TWI822673B - 濕固型聚胺酯熱熔樹脂組成物 - Google Patents
濕固型聚胺酯熱熔樹脂組成物 Download PDFInfo
- Publication number
- TWI822673B TWI822673B TW107108962A TW107108962A TWI822673B TW I822673 B TWI822673 B TW I822673B TW 107108962 A TW107108962 A TW 107108962A TW 107108962 A TW107108962 A TW 107108962A TW I822673 B TWI822673 B TW I822673B
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- Taiwan
- Prior art keywords
- adhesive composition
- polyurethane hot
- polyol
- melt adhesive
- groups
- Prior art date
Links
- 239000004814 polyurethane Substances 0.000 title claims abstract description 35
- 229920002635 polyurethane Polymers 0.000 title claims abstract description 35
- 239000012943 hotmelt Substances 0.000 title description 2
- 239000011342 resin composition Substances 0.000 title description 2
- 150000003077 polyols Chemical class 0.000 claims abstract description 50
- 229920005862 polyol Polymers 0.000 claims abstract description 49
- 239000000203 mixture Substances 0.000 claims abstract description 41
- 239000004831 Hot glue Substances 0.000 claims abstract description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 19
- 239000012948 isocyanate Substances 0.000 claims abstract description 15
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 229920005906 polyester polyol Polymers 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 15
- 239000005056 polyisocyanate Substances 0.000 claims description 15
- 229920001228 polyisocyanate Polymers 0.000 claims description 15
- 239000001257 hydrogen Chemical group 0.000 claims description 13
- 229910052739 hydrogen Chemical group 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 12
- 229920000570 polyether Polymers 0.000 claims description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 150000002009 diols Chemical class 0.000 claims description 5
