TWI816853B - sealant - Google Patents
sealant Download PDFInfo
- Publication number
- TWI816853B TWI816853B TW108128377A TW108128377A TWI816853B TW I816853 B TWI816853 B TW I816853B TW 108128377 A TW108128377 A TW 108128377A TW 108128377 A TW108128377 A TW 108128377A TW I816853 B TWI816853 B TW I816853B
- Authority
- TW
- Taiwan
- Prior art keywords
- sealant
- glycidyl ether
- mass
- compound
- less
- Prior art date
Links
- 239000000565 sealant Substances 0.000 title claims abstract description 162
- -1 ethylhexyl groups Chemical group 0.000 claims abstract description 102
- 150000001875 compounds Chemical class 0.000 claims abstract description 65
- 239000004593 Epoxy Substances 0.000 claims abstract description 48
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 45
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 229920002943 EPDM rubber Polymers 0.000 claims description 49
- 230000008961 swelling Effects 0.000 claims description 37
- 238000012360 testing method Methods 0.000 claims description 17
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical group C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 claims description 7
- 230000001186 cumulative effect Effects 0.000 claims description 5
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 5
- 238000001723 curing Methods 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 4
- 238000013007 heat curing Methods 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 33
- 239000000463 material Substances 0.000 description 25
- 238000007789 sealing Methods 0.000 description 22
- 239000003822 epoxy resin Substances 0.000 description 21
- 229920000647 polyepoxide Polymers 0.000 description 21
- 239000003505 polymerization initiator Substances 0.000 description 21
- 238000010538 cationic polymerization reaction Methods 0.000 description 16
- 239000010410 layer Substances 0.000 description 16
- 229920001971 elastomer Polymers 0.000 description 15
- 239000005060 rubber Substances 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 229930185605 Bisphenol Natural products 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000003566 oxetanyl group Chemical group 0.000 description 3
- HJEORQYOUWYAMR-UHFFFAOYSA-N 2-[(2-butylphenoxy)methyl]oxirane Chemical compound CCCCC1=CC=CC=C1OCC1OC1 HJEORQYOUWYAMR-UHFFFAOYSA-N 0.000 description 2
- DNVXWIINBUTFEP-UHFFFAOYSA-N 2-[(2-phenylphenoxy)methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1C1=CC=CC=C1 DNVXWIINBUTFEP-UHFFFAOYSA-N 0.000 description 2
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- RRDGKBOYQLLJSW-UHFFFAOYSA-N bis(2-ethylhexyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C(C(=O)OCC(CC)CCCC)C(C(=O)OCC(CC)CCCC)CC2OC21 RRDGKBOYQLLJSW-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 150000002921 oxetanes Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- VLTYTTRXESKBKI-UHFFFAOYSA-N (2,4-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 VLTYTTRXESKBKI-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- NPKKFQUHBHQTSH-UHFFFAOYSA-N 2-(decoxymethyl)oxirane Chemical compound CCCCCCCCCCOCC1CO1 NPKKFQUHBHQTSH-UHFFFAOYSA-N 0.000 description 1
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 description 1
- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 1
- QYYCPWLLBSSFBW-UHFFFAOYSA-N 2-(naphthalen-1-yloxymethyl)oxirane Chemical compound C=1C=CC2=CC=CC=C2C=1OCC1CO1 QYYCPWLLBSSFBW-UHFFFAOYSA-N 0.000 description 1
- ZXJBWUAALADCRI-UHFFFAOYSA-N 2-(octadecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCCCCCCCOCC1CO1 ZXJBWUAALADCRI-UHFFFAOYSA-N 0.000 description 1
- HRWYHCYGVIJOEC-UHFFFAOYSA-N 2-(octoxymethyl)oxirane Chemical compound CCCCCCCCOCC1CO1 HRWYHCYGVIJOEC-UHFFFAOYSA-N 0.000 description 1
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 1
- CWNOEVURTVLUNV-UHFFFAOYSA-N 2-(propoxymethyl)oxirane Chemical compound CCCOCC1CO1 CWNOEVURTVLUNV-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- PWKFISHMYLNJIG-UHFFFAOYSA-N 2-methyl-3-(oxiran-2-ylmethoxy)phenol Chemical compound CC1=C(C=CC=C1OCC2CO2)O PWKFISHMYLNJIG-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- WYYQKWASBLTRIW-UHFFFAOYSA-N 2-trimethoxysilylbenzoic acid Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1C(O)=O WYYQKWASBLTRIW-UHFFFAOYSA-N 0.000 description 1
- CGRJJOYCFCCGPX-UHFFFAOYSA-N 3-ethyloxetane Chemical compound CCC1COC1 CGRJJOYCFCCGPX-UHFFFAOYSA-N 0.000 description 1
- RHZAAYVDJRHENK-UHFFFAOYSA-N 3-triethoxysilylpropyl cyanate Chemical compound CCO[Si](OCC)(OCC)CCCOC#N RHZAAYVDJRHENK-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- IFQUPKAISSPFTE-UHFFFAOYSA-M 4-benzoylbenzoate Chemical compound C1=CC(C(=O)[O-])=CC=C1C(=O)C1=CC=CC=C1 IFQUPKAISSPFTE-UHFFFAOYSA-M 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- BEFVTYTYHIAXPG-UHFFFAOYSA-N C(C1CO1)OCCCCOCC Chemical compound C(C1CO1)OCCCCOCC BEFVTYTYHIAXPG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 208000023406 head swelling Diseases 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 150000003463 sulfur Chemical class 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
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Abstract
本發明的課題為提供一種為適合於利用噴墨法進行的塗佈的黏度、且抑制對噴墨裝置的噴墨頭部的損傷、並且硬化物的介電常數低的密封劑。藉由包含(A)具有兩個以上的乙基己基的脂環式環氧化合物、(B)多官能氧雜環丁烷化合物、以及(C)單官能縮水甘油醚的密封劑,來解決所述課題。An object of the present invention is to provide a sealant that has a viscosity suitable for coating by an inkjet method, suppresses damage to the inkjet head of an inkjet device, and has a cured product with a low dielectric constant. Solve the problem by using a sealant containing (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a multifunctional oxetane compound, and (C) a monofunctional glycidyl ether. Describe the topic.
Description
本發明是有關於一種密封劑。The present invention relates to a sealant.
近年來,開發有使用有機電致發光元件(以下,稱為有機EL(electroluminescence)元件)等顯示元件的顯示裝置,但顯示元件通常容易因大氣中的水分或氧而劣化。因此,於各種顯示裝置中,通常顯示元件是由密封層密封(面密封)。另外,為了密封太陽電池元件、或半導體元件等各種元件,亦使用密封劑。In recent years, display devices using display elements such as organic electroluminescence elements (hereinafter referred to as organic EL (electroluminescence) elements) have been developed. However, display elements are generally easily deteriorated by moisture or oxygen in the atmosphere. Therefore, in various display devices, the display elements are usually sealed by a sealing layer (surface sealing). In addition, sealants are also used to seal various elements such as solar cell elements and semiconductor elements.
例如,於包含有機EL元件等各種元件的裝置中,有時有機EL元件等元件是藉由包含硬化性樹脂的密封劑的硬化物來進行面密封。先前,密封劑通常是利用網版印刷法來進行塗佈(印刷)。但是,近年來,為了實現裝置的柔性化,而要求使密封劑的硬化物(以下,亦稱為「密封層」)平坦化、或薄膜化。因此,研究有利用噴墨法來塗佈密封劑。於利用噴墨裝置來塗佈密封劑的情況下,要求可長期穩定地自噴嘴噴出密封劑。另外,要求抑制噴墨裝置的頭部分中所使用的接著劑或橡膠材料的膨潤,且對裝置的損傷少。For example, in a device including various elements such as an organic EL element, the element such as the organic EL element may be surface-sealed with a cured product of a sealant containing a curable resin. Previously, sealants were usually applied (printed) using a screen printing method. However, in recent years, in order to achieve flexibility of the device, there has been a demand for flattening or thinning the cured product of the sealant (hereinafter also referred to as “sealing layer”). Therefore, research has been conducted on using the inkjet method to apply sealants. When the sealant is applied using an inkjet device, it is required that the sealant be ejected from the nozzle stably over a long period of time. In addition, it is required to suppress swelling of the adhesive or rubber material used in the head portion of the inkjet device and to cause less damage to the device.
此處,作為用於利用噴墨裝置進行塗佈的組成物,提出有包含環氧化植物油、含有脂環式環氧基的化合物、含有氧雜環丁烷基的化合物、以及光陽離子聚合起始劑的噴墨組成物(例如,專利文獻1)。 [現有技術文獻] [專利文獻]Here, as a composition for coating with an inkjet device, a composition containing an epoxidized vegetable oil, an alicyclic epoxy group-containing compound, an oxetanyl group-containing compound, and a photocationic polymerization initiator is proposed. agent inkjet composition (for example, Patent Document 1). [Prior art documents] [Patent Document]
[專利文獻1]日本專利特開2016-108512號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 2016-108512
[發明所欲解決之課題] 但是,所述專利文獻1中記載的面密封劑難以自噴墨裝置穩定地進行塗佈。[Problem to be solved by the invention] However, the surface sealant described in Patent Document 1 is difficult to apply stably from an inkjet device.
