TWI853500B - Substrate processing apparatus - Google Patents

Abstract

The carrier of the present invention is transported along the first transport path. A plurality of substrates in the carrier are processed. A first standby section is provided adjacent to the starting point of the first transport path. The first standby section transfers the carrier containing a plurality of unprocessed substrates to the starting point of the first transport path. A second standby section is provided adjacent to the end point of the first transport path. The second standby section receives the carrier containing a plurality of processed substrates. A plurality of substrates are taken out from the carrier. The used carrier is picked up from the standby transport path connecting the second standby section and the first standby section and cleaned. The cleaned carrier returns to the standby transport path.

Description

Substrate processing equipment

The present invention relates to a substrate processing device for processing a plurality of substrates in a processing tank.

A substrate processing apparatus is used to perform various processes on substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates for liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, mask substrates, ceramic substrates, or solar cell substrates.

As such a substrate processing device, there is a batch type substrate processing device that immerses a plurality of substrates in a processing liquid stored in a processing tank and performs processing such as etching. For example, the batch type substrate processing device described in Patent Document 1 includes a wafer transfer box holding unit, a substrate processing unit, and a loading and unloading mechanism. The wafer transfer box holding unit is configured to hold a wafer transfer box (FOUP: Front Opening Unified Pod). The wafer transfer box is configured as a storage device that can hold and store a plurality of substrates in a horizontal position in a manner that the plurality of substrates are arranged at a specified interval in the vertical direction.

In the substrate processing device, a wafer transfer box containing a plurality of unprocessed substrates is supplied to a wafer transfer box holding part and held. In this state, a plurality of substrates are taken out from the wafer transfer box by a hand provided by a loading and unloading mechanism. The hand is configured to hold a plurality of substrates at a time. The plurality of substrates taken out by the hand are transferred to the substrate processing part via a plurality of conveying mechanisms and a supporting mechanism.

The substrate processing unit has a plurality of processing tanks and a main transport mechanism. In each of the plurality of processing tanks, a processing liquid for performing a predetermined processing on the substrate is stored. Each of the plurality of unprocessed substrates transferred to the substrate processing unit is transported to a position above any one of the plurality of processing tanks by the main transport mechanism. The main transport mechanism is the same as the above-mentioned hand and is also configured to hold a plurality of substrates at a time.

The plurality of substrates transported to a position above any one of the plurality of processing tanks are immersed in the processing liquid in the processing tank located below the plurality of substrates for a certain period of time and then lifted up. In this way, the plurality of substrates are subjected to a predetermined process. The processed plurality of substrates are taken out from the substrate processing section and inserted into an empty wafer transfer box held in the wafer transfer box holding section through a plurality of transport mechanisms and support mechanisms. The wafer transfer box containing the processed plurality of substrates is transported out from the substrate processing device.

[Patent Document 1] Japanese Patent Publication No. 2011-238945

[The problem the invention is trying to solve]

As described above, in the substrate processing apparatus described in Patent Document 1, a plurality of substrates are transferred between a plurality of transport mechanisms. The plurality of transport mechanisms have a relatively complex structure in order to hold a plurality of substrates at a time. Such a complex structure makes the maintenance work such as cleaning of the plurality of transport mechanisms complicated.

Furthermore, in the above-mentioned substrate processing apparatus, a plurality of substrates are transferred multiple times between a plurality of components of the substrate processing apparatus including a plurality of transfer mechanisms. Therefore, each of the plurality of substrates taken out of the wafer cassette repeatedly contacts and leaves the plurality of components during the period from when the plurality of substrates are inserted into an empty wafer cassette. The repeated contact and separation of the plurality of components of such a substrate processing apparatus becomes a factor in the generation of particles.

Furthermore, when multiple components that contact multiple substrates are contaminated, the contaminants are transferred from the components to the multiple substrates, significantly reducing the cleanliness of the multiple substrates. Therefore, it is considered to clean each of the multiple components that contact the multiple substrates. However, if multiple cleaning mechanisms corresponding to the multiple components are respectively provided in the substrate processing device, the structure of the substrate processing device becomes complicated and the number of parts increases.

As a method for coping with this problem, it can be considered to collect and store a plurality of substrates on a carrier that can store a plurality of substrates and transport the plurality of substrates at a time.

However, there is a problem that the carrier itself is contaminated because the contaminants are transferred from the plurality of substrates or the processing tank to the carrier. The contaminants on the carrier are transferred to the substrate, which becomes a factor that reduces the quality of the substrate.

Furthermore, the treatment liquid attached to the carrier acts on the surface of the carrier, which may cause the surface of the carrier to deteriorate. Furthermore, when the treatment liquid is a plating liquid, the plating may adhere to the surface of the carrier and grow.

Thus, in the previous substrate processing technology, no structure and method are provided to properly deal with the problem of carrier contamination or carrier deterioration.

Therefore, an object of the present invention is to provide a substrate processing apparatus that can prevent contamination of a plurality of substrates and suppress the complexity of the structure of the transfer mechanism and the increase in the number of parts.

Furthermore, another object of the present invention is to provide a substrate processing device that can clean the surface of a carrier and reset the surface state of the carrier in order to prevent the deterioration of the carrier that is configured to accommodate a plurality of substrates. [Technical means for solving the problem]

(1) According to one aspect of the present invention, a substrate processing device performs a preset processing on a plurality of substrates and comprises: a carrier configured to accommodate a plurality of substrates; a conveying mechanism configured to convey the carrier from a starting point to an end point of a preset first conveying path along the first conveying path; a processing unit configured to perform a preset processing on the plurality of substrates accommodated in the carrier while the plurality of substrates are accommodated in the carrier; a substrate inserting unit configured to insert the plurality of unprocessed substrates transported into the substrate processing device into an empty carrier; and a first standby unit configured to be adjacent to the starting point of the first conveying path and configured to support the plurality of unprocessed substrates accommodated in the carrier by the substrate inserting unit. The first conveying path is provided with a carrier for receiving a plurality of substrates after processing, and the carrier is transferred to the starting point of the first conveying path; the second standby part is arranged in a manner adjacent to the end point of the first conveying path, and is configured to receive and support the carrier containing a plurality of substrates after processing from the end point of the first conveying path; the substrate taking-out part takes out the substrates after processing from the carrier containing a plurality of substrates after processing by the processing unit. A plurality of substrates; and a carrier cleaning section that cleans the carriers; and forms a preset second transport path for transporting the carriers from the second standby section to the first standby section; the carrier cleaning section picks up an empty carrier from the second transport path after the plurality of substrates that have been taken out and processed by the substrate taking-out section, cleans the picked-up carrier, and returns the cleaned carrier to the second transport path.

In the substrate processing device, multiple unprocessed substrates are moved in and inserted into an empty carrier through a substrate insertion portion. The carrier storing the multiple unprocessed substrates is supported by the first standby portion and transferred to the starting point of the first conveying path. The carrier storing the multiple substrates is conveyed from the starting point of the first conveying path toward the end point. In this case, the conveying mechanism can process the multiple substrates as a whole by conveying the carrier storing the multiple substrates. Therefore, the conveying mechanism does not need to be a complicated structure for integrally and directly holding the multiple substrates. While the carrier is being conveyed from the starting point to the end point of the first conveying path, the multiple substrates stored in the carrier are subjected to preset processing by the processing unit.

The carrier storing the processed plurality of substrates is received by the second standby section from the end point of the first conveying path and supported by the second standby section. The processed plurality of substrates are taken out from the carrier by the substrate taking-out section. The empty carrier is conveyed from the second standby section to the first standby section on the second conveying path. In the middle of the conveyance, the empty carrier is picked up from the second conveying path and cleaned by the carrier cleaning section. Furthermore, the cleaned empty carrier is returned to the second conveying path. In this case, the cleaned empty carrier conveyed to the first standby section via the second conveying path can be used to insert the unprocessed plurality of substrates. In this way, since the carrier can be reused, there is no need to prepare a plurality of carriers. Furthermore, since the reused carrier is cleaned, contamination of a plurality of substrates caused by the reused carrier can be prevented.

As a result, contamination of a plurality of substrates can be prevented, and the complexity of the structure of the conveying mechanism and the increase in the number of parts can be suppressed.

Furthermore, according to the above structure, the carrier used for processing a plurality of substrates can be cleaned each time the carrier is used for processing a plurality of substrates. Thus, since the surface state of the carrier is reset each time the plurality of substrates are processed, the degradation of the carrier caused by contamination or corrosion can be suppressed.

(2) Alternatively, the carrier cleaning section may include: a cleaning tank storing a cleaning liquid for cleaning the carrier; and a carrier transport device configured to immerse the carrier in the cleaning liquid in the treatment tank and lift the carrier immersed in the cleaning liquid from the cleaning liquid.

