TW202343645A - Substrate processing apparatus - Google Patents

Abstract

In the present invention, a carrier is conveyed along a first conveyance path. A plurality of substrates in the carrier are processed. A first standby unit is provided adjacent to a start point of the first conveyance path The first standby unit passes a carrier in which a plurality of unprocessed substrates are housed to the start point of the first conveyance path. A second standby unit is provided adjacent to an end point of the first conveyance path. The second standby unit receives the carrier in which the plurality of substrates, which have been processed, are housed. The plurality of substrates are removed from the carrier. After use, the carrier is picked up from a standby conveyance path connecting the second standby unit and the first standby unit, and then cleaned. The cleaned carrier is returned to the standby conveyance path.

Description

Substrate processing equipment

The present invention relates to a substrate processing device for processing a plurality of substrates in a processing tank.

For FPD (Flat Panel Display) substrates such as semiconductor substrates, liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical discs, substrates for magnetic discs, substrates for magneto-optical discs, optical discs, etc. A substrate processing apparatus is used to perform various processes on substrates such as cover substrates, ceramic substrates, and solar cell substrates.

As such a substrate processing apparatus, there is a batch type substrate processing apparatus that immerses a plurality of substrates in a processing liquid stored in a processing tank and performs etching and other processes. For example, the batch type substrate processing apparatus described in Patent Document 1 includes a wafer cassette holding unit, a substrate processing unit, and a loading and unloading mechanism. The wafer pod holding unit is configured to hold a wafer pod (FOUP: Front Opening Unified Pod). The wafer transfer cassette is configured as a container that can hold and store a plurality of substrates in a horizontal position so that the plurality of substrates are arranged at a predetermined pitch in the up and down direction.

In this substrate processing apparatus, a wafer transfer cassette containing a plurality of unprocessed substrates is supplied to and held in the wafer transfer cassette holding unit. In this state, a plurality of substrates are taken out from the wafer transfer cassette by the hand provided with the loading and unloading mechanism. The hand is configured to hold a plurality of substrates at a time. The plurality of substrates taken out by hand are transferred to the substrate processing unit through a plurality of conveying mechanisms and supporting mechanisms.

The substrate processing unit has a plurality of processing tanks and a main transport mechanism. Each of the plurality of processing tanks stores a processing liquid for predetermined processing of the substrate. The plurality of unprocessed substrates transferred to the substrate processing unit are each transported to a position above any one of the plurality of processing tanks by the main transport mechanism. The main conveying mechanism is also configured to hold a plurality of substrates at one time, similar to the above-mentioned hand.

The plurality of substrates transported to a position above any of the plurality of processing tanks are immersed in the processing liquid in the processing tank located below the plurality of substrates for a certain period of time and then lifted up. Thereby, predetermined processing is performed on a plurality of substrates. A plurality of processed substrates are taken out from the substrate processing part and inserted into an empty wafer transfer box held in the wafer transfer box holding part through a plurality of transport mechanisms and supporting mechanisms. The wafer transfer box containing the plurality of processed substrates is carried out from the substrate processing device.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2011-238945

[Problem to be solved by the invention]

As described above, in the substrate processing apparatus described in Patent Document 1, a plurality of substrates are integrally transferred between a plurality of transport mechanisms. The plurality of transport mechanisms hold a plurality of substrates at one time and have a relatively complex structure. Such a complicated structure complicates maintenance work such as cleaning of the plurality of conveying mechanisms.

Furthermore, in the above-mentioned substrate processing apparatus, a plurality of substrates are transferred multiple times between a plurality of components of the substrate processing apparatus including a plurality of transport mechanisms. Therefore, each of the plurality of substrates taken out from the wafer transfer cassette repeatedly contacts and separates from multiple components while being inserted into an empty wafer transfer cassette. Repeated contact and separation of multiple components of such a substrate processing apparatus with respect to each of a plurality of substrates causes the generation of particles.

Furthermore, when a plurality of components in contact with a plurality of substrates are contaminated, contaminants will be transferred from these components to the plurality of substrates, and the cleanliness of the plurality of substrates will be significantly reduced. Therefore, it is considered to clean each of the plurality of components that come into contact with the plurality of substrates. However, if a plurality of cleaning mechanisms respectively corresponding to the plurality of components described above are provided in the substrate processing apparatus, the structure of the substrate processing apparatus becomes complicated and the number of parts increases.

As a method to deal with this problem, it may be considered to centrally store a plurality of substrates into a carrier that can accommodate a plurality of substrates and transport a plurality of substrates at one time.

However, since contaminants are transferred from multiple substrates or processing tanks to the carrier, there is a problem that the carrier itself is contaminated. Since the contaminants on the carrier are transferred to the substrate, they become a factor that degrades the quality of the substrate.

In addition, there is also a problem of deterioration of the surface of the carrier by the treatment liquid adhering to the carrier acting on the surface of the carrier. In addition, when the treatment liquid is a plating liquid, there may be a problem that the plating adheres to the surface of the carrier and grows.

As such, previous substrate processing technologies have not provided structures and methods to appropriately deal with the problems of carrier contamination or carrier deterioration.

Therefore, an object of the present invention is to provide a substrate processing apparatus that can prevent contamination of a plurality of substrates and suppress the complexity of the structure of the transport mechanism and the increase in the number of parts.

Another object of the present invention is to provide a substrate processing apparatus that can clean the surface of the carrier and reset the surface condition of the carrier in order to prevent deterioration of a carrier configured to accommodate a plurality of substrates. [Technical means to solve problems]

(1) A substrate processing device according to one aspect of the present invention is designed to process a plurality of substrates, and is provided with: a carrier configured to accommodate a plurality of substrates; and a transport mechanism along a predetermined first The transport path transports the carrier from the starting point to the end point of the first transport path; the processing unit is provided on the first transport path and processes the plurality of substrates stored in the carrier while the plurality of substrates are stored in the carrier. Perform preset processing; a substrate insertion unit that inserts a plurality of unprocessed substrates carried into the substrate processing device into an empty carrier; a first standby unit that is provided adjacent to the starting point of the first transfer path, The substrate insertion portion is configured to support a carrier containing a plurality of unprocessed substrates and transfer them to the starting point of the first conveyance path; and the second standby portion is provided adjacent to the end point of the first conveyance path. , and is configured to receive and support a carrier containing a plurality of processed substrates from the end point of the first conveying path; A plurality of substrates; and a carrier cleaning part, which cleans the carrier; and forms a preset second transport path for transporting the carrier from the second standby part to the first standby part; the carrier cleaning part is from the second transport path Pick up the empty carrier after taking out the plurality of processed substrates from the substrate taking-out part, clean the picked up carrier, and return the cleaned carrier to the second transport path.

In this substrate processing apparatus, a plurality of loaded unprocessed substrates are inserted into an empty carrier through the substrate insertion portion. The carrier accommodating the plurality of unprocessed substrates is supported by the first standby unit and transferred to the starting point of the first conveyance path. The carrier accommodating a plurality of substrates is conveyed from the starting point to the end point of the first conveying path. In this case, the transport mechanism can handle the plurality of substrates in one piece by transporting the carrier accommodating the plurality of substrates. Therefore, the transport mechanism does not need to have a cumbersome structure for integrally and directly holding a plurality of substrates. During the period when the carrier is transported from the starting point to the end point of the first transport path, preset processing is performed on the plurality of substrates stored in the carrier by the processing unit.

The carrier containing the plurality of processed substrates is received by the second standby unit from the end point of the first conveyance path and is supported by the second standby unit. The processed plurality of substrates are taken out from the carrier through the substrate taking-out part. The empty carrier is conveyed from the second waiting part to the first waiting part on the second conveying path. In the middle of the conveyance, the empty carrier is picked up from the second conveyance path and washed by the carrier washing part. Furthermore, the cleaned and empty carriers are returned to the second conveyance path. In this case, the cleaned and empty carrier transported to the first standby section through the second transport path can be used to insert a plurality of unprocessed substrates. In this way, since the carrier can be reused, there is no need to prepare multiple carriers. In addition, since the reused carrier is washed, contamination of multiple substrates caused by the reused carrier is prevented.

As a result, it is possible to prevent contamination of a plurality of substrates, and to suppress the complexity of the structure of the transport mechanism and the increase in the number of parts.

Furthermore, according to the above configuration, the carrier used for processing a plurality of substrates can be cleaned every time it is used for processing a plurality of substrates. Thereby, since the surface state of the carrier is reset each time a plurality of substrates are processed, deterioration of the carrier due to contamination, corrosion, etc. can also be suppressed.

(2) The carrier washing section may include: a washing tank that stores a cleaning liquid for washing the carrier; and a carrier transfer device that is configured to immerse the carrier in the cleaning liquid of the treatment tank. And the carrier is lifted up from the cleaning liquid and immersed in the cleaning liquid.

In this case, in the carrier washing section, the carrier can be washed with a simple structure and a simple method by immersing the carrier in the cleaning liquid in the washing tank for a certain period of time.

