TWI829827B - 發光裝置、發光模組及發光裝置之製造方法 - Google Patents
發光裝置、發光模組及發光裝置之製造方法 Download PDFInfo
- Publication number
- TWI829827B TWI829827B TW108145714A TW108145714A TWI829827B TW I829827 B TWI829827 B TW I829827B TW 108145714 A TW108145714 A TW 108145714A TW 108145714 A TW108145714 A TW 108145714A TW I829827 B TWI829827 B TW I829827B
- Authority
- TW
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- Prior art keywords
- light
- emitting device
- main surface
- emitting
- wavelength conversion
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 238000006243 chemical reaction Methods 0.000 claims abstract description 83
- 239000002245 particle Substances 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 239000000945 filler Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims description 97
- 239000011347 resin Substances 0.000 claims description 97
- 238000005520 cutting process Methods 0.000 claims description 65
- 239000000463 material Substances 0.000 claims description 50
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000005304 joining Methods 0.000 claims description 9
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 8
- 238000001579 optical reflectometry Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 75
- 238000009792 diffusion process Methods 0.000 description 22
- 239000004973 liquid crystal related substance Substances 0.000 description 18
- 239000002585 base Substances 0.000 description 13
- 238000000605 extraction Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- -1 for example Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 240000003380 Passiflora rubra Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 210000000007 bat wing Anatomy 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052800 carbon group element Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018234960 | 2018-12-14 | ||
| JP2018-234960 | 2018-12-14 | ||
| JP2019221625A JP7007598B2 (ja) | 2018-12-14 | 2019-12-06 | 発光装置、発光モジュール及び発光装置の製造方法 |
| JP2019-221625 | 2019-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202034541A TW202034541A (zh) | 2020-09-16 |
| TWI829827B true TWI829827B (zh) | 2024-01-21 |
Family
ID=71106906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108145714A TWI829827B (zh) | 2018-12-14 | 2019-12-13 | 發光裝置、發光模組及發光裝置之製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7007598B2 (ja) |
| CN (2) | CN211208476U (ja) |
| TW (1) | TWI829827B (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7189451B2 (ja) | 2020-06-30 | 2022-12-14 | 日亜化学工業株式会社 | 発光モジュール、液晶表示装置 |
| TWI807401B (zh) * | 2020-08-31 | 2023-07-01 | 日商日亞化學工業股份有限公司 | 發光模組之製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197715A (ja) * | 2015-04-02 | 2016-11-24 | 日亜化学工業株式会社 | 発光装置 |
| US20170033267A1 (en) * | 2015-07-28 | 2017-02-02 | Nichia Corporation | Light emitting device and method of manufacturing the same |
| JP2017092449A (ja) * | 2015-11-05 | 2017-05-25 | アクロラックス・インコーポレーテッド | パッケージ構造及びその製造方法 |
| US20180069159A1 (en) * | 2015-09-08 | 2018-03-08 | Nichia Corporation | Light emitting device |
| US20180180249A1 (en) * | 2016-12-26 | 2018-06-28 | Nichia Corporation | Light-emitting device and integrated light-emitting device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5535114B2 (ja) * | 2011-03-25 | 2014-07-02 | 株式会社東芝 | 発光装置、発光モジュール、発光装置の製造方法 |
| JP5680472B2 (ja) * | 2011-04-22 | 2015-03-04 | シチズンホールディングス株式会社 | 半導体発光装置の製造方法 |
| CN102759052B (zh) * | 2012-07-19 | 2014-12-17 | 深圳市华星光电技术有限公司 | 背光模块及显示装置 |
| JP6248431B2 (ja) * | 2013-06-28 | 2017-12-20 | 日亜化学工業株式会社 | 半導体発光装置の製造方法 |
| JP2016009761A (ja) * | 2014-06-24 | 2016-01-18 | 株式会社小糸製作所 | 発光モジュール |
| JP6443877B2 (ja) * | 2014-11-12 | 2018-12-26 | 伸 唐沢 | 蓄光表示板及びその製造方法 |
| JP6327220B2 (ja) * | 2015-08-31 | 2018-05-23 | 日亜化学工業株式会社 | 発光装置 |
| JP6857297B2 (ja) * | 2016-12-22 | 2021-04-14 | 日亜化学工業株式会社 | 導光板、面光源装置、表示装置及び電子機器 |
-
2019
- 2019-12-06 JP JP2019221625A patent/JP7007598B2/ja active Active
- 2019-12-13 TW TW108145714A patent/TWI829827B/zh active
- 2019-12-16 CN CN201922265124.3U patent/CN211208476U/zh active Active
- 2019-12-16 CN CN201911292882.2A patent/CN111326647A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197715A (ja) * | 2015-04-02 | 2016-11-24 | 日亜化学工業株式会社 | 発光装置 |
| TW201709551A (zh) * | 2015-04-02 | 2017-03-01 | 日亞化學工業股份有限公司 | 發光裝置及其製造方法 |
| US20170033267A1 (en) * | 2015-07-28 | 2017-02-02 | Nichia Corporation | Light emitting device and method of manufacturing the same |
| US20180069159A1 (en) * | 2015-09-08 | 2018-03-08 | Nichia Corporation | Light emitting device |
| JP2017092449A (ja) * | 2015-11-05 | 2017-05-25 | アクロラックス・インコーポレーテッド | パッケージ構造及びその製造方法 |
| US20180180249A1 (en) * | 2016-12-26 | 2018-06-28 | Nichia Corporation | Light-emitting device and integrated light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020098906A (ja) | 2020-06-25 |
| CN211208476U (zh) | 2020-08-07 |
| JP7007598B2 (ja) | 2022-02-10 |
| TW202034541A (zh) | 2020-09-16 |
| CN111326647A (zh) | 2020-06-23 |
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