TWI826697B - processing device - Google Patents

Abstract

[Problem] Eliminate static electricity well when separating the wafer from the holding assembly. [Solution] By spraying ionized air on the lower surface of the dicing tape that is separated from the holding surface of the work chuck while gradually increasing the area, the dicing tape is removed. of static electricity removal. Therefore, it is possible to remove the static electricity attached to the dicing tape while suppressing the charging of the dicing tape separated from the holding surface of the work chuck, while unloading the workpiece group from the holding surface. This makes it difficult for the dicing tape separated from the holding surface of the work chuck to become statically charged. Therefore, it is possible to suppress degradation in the quality of devices formed on the wafer in the workpiece set.

Description

processing device

The present invention relates to a processing device.

In the dicing apparatus for dicing wafers as disclosed in Patent Document 1 and Patent Document 2, the wafer is diced in a state held by a holding component via a dicing tape attached to one side thereof.

In such a dicing device, the dicing tape attached to the wafer is charged with static electricity after the dicing process, so the quality of the devices formed on the wafer may be degraded. Therefore, in order to remove the static electricity contained in the dicing tape, the dicing tape is sprayed with ionized air.

For example, in the dicing device disclosed in Patent Document 1, the wafer with the dicing tape attached to it, which is held by the holding unit, is separated from the holding unit by the conveying unit, and then the direction of the air injection is changed to The wafer is lifted up as it is held by the transport assembly, allowing the ionized air to contact the dicing tape. Prior technical literature patent documents

Patent Document 1: Japanese Patent Application Publication No. 2012-049359 Patent Document 2: Japanese Patent Application Publication No. 2015-112552

The problem to be solved by the invention

However, in conventional dicing devices, ionized air is sprayed onto the dicing tape after the wafer is completely separated from the holding surface. Therefore, there is a possibility that the quality of the device may be degraded due to residual static electricity in the cutting tape.

Therefore, an object of the present invention is to suppress degradation of device quality by effectively eliminating static electricity when the wafer is separated from the holding member. means to solve problems

The first processing device of the present invention is the following processing device and includes: The holding assembly has a holding surface that holds a workpiece group that is integrated with a workpiece arranged in an opening of the annular frame by attaching a cutting tape to the annular frame, and the holding surface is separated by The cutting tape to hold the aforementioned workpiece set; a processing component that processes the workpiece while supplying water to the workpiece, wherein the workpiece is a workpiece of the workpiece group held on the holding surface; The lifting assembly moves a frame holding part having at least three holding parts in a direction perpendicular to the holding surface, and the holding part is the annular frame holding the workpiece group held on the holding surface; and The ion generator sprays ionized air on the lower surface of the cutting tape to remove the static electricity carried by the cutting tape. Furthermore, the lifting assembly is configured to raise the frame holding portion of the annular frame holding the workpiece group so that the lower surface of the cutting tape of the workpiece group gradually separates from the holding surface starting from the outer peripheral portion toward the center. , The ion generator is configured to continue spraying ionized air toward the part of the lower surface of the cutting tape that has been separated from the holding surface until the lower surface of the cutting tape is completely separated from the holding surface and further allows the cutting until the lower surface of the tape is separated from the holding surface by a predetermined distance, The workpiece is removed from the holding surface while removing static electricity from the dicing tape.

The second processing device of the present invention is the following processing device and includes: A holding component having a holding surface that holds a workpiece having a protective member on one side across the protective member; The processing component processes the workpiece held by the holding surface; The lifting assembly moves the conveying pad having an adsorption surface in a direction perpendicular to the holding surface. The adsorption surface adsorbs and holds the other side of the workpiece, one side of which is held by the holding surface; and The ion generator sprays ionized air on the lower surface of the protective member to remove static electricity carried by the protective member. Furthermore, the aforementioned processing device further includes an inclination changing component for changing the relative inclination of the suction surface and the holding surface of the transfer pad, The inclination changing component is configured to adjust the relative inclination of the adsorption surface and the holding surface of the conveying pad that adsorbs and holds the workpiece held by the holding surface so that the adsorption surface and the holding surface are parallel to each other. The state gradually becomes larger, whereby the area of the separated portion separated from the holding surface in the lower surface of the protective member of the workpiece gradually becomes larger, The ion generator is configured to continuously spray ionized air toward the separated portion of the lower surface of the protective member that is separated from the holding surface until the lower surface of the protective member is completely separated from the holding surface and further allows the protection until the lower surface of the member is separated from the holding surface by a predetermined distance, And the workpiece is carried out from the holding surface while removing the static electricity carried by the protective member. Invention effect