(3) The carrier washing part may further include a carrier drying part for drying the washed carrier. In this case, it is difficult for dust to adhere to the washed carrier. Thereby, the deterioration of the cleanliness of the washed carrier is suppressed.

(4) The carrier washing part may further include a carrier waiting part for waiting the washed carrier. In this case, the washed carrier can be left to wait in the carrier washing section. Thereby, the cleaned carrier can be returned to the second conveyance path at an appropriate timing.

(5) The carrier cleaning unit may pick up empty carriers from the second standby unit in the second conveyance path. In this case, since the second standby unit is located at the starting point of the second conveyance path, it is prevented that the used carrier for processing a plurality of substrates is conveyed across a wide range of the second conveyance path in an unwashed state. Therefore, contamination of the second conveyance path is suppressed.

(6) The carrier cleaning unit may return the cleaned carrier to the first standby unit in the second conveyance path. In this case, since the first standby unit is located at the end point of the second conveyance path, the cleaned carrier is not conveyed over the wide range of the second conveyance path. Therefore, the carrier can accommodate a plurality of unprocessed substrates without reducing the cleanliness of the washed carrier. [Effects of the invention]

According to the present invention, it is possible to prevent contamination of a plurality of substrates, and to suppress the complexity of the structure of the transport device and the increase in the number of parts.

Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, substrates refer to FPD (Flat Panel Display) substrates, semiconductor substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices. Substrates for photomasks, ceramic substrates, or solar cell substrates, etc. In addition, the substrate described below has a rectangular shape in plan view.

＜1＞Structure of substrate processing equipment (1) Definition of overall composition and direction FIG. 1 is a schematic plan view showing the basic structure of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus 1 taken along line A-A in FIG. 1 . As shown in FIGS. 1 and 2 , the substrate processing apparatus 1 mainly includes a substrate loading and unloading block 100 , a relay block 200 , a processing block 300 and a cleaning block 400 .

Here, in the designated drawings after FIG. 1 and FIG. 2 , in order to clarify the positional relationship of each component of the substrate processing apparatus 1 , arrows indicating the X direction, Y direction, and Z direction that are orthogonal to each other are marked. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction is equivalent to the vertical direction. Moreover, among each direction, let the direction toward which the arrow points is a + direction, and let the direction opposite to this + direction be a - direction. In the following description, when simply referred to as the X direction, the X direction includes the +X direction and the -X direction. In addition, when it is simply referred to as the Y direction, the Y direction includes the +Y direction and the -Y direction. In addition, when it is simply called the Z direction, the Z direction includes the +Z direction and the -Z direction.

(2)Substrate loading and unloading block 100 The substrate loading and unloading block 100 includes a plurality of wafer cassette racks 110, wafer cassette transporting devices 111, 112, switches 120, 130, substrate transfer robots 140, 150, two wafer cassette placing units 190, and Control unit 160 (Fig. 2). In addition, the substrate loading and unloading block 100 has an end surface 101 , one side surface 102 , and the other side surface 103 constituting a part of the outer wall of the substrate processing apparatus 1 . The end portion 101 is located at one end of the substrate processing apparatus 1 facing the -X direction, and is orthogonal to the X direction. One side surface part 102 and the other side surface part 103 are opposite to each other in the Y direction, and extend in parallel from both ends of the end surface part 101 toward the +X direction in a plan view.

The two wafer transfer cassette placing portions 190 are provided to protrude from the end portion 101 in the −X direction. Each wafer pod mounting part 190 is configured as a wafer pod (FOUP: Front Opening Unified Pod) 8 that can accommodate a plurality of substrates in multiple stages. In the end portion 101 , a passage opening (not shown) for allowing the wafer transfer pod 8 to pass in the X direction is formed in a portion corresponding to each wafer transfer pod placement portion 190 .

The wafer transfer box 8 is formed with an opening for taking out the substrate from the internal space of the wafer transfer box 8 and inserting the substrate into the internal space of the wafer transfer box 8 . In addition, the wafer transfer box 8 includes a cover for opening and closing the opening. The opening of the wafer transfer box 8 is closed when the wafer transfer box 8 is being transported and when it is on standby, and is opened when the wafer transfer box 8 is taken out and a substrate is inserted. In FIGS. 1 and 2 , in order to clearly distinguish the wafer transfer box 8 from the carrier 9 described below, the wafer transfer box 8 is marked with hatching and the carrier 9 is marked with a dotted pattern. In the example of FIG. 1 , the wafer transfer cassette 8 is placed on one of the two wafer transfer cassette loading parts 190 arranged in the Y direction, and the wafer transfer cassette 8 is placed on the other wafer transfer cassette. The wafer transfer cassette 8 is not placed on the placement portion 190 . The number of wafer transfer boxes 8 or the arrangement of the wafer transfer box racks 110 can be appropriately changed according to the device design specifications.

The plurality of wafer transfer cassette racks 110 are spaced apart from each other at positions separated from the end surface 101 by a predetermined distance in the +X direction. In this example, the 16 wafer transfer cassette racks 110 are arranged in 4 columns and 4 rows in a plane parallel to the Z direction and the Y direction, and are fixed by a fixing member not shown in the figure. Each wafer transfer cassette rack 110 is configured to mount the wafer transfer cassette 8 . In the example of FIG. 1 , a wafer transfer box 8 is placed on each of three of the four wafer transfer box racks 110 located in the uppermost section, and the remaining one wafer transfer box is loaded with a wafer transfer box 8 . The wafer transfer cassette 8 is not placed on the rack 110 .

The two shutters 120 and 130 are spaced apart from each other at positions separated from the plurality of wafer transfer cassette racks 110 by a predetermined distance in the +X direction. In this example, the two switches 120 and 130 are arranged in the Y direction and are fixed by a fixing member (not shown). One shutter 120 is located near one side surface 102 , and the other shutter 130 is located near the other side surface 103 . Each of the shutters 120 and 130 is configured to be able to place the wafer transfer box 8 and open and close the lid of the placed wafer transfer box 8 . In the example of FIG. 1 , the wafer transfer cassette 8 is placed on one switch 120 , but the wafer transfer cassette 8 is not placed on the other switch 130 .

The substrate transfer robot 140 is provided adjacent to the shutter 120 in the +X direction. The substrate transfer robot 140 is configured to be rotatable about an axis in the Z direction and movable (liftable) in the Z direction. The substrate transfer robot 140 is provided with a hand for transferring one or a plurality of substrates. The hands are supported by multi-jointed arms and can move forward and backward in the horizontal direction. The substrate transfer robot 140 is used to take out the substrate from the wafer transfer cassette 8 with the wafer transfer cassette 8 containing unprocessed substrates placed on the switch 120 , and insert and arrange the removed substrate into the relay. Block 200 is located in the carrier 9 described later.

The substrate transfer robot 150 is provided adjacent to the shutter 130 in the +X direction. The substrate transfer robot 150 has the same structure as the substrate transfer robot 140 . The substrate transfer robot 150 is used to take out the substrate from the carrier 9 arranged in the relay block 200 to be described later, with the empty wafer transfer cassette 8 placed on the switch 130, and insert the removed substrate into the switch. In the wafer transfer box 8 on the device 130 .

The wafer pod transport device 111 is located between the end portion 101 in the X direction and the plurality of wafer pod frames 110 . The wafer pod transport device 111 has a holding portion (not shown) configured to hold the wafer pod 8, and is configured to move the holding portion in the Y direction and the Z direction. Thereby, the wafer pod transport device 111 transports the wafer pod 8 between any one of the two wafer pod mounting parts 190 and any one of the plurality of wafer pod racks 110 .

The wafer pod transport device 112 is located between the plurality of wafer pod racks 110 and the two shutters 120 and 130 in the X direction. The pod transport device 112 has the same structure as the pod transport device 111 . The wafer pod transport device 112 transports the wafer pod 8 between any one of the plurality of wafer pod racks 110 and any one of the two shutters 120 and 130 .

The control unit 160 (Fig. 2) includes a computer including a CPU (Central Processing Unit: Central Processing Unit), ROM (Read Only Memory: Read Only Memory), and RAM (Random Access Memory: Random Access Memory), and controls Operations of each component in the substrate processing apparatus 1.

(3) Relay block 200 The relay block 200 mainly includes two carrier support parts 210 and 220, a first standby part 230, a second standby part 240, and a standby transfer device 250. The carrier support unit 210 is provided adjacent to the substrate transfer robot 140 of the substrate loading and unloading block 100 in the +X direction. Furthermore, the carrier support part 210 is configured to support the carrier 9 that accommodates a plurality of substrates in multiple stages. Details of the carrier 9 will be described later. Furthermore, the carrier support part 210 is configured to support the carrier 9 and change the posture of the supported carrier 9 . Details of the structure of the carrier support portion 210 for changing the posture of the carrier 9 will be described later. In addition, in the example of FIG. 1 , the carrier 9 is supported on the carrier support part 210 .