In this case, in the carrier cleaning section, the carrier can be cleaned with a simple structure and a simple method by immersing the carrier in the cleaning liquid in the cleaning tank for a certain period of time.

(3) The carrier cleaning section may further include a carrier drying section for drying the cleaned carrier. In this case, dust is less likely to adhere to the cleaned carrier, thereby suppressing the cleanliness of the cleaned carrier from being reduced.

(4) The carrier cleaning section may further include a carrier standby section for making the cleaned carrier standby. In this case, the cleaned carrier may standby in the carrier cleaning section. Thus, the cleaned carrier may be returned to the second transport path at an appropriate timing.

(5) Alternatively, the carrier cleaning section may pick up an empty carrier from the second standby section in the second transport path. In this case, since the second standby section is at the starting point of the second transport path, it is prevented that a carrier used to process a plurality of substrates is transported over a wide range of the second transport path in an unwashed state. Therefore, contamination of the second transport path is suppressed.

(6) Alternatively, the carrier cleaning section may return the cleaned carrier to the first standby section in the second conveying path. In this case, since the first standby section is at the end of the second conveying path, the cleaned carrier is not conveyed over the wide range of the second conveying path. Therefore, the cleanliness of the cleaned carrier can be maintained without reducing the cleanliness of the carrier, and the carrier can accommodate a plurality of unprocessed substrates. [Effect of the invention]

According to the present invention, contamination of a plurality of substrates can be prevented, and the complexity of the structure of the conveying device and the increase in the number of parts can be suppressed.

Hereinafter, a substrate processing device according to an embodiment of the present invention will be described with reference to the drawings. In the following description, a substrate refers to a FPD (Flat Panel Display) substrate, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a mask substrate, a ceramic substrate, or a solar cell substrate, etc., which is used for a liquid crystal display device or an organic EL (Electro Luminescence) display device. In addition, the substrate described below has a rectangular shape when viewed from above.

<1> Structure of substrate processing apparatus (1) Definition of overall structure and direction FIG. 1 is a schematic top view showing the basic structure of a substrate processing apparatus of one embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus 1 at line A-A of FIG. 1 . As shown in FIG. 1 and FIG. 2 , the substrate processing apparatus 1 mainly includes a substrate loading and unloading block 100, a relay block 200, a processing block 300, and a cleaning block 400.

Here, in the designated figures after FIG. 1 and FIG. 2, in order to clarify the positional relationship of each component of the substrate processing device 1, arrows representing mutually orthogonal X direction, Y direction and Z direction are marked. The X direction and the Y direction are mutually orthogonal in the horizontal plane, and the Z direction is equivalent to the vertical direction. Moreover, in each direction, the direction pointed by the arrow is set as the + direction, and the direction opposite to the + direction is set as the - direction. In the following description, when it is simply referred to as the X direction, the X direction includes the +X direction and the -X direction. Moreover, when it is simply referred to as the Y direction, the Y direction includes the +Y direction and the -Y direction. Moreover, when it is simply referred to as the Z direction, the Z direction includes the +Z direction and the -Z direction.

(2) Substrate loading and unloading block 100 The substrate loading and unloading block 100 includes a plurality of wafer cassette racks 110, wafer cassette transport devices 111, 112, openers 120, 130, substrate transfer robots 140, 150, two wafer cassette loading units 190, and a control unit 160 (Figure 2). In addition, the substrate loading and unloading block 100 has an end portion 101, a side portion 102, and another side portion 103 that constitute a part of the outer wall of the substrate processing device 1. The end portion 101 is located at one end of the substrate processing device 1 facing the -X direction and is orthogonal to the X direction. The side portion 102 and the other side portion 103 extend parallel to each other in the Y direction from both ends of the end portion 101 in a plan view toward the +X direction.

Two wafer cassette loading sections 190 are provided so as to protrude from the end surface 101 in the -X direction. Each wafer cassette loading section 190 is configured to load a wafer cassette (FOUP: Front Opening Unified Pod) 8 that can store multiple substrates in multiple stages. In the end surface 101, at a portion corresponding to each wafer cassette loading section 190, a passage opening (not shown) is formed for allowing the wafer cassette 8 to pass in the X direction.

The wafer transfer box 8 has an opening for taking out a substrate from the inner space of the wafer transfer box 8 and for inserting a substrate into the inner space of the wafer transfer box 8. The wafer transfer box 8 also includes a cover for opening and closing the opening. The opening of the wafer transfer box 8 is closed when the wafer transfer box 8 is being transported and on standby, and is opened when taking out and inserting a substrate into the wafer transfer box 8. In FIG. 1 and FIG. 2, in order to clearly distinguish the wafer transfer box 8 from the carrier 9 described later, the wafer transfer box 8 is marked with a hatched line, and the carrier 9 is marked with a dot pattern. In the example of FIG. 1 , one of the two wafer cassette loading sections 190 arranged in the Y direction has a wafer cassette 8 loaded thereon, and the other wafer cassette loading section 190 has no wafer cassette 8 loaded thereon. The number of wafer cassettes 8 or the arrangement of the wafer cassette racks 110 may be appropriately changed according to the device design specifications.

A plurality of wafer transfer box racks 110 are arranged at a predetermined distance from the end surface portion 101 in the +X direction in a manner of being spaced apart from each other. In this example, 16 wafer transfer box racks 110 are arranged in 4 rows and 4 columns in a plane parallel to the Z direction and the Y direction and are fixed by a fixing member not shown in the figure. Each wafer transfer box rack 110 is configured to carry a wafer transfer box 8. In the example of FIG. 1 , three of the four wafer transfer box racks 110 located at the uppermost stage are each loaded with a wafer transfer box 8, and the remaining one wafer transfer box rack 110 is not loaded with a wafer transfer box 8.

Two openers 120 and 130 are arranged at a predetermined distance from a plurality of wafer cassette racks 110 in the +X direction and are spaced apart from each other. In this example, the two openers 120 and 130 are arranged in the Y direction and fixed by a fixing member not shown. One opener 120 is located near one side surface 102, and the other opener 130 is located near the other side surface 103. Each opener 120 and 130 is configured to carry a wafer cassette 8 and to open and close the cover of the carried wafer cassette 8. In the example of FIG. 1 , a wafer cassette 8 is carried on one opener 120, and no wafer cassette 8 is carried on the other opener 130.

The substrate transfer robot 140 is arranged adjacent to the switch 120 in the +X direction. The substrate transfer robot 140 is configured to be rotatable around an axis in the Z direction and movable (liftable) in the Z direction. The substrate transfer robot 140 is provided with a hand for transferring one or more substrates. The hand is supported by a multi-joint arm and can move forward and backward in the horizontal direction. The substrate transfer robot 140 is used to take out a substrate from a wafer transfer box 8 containing unprocessed substrates while the wafer transfer box 8 is placed on the switch 120, and insert the taken-out substrate into a carrier 9 described later and arranged in the relay block 200.

The substrate transfer robot 150 is disposed adjacent to the shutter 130 in the +X direction. The substrate transfer robot 150 has the same structure as the substrate transfer robot 140. The substrate transfer robot 150 is used to take out a substrate from a carrier 9 (described later) disposed in the relay block 200 while an empty wafer cassette 8 is placed on the shutter 130, and insert the taken-out substrate into the wafer cassette 8 on the shutter 130.

The wafer cassette transport device 111 is located between the end surface portion 101 in the X direction and the plurality of wafer cassette racks 110. The wafer cassette transport device 111 has a holding portion (not shown) configured to hold the wafer cassette 8, and is configured to move the holding portion in the Y direction and in the Z direction. Thus, the wafer cassette transport device 111 transports the wafer cassette 8 between any one of the two wafer cassette placement portions 190 and any one of the plurality of wafer cassette racks 110.

The wafer cassette transport device 112 is located between the plurality of wafer cassette racks 110 and the two shutters 120 and 130 in the X direction. The wafer cassette transport device 112 has the same structure as the wafer cassette transport device 111. The wafer cassette transport device 112 transports the wafer cassette 8 between any one of the plurality of wafer cassette racks 110 and any one of the two shutters 120 and 130.

The control unit 160 ( FIG. 2 ) includes a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory), and controls the operation of each component in the substrate processing apparatus 1 .

(3) Relay block 200 The relay block 200 mainly includes two carrier support sections 210 and 220, a first standby section 230, a second standby section 240, and a standby conveyor 250. The carrier support section 210 is disposed adjacent to the substrate transfer robot 140 of the substrate loading and unloading block 100 in the +X direction. In addition, the carrier support section 210 is configured to support a carrier 9 that stores a plurality of substrates in multiple stages. The details of the carrier 9 will be described later. Furthermore, the carrier support section 210 is configured to support the carrier 9 and change the posture of the supported carrier 9. The details of the structure of the carrier support section 210 for changing the posture of the carrier 9 will be described later. In addition, in the example of FIG. 1 , a carrier 9 is supported on the carrier support portion 210 .