In the first processing device, the area of the portion of the lower surface of the dicing tape that is separated from the holding surface of the holding assembly is gradually increased, and the ion generator sprays ionized air to this portion. Remove static electricity from cutting tape. Therefore, it is possible to carry out the workpiece group from the holding surface while removing the static electricity attached to the dicing tape while suppressing the charging of the dicing tape separated from the holding surface of the holding unit. Thereby, the dicing tape separated from the holding surface of the holding assembly is less likely to become statically charged. Therefore, it is possible to suppress degradation in the quality of the devices formed on the workpiece of the workpiece group.

In the second treatment device, while the area of the portion of the lower surface of the protective member separated from the holding surface of the holding assembly is gradually increased, the ion generator sprays ionized air on this portion to thereby protect the part. Remove static electricity from components. Therefore, it is possible to remove the static electricity attached to the protective member while suppressing the charge of the protective member separated from the holding surface of the holding unit, while unloading the workpiece from the holding surface. Thereby, the protective member separated from the holding surface of the holding assembly is less likely to be charged with static electricity. Therefore, it is possible to suppress deterioration in the quality of the device formed on the workpiece.

Form used to implement the invention

As shown in FIG. 1 , the dicing device 1 of this embodiment is an example of a processing device, and performs dicing processing on a wafer W that is a workpiece.

The wafer W has a substantially circular shape, and a grid-like dividing line L is formed on the front surface. Various devices (not shown) are formed in each area divided by the planned division line L.

A dicing tape T1 is attached to the back side of the wafer W. An annular frame F is attached to the outer periphery of the cutting tape T1. That is, the workpiece group W1 is formed by attaching the dicing tape T1 to the ring frame F and the wafer W arranged in the opening of the ring frame F to integrate them.

In this way, the wafer W is processed in the dicing device 1 in the state of the workpiece group W1 supported by the ring frame F through the dicing tape T1. In addition, the workpiece group W1 is accommodated in a cassette (not shown) and is carried into the cutting device 1 .

The cutting device 1 has a support table 10 , a work clamp 20 provided on the support table 10 , and a rectangular parallelepiped-shaped housing 12 erected on the support table 10 .

A cassette holding platform 16 is provided at one end of the support platform 10 . The cassette holding platform 16 can be used to place cassettes (not shown) holding a plurality of workpiece groups W1 .

Between the cassette stage 16 and the work clamping table 20, a push-pull assembly 17 for transporting the workpiece group W1 is provided. The push-pull assembly 17 is provided with: a push-pull arm 171 that moves the wafer W in and out of the cassette; and a push-pull arm moving mechanism 172 that moves the push-pull arm 171 back and forth in the Y-axis direction.

In addition, a temporary holding unit 18 for temporarily holding the workpiece group W1 is provided on the casing 12 side of the work chuck 20 . The push-pull assembly 17 transports and places the pre-processed workpiece group W1 from the cassette on the cassette stage 16 to the temporary placement assembly 18 . The temporary assembly 18 performs positioning of the workpiece group W1 in the X-axis direction.

A transfer unit 30 is provided on the front surface of the housing 12 in the upper part of the work chuck 20 . The transfer unit 30 holds the workpiece group W1 on the temporary holding unit 18, transfers it, and places it on the work chuck 20. Furthermore, the transport unit 30 transports the workpiece group W1 between the work chuck 20 and the rotary cleaning unit 24 .

The transfer unit 30 includes a frame holding part 31 that holds the workpiece group W1, a frame holding part moving mechanism 33 that moves the frame holding part 31 in the Y-axis direction, and a frame holding part that moves the frame holding part 31 up and down in the Z-axis direction. Lifting mechanism 35.

The frame holding part 31 includes four holding parts 32 of the annular frame F holding the workpiece group W1. The holding part 32 is a so-called suction cup, and can suck and hold the annular frame F of the workpiece group W1. In addition, the frame holding part lifting mechanism 35 is configured to move the frame holding part 31 in a direction perpendicular to the holding surface 23 of the work chuck 20, and is an example of a lifting assembly.

The work clamping table 20 is fixed on the moving plate 21 . The movable plate 21 covers the opening in the center of the upper surface of the support base 10 together with the bellows-shaped waterproof cover C. Under the moving plate 21 and the waterproof cover C, a cutting feed mechanism (not shown), such as a ball screw type, is provided to move the moving plate 21 and the work chuck 20 in the X-axis direction.