另外,近年來,帶觸控面板的顯示裝置大量普及。於該顯示裝置中,由密封層密封的顯示元件與觸控面板等的感測器靠近配置。而且,若密封層的厚度變薄,則顯示元件與感測器容易發生干涉,顯示裝置的運作容易變得不穩定。為了防止此種運作的不穩定化,理想的是密封層的介電常數低。In addition, in recent years, display devices with touch panels have been widely spread. In this display device, the display element sealed by the sealing layer and the sensor such as the touch panel are arranged close to each other. Furthermore, if the thickness of the sealing layer becomes thinner, interference between the display element and the sensor may easily occur, and the operation of the display device may become unstable. In order to prevent such operational instability, it is desirable that the sealing layer has a low dielectric constant.
本發明是鑑於所述情況而成者,目的在於提供一種對於長期穩定地實施利用噴墨法進行的塗佈而言適合的密封劑。 [解決課題之手段]The present invention was made in view of the above-mentioned circumstances, and an object thereof is to provide a sealant suitable for long-term and stable application by the inkjet method. [Means to solve the problem]
本發明提供以下的密封劑。 [1] 一種密封劑,包含:(A)具有兩個以上的乙基己基的脂環式環氧化合物、(B)多官能氧雜環丁烷化合物、以及(C)單官能縮水甘油醚。 [2] 如[1]所述的密封劑,其中利用E型黏度計於25℃、20 rpm的條件下測定的黏度為8 mPa·s~40 mPa·s。 [3] 如[1]或[2]中任一項所述的密封劑,其中所述(A)具有兩個以上的乙基己基的脂環式環氧化合物為下述式(I)所表示的環氧六氫鄰苯二甲酸二2-乙基己酯, [化1]。 [4] 如[1]至[3]中任一項所述的密封劑,其中所述(C)單官能縮水甘油醚為苯基縮水甘油醚衍生物。 [5] 如[1]至[4]中任一項所述的密封劑,其中將乙烯-丙烯-二烯橡膠試驗片於25℃下浸漬於所述(C)單官能縮水甘油醚中一週時產生的、所述試驗片的浸漬前後的重量變化率所表示的乙烯-丙烯-二烯橡膠的膨潤率A為5%以下。 [6] 如[1]至[5]中任一項所述的密封劑,其中所述(C)單官能縮水甘油醚的、利用E型黏度計於25℃、20 rpm的條件下測定的黏度為35 mPa·s以下。 [7] 如[1]至[6]中任一項所述的密封劑,其中將乙烯-丙烯-二烯橡膠試驗片於40℃下浸漬於所述密封劑中一週時產生的、所述試驗片的浸漬前後的重量變化率所表示的乙烯-丙烯-二烯橡膠的膨潤率B為10%以下。 [8] 如[1]至[7]中任一項所述的密封劑,其中對所述密封劑使用波長395 nm的紫外線-發光二極體(Ultraviolet-Light Emitting Diode,UV-LED)燈於照度:1000 mW/cm2 、累計光量:1500 mJ/cm2 的條件下進行紫外線硬化後,以溫度100℃熱硬化30分鐘而成的硬化物的、頻率100 kHz下的介電常數為3.10以下。 [9] 如[1]至[8]中任一項所述的密封劑,其用於顯示元件。 [10] 如[1]至[9]中任一項所述的密封劑,其用於利用噴墨法進行的塗佈中。 [11] 如[10]所述的密封劑,其中所述顯示元件為有機電致發光元件。 [發明的效果]The present invention provides the following sealants. [1] A sealant containing: (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a multifunctional oxetane compound, and (C) a monofunctional glycidyl ether. [2] The sealant as described in [1], wherein the viscosity measured using an E-type viscometer at 25°C and 20 rpm is 8 mPa·s to 40 mPa·s. [3] The sealant according to any one of [1] or [2], wherein (A) the alicyclic epoxy compound having two or more ethylhexyl groups is represented by the following formula (I) Epoxy hexahydrophthalate di-2-ethylhexyl, [Chemical 1] . [4] The sealant according to any one of [1] to [3], wherein the (C) monofunctional glycidyl ether is a phenyl glycidyl ether derivative. [5] The sealant according to any one of [1] to [4], wherein the ethylene-propylene-diene rubber test piece is immersed in the (C) monofunctional glycidyl ether at 25°C for one week The swelling rate A of the ethylene-propylene-diene rubber, represented by the weight change rate of the test piece before and after immersion, is 5% or less. [6] The sealant according to any one of [1] to [5], wherein the (C) monofunctional glycidyl ether is measured using an E-type viscometer at 25°C and 20 rpm. The viscosity is below 35 mPa·s. [7] The sealant according to any one of [1] to [6], wherein the ethylene-propylene-diene rubber test piece is immersed in the sealant at 40° C. for one week. The swelling rate B of the ethylene-propylene-diene rubber represented by the weight change rate of the test piece before and after immersion is 10% or less. [8] The sealant according to any one of [1] to [7], wherein an ultraviolet-light emitting diode (UV-LED) lamp with a wavelength of 395 nm is used for the sealant After ultraviolet curing under the conditions of illumination: 1000 mW/cm 2 and cumulative light intensity: 1500 mJ/cm 2 , the cured product obtained by thermal curing at 100°C for 30 minutes has a dielectric constant of 3.10 at a frequency of 100 kHz. the following. [9] The sealant according to any one of [1] to [8], which is used for a display element. [10] The sealant according to any one of [1] to [9], which is used for coating by the inkjet method. [11] The sealant according to [10], wherein the display element is an organic electroluminescent element. [Effects of the invention]
根據本發明,可提供一種適合於利用噴墨法進行的塗佈的密封劑。According to the present invention, a sealant suitable for coating by the inkjet method can be provided.
1. 密封劑 本發明的密封劑為用於對顯示元件或太陽電池元件、半導體元件等各種元件進行面密封、或者對液晶顯示元件的液晶進行密封的密封劑。該密封劑包含(A)具有兩個以上的乙基己基的脂環式環氧化合物、(B)多官能氧雜環丁烷化合物、以及(C)單官能縮水甘油醚。其中,視需要亦可包含該些以外的成分,例如,亦可包含(D)陽離子聚合起始劑、(E)各種添加劑等。1. Sealant The sealant of the present invention is a sealant used for surface sealing of various elements such as display elements, solar cell elements, and semiconductor elements, or for sealing liquid crystal of a liquid crystal display element. This sealant contains (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a polyfunctional oxetane compound, and (C) a monofunctional glycidyl ether. If necessary, components other than these may be included. For example, (D) cationic polymerization initiator, (E) various additives, etc. may also be included.
本發明者等人進行了努力研究,結果發現,藉由適當地組合(A)具有兩個以上的乙基己基的脂環式環氧化合物、(B)多官能氧雜環丁烷化合物、以及(C)單官能縮水甘油醚,可將密封劑的黏度設為適合於噴墨塗佈的值。另外,發現藉由抑制噴墨裝置的噴墨頭部中所使用的接著劑或橡膠材料的膨潤,而抑制噴墨頭部的變形,從而可長期穩定地噴出密封劑。進而,亦發現可降低密封劑的硬化物的介電常數。As a result of diligent research, the present inventors found that by appropriately combining (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a polyfunctional oxetane compound, and (C) Monofunctional glycidyl ether can set the viscosity of the sealant to a value suitable for inkjet coating. In addition, they found that by suppressing the swelling of the adhesive or rubber material used in the inkjet head of the inkjet device, the deformation of the inkjet head is suppressed, so that the sealant can be ejected stably over a long period of time. Furthermore, it was also found that the dielectric constant of the cured product of the sealant can be lowered.
其理由並未明瞭,但如以下般進行推測。噴墨裝置的頭部分中所使用的接著劑或橡膠材料大多包含例如乙烯-丙烯-二烯單體(ethylene-propylene-diene monomer,EPDM)橡膠等極性低的材料。相對於此,若密封劑包含(A)具有兩個以上的乙基己基的脂環式環氧化合物之類的體積大的結構的化合物,則密封劑與極性低的橡膠材料等難以親和,該橡膠材料的相對於密封劑的膨潤率容易降低。另外,若密封劑包含(B)多官能氧雜環丁烷化合物,則密封劑的黏度容易降低。進而,若密封劑包含(C)單官能縮水甘油醚,則相對於密封劑的接著劑或橡膠材料等的膨潤率容易降低。另外,密封劑的硬化物的介電常數亦容易降低。根據此種密封劑,可利用噴墨法長期穩定地形成平坦性高、厚度薄的密封層。另外,於使用此種密封劑密封顯示元件的情況下,該顯示元件難以與觸控面板等的感測器發生干涉,可與感測器靠近配置。因此,可實現顯示裝置的薄型化。The reason for this is not clear, but it is speculated as follows. Adhesives or rubber materials used in the head portion of inkjet devices often include low-polarity materials such as ethylene-propylene-diene monomer (EPDM) rubber. On the other hand, if the sealant contains (A) a compound with a bulky structure such as an alicyclic epoxy compound having two or more ethylhexyl groups, it will be difficult for the sealant to be compatible with low-polarity rubber materials and the like. The swelling rate of the rubber material with respect to the sealant tends to decrease. In addition, if the sealant contains (B) a polyfunctional oxetane compound, the viscosity of the sealant is likely to be reduced. Furthermore, if the sealant contains (C) monofunctional glycidyl ether, the swelling rate of the adhesive, rubber material, etc. with respect to the sealant is likely to decrease. In addition, the dielectric constant of the cured product of the sealant also tends to decrease. According to this sealant, a sealing layer with high flatness and thin thickness can be stably formed over a long period of time using the inkjet method. In addition, when such a sealant is used to seal a display element, the display element is less likely to interfere with a sensor such as a touch panel and can be placed close to the sensor. Therefore, the display device can be made thinner.
