TWI846954B - 樹脂膜、電子器件、樹脂膜的製造方法及電子器件的製造方法 - Google Patents
樹脂膜、電子器件、樹脂膜的製造方法及電子器件的製造方法 Download PDFInfo
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- TWI846954B TWI846954B TW109132560A TW109132560A TWI846954B TW I846954 B TWI846954 B TW I846954B TW 109132560 A TW109132560 A TW 109132560A TW 109132560 A TW109132560 A TW 109132560A TW I846954 B TWI846954 B TW I846954B
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- resin film
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- polyimide
- carbon atoms
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- 229920005989 resin Polymers 0.000 title claims abstract description 290
- 238000004519 manufacturing process Methods 0.000 title claims description 65
- 229920001721 polyimide Polymers 0.000 claims abstract description 134
- 239000004642 Polyimide Substances 0.000 claims abstract description 122
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- 230000008859 change Effects 0.000 claims abstract description 56
- 239000010408 film Substances 0.000 claims description 374
- 239000000126 substance Substances 0.000 claims description 127
- 125000004432 carbon atom Chemical group C* 0.000 claims description 81
- 238000000576 coating method Methods 0.000 claims description 55
- 239000011248 coating agent Substances 0.000 claims description 53
- 239000011342 resin composition Substances 0.000 claims description 53
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- 238000000034 method Methods 0.000 claims description 42
- 150000000000 tetracarboxylic acids Chemical group 0.000 claims description 42
- 239000002243 precursor Substances 0.000 claims description 41
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- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 claims description 12
- 229910001413 alkali metal ion Inorganic materials 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 12
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- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical group OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 claims description 8
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical group OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 6
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- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 6
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
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- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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| TWI535766B (zh) * | 2010-10-28 | 2016-06-01 | Kaneka Corp | Method for manufacturing conductive polyimide film |
| JP5783789B2 (ja) * | 2011-05-10 | 2015-09-24 | 株式会社カネカ | 導電性ポリイミドフィルムの製造方法 |
| CN104508008B (zh) * | 2012-08-01 | 2016-08-17 | 东丽株式会社 | 聚酰胺酸树脂组合物、使用了该组合物的聚酰亚胺膜及其制造方法 |
| JP6746888B2 (ja) * | 2014-09-30 | 2020-08-26 | 東レ株式会社 | ディスプレイ用支持基板、それを用いたカラーフィルターおよびその製造方法、有機ｅｌ素子およびその製造方法、ならびにフレキシブル有機ｅｌディスプレイ |
| WO2017099183A1 (ja) | 2015-12-11 | 2017-06-15 | 東レ株式会社 | 樹脂組成物、樹脂の製造方法、樹脂膜の製造方法および電子デバイスの製造方法 |
| JPWO2019065164A1 (ja) * | 2017-09-26 | 2020-09-03 | 東レ株式会社 | ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物、ポリイミド樹脂膜、積層体の製造方法、カラーフィルタの製造方法、液晶素子の製造方法および有機ｅｌ素子の製造方法 |
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