The carrier support unit 220 is provided adjacent to the substrate transfer robot 150 of the substrate loading and unloading block 100 in the +X direction. In addition, the carrier support part 220 has the same structure as the carrier support part 210. In addition, in the example of FIG. 1 , the carrier 9 is not supported on the carrier support part 220 .

The first standby part 230 is provided adjacent to the carrier support part 210 in the +X direction. Furthermore, the first standby unit 230 is configured to support the carrier 9 . Furthermore, the first standby unit 230 is configured to transfer the carrier 9 supported by the first standby unit 230 to the carrier support unit 210 and to receive the carrier 9 supported by the carrier support unit 210 from the carrier support unit 210 .

The second standby part 240 is provided adjacent to the carrier support part 220 in the +X direction. In addition, the second standby unit 240 is configured to support the carrier 9 . Furthermore, the second standby unit 240 is configured to transfer the carrier 9 supported by the second standby unit 240 to the carrier support unit 220 and to receive the carrier 9 supported by the carrier support unit 220 from the carrier support unit 220 .

The standby transfer device 250 is provided between the first standby unit 230 and the second standby unit 240 . The standby transfer device 250 is configured to hold the carrier 9 and move in the Y direction between the first standby portion 230 and the second standby portion 240 . The standby transport device 250 transports the carrier 9 supported by the second standby unit 240 to the first standby unit 230 , for example.

(4) Processing block 300 The processing block 300 includes a first transport unit 310 , a second transport unit 320 and a processing unit 330 . The first transport unit 310 and the processing unit 330 are arranged in order in the +Y direction and extend in parallel from the relay block 200 in the +X direction. The second conveying part 320 is formed to extend in the Y direction, and connects the end of the first conveying part 310 facing the +X direction and the end of the processing part 330 facing the +X direction.

In the following description, among the two ends of the first conveyance part 310 extending in the X direction, the end facing the -X direction is appropriately referred to as the first end TA1, and the other end facing the +X direction is appropriately referred to as the first end. 2 end TA2. In addition, of the two ends of the treatment part 330 extending in the X direction, the one facing the -X direction is appropriately called the third end TA3, and the other end facing the +X direction is appropriately called the fourth end TA4.

The first conveyance unit 310 includes a main conveyance device 311 and two auxiliary conveyance devices 312A and 312B. The main transport device 311 includes a movable stage 311a and a guide rail 311b. The guide rail 311b is provided to extend from the first end TA1 of the first conveyance part 310 to the second end TA2. The movable stage 311a is configured to be movable in the X direction on the guide rail 311b and to be able to mount the carrier 9 . The main transport device 311 further includes a drive mechanism (not shown) that moves the movable stage 311a on the guide rail 311b in the X direction. Thereby, when the main conveying device 311 places the carrier 9 on the movable stage 311a near the first end TA1 of the relay block 200, it conveys the placed carrier 9 in the +X direction. to the second end TA2 close to the second conveying part 320.

The auxiliary conveying device 312A and the auxiliary conveying device 312B are respectively provided at the first end TA1 and the second end TA2 of the first conveying part 310 in the X direction. When the carrier 9 accommodating unprocessed substrates is supported by the carrier support part 210, the auxiliary transport device 312A places the carrier 9 on the movable stage 311a of the main transport device 311 disposed at the first end TA1. Furthermore, the auxiliary transport device 312A transports the empty carrier 9 from the first standby unit 230 to the carrier support unit 210 . On the other hand, when the movable stage 311a on which the carrier 9 is mounted moves to the second end TA2, the auxiliary transport device 312B transfers the carrier 9 to the second transport part 320, to be described later, the transport device 321.

Here, as shown in FIG. 2 , the first transport unit 310 is provided at a position separated from the installation surface of the substrate processing apparatus 1 in the +Z direction (upper direction). Thereby, the space located in the -Z direction (below) of the first conveying part 310 can be used as the maintenance space MS1 for the maintenance processing part 330 described later. Therefore, in the substrate processing apparatus 1 of the present embodiment, as shown in FIG. 1 , the first transport section 310 and the maintenance space MS1 of the processing section 330 overlap in a plan view. In FIG. 8 , which will be described later, in the maintenance space MS1 , a worker WP who performs maintenance work on the processing unit 330 is shown below the first transport unit 310 .

The second transport unit 320 includes a transport device 321 . The conveying device 321 is configured to support the carrier 9 and change the posture of the supported carrier 9 . Details of the structure of the conveying device 321 for changing the posture of the carrier 9 will be described later. Furthermore, the conveying device 321 is configured to be movable in the Y direction. Thereby, the second conveying part 320 can receive the carrier 9 from the auxiliary conveying device 312B near the second end TA2 of the first conveying part 310. In addition, the second transport unit 320 can change the posture of the carrier 9 received from the sub-transport device 312B and move the carrier 9 to a position near the fourth end TA4 of the processing unit 330.

The processing unit 330 includes a plurality (five in this example) of liquid processing units 331, a drying unit 332, and a plurality of main transport devices 333A, 333B, and 333C (three in this example). The plurality of liquid processing units 331 and drying units 332 are arranged in the X direction such that the drying unit 332 is located at the third end TA3.

The plurality of main conveying devices 333A, 333B, and 333C are arranged sequentially on a straight line extending in the +X direction from the third end TA3 toward the fourth end TA4. Each of the main conveying devices 333A, 333B, and 333C is configured to hold the carrier 9 and to convey the held carrier 9 between the plurality of liquid processing units 331 and drying units 332 . The main transport device 333C located at the farthest position from the relay block 200 receives the carrier 9 when the carrier 9 is transported to the vicinity of the processing unit 330 in the second transport unit 320 . Furthermore, the main transport device 333C transports the received carrier 9 to any one of the plurality of liquid processing units 331 .

Each of the plurality of liquid treatment units 331 includes one or a plurality of treatment tanks 331a and elevators 331b. Each liquid treatment unit 331 in this example includes two treatment tanks 331a. Each processing tank 331a is configured so that the carrier 9 can be inserted and taken out from a position above the processing tank 331a. In addition, the processing tank 331a stores a processing liquid (chemical liquid or cleaning liquid) for cleaning the plurality of substrates accommodated in the carrier 9 .

The elevator 331b of each liquid treatment unit 331 is configured to hold the carrier 9 . Furthermore, the elevator 331b is configured to receive the carrier 9 from any one of the plurality of main conveyance devices 333A, 333B, and 333C, and to transfer the carrier 9 to any one of the plurality of main conveyance devices 333A, 333B, and 333C. Furthermore, the elevator 331b is configured to immerse the carrier 9 in the treatment liquid and to lift the carrier 9 from the treatment liquid in each of the two treatment tanks 331a of the liquid treatment unit 331. Thereby, the carrier 9 containing unprocessed substrates is transferred to the processing unit 330, and the plurality of substrates accommodated in the carrier 9 are immersed in one or a plurality of processing liquids for a predetermined time, thereby treating the plurality of substrates. Perform common processing.

The drying unit 332 dries the carrier 9 transported by the main transport device 333A located closest to the relay block 200 . Through this drying process, the plurality of substrates accommodated in the carrier 9 are dried. The dried carrier 9 is transferred to the second standby unit 240 of the relay block 200 by the main transport device 333A located closest to the relay block 200 .

Here, in the plurality of processing tanks 331a of the plurality of liquid processing units 331, a plurality of processing liquids respectively corresponding to a plurality of processes to be performed on the substrate are stored in a manner arranged in the -X direction in accordance with the order of processing to be performed on the substrate. . The control unit 160 in FIG. 2 allows each of the main transport devices 333A, 333B, and 333C to move in the -X direction while holding the carrier 9, and restricts the movement in the +X direction while holding the carrier 9. In this case, when the plurality of carriers 9 are conveyed by the plurality of main conveyance devices 333A, 333B, and 333C, the occurrence of interference caused by one carrier 9 and the other carrier 9 moving in opposite directions to each other is suppressed. In addition, since the carrier 9 does not reciprocate in the X direction in the processing part 330, the length of the transport path of the carrier 9 in the processing part 330 does not exceed the length of the processing part 330 in the X direction.

As shown by the dotted line in FIG. 1 , in the processing block 300 and its vicinity, in addition to the above-mentioned maintenance space MS1 , a maintenance space MS2 is also formed on the +Y direction side of the processing part 330 . In this way, by forming two maintenance spaces MS1 and MS2 across the processing part 330 in the Y direction, a sufficiently large maintenance space for the processing part 330 is ensured.

(5) Wash block 400 The cleaning block 400 includes a cleaning transport device 410 and a carrier cleaning unit 420 . The carrier cleaning unit 420 is provided at a position on the side (+Y direction) of the substrate loading and unloading block 100 and the relay block 200 and extends in the X direction. In addition, the carrier washing unit 420 includes one or a plurality (three in this example) of carrier washing tanks 421 and one or a plurality (one in this example) of carriers arranged in the X direction. A drying part 422 and one or a plurality (in this example, two) carrier waiting parts 423.