再者,本發明的密封劑特別適合於利用噴墨法進行的塗佈,但其塗佈方法並不受噴墨法的限制,亦可利用分配器、網版印刷、旋塗法等進行塗佈。Furthermore, the sealant of the present invention is particularly suitable for coating using the inkjet method, but the coating method is not limited to the inkjet method, and can also be applied using a dispenser, screen printing, spin coating, etc. cloth.
·(A)具有兩個以上的乙基己基的脂環式環氧化合物 (A)具有兩個以上的乙基己基的脂環式環氧化合物只要為於分子中具有分別為一個以上的脂環式烴結構及環氧基、且具有兩個以上的乙基己基的化合物,則並無特別限定。具有兩個以上的乙基己基的脂環式環氧化合物較具有一個乙基己基的脂環式環氧化合物而言,為體積大的結構,因此難以使噴墨頭部中可存在的橡膠材料膨潤。·(A) Alicyclic epoxy compound having two or more ethylhexyl groups (A) The alicyclic epoxy compound having two or more ethylhexyl groups must be a compound that has one or more alicyclic hydrocarbon structures and one epoxy group in the molecule and two or more ethylhexyl groups. , there are no special restrictions. Alicyclic epoxy compounds with two or more ethylhexyl groups have a larger structure than those with one ethylhexyl group, so it is difficult to make the rubber material that can exist in the inkjet head Swelling.
(A)具有兩個以上的乙基己基的脂環式環氧化合物較佳為於25℃下為液狀的化合物,利用E型黏度計於25℃、20 rpm的條件下測定的黏度較佳為10 mPa·s~500 mPa·s,更佳為30 mPa·s~300 mPa·s。若(A)具有兩個以上的乙基己基的脂環式環氧化合物的黏度為該範圍,則密封劑的黏度容易處於後述範圍,容易利用噴墨法穩定地進行塗佈。(A) The alicyclic epoxy compound having two or more ethylhexyl groups is preferably a compound that is liquid at 25°C, and the viscosity measured using an E-type viscometer at 25°C and 20 rpm is preferred It is 10 mPa·s~500 mPa·s, more preferably, it is 30 mPa·s~300 mPa·s. If the viscosity of (A) the alicyclic epoxy compound having two or more ethylhexyl groups is within this range, the viscosity of the sealant will be easily in the range described below, and the sealant will be easily coated stably by the inkjet method.
(A)具有兩個以上的乙基己基的脂環式環氧化合物的分子量或重量平均分子量較佳為100~790,更佳為140~500。重量平均分子量是利用凝膠滲透層析法(Gel Permeation Chromatography,GPC)測定的值(聚苯乙烯換算)。若(A)具有兩個以上的乙基己基的脂環式環氧化合物的分子量或重量平均分子量為100以上,則(A)具有兩個以上的乙基己基的脂環式環氧化合物於噴墨裝置內難以揮發。另外,若分子量或重量平均分子量為790以下,則(A)具有兩個以上的乙基己基的脂環式環氧化合物的黏度不會過度提高,進而,可將密封劑的黏度設為所述範圍。(A) The molecular weight or weight average molecular weight of the alicyclic epoxy compound having two or more ethylhexyl groups is preferably 100 to 790, more preferably 140 to 500. The weight average molecular weight is a value measured by gel permeation chromatography (GPC) (polystyrene conversion). If the molecular weight or weight average molecular weight of (A) the alicyclic epoxy compound having two or more ethylhexyl groups is 100 or more, then (A) the alicyclic epoxy compound having two or more ethylhexyl groups is sprayed It is difficult to evaporate in the ink device. In addition, if the molecular weight or weight average molecular weight is 790 or less, the viscosity of (A) the alicyclic epoxy compound having two or more ethylhexyl groups will not increase excessively, and further, the viscosity of the sealant can be set to the above Scope.
另外,(A)具有兩個以上的乙基己基的脂環式環氧化合物較佳為下述式(1)所表示的氧原子含有率為15%以上。 氧原子含有率(%)=一分子中的氧原子的合計質量/重量平均分子量×100 …(1)In addition, (A) the alicyclic epoxy compound having two or more ethylhexyl groups preferably has an oxygen atom content represented by the following formula (1) of 15% or more. Oxygen atom content rate (%) = total mass of oxygen atoms in one molecule/weight average molecular weight × 100... (1)
若(A)具有兩個以上的乙基己基的脂環式環氧化合物的氧原子含有率為15%以上,則可提高該化合物的極性,因此難以與噴墨裝置的頭部分中所使用的極性低的接著劑或橡膠材料(例如,EPDM橡膠等)親和,從而難以使接著劑或橡膠材料(例如,EPDM橡膠等)膨潤。藉此,可降低接著劑或橡膠材料的劣化(對裝置的損傷)。就所述觀點而言,氧原子含有率較佳為18%以上。氧原子含有率的上限值只要為所獲得的密封層的介電常數不會過度變大的程度即可,例如較佳為30%以下。If the oxygen atom content of (A) the alicyclic epoxy compound having two or more ethylhexyl groups is 15% or more, the polarity of the compound will be increased, making it difficult to mix with the alicyclic epoxy compound used in the head part of the inkjet device. Adhesives or rubber materials (eg, EPDM rubber, etc.) with low polarity are compatible with each other, making it difficult to swell the adhesive or rubber materials (eg, EPDM rubber, etc.). This can reduce the deterioration of the adhesive or rubber material (damage to the device). From this viewpoint, the oxygen atom content is preferably 18% or more. The upper limit of the oxygen atom content may be such that the dielectric constant of the sealing layer obtained does not increase excessively, and is preferably 30% or less, for example.
(A)具有兩個以上的乙基己基的脂環式環氧化合物的一分子中的氧原子的合計質量可利用氣相層析-質譜(Gas Chromatography-Mass Spectrometry,GC-MS)法、核磁共振(Nuclear Magnetic Resonance,NMR)法等確定該脂環式環氧化合物的結構,且確定該化合物的一分子中的氧原子的數量,並對其乘以氧原子的原子量而算出。而且,(A)具有兩個以上的乙基己基的脂環式環氧化合物的氧原子含有率可將獲得的氧原子的合計質量、與利用所述GPC法測定的重量平均分子量套用於所述式(1)中來算出。(A) The total mass of oxygen atoms in one molecule of an alicyclic epoxy compound having two or more ethylhexyl groups can be determined using Gas Chromatography-Mass Spectrometry (GC-MS) or NMR. The structure of the alicyclic epoxy compound is determined using a Nuclear Magnetic Resonance (NMR) method or the like, the number of oxygen atoms in one molecule of the compound is determined, and the number is multiplied by the atomic weight of the oxygen atom to calculate the result. Furthermore, (A) the oxygen atom content rate of the alicyclic epoxy compound having two or more ethylhexyl groups can be determined by applying the obtained total mass of oxygen atoms and the weight average molecular weight measured by the GPC method. It can be calculated from equation (1).
(A)具有兩個以上的乙基己基的脂環式環氧化合物的氧原子含有率例如可藉由分子中的環氧基的數量、或具有氧原子的基(例如,-CO-(羰基)、-O-CO-O-(碳酸酯基)、-COO-(羰基氧基或酯基)、-O-(醚基)、-CONH-(醯胺基)等)的數量來調整。即,為了降低氧原子含有率,而較佳為減少一分子中的具有氧原子的基的數量。(A) The oxygen atom content of an alicyclic epoxy compound having two or more ethylhexyl groups can be determined, for example, by the number of epoxy groups in the molecule, or a group having an oxygen atom (for example, -CO-(carbonyl group) ), -O-CO-O- (carbonate group), -COO- (carbonyloxy or ester group), -O- (ether group), -CONH- (amide group), etc.). That is, in order to reduce the oxygen atom content rate, it is preferable to reduce the number of groups having oxygen atoms in one molecule.
(A)具有兩個以上的乙基己基的脂環式環氧化合物較佳為具有一個環烯烴氧化物且兩個乙基己基分別鍵結於脂環結構的化合物。進而,更佳為兩個乙基己基分別經由酯鍵而鍵結於脂環結構的化合物。(A) The alicyclic epoxy compound having two or more ethylhexyl groups is preferably a compound having one cyclic olefin oxide and two ethylhexyl groups respectively bonded to the alicyclic structure. Furthermore, a compound in which two ethylhexyl groups are bonded to an alicyclic structure via an ester bond is more preferred.
作為此種化合物的具體例,可列舉下述式(I)所表示的、環氧六氫鄰苯二甲酸二2-乙基己酯等。 [化2] Specific examples of such compounds include di-2-ethylhexyl epoxy hexahydrophthalate represented by the following formula (I). [Chemicalization 2]
所述環氧六氫鄰苯二甲酸二2-乙基己酯的市售品的例子包含桑索賽澤(Sansocizer)E-PS(新日本理化股份有限公司製造)等。Examples of commercially available products of the epoxy hexahydrophthalate di-2-ethylhexyl ester include Sansocizer E-PS (manufactured by Shinnippon Rika Co., Ltd.) and the like.
