TWI843664B - 用於化學機械研磨的紋理化的小墊 - Google Patents

用於化學機械研磨的紋理化的小墊 Download PDF

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Publication number
TWI843664B
TWI843664B TW112139156A TW112139156A TWI843664B TW I843664 B TWI843664 B TW I843664B TW 112139156 A TW112139156 A TW 112139156A TW 112139156 A TW112139156 A TW 112139156A TW I843664 B TWI843664 B TW I843664B
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TW
Taiwan
Prior art keywords
polishing pad
polishing
pad portion
substrate
recesses
Prior art date
Application number
TW112139156A
Other languages
English (en)
Chinese (zh)
Other versions
TW202406679A (zh
Inventor
正勳 吳
愛德恩Ｃ 隋瑞茲
家祥 馮
永豪 劉
敬儀 向
亞敘溫穆魯嘉龐 裘卡林姆
丹尼爾 瑞特法德
查爾斯Ｃ 蓋瑞森
湯瑪士Ｈ 歐斯特海德
Original Assignee
美商應用材料股份有限公司
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Filing date
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Publication of TW202406679A publication Critical patent/TW202406679A/zh
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Publication of TWI843664B publication Critical patent/TWI843664B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW112139156A 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊 TWI843664B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662313023P 2016-03-24 2016-03-24
US62/313,023 2016-03-24

Publications (2)

Publication Number Publication Date
TW202406679A TW202406679A (zh) 2024-02-16
TWI843664B true TWI843664B (zh) 2024-05-21

Family

ID=59897480

Family Applications (4)

Application Number Title Priority Date Filing Date
TW112139156A TWI843664B (zh) 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊
TW106109841A TWI757275B (zh) 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊
TW112105107A TWI846323B (zh) 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊
TW111104600A TWI836343B (zh) 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW106109841A TWI757275B (zh) 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊
TW112105107A TWI846323B (zh) 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊
TW111104600A TWI836343B (zh) 2016-03-24 2017-03-24 用於化學機械研磨的紋理化的小墊

Country Status (6)

Country Link
US (1) US10589399B2 (enExample)
JP (3) JP6979030B2 (enExample)
KR (2) KR102535628B1 (enExample)
CN (1) CN108883515A (enExample)
TW (4) TWI843664B (enExample)
WO (1) WO2017165216A1 (enExample)

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JP7351170B2 (ja) * 2019-09-26 2023-09-27 日本電気硝子株式会社 研磨パッド、及び研磨方法
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Also Published As

Publication number Publication date
JP6979030B2 (ja) 2021-12-08
KR20180119693A (ko) 2018-11-02
KR102363829B1 (ko) 2022-02-16
WO2017165216A1 (en) 2017-09-28
TWI846323B (zh) 2024-06-21
US10589399B2 (en) 2020-03-17
TW202406679A (zh) 2024-02-16
TW202220797A (zh) 2022-06-01
TW202322971A (zh) 2023-06-16
JP2022031724A (ja) 2022-02-22
KR102535628B1 (ko) 2023-05-30
US20170274498A1 (en) 2017-09-28
KR20220025234A (ko) 2022-03-03
JP7580543B2 (ja) 2024-11-11
TWI757275B (zh) 2022-03-11
CN108883515A (zh) 2018-11-23
TW201736041A (zh) 2017-10-16
JP7326405B2 (ja) 2023-08-15
JP2019510650A (ja) 2019-04-18
TWI836343B (zh) 2024-03-21
JP2023162199A (ja) 2023-11-08

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