- 239000002318 adhesion promoter Substances 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 239000000123 paper Substances 0.000 description 21
- 238000012360 testing method Methods 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- -1 hydroxyethyl isocyanurate Chemical compound 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 150000004072 triols Chemical class 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 159000000032 aromatic acids Chemical class 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004386 Erythritol Substances 0.000 description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- DQJJXEZXOYPSNJ-UHFFFAOYSA-N [2,3-bis(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC(CO)=C1CO DQJJXEZXOYPSNJ-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 2
- 235000019414 erythritol Nutrition 0.000 description 2
- 229940009714 erythritol Drugs 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N hexane carboxylic acid Natural products CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical class CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GOHPTLYPQCTZSE-UHFFFAOYSA-N 2,2-dimethylsuccinic acid Chemical compound OC(=O)C(C)(C)CC(O)=O GOHPTLYPQCTZSE-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- RNWKAIFTTVGWLK-UHFFFAOYSA-N 3,3-diethylpentanedioic acid Chemical compound OC(=O)CC(CC)(CC)CC(O)=O RNWKAIFTTVGWLK-UHFFFAOYSA-N 0.000 description 1
- WZHHYIOUKQNLQM-UHFFFAOYSA-N 3,4,5,6-tetrachlorophthalic acid Chemical compound OC(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C(O)=O WZHHYIOUKQNLQM-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WWEXBGFSEVKZNE-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC2=CC=CC=C21 Chemical class N=C=O.N=C=O.C1=CC=CC2=CC=CC=C21 WWEXBGFSEVKZNE-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
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Abstract
本發明提供聚胺酯熱熔黏著劑組成物,其包含多元醇組分及異氰酸酯組分,其中所述多元醇組分包含具有兩個或更多個OH基團及氫橋聯基團之多元醇。