相對於密封劑的總質量,(A)具有兩個以上的乙基己基的脂環式環氧化合物的量較佳為10質量%~50質量%。若(A)具有兩個以上的乙基己基的脂環式環氧化合物的量為10質量%以上,則密封劑的介電常數容易降低。另一方面,若為50質量%以下,則密封劑的黏度成為適當的值,容易降低噴墨頭部分中所使用的接著劑或橡膠材料的相對於密封劑的膨潤率。進而,(B)多官能氧雜環丁烷化合物的量相對變多,介電常數容易變低。相對於密封劑的總質量,(A)具有兩個以上的乙基己基的脂環式環氧化合物的含量更佳為10質量%~40質量%,進而佳為15質量%~30質量%。The amount of (A) the alicyclic epoxy compound having two or more ethylhexyl groups is preferably 10 to 50 mass % relative to the total mass of the sealant. If the amount of (A) the alicyclic epoxy compound having two or more ethylhexyl groups is 10 mass % or more, the dielectric constant of the sealant is likely to decrease. On the other hand, if it is 50% by mass or less, the viscosity of the sealant becomes an appropriate value, and the swelling rate of the adhesive or rubber material used in the inkjet head part with respect to the sealant is easily reduced. Furthermore, as the amount of the polyfunctional oxetane compound (B) increases relatively, the dielectric constant tends to become lower. The content of (A) the alicyclic epoxy compound having two or more ethylhexyl groups is more preferably 10% by mass to 40% by mass, and further preferably 15% by mass to 30% by mass relative to the total mass of the sealant.
·(B)多官能氧雜環丁烷化合物 (B)多官能氧雜環丁烷化合物只要為具有兩個以上的氧雜環丁基的二官能以上的化合物即可,較佳為分子量或重量平均分子量為180以上。另外,較佳為所述式(1)所表示的氧原子含有率為15%以上。·(B) Multifunctional oxetane compounds (B) The polyfunctional oxetane compound may be a bifunctional or higher compound having two or more oxetanyl groups, and preferably has a molecular weight or a weight average molecular weight of 180 or more. In addition, the oxygen atom content represented by the formula (1) is preferably 15% or more.
若(B)多官能氧雜環丁烷化合物的重量平均分子量為180以上,則可降低該化合物的揮發性。因此,可減少利用噴墨法塗佈密封劑時的作業環境的惡化或對被塗佈物(顯示元件)的損傷。就降低密封劑的揮發性的觀點而言,(B)多官能氧雜環丁烷化合物的重量平均分子量較佳為190以上,更佳為200以上。重量平均分子量的上限只要為不損及密封劑的利用噴墨法進行塗佈時的噴出性的程度即可,例如進而佳為400以下。重量平均分子量可利用與所述相同的方法進行測定。If the weight average molecular weight of the polyfunctional oxetane compound (B) is 180 or more, the volatility of the compound can be reduced. Therefore, it is possible to reduce deterioration of the working environment and damage to the object to be coated (display element) when applying the sealant using the inkjet method. From the viewpoint of reducing the volatility of the sealant, the weight average molecular weight of the polyfunctional oxetane compound (B) is preferably 190 or more, more preferably 200 or more. The upper limit of the weight average molecular weight only needs to be a level that does not impair the ejectability of the sealant when applied by the inkjet method, and is more preferably 400 or less, for example. The weight average molecular weight can be measured using the same method as described above.
若(B)多官能氧雜環丁烷化合物的氧原子含有率為15%以上,則可提高該化合物的極性,因此可降低噴墨裝置的頭部分中所使用的極性低的接著劑或橡膠材料等的劣化(對裝置的損傷)。就降低對裝置的損傷的觀點而言,(B)多官能氧雜環丁烷化合物的氧原子含有率較佳為20%以上。就密封層的介電常數不會過度變大的觀點而言,氧原子含有率例如較佳為30%以下。氧原子含有率是與所述同樣地進行定義及測定。If the oxygen atom content of the polyfunctional oxetane compound (B) is 15% or more, the polarity of the compound can be increased, thereby reducing the need for low-polarity adhesives or rubbers used in the head portion of the inkjet device. Deterioration of materials, etc. (damage to equipment). From the viewpoint of reducing damage to the device, the oxygen atom content of the polyfunctional oxetane compound (B) is preferably 20% or more. From the viewpoint that the dielectric constant of the sealing layer does not increase excessively, the oxygen atom content is preferably 30% or less, for example. The oxygen atom content is defined and measured in the same manner as described above.
該(B)多官能氧雜環丁烷化合物較佳為於25℃下為液狀的化合物,利用E型黏度計於25℃、20 rpm的條件下測定的黏度較佳為1 mPa·s~500 mPa·s,更佳為1 mPa·s~300 mPa·s。若(B)多官能氧雜環丁烷化合物的黏度為該範圍,則密封劑的黏度容易處於上述的範圍,容易利用噴墨法穩定地進行塗佈。The polyfunctional oxetane compound (B) is preferably a liquid compound at 25°C, and the viscosity measured using an E-type viscometer at 25°C and 20 rpm is preferably 1 mPa·s~ 500 mPa·s, preferably 1 mPa·s~300 mPa·s. If the viscosity of the polyfunctional oxetane compound (B) is within this range, the viscosity of the sealant will be easily within the above range, and the sealant will be easily coated stably by the inkjet method.
為了提高(B)多官能氧雜環丁烷化合物的氧原子含有率,例如只要增多該化合物的一分子中的氧雜環丁基的數量、或含有氧原子的基(例如,後述的式(B-1)的R2 所表示的聚氧伸烷基、或R2 中所含的氧原子、或羰基或磺醯基等含有氧原子的基)的數量即可。In order to increase the oxygen atom content of the polyfunctional oxetane compound (B), for example, the number of oxetanyl groups in one molecule of the compound may be increased, or the group containing oxygen atoms may be increased (for example, the following formula ( B-1) The number of polyoxyalkylene groups represented by R 2 , or oxygen atoms contained in R 2 , or groups containing oxygen atoms such as carbonyl groups or sulfonyl groups) is sufficient.
(B)多官能氧雜環丁烷化合物較佳為下述式(II-1)或式(II-2)所表示的化合物。(B) The polyfunctional oxetane compound is preferably a compound represented by the following formula (II-1) or formula (II-2).
[化3]式(II-1)式(II-2)[Chemical 3] Formula (II-1) Formula (II-2)
式(II-1)及式(II-2)的R1 分別為氫原子、碳原子數1~6的烷基、烯丙基、芳基、芳烷基、呋喃基或噻吩基。R2 分別為二價有機殘基。其中,R1 及R2 是以式(II-1)及式(II-2)所表示的化合物的重量平均分子量及氧原子含有率滿足所述範圍的方式進行選擇。R 1 in formula (II-1) and formula (II-2) is respectively a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an allyl group, an aryl group, an aralkyl group, a furyl group or a thienyl group. R 2 are respectively divalent organic residues. Among them, R 1 and R 2 are selected so that the weight average molecular weight and oxygen atom content of the compounds represented by formula (II-1) and formula (II-2) satisfy the above ranges.
碳原子數1~6的烷基的例子包含:甲基、乙基、丙基、丁基、戊基、己基、環己基。芳基的例子包含:苯基、萘基、甲苯基、二甲苯基。芳烷基的例子包含:苄基、苯乙基。Examples of alkyl groups having 1 to 6 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, and cyclohexyl. Examples of aryl groups include phenyl, naphthyl, tolyl, and xylyl. Examples of aralkyl groups include benzyl and phenethyl.
二價有機殘基的例子包含:伸烷基、聚氧伸烷基、伸苯基、伸二甲苯基、下述式所表示的結構。 [化4]、 Examples of the divalent organic residue include an alkylene group, a polyoxyalkylene group, a phenylene group, a xylylene group, and a structure represented by the following formula. [Chemical 4] ,
式中的R3 為氧原子、硫原子、-CH2 -、-NH-、-SO-、-SO2 -、-C(CF3 )2 -或-C(CH3 )2 -。R 3 in the formula is an oxygen atom, a sulfur atom, -CH 2 -, -NH-, -SO-, -SO 2 -, -C(CF 3 ) 2 - or -C(CH 3 ) 2 -.
R4 為碳原子數1~6的伸烷基或伸芳基。伸烷基的例子包含:亞甲基、伸乙基、伸丙基、伸丁基、伸環己基等碳原子數1~15的伸烷基。聚氧伸烷基較佳為碳原子數為4~30、較佳為4~8的聚氧伸烷基,其例包含聚氧伸乙基、聚氧伸丙基。R 4 is an alkylene group or aryl group having 1 to 6 carbon atoms. Examples of the alkylene group include alkylene groups having 1 to 15 carbon atoms, such as methylene, ethylene, propylene, butylene, and cyclohexylene. The polyoxyalkylene group is preferably a polyoxyalkylene group having 4 to 30 carbon atoms, preferably 4 to 8 carbon atoms, and examples thereof include polyoxyethylene and polyoxypropylene.
通式(II-2)所表示的化合物的例子包含3-乙基-3{[(3-乙基氧雜環丁烷-3-基)甲氧基]甲基}氧雜環丁烷等,其市售品的例子包含亞隆氧雜環丁烷(Arone Oxetane)OXT-221(東亞合成股份有限公司製造)等。Examples of the compound represented by the general formula (II-2) include 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane and the like , examples of commercially available products include Arone Oxetane OXT-221 (manufactured by Toa Gosei Co., Ltd.), etc.
