TWI817931B - 積層體 - Google Patents

積層體 Download PDF

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Publication number
TWI817931B
TWI817931B TW106126256A TW106126256A TWI817931B TW I817931 B TWI817931 B TW I817931B TW 106126256 A TW106126256 A TW 106126256A TW 106126256 A TW106126256 A TW 106126256A TW I817931 B TWI817931 B TW I817931B
Authority
TW
Taiwan
Prior art keywords
resin substrate
aromatic
tetracarboxylic dianhydride
peeling layer
bond
Prior art date
Application number
TW106126256A
Other languages
English (en)
Chinese (zh)
Other versions
TW201821540A (zh
Inventor
進藤和也
江原和也
葉鎮嘉
Original Assignee
日商日產化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學工業股份有限公司 filed Critical 日商日產化學工業股份有限公司
Publication of TW201821540A publication Critical patent/TW201821540A/zh
Application granted granted Critical
Publication of TWI817931B publication Critical patent/TWI817931B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/20Carboxylic acid amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW106126256A 2016-08-03 2017-08-03 積層體 TWI817931B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016152528 2016-08-03
JP2016-152528 2016-08-03

Publications (2)

Publication Number Publication Date
TW201821540A TW201821540A (zh) 2018-06-16
TWI817931B true TWI817931B (zh) 2023-10-11

Family

ID=61073845

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126256A TWI817931B (zh) 2016-08-03 2017-08-03 積層體

Country Status (5)

Country Link
JP (1) JP7131385B2 (ja)
KR (1) KR102365302B1 (ja)
CN (1) CN109563341B (ja)
TW (1) TWI817931B (ja)
WO (1) WO2018025954A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7429519B2 (ja) 2019-11-05 2024-02-08 株式会社カネカ 多層ポリイミドフィルム
TW202138431A (zh) * 2019-12-20 2021-10-16 日商日產化學股份有限公司 剝離層形成用組成物
CN112521296B (zh) * 2021-02-05 2021-05-11 武汉柔显科技股份有限公司 二胺化合物、使用其的耐热性树脂或耐热性树脂前体、感光树脂组合物、固化膜及显示装置
CN116003794A (zh) * 2022-12-29 2023-04-25 中国科学院化学研究所 一种高频高耐热可热封性聚(芳酯-酰亚胺)树脂及其制备方法与应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200819501A (en) * 2006-09-11 2008-05-01 Mitsui Chemicals Inc Polyimide-based resin composition, method of manufacturing thereof and metal laminate
CN104685553A (zh) * 2012-09-27 2015-06-03 新日铁住金化学株式会社 显示装置的制造方法
TW201600562A (zh) * 2014-05-14 2016-01-01 宇部興產股份有限公司 聚醯亞胺疊層體及其製造方法
JP2016120630A (ja) * 2014-12-24 2016-07-07 株式会社カネカ 剥離層の製造方法及びポリイミド積層体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619461B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜デバイスの転写方法、及びデバイスの製造方法
JP3809681B2 (ja) 1996-08-27 2006-08-16 セイコーエプソン株式会社 剥離方法
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法
GB0327093D0 (en) 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
JP2008144049A (ja) * 2006-12-11 2008-06-26 Du Pont Toray Co Ltd 成形用ポリイミドフィルム、その製造方法並びに成形品
JP2009068004A (ja) * 2007-08-20 2009-04-02 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着剤シート及びそれを用いた半導体装置
TWI354854B (en) * 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
JP2013153124A (ja) * 2011-10-20 2013-08-08 Nitto Denko Corp 半導体装置の製造方法
US20140249269A1 (en) * 2011-10-20 2014-09-04 Nitto Denko Corporation Thermally-detachable sheet
JP6031877B2 (ja) * 2012-08-02 2016-11-24 日立化成株式会社 接着物の製造方法、接着剤パターンの形成方法、及び接着剤
CN103755959B (zh) * 2014-01-22 2016-03-02 江苏亚宝绝缘材料股份有限公司 一种柔性透明聚酰亚胺薄膜
CN104485344B (zh) * 2014-12-08 2017-12-05 信利(惠州)智能显示有限公司 一种柔性显示器制备方法
CN104725636A (zh) * 2015-02-02 2015-06-24 上海交通大学 含醚键和叔丁基的可溶性聚酰亚胺及其制备方法
CN113402882B (zh) * 2015-02-10 2024-02-06 日产化学工业株式会社 剥离层形成用组合物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200819501A (en) * 2006-09-11 2008-05-01 Mitsui Chemicals Inc Polyimide-based resin composition, method of manufacturing thereof and metal laminate
CN104685553A (zh) * 2012-09-27 2015-06-03 新日铁住金化学株式会社 显示装置的制造方法
TW201600562A (zh) * 2014-05-14 2016-01-01 宇部興產股份有限公司 聚醯亞胺疊層體及其製造方法
JP2016120630A (ja) * 2014-12-24 2016-07-07 株式会社カネカ 剥離層の製造方法及びポリイミド積層体

Also Published As

Publication number Publication date
KR102365302B1 (ko) 2022-02-22
JP7131385B2 (ja) 2022-09-06
CN109563341B (zh) 2022-05-31
WO2018025954A1 (ja) 2018-02-08
KR20190035757A (ko) 2019-04-03
JPWO2018025954A1 (ja) 2019-06-13
TW201821540A (zh) 2018-06-16
CN109563341A (zh) 2019-04-02

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