The carrier support part 220 is disposed adjacent to the substrate transfer robot 150 of the substrate loading/unloading block 100 in the +X direction. The carrier support part 220 has the same structure as the carrier support part 210. In the example of FIG. 1 , the carrier 9 is not supported on the carrier support part 220.

The first standby section 230 is disposed adjacent to the carrier support section 210 in the +X direction. The first standby section 230 is configured to support the carrier 9. Furthermore, the first standby section 230 is configured to transfer the carrier 9 supported by the first standby section 230 to the carrier support section 210 and receive the carrier 9 supported by the carrier support section 210 from the carrier support section 210.

The second standby section 240 is disposed adjacent to the carrier support section 220 in the +X direction. The second standby section 240 is configured to support the carrier 9. Furthermore, the second standby section 240 is configured to transfer the carrier 9 supported by the second standby section 240 to the carrier support section 220 and receive the carrier 9 supported by the carrier support section 220 from the carrier support section 220.

The standby conveying device 250 is provided between the first standby section 230 and the second standby section 240. The standby conveying device 250 is configured to hold the carrier 9 and to be movable in the Y direction between the first standby section 230 and the second standby section 240. The standby conveying device 250 conveys the carrier 9 supported by the second standby section 240 to the first standby section 230, for example.

(4) Processing block 300 The processing block 300 includes a first conveying unit 310, a second conveying unit 320, and a processing unit 330. The first conveying unit 310 and the processing unit 330 are arranged in sequence in the +Y direction and extend in parallel from the relay block 200 in the +X direction. The second conveying unit 320 is formed in a manner extending in the Y direction, connecting the end of the first conveying unit 310 facing the +X direction and the end of the processing unit 330 facing the +X direction.

In the following description, of the two ends of the first conveying unit 310 extending in the X direction, the end facing the -X direction is appropriately referred to as the first end TA1, and the other end facing the +X direction is appropriately referred to as the second end TA2. In addition, of the two ends of the processing unit 330 extending in the X direction, one end facing the -X direction is appropriately referred to as the third end TA3, and the other end facing the +X direction is appropriately referred to as the fourth end TA4.

The first conveying section 310 includes a main conveying device 311 and two auxiliary conveying devices 312A and 312B. The main conveying device 311 includes a movable stage 311a and a guide rail 311b. The guide rail 311b is provided to extend from the first end TA1 to the second end TA2 of the first conveying section 310. The movable stage 311a is configured to be movable in the X direction on the guide rail 311b and to carry the carrier 9. The main conveying device 311 further includes a driving mechanism (not shown) that moves the movable stage 311a along the guide rail 311b in the X direction. Thereby, when the main transport device 311 places the carrier 9 on the movable stage 311 a at the first end TA1 close to the relay block 200 , the placed carrier 9 is transported in the +X direction to the second end TA2 close to the second transport unit 320 .

The auxiliary conveying device 312A and the auxiliary conveying device 312B are respectively provided at the first end TA1 and the second end TA2 of the first conveying section 310 in the X direction. When the carrier support section 210 supports the carrier 9 storing an unprocessed substrate, the auxiliary conveying device 312A places the carrier 9 on the movable stage 311a of the main conveying device 311 arranged at the first end TA1. In addition, the auxiliary conveying device 312A conveys an empty carrier 9 from the first standby section 230 to the carrier support section 210. On the other hand, when the movable stage 311a carrying the carrier 9 moves to the second end TA2, the auxiliary conveying device 312B transfers the carrier 9 to the conveying device 321 described later of the second conveying section 320.

Here, as shown in FIG. 2 , the first conveying unit 310 is disposed at a position separated from the installation surface of the substrate processing apparatus 1 in the +Z direction (upper direction). Thus, the space located in the -Z direction (lower direction) of the first conveying unit 310 can be used as a maintenance space MS1 for maintaining the processing unit 330 described later. Therefore, in the substrate processing apparatus 1 of the present embodiment, as shown in FIG. 1 , the first conveying unit 310 and the maintenance space MS1 of the processing unit 330 overlap in a top view. In FIG. 8 described later, in the maintenance space MS1, an operator WP performing maintenance work on the processing unit 330 is shown below the first conveying unit 310.

The second conveying section 320 includes a conveying device 321. The conveying device 321 is configured to support the carrier 9 and change the posture of the supported carrier 9. The details of the structure of the conveying device 321 for changing the posture of the carrier 9 will be described later. Furthermore, the conveying device 321 is configured to be movable in the Y direction. Thereby, the second conveying section 320 can receive the carrier 9 from the auxiliary conveying device 312B near the second end TA2 of the first conveying section 310. In addition, the second conveying section 320 can change the posture of the carrier 9 received from the auxiliary conveying device 312B and move the carrier 9 to a position near the fourth end TA4 of the processing section 330.

The processing section 330 includes a plurality of (five in this example) liquid processing units 331, a drying unit 332, and a plurality of (three in this example) main transport devices 333A, 333B, and 333C. The plurality of liquid processing units 331 and the drying unit 332 are arranged in the X direction such that the drying unit 332 is located at the third end TA3.

The plurality of main transport devices 333A, 333B, and 333C are arranged in sequence from the third end TA3 toward the fourth end TA4 on a straight line extending in the +X direction. Each of the main transport devices 333A, 333B, and 333C is configured to hold the carrier 9 and to transport the held carrier 9 between the plurality of liquid processing units 331 and the drying unit 332. The main transport device 333C located at the farthest position from the relay block 200 receives the carrier 9 when the second transport unit 320 transports the carrier 9 to the vicinity of the processing unit 330. Furthermore, the main transport device 333C transports the received carrier 9 to any one of the plurality of liquid processing units 331.

Each of the plurality of liquid processing units 331 has one or more processing tanks 331a and an elevator 331b. In this example, each liquid processing unit 331 has two processing tanks 331a. Each processing tank 331a is configured so that the carrier 9 can be inserted and removed from the upper position of the processing tank 331a. In addition, the processing tank 331a stores a processing liquid (chemical liquid or cleaning liquid) for cleaning the plurality of substrates stored in the carrier 9.

The lift 331b of each liquid processing unit 331 is configured to hold the carrier 9. Furthermore, the lift 331b is configured to receive the carrier 9 from any one of the plurality of main transport devices 333A, 333B, and 333C, and to transfer the carrier 9 to any one of the plurality of main transport devices 333A, 333B, and 333C. Furthermore, the lift 331b is configured to immerse the carrier 9 in the processing liquid and to lift the carrier 9 from the processing liquid for each of the two processing tanks 331a of the liquid processing unit 331. Thus, by transferring the carrier 9 containing the unprocessed substrate to the processing unit 330, the plurality of substrates stored in the carrier 9 are immersed in one or more processing liquids for a predetermined time, and the plurality of substrates are subjected to a common process.

The drying unit 332 performs a drying process on the carrier 9 transported by the main transport device 333A located closest to the relay block 200. The plurality of substrates stored in the carrier 9 are dried by the drying process. The carrier 9 after the drying process is transferred to the second standby unit 240 of the relay block 200 by the main transport device 333A located closest to the relay block 200.

Here, in the plurality of processing tanks 331a of the plurality of liquid processing units 331, a plurality of processing liquids corresponding to the plurality of processing to be performed on the substrate are stored in the order of the processing to be performed on the substrate in the -X direction. The control unit 160 of FIG. 2 allows each of the main transport devices 333A, 333B, and 333C to move in the -X direction while holding the carrier 9, and restricts the movement in the +X direction while holding the carrier 9. In this case, when the plurality of carriers 9 are transported by the plurality of main transport devices 333A, 333B, and 333C, the generation of interference caused by one carrier 9 and another carrier 9 moving in opposite directions is suppressed. In addition, since the carrier 9 does not reciprocate in the X direction in the processing section 330, the length of the transport path of the carrier 9 in the processing section 330 does not exceed the length of the processing section 330 in the X direction.

As shown by the dotted line in FIG1 , in the processing block 300 and the vicinity thereof, in addition to the maintenance space MS1, a maintenance space MS2 is formed laterally in the +Y direction of the processing section 330. In this way, by forming two maintenance spaces MS1 and MS2 in a manner that separates the processing section 330 in the Y direction, a sufficiently large maintenance space is ensured for the processing section 330.

(5) Cleaning block 400 The cleaning block 400 includes a cleaning conveying device 410 and a carrier cleaning unit 420. The carrier cleaning unit 420 is provided to extend in the X direction at a position to the side (+Y direction) of the substrate loading and unloading block 100 and the relay block 200. In addition, the carrier cleaning unit 420 includes one or more (three in this example) carrier cleaning tanks 421 arranged in the X direction, one or more (one in this example) carrier drying sections 422, and one or more (two in this example) carrier standby sections 423.