One or a plurality of carrier washing tanks 421, one or a plurality of carrier drying sections 422, and one or a plurality of carrier standby sections 423 are each configured to be inserted from a position above the tank, drying section or standby section. Take out carrier 9. In addition, a treatment liquid (chemical liquid or cleaning liquid) for washing the carrier 9 is stored in each of one or a plurality of carrier washing tanks 421 . Each of one or a plurality of carrier drying parts 422 dries the inserted carrier 9 .

The cleaning and transporting device 410 is configured to be able to operate in the second standby section 240 of the relay block 200, one or a plurality of carrier washing tanks 421, one or a plurality of carrier drying sections 422, and one or a plurality of carrier standby sections. 423, the empty carrier 9 is transported. In the washing block 400, the empty carrier 9 is transported between the plurality of carrier washing tanks 421 and immersed in any one of the carrier washing tanks 421 stored in one or a plurality of carrier washing tanks 421. liquid. Thereby, the empty carrier 9 used for processing a plurality of substrates in the processing block 300 is cleaned.

The washed carrier 9 is transported to the carrier drying section 422 of one or a plurality of carrier drying sections 422, and is dried. The dried carrier 9 is transported to the carrier standby part 423 of one or a plurality of carrier standby parts 423 and held. Thereafter, according to the receiving timing of the plurality of substrates in the relay block 200, they are taken out from the carrier standby section 423 by the cleaning and transport device 410, and transported to the second standby section 240 of the relay block 200.

＜2＞The structure of the carrier 9 and the posture of the carrier 9 FIG. 3 is a top view of the carrier 9 used in the substrate processing apparatus 1 of FIG. 1 , FIG. 4 is a side view of the carrier 9 of FIG. 3 , and FIG. 5 is a cross-sectional view of the carrier 9 along line B-B of FIG. 4 . As shown in FIGS. 3 to 5 , the carrier 9 includes four frame members 10a, 10b, 10c, and 10d.

Each of the frame members 10a and 10b is formed of a substantially square plate-shaped member and has an outer shape larger than the substrate to be processed. Four openings 13 are formed in the center portions of each of the frame members 10a and 10b. Each of the frame members 10c and 10d is formed of a substantially rectangular plate-shaped member. The length of the long sides of the frame members 10c, 10d is substantially equal to the length of one side of the frame members 10a, 10b.

The frame members 10a and 10b are arranged so as to face each other and be spaced apart. The frame member 10c is provided so as to connect one side of the frame member 10a and one side of the frame member 10b. The frame member 10d is provided so as to connect the other side of the frame member 10a and the other side of the frame member 10b. In this state, the frame members 10c and 10d are also arranged facing each other. Thereby, the carrier 9 has a angular tube shape.

A rectangular opening formed at one end of the carrier 9 having a rectangular tube shape functions as a substrate entrance and exit 12 for inserting a substrate into the carrier 9 and for taking out the substrate from the carrier 9 . A plurality of support pieces (six in this example) are provided at the other end of the carrier 9 so as to connect the frame member 10a and the frame member 10b and to be dispersed between the frame member 10c and the frame member 10d. 11.

Each support piece 11 is composed of a long plate member and is provided parallel to the frame members 10c and 10d. In addition, in each supporting piece 11, a plurality of grooves (not shown) are formed at preset reference intervals into which a portion of the outer edge of a plurality of substrates accommodated in the carrier 9 can be inserted. The number of grooves formed in each supporting piece 11 is equal to the number of substrates to be accommodated in the carrier 9 .

A plurality of protrusions pr are formed on each of two mutually facing surfaces of the frame members 10c and 10d. The plurality of protrusions pr are formed to extend in the longitudinal direction of the frame members 10c and 10d and are arranged in the short-side direction at the above-mentioned reference pitch. Thereby, a groove into which the outer edge of the substrate can be inserted is formed between two adjacent protruding portions pr.

As described above, in the substrate processing apparatus 1 of FIG. 1 , the posture of the carrier 9 is appropriately changed. Here, regarding the carrier 9 having the above structure, the posture in which the plurality of support pieces 11 are located at the lower end portion and the frame members 10a and 10b are parallel to the vertical direction is maintained is called a vertical posture. On the other hand, the posture maintained so that the frame members 10a, 10b are orthogonal to the vertical direction is called a horizontal posture.

When inserting a plurality of substrates into the empty carrier 9, the plurality of substrates are inserted into the interior of the carrier 9 from the substrate entrance and exit 12 of the carrier 9 in a horizontal position. At this time, insert both sides of the outer edge of each substrate (the portions of the two sides facing each other) between any two of the plurality of protruding portions pr of the frame member 10c and the plurality of protruding portions of the frame member 10d. Between any 2 of pr. Thereby, when the carrier 9 accommodating a plurality of substrates is in a horizontal posture, each substrate is held in a state in which both sides of the substrate are supported by the plurality of protrusions pr. On the other hand, when the carrier 9 accommodating a plurality of substrates is in a vertical posture, each substrate is held in a state in which a plurality of portions of the lower end portion of the substrate are embedded in a plurality of grooves of the plurality of supporting pieces 11 .

As described above, when the carrier 9 is in the horizontal posture, the entire both sides of each of the accommodated plurality of substrates are supported by the plurality of protrusions pr. On the other hand, when the carrier 9 is in the vertical posture, each of the plurality of accommodated substrates is partially supported by the plurality of support pieces 11 at the lower end portion of the substrate. Therefore, when the carrier 9 is in the horizontal posture, the load (the load of the own weight of each substrate) applied to the outer edge of each accommodated substrate is reduced compared to the case when the carrier 9 is in the vertical posture.

The carrier 9 in this embodiment is formed such that the vertical dimension (height) of the carrier 9 when in the horizontal posture is smaller than the vertical dimension (height) of the carrier 9 when in the vertical posture.

＜3＞Transportation path of multiple substrates and carrier 9 in the substrate processing device 6 to 8 are diagrams for explaining the conveyance paths of a plurality of substrates and carriers 9 in the substrate processing apparatus 1 of FIG. 1 . FIG. 6 shows a schematic plan view of the substrate processing apparatus 1 as in FIG. 1 . FIG. 7 shows a schematic perspective view of the appearance of the substrate processing apparatus 1 of FIG. 1 viewed from one direction. FIG. 8 shows a schematic appearance perspective view of the substrate processing apparatus 1 of FIG. 1 viewed from another direction. In addition, in FIGS. 7 and 8 , the illustration of the cleaning block 400 in FIG. 1 is omitted. Furthermore, in FIGS. 6 to 8 , in addition to the maintenance space MS1 in FIG. 8 , the illustrations of the maintenance spaces MS1 and MS2 in FIG. 1 are also omitted.

It is assumed that a series of processes are performed on a plurality of unprocessed substrates W stored in one wafer transfer cassette 8 . In this case, one wafer transfer cassette 8 is loaded into the substrate loading and unloading block 100, and is placed on the shutter 120 as shown in FIG. 6, and the cover is opened. Furthermore, the empty carrier 9 is supported in a horizontal posture on the carrier support part 210 of the relay block 200 . At this time, the substrate entrance and exit 12 of the carrier 9 ( FIG. 5 ) faces the −X direction in a manner opposite to the wafer transfer box 8 . In this state, the substrate transfer robot 140 takes out a plurality of unprocessed substrates W from one wafer transfer box 8 and inserts them into the carrier 9 . In FIGS. 6 to 8 , arrow a1 with a thick dotted line indicates the transport path of the plurality of substrates W at this time.

Thereafter, the empty wafer pod 8 has its lid closed, is held by the wafer pod transport device 112 , and is placed on any one of the plurality of wafer pod racks 110 . On the other hand, the carrier 9 containing a plurality of substrates W is received by the carrier supporting part 210 and placed on the movable stage 311a of the main conveying device 311 by the auxiliary conveying device 312A of the first conveying part 310. In FIGS. 6 to 8 , arrow a2 with a thick solid line indicates the transport path of the carrier 9 at this time.

Next, the carrier 9 placed on the movable stage 311a is transported in a horizontal posture in the +X direction from a position near the relay block 200 (first end TA1) to a position near the second transport part 320 (second end TA1) end TA2). In the dialog box BA3 of FIG. 8 , the state of the carrier 9 transported by the main transport device 311 of the first transport unit 310 is displayed.

Thereafter, the carrier 9 that has reached the vicinity of the second conveyance part 320 is transferred to the conveyance device 321 of the second conveyance part 320 by the auxiliary conveyance device 312B of the first conveyance part 310 . Therefore, the posture of the carrier 9 transferred to the conveying device 321 is changed from the horizontal posture to the vertical posture by the conveying device 321 . In the dialog box BA2 of FIG. 7 , the status of the posture change of the carrier 9 in the transport device 321 is schematically displayed.