相對於密封劑的總質量,(B)多官能氧雜環丁烷化合物的量較佳為20質量%~80質量%。若(B)多官能氧雜環丁烷化合物的含量為20質量%以上,則容易充分降低密封劑的黏度並且容易提高硬化性,若為80質量%以下,則容易抑制(A)成分或(C)成分過度變少所致的硬化性的降低。就所述觀點而言,相對於密封劑的總質量,(B)多官能氧雜環丁烷化合物的含量更佳為25質量%~80質量%,進而佳為30質量%~70質量%。The amount of the polyfunctional oxetane compound (B) is preferably 20% by mass to 80% by mass relative to the total mass of the sealant. If the content of the polyfunctional oxetane compound (B) is 20% by mass or more, it is easy to sufficiently reduce the viscosity of the sealant and to improve the hardenability. If it is 80% by mass or less, it is easy to suppress the component (A) or ( C) Reduction in hardening properties caused by excessive reduction in ingredients. From this viewpoint, the content of the polyfunctional oxetane compound (B) is more preferably 25% by mass to 80% by mass, and further preferably 30% by mass to 70% by mass relative to the total mass of the sealant.
·(C)單官能縮水甘油醚 密封劑進而包含(C)單官能縮水甘油醚。(C)單官能縮水甘油醚為僅包含一個縮水甘油醚基的化合物,與縮水甘油醚基鍵結的基可為脂肪族、脂環族、芳香族的任一者。(C)單官能縮水甘油醚為體積大的結構,因此若包含於密封劑中,則橡膠材料的相對於密封劑的膨潤率降低。另外,(C)單官能縮水甘油醚為氧含量低的化合物,因此若包含於密封劑中,則密封劑的硬化物的介電常數降低。·(C) Monofunctional glycidyl ether The sealant in turn contains (C) monofunctional glycidyl ether. (C) The monofunctional glycidyl ether is a compound containing only one glycidyl ether group, and the group bonded to the glycidyl ether group may be any of aliphatic, alicyclic, and aromatic. (C) The monofunctional glycidyl ether has a bulky structure, so when contained in the sealant, the swelling rate of the rubber material with respect to the sealant decreases. In addition, (C) monofunctional glycidyl ether is a compound with a low oxygen content. Therefore, when contained in a sealant, the dielectric constant of the cured product of the sealant decreases.
(C)單官能縮水甘油醚的例子包含:甲基縮水甘油醚、乙基縮水甘油醚、丙基縮水甘油醚、正丁基縮水甘油醚、辛基縮水甘油醚、2-乙基己基縮水甘油醚、癸基縮水甘油醚、十二基縮水甘油醚、硬脂基縮水甘油醚、乙氧基丁基縮水甘油醚、1-烯丙基氧基-2,3-環氧丙烷、1-(1',1'-二甲基炔丙基氧基)-2,3-環氧丙烷、苯基縮水甘油醚、甲苯酚基縮水甘油醚、丁基苯基縮水甘油醚、萘基縮水甘油醚、苯基苯酚縮水甘油醚、苄基醇縮水甘油醚等。(C) Examples of monofunctional glycidyl ether include: methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, n-butyl glycidyl ether, octyl glycidyl ether, and 2-ethylhexyl glycidyl ether. Ether, decyl glycidyl ether, dodecyl glycidyl ether, stearyl glycidyl ether, ethoxybutyl glycidyl ether, 1-allyloxy-2,3-epoxypropane, 1-( 1',1'-Dimethylpropargyloxy)-2,3-epoxypropane, phenyl glycidyl ether, cresolyl glycidyl ether, butylphenyl glycidyl ether, naphthyl glycidyl ether , phenylphenol glycidyl ether, benzyl alcohol glycidyl ether, etc.
作為(C)單官能縮水甘油醚,較佳為縮水甘油醚基與芳香族鍵結的化合物,進而,更佳為該芳香族基為苯基的苯基縮水甘油醚衍生物。苯基縮水甘油醚衍生物的例子包含:苯基縮水甘油醚、鄰甲苯酚基縮水甘油醚、間對甲苯酚基縮水甘油醚、丁基苯基縮水甘油醚、第三丁基苯基縮水甘油醚、苯基苯酚縮水甘油醚等。苯基縮水甘油醚衍生物於單官能縮水甘油醚中為體積大的結構,因此容易發揮降低膨潤率的效果。(C) The monofunctional glycidyl ether is preferably a compound in which a glycidyl ether group is bonded to an aromatic group, and more preferably a phenyl glycidyl ether derivative in which the aromatic group is a phenyl group. Examples of phenyl glycidyl ether derivatives include: phenyl glycidyl ether, o-cresolyl glycidyl ether, m-p-cresolyl glycidyl ether, butylphenyl glycidyl ether, and tert-butylphenyl glycidyl ether. Ether, phenylphenol glycidyl ether, etc. The phenyl glycidyl ether derivative has a bulky structure among the monofunctional glycidyl ethers, so it is easy to exert the effect of reducing the swelling rate.
進而,關於(C)單官能縮水甘油醚,較佳為將EPDM試驗片於25℃下浸漬於(C)單官能縮水甘油醚中一週時產生的、所述試驗片的浸漬前後的重量變化率所表示的乙烯-丙烯-二烯橡膠的膨潤率A為5%以下。藉由使用此種(C)單官能縮水甘油醚,可降低噴墨頭部中所使用的EPDM橡膠等橡膠材料或接著劑的相對於密封劑的膨潤率。該膨潤率A可利用後述的方法進行測定。Furthermore, (C) monofunctional glycidyl ether is preferably the weight change rate of the test piece before and after the immersion, which occurs when an EPDM test piece is immersed in (C) monofunctional glycidyl ether for one week at 25°C. The indicated swelling ratio A of the ethylene-propylene-diene rubber is 5% or less. By using such (C) monofunctional glycidyl ether, the swelling rate of rubber materials such as EPDM rubber or adhesives used in the inkjet head with respect to the sealant can be reduced. The swelling ratio A can be measured by the method described below.
(C)單官能縮水甘油醚較佳為利用E型黏度計於25℃、20 rpm的條件下測定的黏度為35 mPa·s以下。若(C)單官能縮水甘油醚的黏度為所述範圍,則密封劑的黏度容易處於後述範圍,容易利用噴墨法穩定地進行塗佈。(C)單官能縮水甘油醚的黏度更佳為3 mPa·s~30 mPa·s,進而佳為5 mPa·s~25 mPa·s。若密封劑的黏度為3 mPa·s以上,則密封劑的硬化性提高,容易降低硬化物的介電常數。(C) The monofunctional glycidyl ether preferably has a viscosity of 35 mPa·s or less measured using an E-type viscometer at 25°C and 20 rpm. If the viscosity of (C) the monofunctional glycidyl ether is within the above range, the viscosity of the sealant will be easily within the range described below, and the sealant will be easily coated stably by the inkjet method. (C) The viscosity of the monofunctional glycidyl ether is more preferably 3 mPa·s to 30 mPa·s, and further preferably 5 mPa·s to 25 mPa·s. If the viscosity of the sealant is 3 mPa·s or more, the curability of the sealant increases, and the dielectric constant of the cured product is easily reduced.
相對於密封劑的總質量,(C)單官能縮水甘油醚的量較佳為5質量%~50質量%。若(C)單官能縮水甘油醚的量為5質量%以上,則噴墨裝置的頭部分中所使用的接著劑或橡膠材料的、相對於密封劑的膨潤率容易降低。另一方面,若為50質量%以下,則硬化物的介電常數容易變低。相對於密封劑的總質量,(C)單官能縮水甘油醚的含量更佳為10質量%~40質量%,進而佳為15質量%~30質量%。The amount of (C) monofunctional glycidyl ether is preferably 5 to 50 mass% relative to the total mass of the sealant. If the amount of (C) monofunctional glycidyl ether is 5 mass % or more, the swelling rate of the adhesive or rubber material used in the head part of the inkjet device with respect to the sealant is likely to decrease. On the other hand, if it is 50 mass % or less, the dielectric constant of the hardened material will tend to become low. Relative to the total mass of the sealant, the content of (C) monofunctional glycidyl ether is more preferably 10 mass% to 40 mass%, and further preferably 15 mass% to 30 mass%.
·(D)陽離子聚合起始劑 密封劑可進而包含(D)陽離子聚合起始劑。(D)陽離子聚合起始劑可為藉由紫外線等的光照射而產生可使陽離子聚合開始的酸的光陽離子聚合起始劑,亦可為藉由加熱而產生酸的熱陽離子聚合起始劑。密封劑可僅包含光陽離子聚合起始劑,亦可僅包含熱陽離子聚合起始劑,亦可包含兩者。另外,密封劑可僅包含一種(D)陽離子聚合起始劑,亦可包含兩種以上。其中,較佳為降低加熱所致的對元件的損傷、即藉由光使密封劑硬化,較佳為包含一種以上的光陽離子聚合起始劑。·(D) Cationic polymerization initiator The sealant may further contain (D) a cationic polymerization initiator. (D) The cationic polymerization initiator may be a photocationic polymerization initiator that generates an acid that can start cationic polymerization by irradiation with light such as ultraviolet rays, or a thermal cationic polymerization initiator that generates an acid by heating. . The sealant may contain only a photocationic polymerization initiator, only a thermal cationic polymerization initiator, or both. In addition, the sealing agent may contain only one type of (D) cationic polymerization initiator, or may contain two or more types. Among them, it is preferable to reduce damage to the element due to heating, that is, to harden the sealant with light, and it is preferable to include one or more photocationic polymerization initiators.