Each of one or more carrier cleaning tanks 421, one or more carrier drying sections 422, and one or more carrier standby sections 423 is configured to allow the carrier 9 to be inserted and removed from a position above the tank, drying section, or standby section. In addition, each of one or more carrier cleaning tanks 421 stores a treatment liquid (chemical solution or cleaning liquid) for cleaning the carrier 9. Each of one or more carrier drying sections 422 performs a drying process on the inserted carrier 9.

The cleaning and transporting device 410 is configured to transport an empty carrier 9 between the second standby section 240, one or more carrier cleaning tanks 421, one or more carrier drying sections 422, and one or more carrier standby sections 423 of the relay block 200. In the cleaning block 400, the empty carrier 9 is transported between the plurality of carrier cleaning tanks 421 and immersed in the processing liquid stored in any one of the one or more carrier cleaning tanks 421. In this way, the empty carrier 9 after being used to process a plurality of substrates in the processing block 300 is cleaned.

The cleaned carrier 9 is transported to one or more carrier drying sections 422 for drying. The dried carrier 9 is transported to one or more carrier standby sections 423 for holding. Thereafter, the carrier 9 is taken out from the carrier standby section 423 by the cleaning transport device 410 according to the receiving sequence of the plurality of substrates in the relay block 200 and transported to the second standby section 240 of the relay block 200.

<2> Structure of carrier 9 and posture of carrier 9 FIG. 3 is a top view of carrier 9 used in substrate processing device 1 of FIG. 1 , FIG. 4 is a side view of carrier 9 of FIG. 3 , and FIG. 5 is a cross-sectional view of carrier 9 at line B-B of FIG. 4 . As shown in FIG. 3 to FIG. 5 , carrier 9 includes four frame members 10a, 10b, 10c, and 10d.

Each of the frame members 10a and 10b is formed of a substantially square plate-shaped member and has a larger shape than the substrate to be processed. Four openings 13 are formed in the central portion of each of the frame members 10a and 10b. Each of the frame members 10c and 10d is formed of a substantially rectangular plate-shaped member. The length of the long side of the frame members 10c and 10d is substantially equal to the length of one side of the frame members 10a and 10b.

The frame members 10a and 10b are arranged to be spaced apart in a mutually opposed state. The frame member 10c is provided in a manner that one side of the frame member 10a is connected to one side of the frame member 10b. The frame member 10d is provided in a manner that the other side of the frame member 10a is connected to the other side of the frame member 10b. In this state, the frame members 10c and 10d are also arranged to be mutually opposed. Thereby, the carrier 9 has a square tube shape.

The rectangular opening formed at one end of the carrier 9 having a square tube shape functions as a substrate entrance 12 for inserting a substrate into the carrier 9 and for taking a substrate out of the carrier 9. At the other end of the carrier 9, a plurality of (six in this example) supporting pieces 11 are provided in a manner connecting the frame members 10a and 10b and dispersedly arranged between the frame members 10c and 10d.

Each support sheet 11 is formed of a long strip plate member and is arranged parallel to the frame members 10c and 10d. In addition, each support sheet 11 is provided with a plurality of grooves (not shown) at a preset reference pitch into which a portion of the outer edges of the plurality of substrates to be accommodated in the carrier 9 can be inserted. The number of grooves formed in each support sheet 11 is equal to the number of substrates to be accommodated in the carrier 9.

A plurality of protrusions pr are formed on each of the two mutually facing surfaces of the frame members 10c and 10d. The plurality of protrusions pr are formed to extend along the long side direction of the frame members 10c and 10d and are arranged in the short side direction at the above-mentioned reference pitch. Thus, a groove into which the outer edge of the substrate can be inserted is formed between each two adjacent protrusions pr.

As described above, in the substrate processing apparatus 1 of FIG. 1 , the posture of the carrier 9 is appropriately changed. Here, regarding the carrier 9 having the above-mentioned structure, the posture in which the plurality of support pieces 11 are located at the lower end and the frame members 10a, 10b are maintained in parallel with the vertical direction is referred to as the vertical posture. On the other hand, the posture in which the frame members 10a, 10b are maintained in a manner perpendicular to the vertical direction is referred to as the horizontal posture.

When inserting a plurality of substrates into an empty carrier 9, the plurality of substrates are inserted into the carrier 9 from the substrate entrance 12 of the carrier 9 in a horizontal position. At this time, the two side portions (parts of two sides facing each other) of the outer edge of each substrate are inserted between any two of the plurality of protrusions pr of the frame member 10c and between any two of the plurality of protrusions pr of the frame member 10d. Thus, when the carrier 9 storing the plurality of substrates is in a horizontal position, each substrate is held in a state where the two side portions of the substrate are supported by the plurality of protrusions pr. On the other hand, when the carrier 9 storing the plurality of substrates is in a vertical position, each substrate is held in a state where the plurality of portions of the lower end of the substrate are embedded in the plurality of grooves of the plurality of support sheets 11.

As described above, when the carrier 9 is in a horizontal position, both sides of each of the plurality of substrates stored are entirely supported by the plurality of protrusions pr. On the other hand, when the carrier 9 is in a vertical position, each of the plurality of substrates stored is partially supported at a plurality of portions of the lower end of the substrate by the plurality of support sheets 11. Therefore, when the carrier 9 is in a horizontal position, the load (load of the self-weight of each substrate) applied to the outer edge of each stored substrate is reduced compared to the case where the carrier 9 is in a vertical position.

The carrier 9 of this embodiment is formed so that the dimension (height) of the carrier 9 in the vertical direction when in a horizontal position is smaller than the dimension (height) of the carrier 9 in the vertical direction when in a vertical position.

<3> Conveying path of multiple substrates and carrier 9 in substrate processing device Figures 6 to 8 are used to illustrate the conveying path of multiple substrates and carrier 9 in substrate processing device 1 of Figure 1. Figure 6 shows a schematic top view of substrate processing device 1 as in Figure 1. Figure 7 shows a schematic external perspective view of substrate processing device 1 of Figure 1 observed from one direction. Figure 8 shows a schematic external perspective view of substrate processing device 1 of Figure 1 observed from another direction. In addition, in Figures 7 and 8, the illustration of cleaning block 400 of Figure 1 is omitted. Furthermore, in Figures 6 to 8, except for maintenance space MS1 of Figure 8, the illustration of maintenance spaces MS1 and MS2 of Figure 1 is also omitted.

Imagine a situation where a series of processes are performed on a plurality of unprocessed substrates W stored in a wafer transfer box 8. In this situation, a wafer transfer box 8 is moved into the substrate loading and unloading block 100, and as shown in FIG6, is placed on the opening and closing device 120, and the lid is opened. In addition, an empty carrier 9 is supported in a horizontal position on the carrier support portion 210 of the relay block 200. At this time, the substrate entrance 12 (FIG. 5) of the carrier 9 is oriented in the -X direction in a manner opposite to the wafer transfer box 8. In this state, the substrate transfer robot 140 takes out a plurality of unprocessed substrates W from a wafer transfer box 8 and inserts them into the carrier 9. The thick dashed arrow a1 in FIG6 to FIG8 indicates the transfer path of the plurality of substrates W at this time.

After that, the empty wafer cassette 8 closes its lid, is held by the wafer cassette transfer device 112, and is placed on any one of the plurality of wafer cassette racks 110. On the other hand, the carrier 9 containing the plurality of substrates W is received by the carrier support 210, and is placed on the movable stage 311a of the main transfer device 311 by the auxiliary transfer device 312A of the first transfer unit 310. The thick solid arrow a2 in FIGS. 6 to 8 indicates the transfer path of the carrier 9 at this time.

Next, the carrier 9 placed on the movable stage 311a is transported in a horizontal position in the +X direction from a position near the intermediate block 200 (first end TA1) to a position near the second transport unit 320 (second end TA2). In the dialog box BA3 of FIG. 8 , the state of the carrier 9 transported by the main transport device 311 of the first transport unit 310 is displayed.

Thereafter, the carrier 9 that has reached the vicinity of the second conveying unit 320 is transferred to the conveying device 321 of the second conveying unit 320 by the auxiliary conveying device 312B of the first conveying unit 310. Therefore, the posture of the carrier 9 transferred to the conveying device 321 is changed from the horizontal posture to the vertical posture by the conveying device 321. In the dialog box BA2 of FIG. 7 , the state of the posture change of the carrier 9 in the conveying device 321 is schematically displayed.