As shown in the dialog box BA2 of FIG. 7 , the transport device 321 includes a movable base 322 and a carrier holder 323 . The movable base 322 is provided movably in the Y direction in the second conveyance part 320 . The carrier holder 323 is composed of a first holding part 323a and a second holding part 323b. The first holding part 323a has a rectangular flat plate shape capable of holding the lower end of the carrier 9 in a horizontal posture. Furthermore, the second holding part 323b has a rectangular flat plate shape capable of holding the lower end of the carrier 9 in the vertical posture.

The first holding part 323a and the second holding part 323b are connected in such a manner that one side of the first holding part 323a and one side of the second holding part 323b are in contact with each other and the two holding parts are orthogonal to each other. The movable base 322 holds a part of the carrier holder 323 in such a manner that the first holding part 323a and the second holding part 323b are both parallel to the Y direction, and the carrier holder 323 can rotate around an axis extending in the Y direction.

The conveying device 321 further has a driving part (not shown) that can adjust the rotation angle of the carrier holder 323 on the movable base 322. Thereby, when receiving the carrier 9 in a horizontal posture from the first conveying part 310, the carrier holder 323 adjusts the rotation angle so that the first holding part 323a becomes horizontal and the second holding part 323b becomes vertical. Thereafter, after receiving the carrier 9 in a horizontal posture on the carrier holder 323, the carrier holder 323 adjusts the rotation angle so that the first holding part 323a becomes vertical and the second holding part 323b becomes horizontal. Thereby, the posture of the carrier 9 is changed from a horizontal posture to a vertical posture.

The conveying device 321 further has a driving part (not shown) that moves the movable base 322 in the Y direction in the second conveying part 320 . Thereby, the carrier 9 maintained in the vertical posture is transported in the +Y direction from a position near the first transport unit 310 to a position near the processing unit 330 in the vertical posture.

Thereafter, the carrier 9 arriving at a position near the processing unit 330 is received from the transportation device 321 by the main transport device 333C of the processing unit 330 . The carrier 9 received by the main transport device 333C is transported to one or any of a plurality of liquid processing units 331 by the main transport device 333C and the other main transport devices 333B and 333A, and is maintained in a vertical posture in various situations. Immerse in treatment liquid for specified period. Thereby, the plurality of substrates W accommodated in the carrier 9 are processed according to the processing liquid in which they are immersed. In the dialog box BA4 of FIG. 8 , the status of the carrier 9 transported by the main transport devices 333A, 333B, and 333C of the processing unit 330 is displayed.

As shown in the dialog box BA4 of FIG. 8 , each of the main transport devices 333A, 333B, and 333C includes a movable support column 333a and a pair of chuck members 333b. The movable support column 333a is movable in the X direction and movable in the Z direction (can be raised and lowered), and is provided on the side (+Y direction side) of the plurality of liquid processing units 331. A pair of chuck members 333b is provided to extend upward from the upper end of the movable support column 333a toward the upper side of the liquid treatment unit 331. The pair of chuck members 333b is configured to clamp and maintain the carrier 9 in a vertical posture. Furthermore, each of the main conveying devices 333A, 333B, and 333C has a driving unit (not shown) that can switch between holding the carrier 9 by the pair of chuck members 333b and releasing the carrier 9 from the pair of chuck members 333b. Thereby, the carrier 9 is transferred between the plurality of main transport devices 333A, 333B, and 333C and the plurality of liquid processing units 331.

Thereafter, the carrier 9 containing the plurality of substrates W processed by the processing liquid is transported to the drying unit 332 close to the relay block 200 . Thereby, the carrier 9 and the plurality of substrates W in the carrier 9 are dried by the drying unit 332 . As mentioned above, in FIGS. 6 to 8 , the thick solid line arrow a3 represents a series of transport paths of the carrier 9 in the processing block 300 .

The carrier 9 containing the plurality of processed substrates W is transported from the drying unit 332 to the carrier supporting part 220 of the relay block 200 by the main transporting device 333A, and is supported by the carrier supporting part 220 . In FIGS. 6 to 8 , arrow a4 with a thick dotted line indicates the transport path of the carrier 9 at this time.

Therefore, the posture of the carrier 9 handed over to the carrier support part 220 is changed from the vertical posture to the horizontal posture by the carrier support part 220 . In the dialog box BA1 of FIG. 7 , the status of the posture change of the carrier 9 in the carrier support unit 220 is schematically displayed.

As shown in the dialog box BA1 of FIG. 7 , the carrier support part 220 includes a fixed base 211 and a carrier holder 212 fixed in the relay block 200 . The carrier holder 212 is composed of a first holding part 212a and a second holding part 212b. The first holding part 212a has a rectangular flat plate shape capable of holding the lower end of the carrier 9 in a horizontal posture. Furthermore, the second holding part 212b has a rectangular flat plate shape capable of holding the lower end of the carrier 9 in the vertical posture.

The first holding part 212a and the second holding part 212b are connected in such a manner that one side of the first holding part 212a and one side of the second holding part 212b are in contact with each other and the two holding parts are orthogonal to each other. The fixed base 211 holds a part of the carrier holder 212 in such a manner that the first holding part 212a and the second holding part 212b are both parallel to the Y direction, and the carrier holder 212 is rotatable around an axis extending in the Y direction.

The carrier support part 220 further has a driving part (not shown) that can adjust the rotation angle of the carrier holder 212 on the fixed base 211 . Thereby, when receiving the carrier 9 in a vertical posture from the drying unit 332, the carrier holder 212 adjusts the rotation angle so that the second holding part 212b becomes horizontal and the first holding part 212a becomes vertical. Thereafter, after receiving the carrier 9 in the vertical posture on the carrier holder 212, the carrier holder 212 adjusts the rotation angle so that the second holding part 212b becomes vertical and the first holding part 212a becomes horizontal. Thereby, the posture of the carrier 9 is changed from a vertical posture to a horizontal posture. At this time, the substrate entrance and exit 12 (Fig. 5) of the carrier 9 faces the -X direction.

When the carrier 9 accommodating a plurality of substrates W is supported in the carrier support part 220 in a horizontal posture, the empty wafer transfer cassette 8 is placed on the shutter 130 of the substrate loading and unloading block 100 . Furthermore, the cover of the wafer transfer box 8 is opened. In this state, the substrate transfer robot 150 takes out a plurality of processed substrates W from the carrier 9 and inserts them into the wafer transfer box 8 on the shutter 130 . In FIGS. 6 to 8 , the arrow a5 with a thick dotted line indicates the transport path of the plurality of substrates W at this time.

Thereafter, the wafer pod 8 containing the plurality of processed substrates W is closed, held by the wafer pod transport device 112 , and placed on any of the plurality of wafer pod racks 110 . Furthermore, the wafer pod 8 is transported to the wafer pod placement portion 190 by the wafer pod transport device 111 , and is carried out from the substrate processing apparatus 1 . On the other hand, the posture of the carrier 9 that becomes empty in the carrier support part 220 is changed from the horizontal posture to the vertical posture again by the carrier support part 220 . The empty carrier 9 returned to the vertical posture in the carrier support unit 220 is transported by the main transport device 333A and received by the second standby unit 240 .

The empty carrier 9 is preferably reused for processing a plurality of new substrates W. Therefore, the empty carrier 9 supported by the second standby unit 240 is transported to the first standby unit 230 by, for example, the standby transfer device 250 and is supported by the first standby unit 230 . Furthermore, it is handed over from the first standby unit 230 to the carrier support unit 210 . In this way, the transfer path of the carrier 9 for reusing the used carrier 9 is set in the relay block 200 . The conveyance path of the carrier 9 from the first standby part 230 to the second standby part 240 (hereinafter referred to as the standby conveyance path) is indicated by a thick two-point chain line arrow b1 in FIG. 6 .

As described above, when the used empty carrier 9 is reused, in order to prevent a decrease in the cleanliness of the new plurality of substrates W to be processed, it is preferable to wash the carrier 9 before reusing it. Therefore, in this embodiment, the empty carrier 9 received from the carrier support part 220 by the second standby part 240 maintains the vertical posture, and is transported to the carrier cleaning unit by the cleaning transport device 410 of the cleaning block 400 420. In other words, the used empty carrier 9 is picked up from the second standby portion 240 in the standby transport path. In FIG. 6 , the transport path of the carrier 9 at this time is indicated by the arrow c1 which is a thicker dotted chain line.

In the carrier washing unit 420, and between one or a plurality of carrier washing tanks 421, one or a plurality of carrier drying parts 422, and one or a plurality of carrier standby parts 423, the washing and conveying device 410 Transport carrier 9. Thereby, the used carrier 9 is washed and dried. Furthermore, the washed and dried carrier 9 is stored in one or a plurality of carrier waiting parts 423 . In each carrier washing tank 421, each carrier drying part 422, and each carrier standby part 423, the vertical posture of the carrier 9 is maintained.