Description
本發明係關於濕固型聚胺酯熱熔樹脂組成物,其對於紙張/箔層合具有改進黏合強度及熱封強度。本發明亦關於黏著劑及使用此類組成物之製品。
習知反應性聚胺酯熱熔黏著劑用於包裝、紙張轉換、紙構造、裝訂、紙盒、紙箱密封、建築、汽車,及其類似者。反應性聚胺酯熱熔黏著劑形成極耐用之製品且特別適用於製作包裝及教科書。
習知反應性聚胺酯熱熔黏著劑為濕固型或濕交聯黏著劑,其在室溫下為固體但其以熔體形式應用。黏著劑之聚合組分含有胺基甲酸酯基團及反應性異氰酸酯基團。熔體之冷卻首先引起熱熔黏著劑之快速物理定型,隨後在環境中之濕氣情況下異氰酸酯基之化學反應仍存在從而形成交聯不溶黏著劑。
然而,當將習知反應性聚胺酯熱熔黏著劑應用於紙/箔層合時,存在一些對於此應用之限制。首先,習知反應性聚胺酯之較高黏度導致不佳潤濕能力及較低層合速度。同時,較高應用溫度(例如高於100℃)並不適用於紙/薄膜層合。此外,習知反應性聚氨酯顯示對箔結構之不佳黏合強度。特定言之,熱封後,完全固化的習知反應性聚胺酯黏著劑將很容易自箔剝離。
因此在本領域中需要具有包括黏合強度及熱封強度之改進性能、尤其適用於黏附箔及紙的新穎聚胺酯熱熔黏著劑。
本發明提供聚胺酯熱熔黏著劑組成物,其包含多元醇組分及異氰酸酯組分,其中所述多元醇組分包含具有兩個或更多個OH基團及氫橋聯基團之多元醇。
根據本發明之聚胺酯熱熔黏著劑組成物包含多元醇組分及異氰酸酯組分。 多元醇組分
聚胺酯熱熔黏著劑組成物包含多元醇組分,所述多元醇組分包含具有兩個或更多個OH基團及氫橋聯基團之多元醇以及選自由聚酯多元醇、聚醚多醇及其組合組成之群的視情況選用之多元醇。多元醇組分可視情況包括黏著促進劑以及二醇或三醇單體。
具有兩個或更多個OH基團及氫橋聯基團之多元醇為具有兩個或更多個末端OH基團(即在多元醇分子鏈末端)及分子鏈一側中之至少一個氫橋聯基團(即分支鏈基團)的多元醇。適合的氫橋聯基團之實例包括但不限於O=C-Oˉ、O=C-C-Oˉ及O=C-C=C-Oˉ,及其質子化形式。具有兩個或更多個OH基團及氫橋聯基團之所揭示多元醇進一步具有至少50 mg KOH/g且不超過200 mg KOH/g之酸值。另外,所揭示多元醇具有至少400 g/mol且不超過5,000 g/mol之分子量。再者,所揭示多元醇具有至少1.8且不超過3之羥基官能度(即1.8 ≤f
≤ 3)。在一些實施例中,具有兩個或更多個OH基團及氫橋聯基團之多元醇為聚酯多元醇。
在黏著劑組成物中具有兩個或更多個OH基團及氫橋聯基團之多元醇的量為按黏著劑組成物之重量計至少4wt%、或至少5 wt%、或至少6 wt%。在黏著劑組成物中具有兩個或更多個OH基團及氫橋聯基團之多元醇的量按黏著劑組成物之重量計並不超過45 wt%、或50 wt%、或80 wt%。
具有兩個或更多個羥基之化合物為「多元醇」。具有恰好兩個羥基之多元醇為「二醇」。具有恰好三個羥基之多元醇為「三醇」。在原子之相同直鏈中含有兩個或更多個酯鍵之化合物在本文中稱為「聚酯」。作為聚酯及多元醇之化合物在本文中已知為「聚酯多元醇」。所揭示聚酯多元醇之分子量不超過4,000 g/mol。另外,所揭示聚酯多元醇之羥基官能度為至少1.5且不超過3(即1.5 ≤f
≤ 3)。
根據本發明之適於使用的聚酯多元醇為已知的二醇以及視情況多元醇(例如三醇、四醇)之聚縮合物,且為二羧酸以及視情況多元羧酸(例如三羧酸、四羧酸)或羥基羧酸或內酯之聚縮合物。聚酯多元醇亦可衍生自對應多元羧酸酐或低級醇之對應多元羧酸酯,而非游離多元羧酸。
適合之二醇包括但不限於乙二醇、丁二醇、二乙二醇、三乙二醇、聚伸烷二醇(諸如聚乙二醇),以及1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、1,6-己二醇及新戊二醇。為了達成大於2之聚酯多元醇官能度,官能度為3之多元醇可視情況包括於黏著劑組成物(例如三羥甲基丙烷、甘油、赤藻糖醇、季戊四醇、三羥甲基苯或異氰脲酸參羥乙酯)中。
適合的二羧酸包括但不限於脂族酸、芳族酸及其組合。適合的芳族酸之實例包括鄰苯二甲酸、間苯二甲酸、對苯二甲酸及四氫鄰苯二甲酸。適合之脂族酸之實例包括六氫鄰苯二甲酸、環己二酸、己二酸、壬二酸、癸二酸、戊二酸、四氯鄰苯二甲酸、順丁烯二酸、反丁烯二酸、伊康酸、丙二酸、辛二酸、2-甲基丁二酸、3,3-二乙基戊二酸、2,2-二甲基丁二酸及偏苯三甲酸。如本文所使用,術語「酸」亦包括所述酸之任何酸酐。另外,單羧酸,諸如苯甲酸及己烷羧酸應自所揭示組成物減至最少或排除。飽和脂族或芳族酸為較佳的,諸如己二酸或間苯二甲酸。