As shown in the dialog box BA2 of FIG. 7 , the conveying device 321 includes a movable pedestal 322 and a carrier holder 323. The movable pedestal 322 is configured to be movable in the Y direction within the second conveying section 320. The carrier holder 323 is composed of a first holder 323a and a second holder 323b. The first holder 323a has a rectangular flat plate shape that can hold the lower end of the carrier 9 when it is in a horizontal position. In addition, the second holder 323b has a rectangular flat plate shape that can hold the lower end of the carrier 9 when it is in a vertical position.

The first holding portion 323a and the second holding portion 323b are connected in a manner that one side of the first holding portion 323a and one side of the second holding portion 323b are connected to each other and the two holding portions are orthogonal to each other. The movable pedestal 322 holds a portion of the carrier holder 323 in a manner that the first holding portion 323a and the second holding portion 323b are parallel to the Y direction and the carrier holder 323 can rotate around an axis extending in the Y direction.

The conveying device 321 further has a driving portion (not shown) that can adjust the rotation angle of the carrier holder 323 on the movable pedestal 322. Thereby, when receiving the carrier 9 in a horizontal position from the first conveying portion 310, the carrier holder 323 adjusts the rotation angle in a manner that the first holding portion 323a becomes horizontal and the second holding portion 323b becomes vertical. Thereafter, after receiving the carrier 9 in a horizontal position on the carrier holder 323, the carrier holder 323 adjusts the rotation angle in a manner that the first holding portion 323a becomes vertical and the second holding portion 323b becomes horizontal. Thereby, the posture of the carrier 9 is changed from a horizontal posture to a vertical posture.

The conveying device 321 further includes a driving unit (not shown) for moving the movable pedestal 322 in the Y direction on the second conveying unit 320. Thus, the carrier 9 maintained in a vertical position is conveyed in a vertical position in the +Y direction from a position near the first conveying unit 310 to a position near the processing unit 330.

Thereafter, the carrier 9 that has arrived at the vicinity of the processing section 330 is received from the conveying device 321 by the main conveying device 333C of the processing section 330. The carrier 9 received by the main conveying device 333C is conveyed to one or more liquid processing units 331 by the main conveying device 333C and other main conveying devices 333B and 333A, and is immersed in various processing liquids for a predetermined period of time while maintaining a lead-up posture. In this way, the plurality of substrates W stored in the carrier 9 are processed according to the immersed processing liquid. In the dialog box BA4 of FIG. 8 , the state of the carrier 9 conveyed by the main conveying devices 333A, 333B, and 333C of the processing section 330 is displayed.

As shown in the dialog box BA4 of FIG8 , each main transport device 333A, 333B, 333C includes a movable support column 333a and a pair of chuck components 333b. The movable support column 333a is movable in the X direction and movable in the Z direction (can be raised and lowered) and is disposed on the side (+Y direction side) of the plurality of liquid processing units 331. A pair of chuck components 333b is disposed in a manner extending from the upper end of the movable support column 333a to the upper side of the liquid processing unit 331. The pair of chuck components 333b is configured to clamp and maintain the carrier 9 in an upright position. Furthermore, each main transport device 333A, 333B, 333C has a driving unit (not shown) that can switch to hold the carrier 9 through a pair of chuck components 333b and release the carrier 9 from the pair of chuck components 333b. In this way, the carrier 9 is transferred between the plurality of main transport devices 333A, 333B, 333C and the plurality of liquid processing units 331.

Thereafter, the carrier 9 containing the plurality of substrates W treated by the treatment liquid is further transported to the drying unit 332 near the intermediate block 200. Thus, the carrier 9 and the plurality of substrates W in the carrier 9 are dried by the drying unit 332. As described above, the arrow a3 in the thick solid line in FIGS. 6 to 8 indicates a series of transport paths of the carrier 9 in the treatment block 300.

The carrier 9 containing the processed substrates W is transferred from the drying unit 332 to the carrier support 220 of the intermediate block 200 by the main transfer device 333A, and is supported by the carrier support 220. The bold dashed arrow a4 in FIG6 to FIG8 indicates the transfer path of the carrier 9 at this time.

Therefore, the posture of the carrier 9 transferred to the carrier support unit 220 is changed from the upright posture to the horizontal posture by the carrier support unit 220. In the dialog box BA1 of FIG. 7 , the state of the posture change of the carrier 9 in the carrier support unit 220 is schematically displayed.

As shown in the dialog box BA1 of FIG. 7 , the carrier support part 220 includes a fixed base 211 fixed in the relay block 200 and a carrier holder 212. The carrier holder 212 is composed of a first holder 212a and a second holder 212b. The first holder 212a has a rectangular flat plate shape that can hold the lower end of the carrier 9 in a horizontal position. In addition, the second holder 212b has a rectangular flat plate shape that can hold the lower end of the carrier 9 in a vertical position.

The first holding portion 212a and the second holding portion 212b are connected in a manner that one side of the first holding portion 212a and one side of the second holding portion 212b are connected to each other and the two holding portions are orthogonal to each other. The fixed base 211 holds a portion of the carrier holder 212 in a manner that the first holding portion 212a and the second holding portion 212b are parallel to the Y direction and the carrier holder 212 can rotate around an axis extending in the Y direction.

The carrier support portion 220 further has an unillustrated driving portion that can adjust the rotation angle of the carrier holder 212 on the fixed base 211. Thereby, when the carrier 9 in a lead-up position is received from the drying unit 332, the carrier holder 212 adjusts the rotation angle in a manner that the second holding portion 212b becomes horizontal and the first holding portion 212a becomes lead-up. Thereafter, after the carrier 9 in a lead-up position is received on the carrier holder 212, the carrier holder 212 adjusts the rotation angle in a manner that the second holding portion 212b becomes lead-up and the first holding portion 212a becomes horizontal. Thereby, the posture of the carrier 9 is changed from the lead-up position to the horizontal posture. At this time, the substrate inlet and outlet 12 (Figure 5) of the carrier 9 is facing the -X direction.

When the carrier 9 containing the plurality of substrates W is supported in a horizontal position on the carrier support portion 220, an empty wafer transfer box 8 is placed on the switch 130 of the substrate loading and unloading block 100. Furthermore, the cover of the wafer transfer box 8 is opened. In this state, the substrate transfer robot 150 takes out the processed plurality of substrates W from the carrier 9 and inserts them into the wafer transfer box 8 on the switch 130. The arrow a5 with a thick dashed line in Figures 6 to 8 indicates the transfer path of the plurality of substrates W at this time.

Thereafter, the wafer cassette 8 containing the plurality of processed substrates W has its lid closed, is held by the wafer cassette transport device 112, and is placed on any one of the plurality of wafer cassette racks 110. Furthermore, the wafer cassette 8 is transported to the wafer cassette placement section 190 by the wafer cassette transport device 111, and is unloaded from the substrate processing device 1. On the other hand, the empty carrier 9 in the carrier support section 220 is changed from a horizontal position to a vertical position by the carrier support section 220. The empty carrier 9 in the carrier support section 220 that has been restored to a vertical position is transported by the main transport device 333A and received by the second standby section 240.

The empty carrier 9 is preferably reused for processing a new plurality of substrates W. Therefore, the empty carrier 9 supported by the second standby section 240 is, for example, transported to the first standby section 230 by the standby transport device 250 and supported by the first standby section 230. Furthermore, it is transferred from the first standby section 230 to the carrier support section 210. In this way, a transport path for the carrier 9 for reusing the used carrier 9 is set in the relay block 200. The transport path for the carrier 9 from the first standby section 230 to the second standby section 240 (hereinafter referred to as the standby transport path) is indicated by a thicker two-point chain arrow b1 in FIG. 6 .

As described above, in the case of reusing the empty carrier 9 after use, in order to suppress the decrease in the cleanliness of the new plurality of substrates W to be processed, it is preferable to clean the carrier 9 before reusing it. Therefore, in this embodiment, the empty carrier 9 received from the carrier support part 220 by the second standby part 240 is maintained in a vertical position and is transported to the carrier cleaning unit 420 by the cleaning conveying device 410 of the cleaning block 400. In other words, the empty carrier 9 after use is picked up from the part of the second standby part 240 in the standby conveying path. The conveying path of the carrier 9 at this time is represented by the thicker one-dot chain arrow c1 in FIG. 6.

In the carrier cleaning unit 420, the carrier 9 is further transported between one or more carrier cleaning tanks 421, one or more carrier drying sections 422, and one or more carrier standby sections 423 by the cleaning and transporting device 410. In this way, the used carrier 9 is cleaned and dried. In addition, the cleaned and dried carrier 9 is stored in any one of the one or more carrier standby sections 423. In each carrier cleaning tank 421, each carrier drying section 422, and each carrier standby section 423, the upright posture of the carrier 9 is maintained.