It is assumed that a series of processes are performed on a plurality of unprocessed substrates W newly accommodated in another wafer transfer cassette 8 . In this case, the cleaned carrier 9 stored in the carrier standby section 423 of the cleaning block 400 is transported as a new carrier 9 from the carrier cleaning unit 420 to the second standby section 240 by the cleaning transfer device 410 . In other words, the cleaned and empty carrier 9 is returned to the second standby portion 240 in the standby conveyance path as a new carrier 9 . In FIG. 6 , arrow c2 , which is a thicker dotted chain line, indicates the conveying path of the new carrier 9 at this time.

The new carrier 9 transferred to the second standby unit 240 maintains a vertical posture and is transported to the first standby unit 230 along the standby transfer path by the standby transfer device 250 (refer to the thicker two-point chain line arrow in FIG. 6 mentioned above). b1). Also, it is supported by the first standby unit 230 . The first standby unit 230 transfers the new carrier 9 supported by the first standby unit 230 to the carrier support unit 210 . Therefore, the posture of the new carrier 9 transferred to the carrier support unit 210 is changed from the vertical posture to the horizontal posture by the carrier support unit 210 in order to receive the plurality of unprocessed substrates W.

As mentioned above, the two bearer supporting parts 210 and 220 in the relay block 200 have the same structure. Thereby, in the carrier support part 210, as shown in the dialog box BA1 of FIG. 7, the posture of the updated carrier 9 is changed. Thereafter, a plurality of new unprocessed substrates W stored in other wafer transfer boxes 8 are inserted into the new carrier 9 in a horizontal position.

The new carrier 9 containing the plurality of unprocessed substrates W is conveyed along a conveyance path indicated by a series of arrows a2, a3, and a4 shown in FIGS. 6 to 8 . Thereby, a series of processes are performed on the plurality of substrates W accommodated in the new carrier 9 .

＜4＞Effect (1) In the above-mentioned substrate processing apparatus 1, while the empty carrier 9 is supported on the carrier support part 210, a plurality of unprocessed substrates W in the loaded wafer transfer cassette 8 are inserted by the substrate transfer robot 140 to empty carrier 9. The carrier 9 containing a plurality of unprocessed substrates W is received by the first standby unit 230 . Furthermore, the carrier 9 is received by the first end TA1 of the processing block 300 . In the processing block 300, the carrier 9 is conveyed from the first end TA1 to the third end TA3 on the conveyance path of arrow a3 in FIG. 6 . While the carrier 9 is transported in the processing block 300 , preset processing is performed on the plurality of substrates W stored in the carrier 9 by various liquid processing units 331 and drying units 332 .

In this case, each of the plurality of conveying devices (311, 321, 333A, 333B, and 333C) in the processing block 300 can integrally process the plurality of substrates W by conveying the carrier 9 accommodating the plurality of substrates W. Therefore, each of the plurality of conveying devices (311, 321, 333A, 333B, 333C) does not need to have a cumbersome structure to integrate and directly hold a plurality of substrates W.

The carrier 9 storing the plurality of processed substrates W is transferred from the third end TA3 of the processing block 300 to the second standby unit 240 and is supported by the second standby unit 240 . Furthermore, the carrier 9 containing the plurality of processed substrates W is transferred to the carrier support part 220 and supported by it. With the empty wafer transfer box 8 placed on the shutter 130 , the processed substrates W are taken out from the carrier 9 by the substrate transfer robot 150 and inserted into the empty wafer transfer box 8 .

The empty carrier 9 from which the plurality of processed substrates W has been taken out is conveyed from the second standby part 240 to the first standby part 230 along the conveyance path (standby conveyance path) of arrow b1 in FIG. 6 , for example. Thereby, the carrier 9 can be reused.

Here, the above-mentioned substrate processing apparatus 1 includes a cleaning block 400 . The cleaning transport device 410 of the cleaning block 400 picks up the empty carriers 9 on the waiting transport path from the waiting transport path, and transports them to the carrier cleaning unit 420 . In the carrier washing unit 420, the empty carrier 9 after use is washed. Furthermore, the cleaned and empty carrier 9 is returned to the waiting conveyance path again. The carrier 9 returned to the standby conveyance path is conveyed to the first standby part 230 along the standby conveyance path. In this case, the cleaned and empty carrier 9 transported to the first standby unit 230 can be used to insert a plurality of unprocessed substrates W.

As described above, in the substrate processing apparatus 1 of this embodiment, since the carrier 9 can be reused, there is no need to prepare a plurality of carriers 9 . In addition, since the reused carrier 9 can be washed, contamination of the plurality of substrates W caused by the reused carrier 9 can be prevented. As a result, it is possible to prevent contamination of the plurality of substrates W, and to suppress the complexity of the structure of the plurality of transport devices (311, 321, 333A, 333B, 333C) and the increase in the number of parts.

Furthermore, according to the above-mentioned substrate processing apparatus 1, the carrier 9 used for processing the plurality of substrates W can be cleaned every time it is used to process the plurality of substrates W. Thereby, since the surface state of the carrier 9 is reset each time a plurality of substrates W are processed, deterioration of the carrier 9 due to contamination, corrosion, etc. can also be suppressed.

(2) As mentioned above, the carrier washing unit 420 includes one or a plurality of carrier washing tanks 421 and a washing and conveying device 410 . The processing liquid is stored in each of one or a plurality of carrier washing tanks 421 . The washing and conveying device 410 is configured to immerse the carrier 9 in the treatment liquid in each carrier washing tank 421 and to lift the carrier 9 from each carrier washing tank 421 . Thereby, in the carrier washing unit 420, the carrier 9 can be washed with a simple structure and a simple method.

(3) The carrier washing unit 420 includes one or a plurality of carrier drying parts 422 . Thereby, the carrier 9 washed by the carrier washing tank 421 can be dried by one or a plurality of carrier drying parts 422 . Thereby, dust is less likely to adhere to the cleaned carrier 9 . Therefore, deterioration in the cleanliness of the washed carrier 9 is suppressed.

(4) The carrier cleaning unit 420 includes one or a plurality of carrier standby units 423 . Thereby, the washed carrier 9 can be put on standby in the carrier washing unit 420 . Therefore, the cleaned carrier 9 can be returned to the standby transport path at an appropriate timing.

(5) In the substrate processing apparatus 1 described above, the cleaning and transporting device 410 picks up the used empty carrier 9 from the second standby unit 240 . In this case, since the second standby unit 240 is located at the starting point of the standby conveyance path, the used carrier 9 is prevented from being conveyed throughout the wide range of the standby conveyance path in an unwashed state. Therefore, contamination of the standby conveyance path is suppressed.

＜5＞Other implementation forms (1) In the substrate processing apparatus 1 of the above embodiment, the carrier cleaning unit 420 is provided at a side (+Y direction) position of the substrate loading and unloading block 100 and the relay block 200 . Furthermore, the cleaning and conveying device 410 picks up the used carrier 9 from the second standby part 240 in the standby conveying path, and returns the washed carrier 9 to the second standby part 240 . However, in the substrate processing apparatus 1 according to an aspect of the present invention, the configuration of the carrier cleaning unit 420 is not limited to the above example. In addition, the portion of the standby conveyance path where the carrier 9 is picked up and the portion of the standby conveyance path where the carrier 9 returns are not limited to the above example.

FIG. 9 is a schematic plan view showing the basic structure of the substrate processing apparatus 1 according to another embodiment. FIG. 10 is a schematic side view of the substrate processing apparatus 1 of FIG. 9 . In FIGS. 9 and 10 , arrows indicating mutually orthogonal X directions, Y directions, and Z directions are marked, as in the examples of the respective figures of the substrate processing apparatus 1 of the above-mentioned embodiment. The schematic side view of FIG. 10 is a schematic side view of the substrate processing apparatus 1 of FIG. 9 viewed in the +Y direction. The differences between the substrate processing apparatus 1 of another embodiment and the substrate processing apparatus 1 of the above embodiment will be described.

In the substrate processing apparatus 1 of this embodiment, the carrier cleaning unit 420 is installed in the first transfer of the processing block 300 instead of the position on the side (+Y direction) of the substrate loading and unloading block 100 and the relay block 200 The position below part 310. Therefore, the carrier cleaning unit 420 of this example overlaps with the first transport part 310 in a plan view. In FIG. 9 , in order to make it easier to understand the arrangement of the carrier cleaning unit 420 , the first transport section 310 of the processing block 300 is shown with a dotted line.

In addition, the carrier cleaning unit 420 in this example is disposed adjacent to the first standby unit 230 of the relay block 200 in the +X direction. Furthermore, the carrier washing unit 420 in this example includes one or a plurality (two in this example) of carrier washing tanks 421, one or a plurality (one in this example) of carrier drying parts 422 and 1 One or a plurality of (in this example, two) carrier standby units 423. One or a plurality of carrier washing tanks 421, one or a plurality of carrier drying units 422, and one or a plurality of carrier standby units 423 are self-relayed The first standby portion 230 of the block 200 is arranged along the +X direction.