The work clamp 20 is an example of a holding component and has a holding surface 23 made of porous ceramic material. By the negative pressure generated on the holding surface 23, the workpiece group W1 can be attracted and held through the dicing tape T1. Four clamps 22 are provided around the work clamp table 20 . The annular frame F of the workpiece group W1 can be clamped and fixed from four directions by each clamp 22 .

The work clamp 20 holds the workpiece group W1 and is transported from the support table 10 to the processing space inside the casing 12 by the cutting and feeding mechanism together with the moving plate 21 . A cutting mechanism 41 shown in Figure 2 is provided in the processing space. In the processing space, the wafer W is cut and processed by the cutting mechanism 41 .

The cutting mechanism 41 is a mechanism that processes (cuts) the wafer W while supplying water (cutting water) to the wafer W that is held on the holding surface of the chuck 20 , and is an example of the processing mechanism. 23. Wafer W of workpiece group W1.

As shown in FIG. 2 , the cutting mechanism 41 includes a main shaft 42 having a horizontal rotation axis, and a cutting blade 43 that can rotate together with the main shaft 42 . During the dicing process, the dicing blade 43 is lowered while the main shaft 42 is rotated, so that the dicing blade 43 is brought into contact with the wafer W. At the contact portion between the cutting blade 43 and the wafer W, cutting water can be supplied by a cutting water supply component (not shown). Furthermore, the work chuck 20 holding the workpiece group W1 moves in a horizontal plane in a direction orthogonal to the rotation axis of the spindle 42 . In this manner, the dicing blade 43 cuts the wafer W along the planned division line L (see FIG. 1 ) of the wafer W in the workpiece group W1.

After the wafer W has been cut and processed, the work chuck 20 and the moving plate 21 shown in FIG. 1 are returned to the support table 10 by the cutting and feeding mechanism. Furthermore, the workpiece group W1 is sent from the work chuck 20 to the rotary cleaning unit 24 on the rear side of the work chuck 20 by the transfer unit 30 .

The rotary cleaning unit 24 includes a rotary table 27 that holds the workpiece group W1 and various nozzles (not shown) that inject wash water and dry air toward the workpiece group W1 held on the rotary table 27 . The rotary table 27 is an example of a holding unit, and has a rotary holding surface 28 that holds the workpiece group W1 via the dicing tape T1.

In the rotary cleaning unit 24, the rotary table 27 holding the workpiece group W1 rotates at high speed. Furthermore, the wash water can be sprayed toward the workpiece group W1 that is rotating at high speed, so that the workpiece group W1 can be washed. Thereafter, dry air is sprayed to dry the workpiece group W1. The dried workpiece group W1 is removed from the rotary table 27 by the transport assembly 30 .

In this way, the spin cleaning unit 24 is a unit that processes (cleans) the wafer W while supplying water (cleaning water) to the wafer W. The wafer W is held in the rotating operation and is an example of a processing module. The rotating surface 28 of the stage 27 holds the wafer W of the workpiece group W1.

A touch panel 40 is provided on the side of the housing 12 . Various information regarding the processing conditions of the cutting device 1 can be displayed on the touch panel 40 . In addition, the touch panel 40 can also be used to set various information such as processing conditions. In this manner, the touch panel 40 functions as a display unit (display screen) that displays various information, and also functions as an input unit for inputting information. Furthermore, a control unit 14 for controlling each component of the cutting device 1 is provided inside the casing 12 .

In addition, a pair of ion generators 51 are provided on the -Y direction side and the +Y direction side of the work chuck 20 so as to sandwich the work chuck 20 along the Y-axis direction. In addition, a pair of ion generators 51 are also provided on the -Y direction side and the +Y direction side of the rotary cleaning unit 24 so as to sandwich the rotary table 27 along the Y-axis direction.

As shown in FIG. 3 , the ion generator 51 has a plurality of air supply ports 53 . The ion generator 51 has a built-in fan (not shown), and is configured to rotate the fan to take in air from the outside and blow it out as ionized air from the air supply port 53 . Furthermore, the ion generator 51 may be configured without using a fan. In this case, it is connected to the air supply source, and the air supplied from the air supply source is blown out from the air blower 53 as ionized air.