Assume that a series of processes are performed on a plurality of unprocessed substrates W newly stored in other wafer transfer boxes 8. In this case, the cleaned carrier 9 stored in the carrier standby section 423 of the cleaning block 400 is transported from the carrier cleaning unit 420 to the second standby section 240 by the cleaning transfer device 410 as a new carrier 9. In other words, the empty carrier 9 after cleaning is returned to the second standby section 240 in the standby transfer path as a new carrier 9. The thicker dot chain arrow c2 in FIG6 indicates the transfer path of the new carrier 9 at this time.

The new carrier 9 transferred to the second standby section 240 maintains a vertical posture and is transferred to the first standby section 230 along the standby transfer path by the standby transfer device 250 (refer to the arrow b1 of the thicker two-point chain in FIG. 6 ). Furthermore, it is supported by the first standby section 230. The first standby section 230 transfers the new carrier 9 supported by the first standby section 230 to the carrier support section 210. Therefore, the new carrier 9 transferred to the carrier support section 210 changes its posture from a vertical posture to a horizontal posture by the carrier support section 210 in order to receive a plurality of unprocessed substrates W.

As described above, the two carrier support parts 210 and 220 in the relay block 200 have the same structure. Thus, in the carrier support part 210, as shown in the dialog box BA1 of FIG. 7, the posture of the new carrier 9 is changed. Thereafter, the unprocessed plurality of substrates W newly stored in other wafer cassettes 8 are inserted into the new carrier 9 in the horizontal posture.

The new carrier 9 storing the unprocessed plurality of substrates W is transported along a transport path indicated by a series of arrows a2, a3, and a4 shown in Fig. 6 to Fig. 8. Thus, the plurality of substrates W stored in the new carrier 9 are subjected to a series of processes.

<4> Effects (1) In the above-mentioned substrate processing device 1, while the empty carrier 9 is supported on the carrier support portion 210, the unprocessed plurality of substrates W in the wafer transfer box 8 are inserted into the empty carrier 9 by the substrate transfer robot 140. The carrier 9 containing the unprocessed plurality of substrates W is received by the first standby portion 230. Furthermore, the carrier 9 is received by the first end TA1 of the processing block 300. In the processing block 300, the carrier 9 is transported from the first end TA1 to the third end TA3 on the transport path of arrow a3 in FIG. 6. While the carrier 9 is being transported in the processing block 300, the plurality of substrates W stored in the carrier 9 are subjected to preset processing by various liquid processing units 331 and drying units 332.

In this case, each of the plurality of transfer devices (311, 321, 333A, 333B, 333C) in the processing block 300 can process the plurality of substrates W in an integrated manner by transferring the carrier 9 storing the plurality of substrates W. Therefore, each of the plurality of transfer devices (311, 321, 333A, 333B, 333C) does not need to be a complicated structure for directly holding the plurality of substrates W in an integrated manner.

The carrier 9 containing the processed plural substrates W is transferred from the third end TA3 of the processing block 300 to the second standby unit 240 and supported by the second standby unit 240. Furthermore, the carrier 9 containing the processed plural substrates W is transferred to the carrier support unit 220 and supported by it. When the empty wafer cassette 8 is placed on the shutter 130, the processed plural substrates W are taken out from the carrier 9 by the substrate transfer robot 150 and inserted into the empty wafer cassette 8.

The empty carrier 9 from which the processed plurality of substrates W have been taken out is transported from the second standby section 240 to the first standby section 230 along the transport path (standby transport path) indicated by the arrow b1 in FIG6 , for example. In this way, the carrier 9 can be reused.

Here, the substrate processing device 1 is provided with a cleaning block 400. The cleaning conveying device 410 of the cleaning block 400 picks up the empty carrier 9 on the standby conveying path from the standby conveying path and conveys it to the carrier cleaning unit 420. In the carrier cleaning unit 420, the empty carrier 9 after use is cleaned. Furthermore, the empty carrier 9 after cleaning is returned to the standby conveying path again. The carrier 9 returned to the standby conveying path is conveyed to the first standby section 230 along the standby conveying path. In this case, the empty carrier 9 after cleaning conveyed to the first standby section 230 can be used to insert a plurality of unprocessed substrates W.

As described above, in the substrate processing apparatus 1 of the present embodiment, since the carrier 9 can be reused, it is not necessary to prepare a plurality of carriers 9. Furthermore, since the reused carrier 9 can be cleaned, contamination of the plurality of substrates W caused by the reused carrier 9 can be prevented. As a result, contamination of the plurality of substrates W can be prevented, and the complexity of the structure of the plurality of transfer devices (311, 321, 333A, 333B, 333C) and the increase in the number of parts can be suppressed.

Furthermore, according to the substrate processing apparatus 1, the carrier 9 used for processing a plurality of substrates W can be cleaned each time the carrier 9 is used for processing a plurality of substrates W. Thus, since the surface state of the carrier 9 is reset each time the plurality of substrates W are processed, degradation of the carrier 9 due to contamination or corrosion can be suppressed.

(2) As described above, the carrier cleaning unit 420 includes one or more carrier cleaning tanks 421 and a cleaning conveying device 410. A treatment liquid is stored in each of the one or more carrier cleaning tanks 421. The cleaning conveying device 410 is configured to immerse the carrier 9 in the treatment liquid in each carrier cleaning tank 421 and to lift the carrier 9 from each carrier cleaning tank 421. Thus, in the carrier cleaning unit 420, the carrier 9 can be cleaned with a simple structure and a simple method.

(3) The carrier cleaning unit 420 includes one or more carrier drying sections 422. The carrier 9 cleaned in the carrier cleaning tank 421 can be dried by the one or more carrier drying sections 422. As a result, dust is less likely to adhere to the cleaned carrier 9. Therefore, the cleanliness of the cleaned carrier 9 is suppressed from decreasing.

(4) The carrier cleaning unit 420 includes one or more carrier standby sections 423. Thus, the cleaned carrier 9 can be placed on standby in the carrier cleaning unit 420. Therefore, the cleaned carrier 9 can be returned to the standby transport path at an appropriate timing.

(5) In the above-mentioned substrate processing apparatus 1, the cleaning and conveying device 410 picks up the empty carrier 9 after use from the second standby section 240. In this case, since the second standby section 240 is located at the starting point of the standby conveying path, it is prevented that the used carrier 9 is conveyed in an uncleaned state over a wide range of the standby conveying path. Therefore, contamination of the standby conveying path is suppressed.

<5> Other embodiments (1) In the substrate processing device 1 of the above embodiment, the carrier cleaning unit 420 is arranged at a position to the side (+Y direction) of the substrate loading and unloading block 100 and the relay block 200. In addition, the cleaning conveying device 410 picks up the used carrier 9 from the second standby section 240 in the standby conveying path, and returns the cleaned carrier 9 to the second standby section 240. However, in the substrate processing device 1 according to one aspect of the present invention, the configuration of the carrier cleaning unit 420 is not limited to the above example. In addition, the part of the standby conveying path that picks up the carrier 9 and the part of the standby conveying path that returns the carrier 9 are not limited to the above example.

FIG9 is a schematic top view showing the basic structure of another embodiment of the substrate processing apparatus 1. FIG10 is a schematic side view of the substrate processing apparatus 1 of FIG9. In FIG9 and FIG10, as in the examples of the respective figures of the substrate processing apparatus 1 of the above-mentioned embodiment, arrows indicating mutually orthogonal X-direction, Y-direction and Z-direction are marked. The schematic side view of FIG10 is a schematic side view of the substrate processing apparatus 1 of FIG9 observed in the +Y direction. The differences between another embodiment of the substrate processing apparatus 1 and the substrate processing apparatus 1 of the above-mentioned embodiment are described.

In the substrate processing apparatus 1 of this embodiment, the carrier cleaning unit 420 is disposed below the first conveying unit 310 of the processing block 300 instead of the position on the side (+Y direction) of the substrate loading and unloading block 100 and the relay block 200. Therefore, the carrier cleaning unit 420 of this example overlaps with the first conveying unit 310 in a plan view. In FIG. 9 , the first conveying unit 310 of the processing block 300 is shown in dotted lines for easy understanding of the arrangement of the carrier cleaning unit 420.

In addition, the carrier cleaning unit 420 of this example is arranged to be adjacent to the first standby section 230 of the relay block 200 in the +X direction. Furthermore, the carrier cleaning unit 420 of this example includes one or more (two in this example) carrier cleaning tanks 421, one or more (one in this example) carrier drying sections 422, and one or more (two in this example) carrier standby sections 423. One or more carrier cleaning tanks 421, one or more carrier drying sections 422, and one or more carrier standby sections 423 are arranged from the first standby section 230 of the relay block 200 along the +X direction.

A cleaning and transporting device 410 is provided in conjunction with the carrier cleaning unit 420. The cleaning and transporting device 410 can transport the substrate W between the first standby section 230, one or more carrier cleaning tanks 421, one or more carrier drying sections 422, and one or more carrier standby sections 423 by moving in the X direction and the Z direction.