光陽離子聚合起始劑的例子包含:陰離子部分為BF4 - 、(Rf )n PF6-n (Rf 為有機基,n為1~5的整數)、PF6 - 、SbF6 - 、或BX4 - (X為經至少兩個以上的氟或三氟甲基取代的苯基)的、芳香族鋶鹽、芳香族錪鹽、芳香族重氮鎓鹽、芳香族銨鹽等。Examples of photocationic polymerization initiators include: BF 4 - as an anionic part, (R f ) n PF 6-n (R f is an organic group, n is an integer from 1 to 5), PF 6 - , SbF 6 - , Or BX 4 - (X is a phenyl group substituted by at least two fluorine or trifluoromethyl groups), aromatic sulfonium salt, aromatic iodonium salt, aromatic diazonium salt, aromatic ammonium salt, etc.
芳香族鋶鹽的例子包含:雙[4-(二苯基鋶基)苯基]硫醚雙六氟磷酸鹽、雙[4-(二苯基鋶基)苯基]硫醚雙六氟銻酸鹽、雙[4-(二苯基鋶基)苯基]硫醚雙四氟硼酸鹽、雙[4-(二苯基鋶基)苯基]硫醚四(五氟苯基)硼酸鹽、二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽、二苯基-4-(苯硫基)苯基鋶六氟銻酸鹽、二苯基-4-(苯硫基)苯基鋶四氟硼酸鹽等。Examples of aromatic sulfonium salts include: bis[4-(diphenylsonium)phenyl]sulfide bishexafluorophosphate, bis[4-(diphenylsonium)phenyl]sulfide bishexafluoroantimony acid salt, bis[4-(diphenylsonyl)phenyl]sulfide bistetrafluoroborate, bis[4-(diphenylsonyl)phenyl]sulfide tetrakis(pentafluorophenyl)borate , diphenyl-4-(phenylthio)phenylsulfonium hexafluorophosphate, diphenyl-4-(phenylthio)phenylsulfonium hexafluoroantimonate, diphenyl-4-(phenylthio) ) phenylsonium tetrafluoroborate, etc.
芳香族錪鹽的例子包含:二苯基錪六氟磷酸鹽、二苯基錪六氟銻酸鹽、二苯基錪四氟硼酸鹽、二苯基錪四(五氟苯基)硼酸鹽、雙(十二基苯基)錪六氟磷酸鹽、雙(十二基苯基)錪六氟銻酸鹽、雙(十二基苯基)錪四氟硼酸鹽、雙(十二基苯基)錪四(五氟苯基)硼酸鹽等。Examples of aromatic iodonium salts include: diphenyl iodonium hexafluorophosphate, diphenyl iodonium hexafluoroantimonate, diphenyl iodonium tetrafluoroborate, diphenyl iodonium tetrakis(pentafluorophenyl)borate, Bis(dodecylphenyl)iodonium hexafluorophosphate, bis(dodecylphenyl)iodonium hexafluoroantimonate, bis(dodecylphenyl)iodonium tetrafluoroborate, bis(dodecylphenyl)iodonium hexafluorophosphate ) Tetrakis(pentafluorophenyl)borate, etc.
芳香族重氮鎓鹽的例子包含:苯基重氮鎓六氟磷酸鹽、苯基重氮鎓六氟銻酸鹽、苯基重氮鎓四氟硼酸鹽、苯基重氮鎓四(五氟苯基)硼酸鹽等。Examples of aromatic diazonium salts include: phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, phenyldiazonium tetrafluoroantimonate phenyl) borate, etc.
芳香族銨鹽的例子包含:1-苄基-2-氰基吡啶鎓六氟磷酸鹽、1-苄基-2-氰基吡啶鎓六氟銻酸鹽等。Examples of aromatic ammonium salts include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, and the like.
光陽離子聚合起始劑的市售品的例子包含:豔佳固(Irgacure)250、豔佳固(Irgacure)270、豔佳固(Irgacure)290(巴斯夫(BASF)公司製造),CPI-100P、CPI-101A、CPI-200K、CPI-210S、CPI-310B、CPI-400PG(聖普羅(San-Apro)公司製造),SP-150、SP-170、SP-171、SP-056、SP-066、SP-130、SP-140、SP-601、SP-606、SP-701(艾迪科(ADEKA)公司製造)。其中,較佳為豔佳固(Irgacure)270、豔佳固(Irgacure)290、CPI-100P、CPI-101A、CPI-200K、CPI-210S、CPI-310B、CPI-400PG、SP-150、SP-170、SP-171、SP-056、SP-066、SP-601、SP-606、SP-701等鋶鹽。Examples of commercially available photocationic polymerization initiators include: Irgacure 250, Irgacure 270, Irgacure 290 (manufactured by BASF), CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310B, CPI-400PG (manufactured by San-Apro), SP-150, SP-170, SP-171, SP-056, SP-066 , SP-130, SP-140, SP-601, SP-606, SP-701 (manufactured by ADEKA). Among them, preferred are Irgacure 270, Irgacure 290, CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310B, CPI-400PG, SP-150, SP -170, SP-171, SP-056, SP-066, SP-601, SP-606, SP-701 and other sulfur salts.
相對於密封劑整體的質量,(D)陽離子聚合起始劑的量較佳為0.1質量%~10質量%。若(D)陽離子聚合起始劑的量為0.1質量%以上,則容易提高密封劑的硬化性,若為10質量%以下,則容易抑制密封劑的硬化物的著色。相對於密封劑整體的質量,(D)陽離子聚合起始劑的量更佳為0.1質量%~5質量%,進而佳為0.1質量%~3質量%。The amount of (D) cationic polymerization initiator is preferably 0.1% by mass to 10% by mass relative to the mass of the entire sealant. When the amount of the (D) cationic polymerization initiator is 0.1% by mass or more, the curability of the sealant is easily improved, and when it is 10% by mass or less, the coloring of the cured product of the sealant is easily suppressed. The amount of (D) the cationic polymerization initiator is more preferably 0.1% by mass to 5% by mass, and further preferably 0.1% by mass to 3% by mass relative to the mass of the entire sealant.
·(E)其他成分 本發明的密封劑可於不損及本發明的效果的範圍內進而包含所述以外的其它成分。其它成分的例子包含芳香族環氧化合物、增感劑、矽烷偶合劑、調平劑等。·(E) Other ingredients The sealant of the present invention may further contain components other than those described above within a range that does not impair the effects of the present invention. Examples of other ingredients include aromatic epoxy compounds, sensitizers, silane coupling agents, leveling agents, and the like.
芳香族環氧化合物的例子包含含有芳香環的醇(包含多元醇)的縮水甘油醚。芳香族環氧化合物的例子包含:雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚O型環氧樹脂、2,2'-二烯丙基雙酚A型環氧樹脂、環氧丙烷加成雙酚A型環氧樹脂、間苯二酚型環氧樹脂、聯苯基型環氧樹脂、硫醚型環氧樹脂、二苯基醚型環氧樹脂、萘型環氧樹脂、苯酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、聯苯基酚醛清漆型環氧樹脂、萘酚酚醛清漆型環氧樹脂等。密封劑可僅包含一種芳香族環氧化合物,亦可包含兩種以上。Examples of aromatic epoxy compounds include glycidyl ethers of aromatic ring-containing alcohols (including polyhydric alcohols). Examples of aromatic epoxy compounds include: bisphenol A-type epoxy resin, bisphenol E-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol O-type epoxy resin, 2 , 2'-diallyl bisphenol A-type epoxy resin, propylene oxide addition bisphenol A-type epoxy resin, resorcinol-type epoxy resin, biphenyl-type epoxy resin, thioether-type epoxy resin Oxygen resin, diphenyl ether type epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, o-cresol novolac type epoxy resin, diphenyl novolak type epoxy resin, naphthol novolac type epoxy resin type epoxy resin, etc. The sealant may contain only one aromatic epoxy compound or two or more.
芳香族環氧化合物的氧原子含有率或重量平均分子量並無特別限制,就化合物的揮發性、或降低密封劑的硬化物的介電常數的觀點而言,所述式(1)所表示的氧原子含有率較佳為10%以上且30%以下,重量平均分子量較佳為100以上。The oxygen atom content or weight average molecular weight of the aromatic epoxy compound is not particularly limited. From the viewpoint of the volatility of the compound or the reduction of the dielectric constant of the cured product of the sealant, the formula (1) represents The oxygen atom content is preferably 10% or more and 30% or less, and the weight average molecular weight is preferably 100 or more.
其中,若密封劑大量包含例如雙酚A型環氧樹脂、或雙酚F型環氧樹脂,則其黏度容易變高。另外,若密封劑大量包含芳香族環氧樹脂,則密封劑的硬化物容易著色。因此,芳香族環氧樹脂的含量較佳為以對密封劑的黏度或硬化物的著色的影響小的程度來調整。Among them, if the sealant contains a large amount of bisphenol A-type epoxy resin or bisphenol F-type epoxy resin, its viscosity is likely to increase. In addition, if the sealant contains a large amount of aromatic epoxy resin, the cured product of the sealant will be easily colored. Therefore, the content of the aromatic epoxy resin is preferably adjusted to a level that has little effect on the viscosity of the sealant or the coloring of the cured product.