A cleaning transfer device 410 is provided accompanying the carrier cleaning unit 420 . The washing and conveying device 410 can move in the X direction and the Z direction between the first standby part 230, one or a plurality of carrier washing tanks 421, one or a plurality of carrier drying parts 422, and one or a plurality of carriers. The substrate W is transported between the standby units 423 .

In this substrate processing apparatus 1, the used carrier 9 supported by the second standby part 240 is transported to the first standby part 230 along the standby transport path by the standby transport device 250 (refer to the two thicker dots in FIG. 9 Arrow b1) of the chain line. Thereafter, the empty carrier 9 supported by the first standby unit 230 maintains the vertical posture and is transported to the carrier cleaning unit 420 by the cleaning transport device 410 . In other words, the used empty carrier 9 is picked up from the first standby portion 230 in the standby conveyance path and conveyed to the carrier cleaning unit 420 . The transport path of the carrier 9 at this time is represented by the arrow d1 of the thicker dotted chain line in FIGS. 9 and 10 .

In the carrier washing unit 420, the used carrier 9 is washed and dried in the same manner as in the above embodiment. The carrier 9 after the washing process and the drying process is held in one or a plurality of carrier standby parts 423 and enters a standby state.

Here, it is assumed that a series of processes are performed on a plurality of unprocessed substrates W accommodated in a new wafer transfer cassette 8 . In this case, the clean carrier 9 held in the carrier standby unit 423 is transported to the first standby unit 230 by the cleaning transfer device 410 as a new carrier 9 . In other words, the cleaned and empty carrier 9 is returned to the first standby portion 230 in the standby conveyance path as a new carrier 9 . In FIGS. 9 and 10 , the transport path of the new carrier 9 is indicated by the arrow d2 which is a thicker dotted chain line.

As mentioned above, in the substrate processing apparatus 1 of FIGS. 9 and 10 , the carrier 9 is also used to process a plurality of substrates W, and the carrier 9 is reused. Furthermore, wash the carrier 9 after use. Therefore, the same effects as those of the above embodiment can be obtained.

In the substrate processing apparatus 1 of FIGS. 9 and 10 , the cleaning and conveying device 410 picks up the used empty carrier 9 from the first standby part 230 . In this case, since the first standby unit 230 is located at the end of the standby conveyance path, the washed carrier 9 is not conveyed over the wide range of the standby conveyance path. Therefore, the carrier 9 can accommodate a plurality of unprocessed substrates W without reducing the cleanliness of the washed carrier 9 .

(2) The carrier cleaning unit 420 may be further provided in a part different from the example of the substrate processing apparatus 1 shown in FIGS. 1 and 9 . FIG. 11 is a schematic plan view showing the basic structure of the substrate processing apparatus 1 according to another embodiment. In FIG. 11 , arrows indicating the mutually orthogonal X direction, Y direction, and Z direction are marked, as in the examples of the respective figures of the substrate processing apparatus 1 of the above-mentioned embodiment. The differences between the substrate processing apparatus 1 of FIG. 11 and the substrate processing apparatus 1 of the above embodiment will be described.

The carrier cleaning unit 420 in this example is provided to extend along the X direction inside the substrate loading and unloading block 100 and the relay block 200, and includes one or a plurality of cleaning and transporting devices 410 (two in this example). 1) carrier washing tank 421, 1 or multiple carriers (1 in this example) carrier drying section 422, and 1 or multiple (1 in this example) carrier standby section 423. 1 or multiple carriers The washing tank 421, one or a plurality of carrier drying parts 422, and one or a plurality of the carrier waiting parts 423 are arranged along the -X direction from the standby transfer path in the relay block 200.

A cleaning transfer device 410 is provided accompanying the carrier cleaning unit 420 . The washing and conveying device 410 can move along the waiting conveying path, one or a plurality of carrier washing tanks 421, one or a plurality of carrier drying parts 422, and one or a plurality of carrier waiting parts by moving in the X direction and the Z direction. The substrate W is transported between 423.

In the substrate processing apparatus 1 , the cleaning and conveying device 410 picks up the empty carrier 9 that is conveyed from the second standby part 240 to the first standby part 230 along the standby conveyance path, and conveys it to the carrier cleaning unit 420 . In FIG. 11 , the transport path of the carrier 9 at this time is indicated by the arrow e1 of a thicker dotted chain line.

Furthermore, the carrier 9 washed by the carrier washing unit 420 is returned to the standby conveying path by the washing conveying device 410 . In FIG. 11 , the transport path of the carrier 9 at this time is indicated by an arrow e2 of a thicker dotted chain line. By transporting the carrier 9 returned to the standby transport path to the first standby section 230, the cleaned carrier 9 can be used for processing a plurality of new substrates W.

(3) In the cleaning block 400 of the above embodiment, an elevator that can immerse the carrier 9 in the treatment liquid and lift the carrier 9 from the treatment liquid may be provided in one or a plurality of carrier washing tanks 421 . In this case, the carrier washing unit 420 may be equipped with an elevator capable of raising and lowering the carrier 9 relative to the plurality of carrier washing tanks 421 , similarly to the processing unit 330 of the processing block 300 . Furthermore, the carrier washing unit 420 may be provided with a main transport device for transferring the carrier 9 between a plurality of elevators.

(4) In the substrate processing apparatus 1 of the above embodiment, the frame members 10a and 10b of the carrier 9 in the vertical posture are maintained parallel to the vertical direction. However, the frame members 10a and 10b of the carrier 9 in the vertical posture may be maintained parallel to the vertical direction. The vertical direction is roughly parallel. That is, the carrier 9 in the vertical posture only needs to be able to keep the plurality of accommodated substrates W parallel or substantially parallel to the vertical direction.

Furthermore, in the substrate processing apparatus 1 of the above embodiment, the frame members 10a and 10b of the carrier 9 in the horizontal posture are maintained orthogonal to the vertical direction. However, the frame members 10a and 10b of the carrier 9 in the horizontal posture may be maintained orthogonal to the vertical direction. The vertical directions are approximately orthogonal. That is, the carrier 9 in the horizontal posture only needs to be able to hold the plurality of accommodated substrates W parallel to or substantially parallel to the horizontal direction.

(5) In the substrate processing apparatus 1 of the above embodiment, the carrier support part 210 and the first standby part 230 are separately provided in the relay block 200, but the present invention is not limited to this. When the function of changing the posture of the carrier 9 can be added to the first standby portion 230, the carrier support portion 210 may not be provided.

Furthermore, in the substrate processing apparatus 1 of the above embodiment, the carrier support part 220 and the second standby part 240 are separately provided in the relay block 200, but the present invention is not limited to this. When the function of changing the posture of the carrier 9 can be added to the second standby portion 240, the carrier support portion 220 may not be provided.

(6) In the second transport section 320 of the processing block 300 in the above embodiment, the transport device 321 has the function of changing the posture of the carrier 9 and transporting the carrier 9, but the present invention is not limited to this. In the second transport unit 320 , components having a function of changing the posture of the carrier 9 and components having a function of transporting the carrier 9 may be separately provided in place of the above-mentioned transport device 321 .

(7) In the substrate processing apparatus 1 of the above embodiment, the substrate W to be processed has a rectangular shape when viewed from above. However, the substrate W to be processed may also have a circular shape when viewed from above, or may have a triangular or triangular shape when viewed from above. Polygonal shapes other than quadrilaterals such as pentagons.

(8) The carrier 9 of the above embodiment supports both sides of the rectangular substrate W when the rectangular substrate W is stored in a horizontal posture, but the present invention is not limited to this. The carrier 9 may be configured to support the center portion of the substrate W in a horizontal posture.

(9) In the substrate processing apparatus 1 of the above embodiment, the processing liquid for cleaning the substrate W is stored in the plurality of processing tanks 331a of the processing unit 330. However, the present invention is not limited to this. A plating liquid for plating the substrate W, a liquid for modifying the surface state of the substrate W, or the like may be stored in at least a part of the plurality of processing tanks 331a of the processing unit 330 as the processing liquid. As described above, the above embodiment is an example of applying the present invention to the cleaning process of a plurality of substrates W, but it is not limited thereto. The present invention can also be applied to other processes such as plating processing or surface modification processing of a plurality of substrates W. handle.

(10) In the substrate processing apparatus 1 of the above embodiment, the cleaning block 400 takes out the empty carrier 9 from the standby transfer path from the second standby part 240 to the first standby part 230, cleans it, and makes it again Returning to the standby conveyance path, the present invention is not limited to this. The washing block 400 may also constitute a part of the waiting conveyance path from the second waiting part 240 to the first waiting part 230.

Specifically, for example, the cleaning block 400 may receive the empty carrier 9 before cleaning from the second standby unit 240 through the cleaning transport device 410, and wash the carrier 9 through the carrier cleaning unit 420. The carrier 9 is then handed over to the first standby unit 230 . Or, for example, the cleaning block 400 can also receive the empty carrier 9 before cleaning from the position between the second standby part 240 and the first standby part 230 through the cleaning transport device 410, and use the carrier cleaning unit 420 to Washing is performed, and the washed carrier 9 is handed over to the first standby part 230 .