The ion generator 51 installed across the work chuck 20 is disposed so that the air blower 53 faces the work chuck 20 . These ion generators 51 blow ionized air toward the holding surface 23 of the work chuck 20 . Therefore, when the workpiece group W1 is separated from the holding surface 23 , the ion generator 51 blows the ionized air toward the lower surface of the dicing tape T1 in the workpiece group W1 . Thereby, the ion generator 51 removes the static electricity contained in the dicing tape T1.

On the other hand, the ion generator 51 installed across the rotary table 27 of the rotary cleaning unit 24 is arranged so that the air blower 53 faces the rotary table 27 . These ion generators 51 blow ionized air toward the rotation holding surface 28 of the rotation table 27 . Therefore, when the workpiece group W1 is separated from the rotation holding surface 28, the ion generator 51 blows the ionized air toward the lower surface of the dicing tape T1 in the workpiece group W1. Thereby, the ion generator 51 removes the static electricity contained in the dicing tape T1.

Next, the transport operation of the workpiece group W1 by the transport unit 30 in the cutting device 1 will be described. The following operations are implemented, for example, under the control of the control unit 14 .

After the workpiece group W1 placed on the work chuck 20 is cut by the cutting mechanism 41 shown in FIG. 2 and the work chuck 20 is returned to the support table 10 , the control unit 14 controls the transport assembly 30 , and the workpiece group W1 is removed from the work chuck 20 and transported to the rotary cleaning unit 24 .

That is, first, as shown in FIG. 4 , the transport assembly 30 can be arranged above the workpiece group W1 placed on the holding surface 23 of the work chuck 20 . As shown in this figure, the holding part 32 of the frame holding part 31 is connected to the suction source 37 through the suction valve 36. By opening the suction valve 36, the holding part 32 can be connected to the suction source 37 so that the holding part 32 has suction force. Furthermore, in the state shown in Fig. 4, the suction valve 36 is closed.

Thereafter, as shown in FIG. 5 , the clamp 22 that has fixed the annular frame F of the workpiece group W1 is retracted from the annular frame F. Furthermore, the suction valve 36 is opened, and the frame holding part lifting mechanism 35 of the conveyance unit 30 moves the frame holding part 31 downward (-Z direction) until the holding part 32 attracts and holds the annular frame F.

After the holding part 32 has attracted and held the annular frame F, as shown in FIG. 6 , the frame holding part lifting mechanism 35 moves the frame holding part 31 upward (+Z direction). At this time, as shown in FIGS. 6 and 7 , the frame holding part lifting mechanism 35 lifts the frame holding part 31 holding the annular frame F so that the lower surface of the dicing tape T1 of the workpiece group W1 gradually moves from the outer peripheral part toward the center. The ground is separated from the retaining surface 23.

That is, when the frame holding part 31 (workpiece group W1) starts to rise, the outer peripheral part of the flexible dicing tape T1 is lifted through the holding part 32 of the frame holding part 31 and the ring frame F. Thereby, the center of the dicing tape T1 is deflected to become lower, and the outer peripheral portion is deformed to be bent upward. Then, as the frame holding portion 31 rises, the portion of the lower surface of the dicing tape T1 separated from the holding surface 23 expands toward the center portion. That is, as the frame holding portion 31 rises, the area of the portion of the lower surface of the dicing tape T1 separated from the holding surface 23 of the work chuck 20 gradually becomes larger.

In addition, at this time, as shown in FIG. 7 , the ion generator 51 , for example, starts from the time when the outer peripheral part of the lower surface of the dicing tape T1 starts to separate from the holding surface 23 . 23 The separated parts are sprayed with ionized air A1.

Then, as shown in FIGS. 7 and 8 , the ion generator 51 continues to spray the ionized air A1 toward the portion of the lower surface of the dicing tape T1 that has been separated from the holding surface 23 until the lower surface of the dicing tape T1 is completely separated from the holding surface 23 . The holding surface 23 is separated until the lower surface of the cutting tape T1 is further separated from the holding surface 23 by a predetermined distance D1. This distance D1 is, for example, a distance at which the electrostatic interaction between the holding surface 23 and the lower surface of the dicing tape T1 becomes so small that it can be ignored.

As described above, in this embodiment, the ion generator 51 responds by gradually increasing the area of the separated portion of the lower surface of the dicing tape T1 that is separated from the holding surface 23 of the work chuck 20 . The ionized air A1 is partially sprayed to remove the static electricity contained in the cutting tape T1. Therefore, it is possible to unload the workpiece group W1 from the holding surface 23 while removing the static electricity attached to the dicing tape T1 while suppressing the charging of the dicing tape T1 separated from the holding surface 23 of the work chuck 20 . Thereby, the dicing tape T1 separated from the holding surface 23 of the work chuck 20 is less likely to be charged with static electricity. Therefore, it is possible to suppress degradation in the quality of the devices formed on the wafer W in the workpiece group W1.