增感劑具有進一步提高所述(D)陽離子聚合起始劑的聚合起始效率並進一步促進密封劑的硬化反應的功能。增感劑的例子包含:2,4-二乙基硫雜蒽酮等硫雜蒽酮系化合物、或2,2-二甲氧基-1,2-二苯基乙烷-1-酮、二苯甲酮、2,4-二氯二苯甲酮、鄰苯甲醯基苯甲酸甲酯、4,4'-雙(二甲基胺基)二苯甲酮、4-苯甲醯基-4'-甲基二苯基硫醚、9,10-二丁氧基蒽等。密封劑可僅包含一種增感劑,亦可包含兩種以上。The sensitizer has the function of further improving the polymerization start efficiency of the (D) cationic polymerization initiator and further promoting the hardening reaction of the sealant. Examples of sensitizers include: thioxanthone-based compounds such as 2,4-diethylthioxanthone, or 2,2-dimethoxy-1,2-diphenylethan-1-one, Benzophenone, 2,4-dichlorobenzophenone, methyl o-benzoyl benzoate, 4,4'-bis(dimethylamino)benzophenone, 4-benzoyl benzoate -4'-methyldiphenyl sulfide, 9,10-dibutoxyanthracene, etc. The sealant may contain only one sensitizer or two or more sensitizers.
矽烷偶合劑提高密封劑與被密封物的接著性。矽烷偶合劑可設為具有環氧基、羧基、甲基丙烯醯基、異氰酸酯基等反應性基的矽烷化合物。此種矽烷化合物的例子包含:三甲氧基矽烷基苯甲酸、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三甲氧基矽烷、γ-異氰酸基丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等。密封劑可僅包含一種矽烷偶合劑,亦可包含兩種以上。Silane coupling agent improves the adhesion between the sealant and the object to be sealed. The silane coupling agent can be a silane compound having a reactive group such as an epoxy group, a carboxyl group, a methacryl group, or an isocyanate group. Examples of such silane compounds include: trimethoxysilyl benzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriethyloxysilane, vinyltrimethoxysilane, γ-isopropyltrimethoxysilane Cyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc. The sealant may contain only one type of silane coupling agent, or may contain two or more types.
調平劑提高密封劑的塗膜的平坦性。調平劑的例子包含矽酮系、丙烯酸系、氟系的調平劑。調平劑的市售品的例子包含:BYK-340、BYK-345(均為日本畢克化學(BYK Chemie Japan)公司製造),沙福隆(Surflon)S-611(AGC清美化學(AGC Seimi Chemical)公司製造)等。密封劑可僅包含一種調平劑,亦可包含兩種以上。Leveling agents improve the flatness of the sealant film. Examples of leveling agents include silicone-based, acrylic-based, and fluorine-based leveling agents. Examples of commercially available leveling agents include: BYK-340, BYK-345 (both manufactured by BYK Chemie Japan), Surflon S-611 (AGC Seimi Chemical) Co., Ltd.), etc. The sealant may contain only one leveling agent or two or more.
就抑制密封劑的揮發且降低對裝置的損傷的觀點而言,相對於密封劑的總質量,(E)其他成分的合計量較佳為20質量%以下,更佳為10質量%以下。From the viewpoint of suppressing volatilization of the sealant and reducing damage to the device, the total amount of (E) other components is preferably 20 mass% or less, more preferably 10 mass% or less, based on the total mass of the sealant.
·密封劑的物性 (黏度) 密封劑的利用E型黏度計於25℃、20 rpm下測定的黏度較佳為8 mPa·s~40 mPa·s,更佳為10 mPa·s~30 mPa·s,進而佳為11 mPa·s~28 mPa·s,最佳為11 mPa·s~25 mPa·s。若密封劑的黏度為所述範圍,則容易自噴墨裝置噴出密封劑。另外,塗佈後不會過度潤濕擴展,容易形成所需的厚度的硬化物(密封層)。·Physical properties of sealant (viscosity) The viscosity of the sealant measured at 25°C and 20 rpm using an E-type viscometer is preferably 8 mPa·s to 40 mPa·s, more preferably 10 mPa·s to 30 mPa·s, and even more preferably 11 mPa·s. s~28 mPa·s, the best is 11 mPa·s~25 mPa·s. If the viscosity of the sealant is within the above range, the sealant can be easily ejected from the inkjet device. In addition, it does not wet and expand excessively after coating, and it is easy to form a hardened material (sealing layer) of the required thickness.
(EPDM的膨潤率B) 相對於密封劑的乙烯-丙烯-二烯橡膠(EPDM)的膨潤率(以下,亦稱為EPDM膨潤率B)較佳為10.0%以下,更佳為9.5%以下,進而佳為9.0%以下。若EPDM膨潤率B為所述範圍內,則即便長期使用噴墨裝置塗佈密封劑,亦可抑制頭部等包含EPDM的零件的損傷。(Swelling rate of EPDM B) The swelling rate of ethylene-propylene-diene rubber (EPDM) with respect to the sealant (hereinafter also referred to as EPDM swelling rate B) is preferably 10.0% or less, more preferably 9.5% or less, and still more preferably 9.0% or less. If the EPDM swelling ratio B is within the above range, even if the sealant is applied using an inkjet device for a long period of time, damage to EPDM-containing parts such as the head can be suppressed.
該EPDM膨潤率為利用以下的方法測定的值。 準備重量0.56 g(W1 )的乙烯-丙烯-二烯橡膠(EPDM;日本谷大(Kakudai)股份有限公司製造的「水龍頭襯墊 9074」的)試驗片,保持該狀態而放入20 mL的褐色螺口管中,於其中添加密封劑10 g,浸漬EPDM試驗片。對螺口管蓋上蓋後,於40℃下放置一週。其後,自密封劑取出EPDM試驗片,並利用異丙醇(Isopropyl Alcohol,IPA)進行清洗,之後,對其表面利用破布進行擦拭,之後,測量重量(W2 )。基於下述式,並根據浸漬於密封劑後的EPDM試驗片的重量變化,計算EPDM膨潤率B。 EPDM膨潤率B=(W2 -W1 )/W1 ×100The EPDM swelling rate is a value measured by the following method. Prepare an ethylene-propylene-diene rubber (EPDM; "faucet gasket 9074" manufactured by Kakudai Co., Ltd.) test piece with a weight of 0.56 g (W 1 ), and put 20 mL of In a brown screw-top tube, add 10 g of sealant and immerse the EPDM test piece. Cap the screw-top tube and place it at 40°C for one week. Thereafter, the EPDM test piece was taken out from the sealant and washed with isopropyl alcohol (IPA). Then, the surface was wiped with a rag, and then the weight (W 2 ) was measured. Based on the following formula, the EPDM swelling rate B is calculated from the weight change of the EPDM test piece after being immersed in the sealant. EPDM swelling rate B=(W 2 -W 1 )/W 1 ×100
(介電常數) 對密封劑利用波長395 nm的UV-LED以照度1000 mW/cm2 、累計光量1500 mJ/cm2 進行硬化、進而於100℃下熱硬化30分鐘而成的硬化物的頻率100 kHz下的介電常數為3.10以下,較佳為3.00以下,更佳為2.90以下,進而佳為2.80以下。若硬化物的介電常數為3.0以下,則於藉由該硬化物(密封層)密封例如顯示元件時,硬化物的絕緣性充分高,可抑制顯示元件、與其他構件(例如,感測器等)的干涉。該介電常數可使用LCR計HP4284A(安捷倫科技(Agilent Technologies)公司製造)並利用自動平衡橋法進行測定。(Dielectric constant) The frequency of the cured product obtained by curing the sealant using UV-LED with a wavelength of 395 nm at an illumination intensity of 1000 mW/cm 2 and a cumulative light intensity of 1500 mJ/cm 2 and then thermally curing it at 100°C for 30 minutes. The dielectric constant at 100 kHz is 3.10 or less, preferably 3.00 or less, more preferably 2.90 or less, still more preferably 2.80 or less. If the dielectric constant of the hardened material is 3.0 or less, when a display element, for example, is sealed with the hardened material (sealing layer), the insulation of the hardened material is sufficiently high to prevent the display element from interfering with other components (for example, a sensor). etc.) interference. The dielectric constant can be measured using the LCR meter HP4284A (manufactured by Agilent Technologies) and the automatic balancing bridge method.
密封劑的硬化物的介電常數可藉由密封劑整體的氧含有率來調整。氧含有率較佳為設為30%以下,更佳為設為25%以下,進而佳為設為20%以下。密封劑整體的氧原子含有率可作為(密封劑中所含的氧原子的合計質量/密封劑的總質量)×100(%)來算出。密封劑中所含的氧原子的合計質量可藉由如下方式來算出:利用元素分析而算出氧原子的含有比例,並對其乘以氧原子的原子量。The dielectric constant of the hardened material of the sealant can be adjusted by the oxygen content of the entire sealant. The oxygen content is preferably 30% or less, more preferably 25% or less, still more preferably 20% or less. The oxygen atom content rate of the entire sealant can be calculated as (total mass of oxygen atoms contained in the sealant/total mass of the sealant) × 100 (%). The total mass of oxygen atoms contained in the sealant can be calculated by calculating the content ratio of oxygen atoms by elemental analysis and multiplying this by the atomic weight of oxygen atoms.
(光線透過率) 關於密封劑的硬化物的、厚度10 μm時的光線透過率,波長380 nm~800 nm下的光線透過率的平均值較佳為85%以上,更佳為90%以上。若密封劑的硬化物的光線透過率為所述範圍,則具有良好的光透過性,因此作為例如有機EL元件的面密封劑而適宜。平均光線透過率例如可使用紫外可見分光光度計(島津(SHIMADZU)公司製造)並作為波長380 nm~800 nm中針對波長每1 nm而測定的光線透過率的平均值來測定。(light transmittance) Regarding the light transmittance of the cured product of the sealant when the thickness is 10 μm, the average light transmittance at a wavelength of 380 nm to 800 nm is preferably 85% or more, more preferably 90% or more. When the light transmittance of the cured product of the sealing agent is within the above range, it has good light transmittance and is therefore suitable as a surface sealing agent for organic EL elements, for example. The average light transmittance can be measured, for example, using a UV-visible spectrophotometer (manufactured by SHIMADZU Corporation) as the average value of the light transmittance measured per wavelength of 1 nm in the wavelength range of 380 nm to 800 nm.