In this case, the cleaning block 400 may also be separately provided with a transport device for receiving the carrier 9 before cleaning and a transport device for transferring the carrier 9 after cleaning. Thereby, by not using the same structure for transporting the carrier 9 before cleaning and the structure for transporting the carrier 9 after cleaning, the exchange of contaminants between the carrier 9 and the structure for transporting the carrier 9 is prevented. Transfer. As a result, deterioration in the cleanliness of the carrier 9 in the relay block 200 and the washing block 400 is suppressed.

(11) In the carrier 9 of the above embodiment, four openings 13 are formed in the center portions of each of the frame members 10a and 10b, but the present invention is not limited to this. The number of openings 13 is not limited to four, but other numbers such as one, two, three or five may be formed in the central portion of each of the frame members 10a and 10b. Alternatively, the opening 13 may not be formed in the central portion of each of the frame members 10a and 10b. Furthermore, the shapes of the frame members 10a and 10b can also be appropriately designed and changed.

(12) In each of the main conveying devices 333A, 333B, and 333C of the above embodiment, the pair of chuck members 333b holds the carrier 9 by sandwiching the carrier 9 in the X direction, but the present invention is not limited to this. The pair of chuck members 333b can also hold the carrier 9 by sandwiching the carrier 9 in the Y direction, and can hold the carrier 9 by sandwiching the carrier 9 in a horizontal plane in a direction intersecting the X direction and the Y direction.

＜6＞Correspondence between each component element of the technical solution and each element of the implementation form Hereinafter, examples corresponding to each constituent element of the technical solution and each element of the embodiment will be described, but the present invention is not limited to the following examples. As each constituent element of the technical solution, various other elements having the constitution or functions described in the technical solution can also be used.

In the above embodiment, the substrate processing apparatus 1 is an example of a substrate processing apparatus, the carrier 9 is an example of a carrier, the conveyance path of the carrier 9 shown by arrow a3 in FIG. 6 is an example of the first conveyance path, and the first conveyance part 310 The first end TA1 is an example of the starting point of the first conveyance path, and the third end TA3 of the processing unit 330 is an example of the end point of the first conveyance path, including the main conveyance devices 311, 333A, 333B of the processing block 300. The component group of 333C and the conveyance device 321 is an example of a conveyance mechanism.

In addition, the plurality of liquid processing units 331 of the processing unit 330 is an example of the processing unit, the substrate transfer robot 140 is an example of the substrate insertion unit, the first standby unit 230 is an example of the first standby unit, and the second standby unit 240 is an example of the second standby unit. As an example of the standby section, the substrate transfer robot 150 is an example of the substrate taking-out section, and the cleaning block 400 and the carrier cleaning unit 420 are an example of the carrier cleaning section.

In addition, the standby conveying path of the carrier 9 indicated by arrow b1 in FIG. 6 is an example of the second conveying path, the carrier washing tank 421 is an example of a washing tank, the washing and conveying device 410 is an example of a carrier conveying device, and the carrier is dried The part 422 is an example of a carrier drying part, and the carrier standby part 423 is an example of a carrier standby part.

1:Substrate processing device 8: Wafer transfer box 9: Carrier 10a, 10b, 10c, 10d: frame members 11: Support film 12:Substrate entrance and exit 13:Opening part 100: Substrate loading and unloading area 101:End face 102: One side of face 103:The other side of the face 110:Wafer transfer box rack 111,112: Wafer transfer box transport device 120,130: switch 140,150:Substrate handover robot 160:Control Department 190: Wafer transfer cassette loading part 200: Relay block 210,220: Carrier Support Department 211: Fixed pedestal 212: Carrier holder 212a: 1st holding part 212b: 2nd maintenance part 230: 1st standby section 240: 2nd standby section 250: Standby transfer device 300: Processing block 310: 1st Transport Department 311: Main transport device 311a: Movable carrier 311b: Guide rail 312A, 312B: Sub-conveying device 320: 2nd Transport Department 321:Conveying device 322: Movable pedestal 323: Carrier holder 323a: 1st holding part 323b: 2nd holding part 330:Processing Department 331:Liquid handling unit 331a: Processing tank 331b: Lift 332:Drying unit 333a: Movable support column 333A, 333B, 333C: Main transport device 333b:Chuck member 400: Clean block 410: Cleaning and conveying device 420: Carrier cleaning unit 421: Carrier washing tank 422: Carrier drying section 423: Carrier standby department a1~a5,b1,c1,c2,d1,d2,e1,e2: arrow BA1, BA2, BA3, BA4: dialog box MS1, MS2: Maintenance space pr:protrusion TA1: 1st end TA2: 2nd end TA3: 3rd end TA4: 4th end W: substrate WP:worker

FIG. 1 is a schematic plan view showing the basic structure of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus taken along line A-A in FIG. 1 . FIG. 3 is a top view of the carrier used in the substrate processing apparatus of FIG. 1 . Figure 4 is a side view of the carrier of Figure 3. Figure 5 is a cross-sectional view of the carrier along line B-B in Figure 4. FIG. 6 is a diagram illustrating transport paths of a plurality of substrates and carriers in the substrate processing apparatus of FIG. 1 . FIG. 7 is a diagram illustrating transport paths of a plurality of substrates and carriers in the substrate processing apparatus of FIG. 1 . FIG. 8 is a diagram illustrating transport paths of a plurality of substrates and carriers in the substrate processing apparatus of FIG. 1 . FIG. 9 is a schematic plan view showing the basic structure of a substrate processing apparatus according to another embodiment. FIG. 10 is a schematic side view of the substrate processing apparatus of FIG. 9 . FIG. 11 is a schematic plan view showing the basic structure of a substrate processing apparatus according to another embodiment.

1:Substrate processing device

8: Wafer transfer box

9: Carrier

100: Substrate loading and unloading area

110:Wafer transfer box rack

111,112: Wafer transfer box transport device

120,130: switch

140,150:Substrate handover robot

190: Wafer transfer cassette loading part

200: Relay block

210,220: Carrier Support Department

230: 1st standby section

240: 2nd standby section

250: Standby transfer device

300: Processing block

310: 1st Transport Department

311: Main transport device

311a: Movable carrier

311b: Guide rail

312A, 312B: Sub-conveying device

320: 2nd Transport Department

321:Conveying device

330:Processing Department

331:Liquid handling unit

332:Drying unit

333A, 333B, 333C: Main transport device

400: Clean block

410: Cleaning and conveying device

420: Carrier cleaning unit

421: Carrier washing tank

422: Carrier drying section

423: Carrier standby department

a1~a5,b1,c1,c2: arrow

TA1: 1st end

TA2: 2nd end

TA3: 3rd end

TA4: 4th end

Claims (6)

A substrate processing device that performs preset processing on a plurality of substrates and has: A carrier configured to accommodate the plurality of substrates; A transport mechanism that transports the above-mentioned carrier from the starting point to the end point of the first transport path along the preset first transport path; A processing unit, which is disposed on the first transport path and performs the preset processing on the plurality of substrates stored in the carrier while the plurality of substrates are stored in the carrier; a substrate insertion unit that inserts the plurality of unprocessed substrates carried into the substrate processing device into the empty carrier; A first standby unit is provided adjacent to the starting point of the first transfer path, and is configured to support and transfer the carrier accommodating the plurality of unprocessed substrates via the substrate insertion unit To the above-mentioned starting point of the above-mentioned first conveyance path; A second standby unit is provided adjacent to the end point of the first conveyance path, and is configured to receive and support the carrier containing the plurality of processed substrates from the end point of the first conveyance path. ; a substrate taking-out part that takes out the plurality of processed substrates from the carrier containing the plurality of substrates processed by the processing unit; and a carrier washing section, which washes the above-mentioned carrier; and Forming a preset second transport path for transporting the carrier from the second standby part to the first standby part; The carrier cleaning unit picks up the empty carriers from the second transport path after the plurality of substrates have been processed by the substrate taking-out unit, and cleans the picked up carriers so that the cleaned carriers The carrier returns to the second conveyance path described above. The substrate processing device of claim 1, wherein The above-mentioned carrier cleaning part includes: A washing tank that stores the cleaning liquid used to wash the above-mentioned carrier; and The carrier transport device is configured to immerse the carrier in the cleaning liquid of the cleaning tank and lift the carrier immersed in the cleaning liquid from the cleaning liquid. The substrate processing device of claim 2, wherein The carrier washing part further includes a carrier drying part for drying the washed carrier. The substrate processing device according to any one of claims 1 to 3, wherein The above-mentioned carrier washing part further includes a carrier standby part that waits for the washed carrier. The substrate processing device according to any one of claims 1 to 3, wherein The carrier cleaning unit picks up the empty carrier from the second standby unit in the second conveyance path. The substrate processing device according to any one of claims 1 to 3, wherein The carrier washing part returns the washed carrier to the first standby part in the second conveyance path.