Furthermore, "the lower surface of the dicing tape T1 is gradually separated from the holding surface 23 from the outer peripheral part toward the center" means, for example, the following situation: first, only the outer peripheral part of the lower surface of the dicing tape T1 is separated from the holding surface 23, and then On the one hand, other parts are still in contact with the holding surface 23. After that, the part of the lower surface of the cutting tape T1 that is separated from the holding surface 23 expands toward the central part as the frame holding part 31 rises. When the central part has been separated , the entire lower surface of the cutting tape T1 is separated from the holding surface 23 .

Furthermore, in this embodiment, as an example of the transportation operation of the workpiece group W1 by the transportation unit 30, the operation of removing the workpiece group W1 from the holding surface 23 of the work chuck 20 has been described. In this regard, when the workpiece group W1 is removed from the rotation holding surface 28 of the rotation table 27 in the rotation cleaning unit 24 shown in FIG. 1 , the transport unit 30 and the ion generator 51 also perform the same operation.

That is, the frame holding part lifting mechanism 35 of the conveying unit 30 lifts the workpiece group W1 from the rotation holding surface 28 in the same manner as shown in FIGS. 4 to 8 so that the lower surface of the dicing tape T1 moves from The area of the divided portion where the rotation holding surface 28 of the rotation table 27 is separated gradually becomes larger. At this time, the ion generator 51 provided so as to sandwich the rotation cleaning unit 24 sprays ionized air toward the portion of the dicing tape T1 separated from the rotation holding surface 28 .

Thereby, the charging of the dicing tape T1 separated from the rotation holding surface 28 can be suppressed, and the static electricity carried by the dicing tape T1 can be removed. Therefore, the dicing tape T1 separated from the rotation holding surface 28 can be made less likely to become statically charged. Therefore, it is possible to suppress a decrease in the quality of the devices formed on the wafer W in the workpiece group W1.

Moreover, in this embodiment, the holding part 32 provided in the frame holding part 31 of the conveyance unit 30 is a suction cup. Furthermore, in this embodiment, the frame holding part 31 is provided with four holding parts 32 . In this regard, the frame holding part 31 only needs to include at least three holding parts 32 .

In this embodiment, as a processing device for processing a workpiece, a dicing device 1 for dicing the wafer W is exemplified. The processing device of this embodiment may be replaced by, for example, the following devices: a grinding device that grinds the workpiece, a laser processing device that processes the workpiece with laser light, or a cutting device that cuts the workpiece. A knife cutting device, an expansion device for dividing the workpiece into wafers, or a tape laminating machine for attaching tape to the workpiece.

Here, a case where the processing device according to this embodiment is a grinding device will be described. As shown in FIG. 9 , the grinding device 2 has a work chuck 60 as a holding unit for holding a workpiece, a processing unit 55 for grinding the workpiece, and a work chuck 60 for transporting (carrying in) the workpiece. and unloading) the workpiece conveying mechanism 71, the ion generator 51 shown in FIG. 3, and the control unit 57 that controls each component of the grinding device 2.

As shown in FIG. 10 , in a wafer W that is a workpiece, a device (not shown) is formed on one of the front surfaces Wa. The front surface Wa of the wafer W faces downward in FIG. 10 and is protected by a protective tape T2 attached as a protective member. The other surface of the wafer W, that is, the back surface Wb, serves as a surface to be processed by grinding.

The work clamp 60 has a holding surface 63 made of porous ceramic material. The negative pressure generated on the holding surface 63 can attract and hold the wafer W through the protective tape T2. The processing assembly 55 shown in FIG. 9 performs a grinding process on the wafer W held on the holding surface 63 .

Furthermore, as shown in FIG. 10 , the transfer mechanism 71 includes a transfer pad 72 that holds the wafer W, a transfer arm 74 that holds the transfer pad 72 through the connection portion 76 , and a lifting assembly 75 that raises and lowers the transfer pad 72 and the transfer arm 74 .

The transfer pad 72 has a downward suction surface 73 for holding the wafer W parallel to the holding surface 63 of the chuck 60 . When the wafer W held on the holding surface 63 of the chuck 60 is moved out by the transport mechanism 71 , the suction surface 73 suctions and holds the back surface Wb of the wafer W held on the holding surface 63 .