In the substrate processing apparatus 1, the used carrier 9 supported by the second standby section 240 is transported to the first standby section 230 along the standby transport path by the standby transport device 250 (refer to the arrow b1 of the thicker two-dot chain line in FIG. 9). Thereafter, the empty carrier 9 supported by the first standby section 230 maintains a vertical posture and is transported to the carrier cleaning unit 420 by the cleaning transport device 410. In other words, the used empty carrier 9 is picked up from the first standby section 230 in the standby transport path and transported to the carrier cleaning unit 420. The transport path of the carrier 9 at this time is indicated by the arrow d1 of the thicker one-dot chain line in FIG. 9 and FIG. 10.

In the carrier cleaning unit 420, the used carrier 9 is cleaned and dried as in the above-mentioned embodiment. The cleaned and dried carriers 9 are held in one or more carrier standby sections 423 and are in a standby state.

Here, it is assumed that a series of processes are performed on a plurality of unprocessed substrates W stored in another new wafer transfer box 8. In this case, the clean carrier 9 held in the carrier standby section 423 is transported to the first standby section 230 by the cleaning conveying device 410 as a new carrier 9. In other words, the cleaned empty carrier 9 is returned to the first standby section 230 in the standby conveying path as a new carrier 9. The thick dot chain arrow d2 in Figures 9 and 10 indicates the conveying path of the new carrier 9.

As described above, in the substrate processing apparatus 1 of FIG. 9 and FIG. 10 , the carrier 9 is also used to process a plurality of substrates W, and the carrier 9 is reused. Furthermore, the carrier 9 is cleaned after use. Therefore, the same effect as the above-mentioned embodiment can be obtained.

In the substrate processing apparatus 1 of FIG9 and FIG10, the cleaning and conveying device 410 picks up the empty carrier 9 after use from the first standby section 230. In this case, since the first standby section 230 is located at the end of the standby conveying path, the cleaned carrier 9 is not conveyed over the wide range of the standby conveying path. Therefore, the cleanliness of the cleaned carrier 9 can be kept without reducing the cleanliness of the carrier 9, and the carrier 9 can store a plurality of unprocessed substrates W.

(2) The carrier cleaning unit 420 may be further provided in a portion different from the substrate processing apparatus 1 of the examples of FIG. 1 and FIG. 9. FIG. 11 is a schematic top view showing the basic structure of another embodiment of the substrate processing apparatus 1. In FIG. 11, as in the examples of the respective figures of the substrate processing apparatus 1 of the above-mentioned embodiment, arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other are marked. The differences between the substrate processing apparatus 1 of FIG. 11 and the substrate processing apparatus 1 of the above-mentioned embodiment are explained.

The carrier cleaning unit 420 of this example is arranged in a manner extending along the X direction inside the substrate loading and unloading block 100 and the relay block 200, and includes a cleaning conveying device 410, one or more (two in this example) carrier cleaning tanks 421, one or more (one in this example) carrier drying sections 422, and one or more (one in this example) carrier standby sections 423. One or more carrier cleaning tanks 421, one or more carrier drying sections 422, and one or more carrier standby sections 423 are arranged along the -X direction from the standby conveying path in the relay block 200.

A cleaning and transporting device 410 is provided in conjunction with the carrier cleaning unit 420. The cleaning and transporting device 410 can transport the substrate W between the standby transport path, one or more carrier cleaning tanks 421, one or more carrier drying sections 422, and one or more carrier standby sections 423 by moving in the X direction and the Z direction.

In the substrate processing apparatus 1, the cleaning and transporting device 410 picks up the empty carrier 9 being transported from the second standby section 240 to the first standby section 230 along the standby transport path, and transports it to the carrier cleaning unit 420. The thick dot-link arrow e1 in FIG. 11 indicates the transport path of the carrier 9 at this time.

Furthermore, the carrier 9 cleaned by the carrier cleaning unit 420 is returned to the standby transport path by the cleaning transport device 410. The thick one-dot chain arrow e2 in FIG. 11 indicates the transport path of the carrier 9 at this time. By transporting the carrier 9 returned to the standby transport path to the first standby section 230, the cleaned carrier 9 can be used for processing a plurality of new substrates W.

(3) In the cleaning block 400 of the above-mentioned embodiment, an elevator that can immerse the carrier 9 in the processing liquid and lift the carrier 9 from the processing liquid can be provided in one or more carrier cleaning tanks 421. In this case, the carrier cleaning unit 420 can also have an elevator that can lift the carrier 9 relative to the plurality of carrier cleaning tanks 421, similar to the processing section 330 of the processing block 300. In addition, the carrier cleaning unit 420 can also have a main transport device that transfers the carrier 9 between the plurality of elevators.

(4) In the substrate processing apparatus 1 of the above-mentioned embodiment, the frame members 10a and 10b of the carrier 9 in the lead vertical position are maintained parallel to the lead vertical direction, but the frame members 10a and 10b of the carrier 9 in the lead vertical position may be maintained substantially parallel to the lead vertical direction. That is, the carrier 9 in the lead vertical position only needs to be able to keep the plurality of substrates W stored therein parallel or substantially parallel to the lead vertical direction.

In the substrate processing apparatus 1 of the above-mentioned embodiment, the frame members 10a and 10b of the carrier 9 in a horizontal position are maintained perpendicular to the vertical direction, but the frame members 10a and 10b of the carrier 9 in a horizontal position may be maintained substantially perpendicular to the vertical direction. That is, the carrier 9 in a horizontal position only needs to be able to keep the plurality of substrates W stored therein parallel or substantially parallel to the horizontal direction.

(5) In the substrate processing apparatus 1 of the above embodiment, the carrier support unit 210 and the first standby unit 230 are separately provided in the relay block 200, but the present invention is not limited thereto. In the case where the first standby unit 230 can be provided with a function of changing the posture of the carrier 9, the carrier support unit 210 may not be provided.

In the substrate processing apparatus 1 of the above embodiment, the carrier support unit 220 and the second standby unit 240 are separately provided in the relay block 200, but the present invention is not limited thereto. When the second standby unit 240 can be provided with a function of changing the posture of the carrier 9, the carrier support unit 220 may not be provided.

(6) In the second conveying section 320 of the processing block 300 of the above-mentioned embodiment, the conveying device 321 has the function of changing the posture of the carrier 9 and has the function of conveying the carrier 9, but the present invention is not limited to this. In the second conveying section 320, a component having the function of changing the posture of the carrier 9 and a component having the function of conveying the carrier 9 may be separately provided instead of the above-mentioned conveying device 321.

(7) In the substrate processing apparatus 1 of the above-mentioned embodiment, the substrate W to be processed has a rectangular shape in a plan view, but the substrate to be processed may also have a circular shape in a plan view, or may have a polygonal shape other than a quadrilateral such as a triangle or pentagon in a plan view.

(8) The carrier 9 of the above-mentioned embodiment supports both sides of the rectangular substrate W when the rectangular substrate W is stored in a horizontal position, but the present invention is not limited to this. The carrier 9 may also be configured to support the central portion of the substrate W in a horizontal position.

(9) In the substrate processing apparatus 1 of the above-mentioned embodiment, a processing liquid for cleaning the substrate W is stored in the plurality of processing tanks 331a of the processing section 330, but the present invention is not limited thereto. A coating liquid for coating the substrate W or a liquid for modifying the surface state of the substrate W may be stored as the processing liquid in at least a portion of the plurality of processing tanks 331a of the processing section 330. Thus, the above-mentioned embodiment is an example of applying the present invention to a cleaning process of a plurality of substrates W, but the present invention is not limited thereto and may also be applied to other processes such as a coating process or a surface modification process of a plurality of substrates W.

(10) In the substrate processing apparatus 1 of the above-mentioned embodiment, the cleaning block 400 takes out an empty carrier 9 from the standby conveying path from the second standby section 240 to the first standby section 230, cleans it, and returns it to the standby conveying path again, but the present invention is not limited to this. The cleaning block 400 may also constitute a part of the standby conveying path from the second standby section 240 to the first standby section 230.

Specifically, the cleaning block 400 may receive the empty carrier 9 before cleaning from the second standby section 240 by the cleaning transfer device 410, clean the carrier 9 by the carrier cleaning unit 420, and transfer the cleaned carrier 9 to the first standby section 230. Alternatively, the cleaning block 400 may receive the empty carrier 9 before cleaning from a position between the second standby section 240 and the first standby section 230 by the cleaning transfer device 410, clean the carrier 9 by the carrier cleaning unit 420, and transfer the cleaned carrier 9 to the first standby section 230.