在原子之相同直鏈中含有兩個或更多個醚鍵之化合物在本文中稱為「聚醚」。作為聚醚及多元醇之化合物為「聚醚多元醇」。所揭示聚酯多元醇之分子量不超過5,000 g/mol。另外,所揭示聚醚多元醇之羥基官能度為至少1.5且不超過4(即1.5 ≤f
≤ 4)。
根據本發明之適於使用的聚醚多元醇為環氧乙烷、環氧丙烷、四氫呋喃、環氧丁烷之加成聚合產物,以及其共加成及接枝產物,以及藉由多元醇之縮合所獲得的聚醚多元醇,或其混合物。適用於使用之聚醚多元醇之實例包括但不限於聚丙二醇(「PPG」)、聚乙二醇(「PEG」)、聚丁二醇及聚四亞甲基醚乙二醇(「PTMEG」)。
所揭示多元醇組分可視情況進一步包含生物類多元醇,諸如蓖麻油或其他已知的生物類多元醇。再者,所揭示生物類多元醇之羥基官能度為至少1.5且不超過4(即1.5 ≤f
≤ 4)。
所揭示多元醇組分可視情況進一步包含一些小分子量擴鏈劑,其包括但不限於二醇及三醇,諸如乙二醇、丁二醇、二乙二醇、三乙二醇;聚伸烷二醇,諸如聚乙二醇;以及1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、1,6-己二醇、新戊二醇、三羥甲基丙烷、甘油、赤藻糖醇、季戊四醇、三羥甲基苯及異氰尿酸三羥乙酯。 異氰酸酯組分
異氰酸酯組分包含至少一種多異氰酸酯。
如本文中所使用,「多異氰酸酯」為含有兩個或更多個異氰酸酯基團之任何化合物。「芳族聚異氰酸酯」為含有一或多個芳環之多異氰酸酯。「脂族多異氰酸酯」不含芳環。
根據本發明之適於使用的多異氰酸酯可選自由芳族多異氰酸酯、脂族多異氰酸酯及其組合組成之群。根據本發明之適於使用之芳族多異氰酸酯的實例包括但不限於二聚異氰酸亞甲基二苯酯(「MDI」)之異構體,所述二聚異氰酸亞甲基二苯酯諸如4,4-MDI、2,4-MDI及2,2’-MDI;甲苯-二聚異氰酸酯(「TDI」)之異構體,所述甲苯-二聚異氰酸酯諸如2,4-TDI、2,6-TDI;萘-二聚異氰酸酯(「NDI」)之異構體,所述萘-二聚異氰酸酯諸如1,5-NDI;及其組合。根據本發明之適用於使用之脂族多異氰酸酯的實例包括但不限於六亞甲基二聚異氰酸酯(「HDI」)之異構體、異佛酮二聚異氰酸酯(「IPDI」)之異構體、二甲苯二聚異氰酸酯(「XDI」)之異構體、氫化甲烷二異氰酸苯酯(「HMDI」)之異構體,及其組合。在一些實施例中,芳族多異氰酸酯包含MDI之異構體。
異氰酸酯組分可視情況包含一或多種催化劑。根據本發明之適用於使用之至少一種催化劑的實例包括但不限於二月桂酸二丁錫、乙酸鋅、2,2-二嗎啉基二乙基醚,及其組合。
在一些實施例中,異氰酸酯組分與多元醇組分之重量比為5:1或更低、或4.5:1或更高、或4:1或更低。在一些實施例中,異氰酸酯組分與多元醇組分之重量比為1:4或更高、或1:2或更高。
在一些實施例中,黏著劑組成物視情況包含黏著促進劑,諸如胺基矽烷。
聚胺酯熱熔黏著劑組成物之製備可以本領域中一般熟習此項技術者已知的任何方式進行,且包括縮合聚合。聚胺酯黏著劑組成物調配物揭示案之化學計量使得二異氰酸酯過量存在,且聚胺酯黏著劑組成物以NCO基團封端。在一些實施例中,聚胺酯黏著劑組成物之異氰酸酯含量(亦稱為NCO%,如藉由ASTM D2572所量測)為3%至10%,或4%至9%,或5%至9%。
在一些實施例中,聚胺酯黏著劑組成物之黏度如藉由ASTM D2196之方法所量測在25℃下為300 mPa-s至100,000 mPa-s。
亦揭示使用聚胺酯黏著劑組成物形成層合物之方法。在一些實施例中,聚胺酯黏著劑組成物呈液態。在一些實施例中,組成物在25℃下為液體。即使組成物在25℃下為固體,但視需要可接受加熱組成物以使其處於液態。聚胺酯黏著劑組成物之層可藉由塗佈滾筒應用於箔之表面或紙之表面,隨後將水添加至聚胺酯黏著劑組成物層上。「箔」為在一個維度中為6 µm至20 µm且在其他兩個維度中為1 cm或更大的結構。較佳地,箔由鋁製成。「紙」為在一個維度中為10 µm至200 µm且在其他兩個維度中為1 cm或更大的結構。「紙」由植物纖維或聚合物樹脂製成,且適合之實例包括牛皮紙、白色卡紙板、膠版紙、美術紙,及其類似者。紙表面(或箔表面)藉由壓輥與箔/黏著劑(或紙/黏著劑)複合物進一步層合從而形成箔/黏著劑/紙(或紙/黏著劑/箔)層合物。 實例