The conveying pad 72 is attached to the front end of the conveying arm 74 through the connecting portion 76 . The connecting portion 76 is attached to the transfer arm 74 in a state of penetrating through a through hole 77 provided at the front end of the transfer arm 74 . The connecting portion 76 has an enlarged diameter portion 81 at the upper end, thereby suppressing the connecting portion 76 from falling off from the through hole 77 .

The lower end of the connecting portion 76 is attached to the upper surface of the transfer pad 72 . In addition, a spring 83 is disposed between the lower surface of the transfer arm 74 and the upper surface of the transfer pad 72 , and the spring 83 is provided so as to surround the connecting portion 76 . The spring 83 imparts potential energy to the lower surface of the transfer arm 74 and the upper surface of the transfer pad 72 in a direction that moves them away from each other.

The base end side of the transfer arm 74 is attached to the lifting assembly 75 . The lifting assembly 75 raises and lowers the transfer pad 72 and the transfer arm 74 along the direction perpendicular to the holding surface 63 of the work chuck 60 , that is, the Z-axis direction.

Furthermore, an inclination changing unit 85 for changing the relative inclination between the suction surface 73 of the transfer pad 72 and the holding surface 23 of the work chuck 20 is mounted on the upper surface 74 a of the transfer arm 74 . The inclination changing unit 85 is configured to be movable along the extending direction of the transport arm 74 under the control of the control unit 57 .

The tilt changing assembly 85 has a wedge-shaped wedge portion 86 at its front end. The tilt changing assembly 85 moves the upper surface 74 a of the transport arm 74 toward the front end of the transport arm 74 so that the wedge portion 86 enters between the upper surface 74 a and the enlarged diameter portion 81 of the connecting portion 76 .

In addition, the ion generator 51 shown in FIG. 3 is installed on the -X side of the work chuck 60 with its air blower 53 facing the work chuck 60 . The ion generator 51 blows ionized air toward the holding surface 63 of the work chuck 60 . Therefore, when the wafer W is separated from the holding surface 63 by the transfer pad 72 , the ion generator 51 blows the ionized air toward the lower surface of the protective tape T2 of the wafer W. Thereby, the ion generator 51 removes the static electricity contained in the protective tape T2.

Here, the transportation operation of the wafer W by the transportation mechanism 71 will be described. The following operations are implemented, for example, under the control of the control unit 57 . After the wafer W placed on the work chuck 60 is ground by the processing assembly 55 shown in FIG. 9 , the control unit 57 controls the transport mechanism 71 to remove the wafer W from the work chuck 60 .

That is, first, as shown in FIG. 10 , the transport mechanism 71 is arranged above the wafer W placed on the holding surface 63 of the chuck 60 . As shown in this figure, the suction surface 73 of the transfer pad 72 installed on the transfer arm 74 is connected to the suction source 92 through the suction valve 91 . By opening the suction valve 91, the adsorption surface 73 can be connected to the suction source 92 so that the adsorption surface 73 has suction force. Furthermore, in the state shown in Fig. 10, the suction valve 91 is closed.

Thereafter, the suction valve 91 is opened, and the lift assembly 75 of the transfer mechanism 71 moves the transfer arm 74 downward (-Z direction) until the suction surface 73 of the transfer pad 72 holds (adsorbs) the wafer W.

After the wafer W is held on the suction surface 73 , as shown in FIG. 11 , the tilt change unit 85 moves the upper surface 74 a of the transfer arm 74 toward the front end direction (+X direction) of the transfer arm 74 , so that the wedge portion 86 enters the transfer arm 74 . between the upper surface 74a and the enlarged diameter portion 81 of the connecting portion 76.

When the wedge portion 86 is inserted between the upper surface 74a of the transfer arm 74 and the enlarged diameter portion 81 of the connection portion 76, the portion of the connection portion 76 on the base end side (-X side) of the transfer arm 74 gradually Lifted by wedge 86. As a result, the adsorption surface 73 of the transfer pad 72 supported by the connection part 76 is gradually inclined with respect to the holding surface 63 of the work chuck 60 so that the −X side becomes higher.