In such cases, the cleaning block 400 may also be provided with a conveying device for receiving the carrier 9 before cleaning and a conveying device for transferring the carrier 9 after cleaning. In this way, by not using the same structure for conveying the carrier 9 before cleaning and the structure for conveying the carrier 9 after cleaning, the transfer of contaminants between the carrier 9 and the structure for conveying the carrier 9 is prevented. As a result, the cleanliness of the carrier 9 in the relay block 200 and the cleaning block 400 is suppressed from being reduced.

(11) In the carrier 9 of the above-mentioned embodiment, four openings 13 are formed in the central portion of each of the frame members 10a and 10b, but the present invention is not limited thereto. The number of openings 13 in the central portion of each of the frame members 10a and 10b is not limited to four, and one, two, three, five, or other numbers of openings 13 may be formed. Alternatively, the opening 13 may not be formed in the central portion of each of the frame members 10a and 10b. Furthermore, the shapes of the frame members 10a and 10b may be appropriately designed and changed.

(12) In each of the main transport devices 333A, 333B, and 333C of the above-mentioned embodiment, the pair of chuck members 333b holds the carrier 9 by clamping the carrier 9 in the X direction, but the present invention is not limited thereto. The pair of chuck members 333b may also hold the carrier 9 by clamping the carrier 9 in the Y direction, or may hold the carrier 9 by clamping the carrier 9 in a direction intersecting the X direction and the Y direction in a horizontal plane.

<6> Correspondence between the constituent elements of the technical solution and the elements of the implementation form Below, the correspondence between the constituent elements of the technical solution and the elements of the implementation form is described, but the present invention is not limited to the following example. As the constituent elements of the technical solution, various other elements having the structure or function described in the technical solution can also be used.

In the above-mentioned embodiment, the substrate processing device 1 is an example of a substrate processing device, the carrier 9 is an example of a carrier, the transport path of the carrier 9 indicated by the arrow a3 in Figure 6 is an example of a first transport path, the first end TA1 of the first transport section 310 is an example of a starting point of the first transport path, the third end TA3 of the processing section 330 is an example of an end point of the first transport path, and the component group including the main transport device 311, 333A, 333B, 333C of the processing block 300 and the transport device 321 is an example of a transport mechanism.

In addition, the plurality of liquid processing units 331 of the processing section 330 is an example of a processing unit, the substrate transfer robot 140 is an example of a substrate insertion section, the first standby section 230 is an example of a first standby section, the second standby section 240 is an example of a second standby section, the substrate transfer robot 150 is an example of a substrate removal section, and the cleaning block 400 and the carrier cleaning unit 420 are examples of a carrier cleaning section.

6 is an example of the second transport path, the carrier cleaning tank 421 is an example of a cleaning tank, the cleaning transport device 410 is an example of a carrier transport device, the carrier drying section 422 is an example of a carrier drying section, and the carrier standby section 423 is an example of a carrier standby section.

1: Substrate processing device 8: Wafer cassette 9: Carrier 10a, 10b, 10c, 10d: Frame member 11: Support plate 12: Substrate inlet and outlet 13: Opening 100: Substrate loading and unloading area 101: End surface 102: One side surface 103: Other side surface 110: Wafer cassette rack 111, 112: Wafer cassette transport device 120, 130: Opener 140, 150: Substrate transfer robot 160: Control unit 190: Wafer cassette loading unit 200: Intermediate block 210, 220: Carrier support unit 211: Fixed pedestal 212: Carrier holder 212a: 1st holding section 212b: 2nd holding section 230: 1st standby section 240: 2nd standby section 250: Standby conveyor 300: Processing block 310: 1st conveyor 311: Main conveyor 311a: Movable stage 311b: Guide rail 312A, 312B: Sub-conveying device 320: 2nd conveyor 321: Conveying device 322: Movable pedestal 323: Carrier holder 323a: 1st holding section 323b: 2nd holding section 330: Processing section 331: Liquid processing unit 331a: Processing tank 331b: Elevator 332: Drying unit 333a: Movable support column 333A, 333B, 333C: Main transport device 333b: Chuck member 400: Cleaning block 410: Cleaning transport device 420: Carrier cleaning unit 421: Carrier cleaning tank 422: Carrier drying section 423: Carrier standby section a1~a5, b1, c1, c2, d1, d2, e1, e2: Arrows BA1, BA2, BA3, BA4: Dialog box MS1, MS2: Maintenance space pr: Protrusion TA1: 1st end TA2: 2nd end TA3: 3rd end TA4: 4th end W: Substrate WP: Worker

FIG. 1 is a schematic top view showing the basic structure of a substrate processing device of an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the substrate processing device at line A-A of FIG. 1 . FIG. 3 is a top view of a carrier used in the substrate processing device of FIG. 1 . FIG. 4 is a side view of the carrier of FIG. 3 . FIG. 5 is a cross-sectional view of the carrier at line B-B of FIG. 4 . FIG. 6 is a diagram for illustrating the transport path of a plurality of substrates and a carrier in the substrate processing device of FIG. 1 . FIG. 7 is a diagram for illustrating the transport path of a plurality of substrates and a carrier in the substrate processing device of FIG. 1 . FIG. 8 is a diagram for illustrating the transport path of a plurality of substrates and a carrier in the substrate processing device of FIG. 1 . FIG. 9 is a schematic top view showing the basic structure of another embodiment of a substrate processing device. FIG. 10 is a schematic side view of the substrate processing device of FIG. 9. FIG. 11 is a schematic top view showing the basic structure of another embodiment of a substrate processing device.

1: Substrate processing equipment

8: Wafer transfer box

9: Carrier

100: Substrate loading and unloading area

110: Wafer transfer box rack

111,112: Wafer transfer box transport device

120,130: switch

140,150: Substrate transfer robot

190: Wafer transfer box loading unit

200: Relay block

210,220: Carrier support department

230: 1st standby unit

240: Second standby unit

250: Standby transport device

300: Processing block

310: 1st transport section

311: Main transport device

311a: Movable platform

311b:Guide rails

312A, 312B: Auxiliary conveyor device

320: Second transport section

321: Transport device

330: Processing Department

331:Liquid handling unit

332: Drying unit

333A, 333B, 333C: Main transport device

400: Washing area

410: Cleaning and conveying device

420: Carrier cleaning unit

421: Carrier cleaning tank

422: Carrier drying section

423: Carrier standby unit

a1~a5,b1,c1,c2:arrow

TA1: End 1

TA2: End 2

TA3: End 3

TA4: End 4

Claims (6)

A substrate processing device is used to perform a preset processing on a plurality of substrates, and comprises: a carrier, which is configured to accommodate the plurality of substrates; a conveying mechanism, which conveys the carrier from a starting point to an end point along a preset first conveying path; and a processing unit, which is arranged on the first conveying path and performs the preset processing on the plurality of substrates accommodated in the carrier while the plurality of substrates are accommodated in the carrier. processing; a substrate inserting section, which inserts the unprocessed plurality of substrates carried into the substrate processing device into the empty carrier; a first standby section, which is arranged adjacent to the starting point of the first conveying path, and is configured to support the carrier containing the unprocessed plurality of substrates by the substrate inserting section and transfer the carrier to the starting point of the first conveying path; a second standby section, which is arranged adjacent to the starting point of the first conveying path The first transport path is configured to receive and support the carrier containing the plurality of processed substrates from the first transport path; a substrate removal portion that removes the plurality of processed substrates from the carrier containing the plurality of processed substrates by the processing unit; and a carrier cleaning portion that cleans the carrier; and forms a preset position for transporting the carrier from the second standby portion to the first standby portion. The second conveying path of the carrier cleaning section; the carrier cleaning section has a cleaning conveying device and a carrier cleaning unit; the carrier cleaning unit cleans the carrier; the cleaning conveying device picks up the empty carrier after the plurality of substrates processed by the substrate removal section are removed from the second standby section in the second conveying path and transfers it to the carrier cleaning unit, and returns the carrier cleaned by the carrier cleaning unit to the second conveying path. The substrate processing device of claim 1, wherein the carrier cleaning unit comprises: a cleaning tank storing a cleaning liquid for cleaning the carrier; the cleaning transport device is configured to immerse the carrier in the cleaning liquid in the cleaning tank and lift the carrier immersed in the cleaning liquid from the cleaning liquid. As in claim 2, the substrate processing device, wherein the carrier cleaning unit further includes a carrier drying section for drying the cleaned carrier. A substrate processing device as claimed in any one of claims 1 to 3, wherein the carrier cleaning unit further comprises: a carrier standby unit which allows the cleaned carrier to standby. A substrate processing device as claimed in any one of claims 1 to 3, wherein the carrier cleaning section returns the cleaned carrier to the first standby section in the second transport path. A substrate processing device as claimed in any one of claims 1 to 3, wherein the carrier cleaning section is located in a direction away from the first standby section relative to the second standby section.