本發明現將藉由說明性實例及比較例(統稱為「實例」)進一步詳細解釋。然而,本發明之範疇當然不限於實例中所闡述之調配物。確切而言,實例對本發明僅為說明性的。 聚胺酯黏著劑組成物製備
用於製備實例之原材料藉由市售名稱及供應商在以下表1中確認。 表1:原材料
聚胺酯黏著劑組成物實例(說明性實例1至7(IE1-7)及比較例1至3(CE1-3))遵循以下程序而合成:步驟1)將一或多種異氰酸酯組分裝入反應器中且在氮保護之情況下將其保持在60℃下,步驟2)在約80℃之升高溫度下將一或多種多元醇組分緩慢裝入同一反應器中且保持直至「NCO%」達到所計算範圍為止。所製備聚胺酯黏著劑組成物接著用於與紙及鋁箔形成層合物以用於性能測試。 表2:聚胺酯黏著劑組成物實例CE1-3及IE1-7
層合物性能測試
黏著劑組成物以3.5 gsm塗佈重量應用於紙,與鋁膜結合在一起,且接著在50℃下固化24小時,從而形成層合物。當層合物形成時,進行測試以分析黏合強度及熱封強度, 1. 襯底撕裂度測試
固化後,將層合膜切割成15 mm寬度條帶以用於在Instron 5943機器中以250 mm/min十字頭速度進行T-剝離測試。測試三個條帶以獲取平均值。在測試期間,由手指略微牽拉條帶之尾部以確保尾部與剝離方向保持90度。在撕裂度測試後紙表面之損壞率記錄為層合牢度。 2. 熱封強度測試
層合物在可自Brugger Company獲得之HSG-C熱封機器中於220℃密封溫度及300 N壓力下熱封1秒,接著冷卻下來且切割成15 mm寬度條帶以用於使用可自Instron公司獲得之5940系列單柱台面系統(5940 Series Single Column Table Top System)在250 mm/min十字頭速度下進行熱封強度測試。測試各樣本之三個條帶且計算平均值。結果以N/15mm為單位。 3. 黏度測試
在測試前於100℃下將層合物置於之暖爐中幾小時。在Brookfield DV-II黏度計中使用27軸在100℃下量測黏度。旋轉速度為12 RM,且在穩定旋轉速度下測試層合物20分鐘。 表3:性能測試結果
相比於比較例,說明性實例呈現紙/箔層合之良好黏合強度及熱封強度。在多元醇HA-0135聚酯多元醇之含量增加情況下,在撕裂度測試後檢測到較高紙破損率。當DMPA™多元醇HA-0135聚酯多元醇之含量達到6.3%時,在撕裂度測試後紙破損率變得穩定且達到90%破損率。然而,當DMPA™多元醇HA-0135聚酯多元醇含量小於6.3%時,紙破損率為對於此應用不可接受之低。此外,在比較例之熱封後,檢測到穿透及分層。
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Claims (6)
- 一種聚胺酯熱熔黏著劑組成物,其係由以下所組成:多元醇組分及異氰酸酯組分,其中所述異氰酸酯組分係由至少一種多異氰酸酯及選擇性的一或多種催化劑所組成,且該聚胺酯熱熔黏著劑組成物係以NCO基團封端,其中所述多元醇組分係由以下所組成:按所述黏著劑組成物重量計4wt%至45wt%之具有兩個或更多個OH基團及一種氫橋聯基團之聚酯多元醇,其中所述氫橋聯基團選自O=C-O-、O=C-C-O-及O=C-C=C-O-,及其質子化形式(pronated forms);選自於由聚醚多元醇及聚酯多元醇和聚醚多元醇之組合所構成的群組之多元醇;其中所述異氰酸酯組分具有3%至10%的NCO%,其中所述NCO%係依ASTM D2572所量測;以及選擇性的黏著促進劑及選擇性的二醇或三醇單體。
- 如請求項1所述之聚胺酯熱熔黏著劑組成物,其中具有兩個或更多個OH基團及一種氫橋聯基團之所述聚酯多元醇的酸值為至少50mg KOH/g且不超過200mg KOH/g。
- 如請求項1所述之聚胺酯熱熔黏著劑組成物,其中具有兩個或更多個OH基團及一種氫橋聯基團之所述聚酯多元醇的分子量為至少400g/mol且不超過5,000g/mol。
- 如請求項1所述之聚胺酯熱熔黏著劑組成物,其中所述至少一種多異氰酸酯係選自由芳族多異氰酸酯、脂族多異氰酸酯及其等之組合組成之群。
- 如請求項1所述之聚胺酯熱熔黏著劑組成物,其中該聚胺酯熱熔黏著劑組成物之異氰酸酯含量為3%至10%。
- 一種層合物,其用如請求項1所述之聚胺酯熱熔黏著劑組成物來黏附箔及紙張。
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