In this manner, the inclination changing component 85 adjusts the relative inclination of the adsorption surface 73 of the transfer pad 72 holding the wafer W held by the holding surface 63 to the position where the adsorption surface 73 and the holding surface 63 are parallel to each other. The state gradually becomes larger. That is, the inclination changing unit 85 gradually inclines the suction surface 73 of the transfer pad 72 from a state in which it is parallel to the holding surface 63 of the work chuck 60 (a state in which the inclination difference is zero) (the inclination difference becomes larger). status). Thereby, the −X side of the lower surface of the protective tape T2 of the wafer W is gradually separated from the holding surface 63 . In this manner, the tilt changing component 85 gradually increases the area of the separated portion separated from the holding surface 63 in the lower surface of the protective tape T2 of the wafer W.

At this time, as shown in FIG. 11 , the ion generator 51 located on the −X side of the work chuck 60 starts to ignite the lower surface of the protective tape T2 from the time when a part of the protective tape T2 starts to separate from the holding surface 63 . The separated portion separated from the holding surface 63 is sprayed with ionized air A2.

Thereafter, the lifting unit 75 moves the transfer arm 74 upward (+Z direction). Thereby, the separated part separated from the holding surface 63 in the lower surface of the protective tape T2 can be further expanded and exposed. Then, as shown in FIGS. 11 and 12 , the ion generator 51 continues to spray the ionized air A2 toward the portion of the lower surface of the protective tape T2 that has been separated from the holding surface 63 until the lower surface of the protective tape T2 is completely separated from the holding surface 63 . The holding surface 63 is separated until the lower surface of the protective tape T2 is further separated from the holding surface 63 by a predetermined distance D2. This distance D2 is, for example, a distance at which the electrostatic interaction between the holding surface 63 and the lower surface of the protective tape T2 becomes so small that it can be ignored.

In this way, even in the grinding device 2, the area of the separated portion separated from the holding surface 63 in the lower surface of the protective tape T2 is gradually increased, and the ion generator 51 is sprayed on this portion. The air A2 is ionized to remove the static electricity contained in the protective tape T2. Therefore, it is possible to unload the wafer W from the holding surface 63 while removing the static electricity attached to the protective tape T2 while suppressing the charge of the protective tape T2 separated from the holding surface 63 of the chuck 60 . Thereby, the protective tape T2 separated from the holding surface 63 is less likely to be charged with static electricity. Therefore, it is possible to suppress deterioration in the quality of devices formed on the wafer W.

Furthermore, the grinding device 2 is provided with one ion generator 51 . Alternatively, the grinding device 2 may be provided with a plurality of ion generators 51 .

Furthermore, in this embodiment, the inclination changing unit 85 is configured to incline the suction surface 73 of the transfer pad 72 . The inclination changing unit is not limited as long as it can change the relative inclination of the suction surface 73 of the transfer pad 72 and the holding surface 63 of the work chuck 60 . For example, the grinding device 2 may be provided with an inclination changing unit that changes (adjusts) the inclination of the holding surface 63 of the work chuck 60 instead of the inclination changing unit 85 . Such a tilt changing unit is disclosed in, for example, Japanese Patent Application Laid-Open No. 2013-119123.

In this configuration, the tilt changing unit gradually tilts the holding surface 63 of the chuck 60 holding the wafer W from being parallel to the suction surface 73 of the transfer pad 72 that suction-holds the wafer W. In this configuration, the area of the separated portion separated from the holding surface 63 in the lower surface of the protective tape T2 of the wafer W may be gradually increased, and the ion generator 51 may spray ionized air to this portion. .

1: Cutting device 2:Grinding device 10: Support platform 12: Shell 14:Control Department 16:Cassette carrier 17:Push-pull components 171: Push-pull arm 172:Push-pull arm moving mechanism 18: Temporary component 20:Work clamp table 21:Mobile board 22: Fixture 23:Keep the surface 24: Rotary cleaning unit 27: Rotary table 28: Rotation retaining surface 30:Transporting components 31: Frame holding part 32:Maintenance Department 33: Frame holding part moving mechanism 35: Frame holding part lifting mechanism 36,91:Suction valve 37,92: Source of attraction 40:Touch panel 41: Cutting mechanism 42:Spindle 43:Cutting blade 51:Ion generator 53:Air supply outlet 55: Processing components 57:Control Department 60:Work clamp 63:Keep the surface 71:Transportation mechanism 72:Transfer pad 73: Adsorption surface 74:Conveying arm 74a: Upper surface 75: Lifting components 76:Connection Department 77:Through hole 81: Expanded diameter part 83:Spring 85: Tilt change component 86: Wedge A1,A2: ionized air C: Waterproof cover D1, D2: distance F: ring frame L: dividing line T1: cutting tape T2: Protective tape W:wafer Wa:front Wb: back W1: workpiece group X,Y,+X,-X,+Y,-Y,+Z,-Z: direction

