TWI850353B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI850353B
TWI850353B TW109109147A TW109109147A TWI850353B TW I850353 B TWI850353 B TW I850353B TW 109109147 A TW109109147 A TW 109109147A TW 109109147 A TW109109147 A TW 109109147A TW I850353 B TWI850353 B TW I850353B
Authority
TW
Taiwan
Prior art keywords
resin
resin composition
magnetic
mass
manufactured
Prior art date
Application number
TW109109147A
Other languages
English (en)
Chinese (zh)
Other versions
TW202104408A (zh
Inventor
依田正応
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202104408A publication Critical patent/TW202104408A/zh
Application granted granted Critical
Publication of TWI850353B publication Critical patent/TWI850353B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW109109147A 2019-03-20 2020-03-19 樹脂組成物 TWI850353B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019053604 2019-03-20
JP2019-053604 2019-03-20

Publications (2)

Publication Number Publication Date
TW202104408A TW202104408A (zh) 2021-02-01
TWI850353B true TWI850353B (zh) 2024-08-01

Family

ID=72520363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109109147A TWI850353B (zh) 2019-03-20 2020-03-19 樹脂組成物

Country Status (3)

Country Link
JP (1) JP7552583B2 (https=)
TW (1) TWI850353B (https=)
WO (1) WO2020189778A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7510888B2 (ja) 2021-01-22 2024-07-04 Tdk株式会社 積層コイル部品およびその製造方法
TW202239616A (zh) * 2021-03-26 2022-10-16 日商太陽油墨製造股份有限公司 硬化性樹脂組成物
JP2023077268A (ja) * 2021-11-24 2023-06-05 味の素株式会社 樹脂組成物
JP7619247B2 (ja) * 2021-11-25 2025-01-22 味の素株式会社 樹脂シート
WO2023145500A1 (ja) * 2022-01-31 2023-08-03 富士フイルム株式会社 組成物の製造方法、磁性材料、電子部品
JP7817026B2 (ja) * 2022-03-14 2026-02-18 株式会社トーキン 粘着テープ及びテープロール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134465A (ja) * 2005-11-09 2007-05-31 Toda Kogyo Corp 電波吸収材用球状複合体粒子粉末及びその製造方法、該複合体粒子粉末を含む半導体封止用樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283357A (ja) * 1993-03-30 1994-10-07 Nippon Steel Corp 絶縁被覆Ｍｎ−Ｚｎ系フェライトコアおよびその製造方法
TWI653312B (zh) 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
JP6127324B2 (ja) 2015-01-28 2017-05-17 パウダーテック株式会社 磁性フィラー
JP6443215B2 (ja) 2015-05-18 2018-12-26 堺化学工業株式会社 顔料用酸化チタン系複合粒子、及びそれを含有する組成物
TW201842123A (zh) 2017-04-19 2018-12-01 日商味之素股份有限公司 樹脂組成物
JP7393856B2 (ja) * 2017-10-02 2023-12-07 味の素株式会社 インダクタ基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134465A (ja) * 2005-11-09 2007-05-31 Toda Kogyo Corp 電波吸収材用球状複合体粒子粉末及びその製造方法、該複合体粒子粉末を含む半導体封止用樹脂組成物

Also Published As

Publication number Publication date
JP7552583B2 (ja) 2024-09-18
WO2020189778A1 (ja) 2020-09-24
TW202104408A (zh) 2021-02-01
JPWO2020189778A1 (https=) 2020-09-24

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