) 2022-09-29
TW202306770A (zh) 2023-02-16
WO2022202886A1 (ja) 2022-09-29

Similar Documents

Publication Publication Date Title
TWI448509B (zh) 樹脂組成物，預浸片及其用途
TWI871302B (zh) 硬化性樹脂組成物
TWI844626B (zh) 硬化性樹脂組成物
US9469757B2 (en) Low dissipation factor resin composition and product made thereby
JP6886292B2 (ja) 超低誘電損失熱硬化性樹脂組成物およびこれにより製造される高性能ラミネート
KR101260535B1 (ko) 에폭시 수지, 에폭시 수지 조성물, 이것을 사용한프리프레그 및 적층판
CN108485182B (zh) 一种高频树脂组合物及使用其制作的半固化片和层压板
TW202041595A (zh) 硬化性樹脂組成物
TWI844625B (zh) 硬化性樹脂組成物
CN105683154A (zh) 氰酸酯化合物、包含该化合物的固化性树脂组合物及其固化物
TWI856301B (zh) 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法
TWI875735B (zh) 硬化性樹脂組成物
TWI871505B (zh) 低介電材料用之樹脂組成物、積層基板用膜、積層基板、低介電材料用之樹脂組成物之製造方法、積層基板用膜之製造方法以及積層基板之製造方法
JP5880921B2 (ja) 硬化性樹脂組成物、その硬化物、プリント配線基板
CN115637020A (zh) 一种超支化环氧树脂热固性树脂组合物及其应用
TW202110922A (zh) 環氧樹脂、其製備方法以及包含其之環氧樹脂組成物
CN111849123A (zh) 一种环氧树脂组合物及其应用
JP2026058130A (ja) 樹脂、樹脂組成物、成形体、及び成形体の製造方法
JP2000319509A (ja) 難燃性樹脂組成物の製造方法及び積層板
JP2000095938A (ja) 印刷配線板用難燃性樹脂組成物の製造方法及びそれにより得られた印刷配線板用難燃性樹脂組成物