Fig. 1 is a perspective view of the processing device of this embodiment. Fig. 2 is an explanatory diagram showing a cutting mechanism. FIG. 3 is a perspective view showing the structure of the ion generator. FIG. 4 is an explanatory diagram showing a state in which the transfer unit is being arranged on the workpiece group held on the holding surface of the work chuck. FIG. 5 is an explanatory diagram showing a state in which the ring frame of the workpiece group is held by the holding portion of the transport unit. 6 is an explanatory diagram showing a state in which the ring frame of the workpiece group is lifted up by the holding portion of the transport unit. 7 is an explanatory diagram showing a state in which the outer peripheral portion of the lower surface of the dicing tape in the workpiece group has been separated from the holding surface. 8 is an explanatory diagram showing a state in which the lower surface of the cutting tape is separated from the holding surface of the work chuck by a predetermined distance. Fig. 9 is a block diagram showing the structure of the grinding device. FIG. 10 is an explanatory diagram showing a state in which the transfer unit is placed on the wafer held on the holding surface of the chuck. FIG. 11 is an explanatory diagram showing a state where a part of the lower surface of the protective tape of the wafer is being separated from the holding surface of the chuck. 12 is an explanatory diagram showing a state in which the lower surface of the protective tape is separated from the holding surface of the work chuck by a predetermined distance.

20:Work clamp table

22: Fixture

23:Keep the surface

31: Frame holding part

32:Maintenance Department

35: Frame holding part lifting mechanism

36:Suction valve

37: source of attraction

51:Ion generator

A1: Ionized air

F: ring frame

T1: cutting tape

W:wafer

W1: workpiece group

X,+Y,-Y,+Z,-Z: direction

Claims (2)

A processing device having: The holding assembly has a holding surface that holds a workpiece group that is integrated with a workpiece arranged in an opening of the annular frame by attaching a cutting tape to the annular frame, and the holding surface is separated by The cutting tape to hold the aforementioned workpiece set; a processing component that processes the workpiece while supplying water to the workpiece, wherein the workpiece is a workpiece of the workpiece group held on the holding surface; The lifting assembly moves a frame holding part having at least three holding parts in a direction perpendicular to the holding surface, and the holding part is the annular frame holding the workpiece group held on the holding surface; and The ion generator sprays ionized air on the lower surface of the cutting tape to remove the static electricity carried by the cutting tape. Furthermore, the lifting assembly is configured to raise the frame holding portion of the annular frame holding the workpiece group so that the lower surface of the cutting tape of the workpiece group gradually separates from the holding surface starting from the outer peripheral portion toward the center. , The ion generator is configured to continue spraying ionized air toward the part of the lower surface of the cutting tape that has been separated from the holding surface until the lower surface of the cutting tape is completely separated from the holding surface and further allows the cutting until the lower surface of the tape is separated from the holding surface by a predetermined distance, The workpiece is removed from the holding surface while removing static electricity from the dicing tape. A processing device having: A holding component having a holding surface that holds a workpiece having a protective member on one side across the protective member; The processing component processes the workpiece held by the holding surface; The lifting assembly moves the conveying pad having an adsorption surface in a direction perpendicular to the holding surface. The adsorption surface adsorbs and holds the other side of the workpiece, one side of which is held by the holding surface; and The ion generator sprays ionized air on the lower surface of the protective member to remove static electricity carried by the protective member. Furthermore, the aforementioned processing device further includes an inclination changing component for changing the relative inclination of the suction surface and the holding surface of the transfer pad, The inclination changing component is configured to adjust the relative inclination of the adsorption surface and the holding surface of the conveying pad that adsorbs and holds the workpiece held by the holding surface so that the adsorption surface and the holding surface are parallel to each other. The state gradually becomes larger, whereby the area of the separated portion separated from the holding surface in the lower surface of the protective member of the workpiece gradually becomes larger, The ion generator is configured to continuously spray ionized air toward the separated portion of the lower surface of the protective member that is separated from the holding surface until the lower surface of the protective member is completely separated from the holding surface and further allows the protection until the lower surface of the member is separated from the holding surface by a predetermined distance, And the workpiece is carried out from the holding surface while removing the static electricity carried by the protective member.