·密封劑的製備方法 密封劑可將所述成分混合、例如使用均質分散機、均質混合器、萬能混合器、行星式混合器、捏合機、三根輥等混合機進行混合而獲得。再者,就穩定地混合密封劑的觀點而言,更佳為於混合(D)陽離子聚合起始劑以外的成分後,混合(D)陽離子聚合起始劑。·Preparation method of sealant The sealant can be obtained by mixing the above ingredients using, for example, a mixer such as a homodisperser, a homomixer, a universal mixer, a planetary mixer, a kneader, and a three-roller. Furthermore, from the viewpoint of stably mixing the sealant, it is more preferred to mix the (D) cationic polymerization initiator after mixing the components other than the (D) cationic polymerization initiator.
·密封劑的用途 所述密封劑例如對於有機EL元件或LED元件、半導體元件、太陽電池元件等各種元件的密封而言適宜。其中,其用途並不限定於元件的面密封,例如亦可作為液晶顯示裝置的液晶密封劑等來使用。另外,特別是,因光透過性優異,因此作為顯示元件用的面密封劑而適宜。·Use of sealant The sealant is suitable for sealing various elements such as organic EL elements, LED elements, semiconductor elements, and solar cell elements. However, its use is not limited to surface sealing of elements, but may also be used as a liquid crystal sealing compound for a liquid crystal display device. In addition, in particular, since it has excellent light transmittance, it is suitable as a surface sealant for display elements.
2. 各種裝置的製造方法 以下,對使用所述密封劑對各種元件進行面密封的各種裝置的製造方法進行說明。其中,使用所述密封劑的裝置的製造方法並不限定於該方法。該各種裝置的製造方法只要包括1)準備元件的步驟、2)於該元件上塗佈所述密封劑並密封元件的步驟即可,亦可包括其他步驟。2. Manufacturing methods of various devices Hereinafter, methods of manufacturing various devices for surface sealing various components using the sealant will be described. However, the method of manufacturing a device using the sealant is not limited to this method. The manufacturing method of various devices only needs to include the steps of 1) preparing the component and 2) applying the sealant on the component and sealing the component, and may also include other steps.
1)步驟中,準備元件。元件通常配置於基板上。基板可為玻璃基板,亦可為樹脂基板。於獲得柔性顯示裝置的情況下,較佳為樹脂基板(樹脂膜)。1) In step 1, prepare the components. Components are usually arranged on a substrate. The substrate may be a glass substrate or a resin substrate. When obtaining a flexible display device, a resin substrate (resin film) is preferred.
另外,元件的種類並無特別限制,可為半導體元件等,較佳為將電轉換為光、或將光轉換為電的元件。此種元件的例子包含有機EL元件或LED元件、太陽電池元件等。其中,元件較佳為有機EL元件。於元件為有機EL元件的情況下,有機EL元件通常包含反射畫素電極層、有機EL層、以及透明相向電極層。再者,有機EL元件視需要亦可進而包含其他功能層。In addition, the type of the element is not particularly limited and may be a semiconductor element or the like. Preferably, it is an element that converts electricity into light or light into electricity. Examples of such elements include organic EL elements, LED elements, solar cell elements, and the like. Among them, the element is preferably an organic EL element. When the element is an organic EL element, the organic EL element usually includes a reflective pixel electrode layer, an organic EL layer, and a transparent counter electrode layer. Furthermore, the organic EL element may further include other functional layers if necessary.
2)步驟中,以覆蓋配置於基板上的元件的方式利用噴墨法塗佈所述密封劑。藉由利用噴墨法塗佈所述密封劑,可高速形成平坦性高、且厚度薄的塗膜。In step 2), the sealant is applied using an inkjet method so as to cover the components arranged on the substrate. By applying the sealant using an inkjet method, a coating film with high flatness and thin thickness can be formed at high speed.
其後,使塗佈於元件上的密封劑硬化而獲得硬化物層。密封劑的硬化較佳為光硬化。光硬化時可使用氙燈、碳弧燈等公知的光源。另外,照射量若為可使密封劑充分硬化的程度,則並無特別限制,例如,可以300 mJ/m2 ~3000 mJ/m2 的累計光量照射波長300 nm~400 nm的光。Thereafter, the sealant applied on the element is cured to obtain a cured material layer. The sealant is preferably cured by light. For light hardening, known light sources such as xenon lamps and carbon arc lamps can be used. In addition, the irradiation dose is not particularly limited as long as the sealant can be sufficiently hardened. For example, light with a wavelength of 300 nm to 400 nm can be irradiated with a cumulative light dose of 300 mJ/m 2 to 3000 mJ/m 2 .
另外,藉由在光硬化後實施熱硬化,亦可進一步降低硬化物的介電常數。關於光硬化後進而實施的熱硬化,就不會產生對元件的損傷地進一步提高硬化性的觀點而言,較佳為將加熱溫度設為50℃~120℃左右,加熱時間較佳為設為1分鐘~1小時。In addition, by performing thermal hardening after photohardening, the dielectric constant of the hardened product can be further reduced. Regarding thermal hardening performed after photohardening, from the viewpoint of further improving the curability without causing damage to the element, the heating temperature is preferably set to about 50°C to 120°C, and the heating time is preferably set to 1 minute to 1 hour.
關於密封劑的硬化物層(密封層)的厚度,只要可充分地密封元件、進而可製成平坦性高的膜即可,例如較佳為1 μm~20 μm,更佳為設為3 μm~10 μm。 [實施例]The thickness of the hardened material layer (sealing layer) of the sealant is sufficient as long as the element can be fully sealed and a film with high flatness can be formed. For example, 1 μm to 20 μm is preferred, and 3 μm is more preferred. ~10 μm. [Example]
以下,參照實施例來更詳細地說明本發明。並不由該些實施例來限定性地解釋本發明的範圍。Hereinafter, the present invention will be described in more detail with reference to Examples. The scope of the present invention is not limitedly interpreted by these examples.
1. 密封劑的材料 (A)具有兩個以上的乙基己基的脂環式環氧化合物 ·桑索賽澤(Sansocizer)E-PS(新日本理化股份有限公司製造,下述式所表示的環氧六氫鄰苯二甲酸二2-乙基己酯,分子量:410)1. Material of sealant (A) Alicyclic epoxy compound having two or more ethylhexyl groups ·Sansocizer E-PS (manufactured by Shin Nippon Rika Co., Ltd., epoxy hexahydrophthalate di-2-ethylhexyl represented by the following formula, molecular weight: 410)
[化5] [Chemistry 5]
(B)多官能氧雜環丁烷化合物 ·OXT-221(東亞合成股份有限公司製造,亞隆氧雜環丁烷(Arone Oxetane)OXT-221(下述式所表示的3-乙基-3{[(3-乙基氧雜環丁烷-3-基)甲氧基]甲基}氧雜環丁烷))(B) Multifunctional oxetane compounds ·OXT-221 (manufactured by Toagosei Co., Ltd., Arone Oxetane) OXT-221 (3-ethyl-3{[(3-ethyloxetane represented by the following formula Alk-3-yl)methoxy]methyl}oxetane))
[化6] [Chemical 6]
(C)單官能縮水甘油醚 ·m,p-CGE(阪本藥品工業股份有限公司製造, 間對甲苯酚基縮水甘油醚,環氧當量165 g/eq,黏度:7 mPa·s,EPDM膨潤率A:4.3%) ·ED-509S(艾迪科(ADEKA)股份有限公司製造,對第三丁基苯基縮水甘油醚,環氧當量206 g/eq,黏度:20 mPa·s,EPDM膨潤率A:1.2%) 再者,所述EPDM膨潤率A為如下值:除了代替密封劑而使用(C)單官能縮水甘油醚並將評價溫度設為25℃以外,與後述的EPDM膨潤率B同樣地進行測定而得的值。(C) Monofunctional glycidyl ether ·m,p-CGE (manufactured by Sakamoto Pharmaceutical Co., Ltd., m-p-cresol-based glycidyl ether, epoxy equivalent 165 g/eq, viscosity: 7 mPa·s, EPDM swelling rate A: 4.3%) ·ED-509S (manufactured by ADEKA Co., Ltd., p-tert-butylphenyl glycidyl ether, epoxy equivalent 206 g/eq, viscosity: 20 mPa·s, EPDM swelling rate A: 1.2%) In addition, the EPDM swelling rate A is a value measured in the same manner as the EPDM swelling rate B described below, except that (C) monofunctional glycidyl ether is used instead of the sealant and the evaluation temperature is 25°C. value.
·(D)陽離子聚合起始劑 ·CPI-210S(聖普羅(san-apro)公司製造,下述式所表示的二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽) [化7] X- :(Rf )n PF6-n - (Rf 為有機基,n為1~5的整數)·(D) Cationic polymerization initiator·CPI-210S (diphenyl-4-(phenylsulfanyl)phenylsonium hexafluorophosphate represented by the following formula manufactured by San-Apro Co., Ltd.) [ chemical 7] X - : (R f ) n PF 6-n - (R f is an organic group, n is an integer from 1 to 5)
(E)增感劑 ·UVS-1331(川崎化成工業公司製造,昂特拉固(Anthracure)UVS-1331(下述式所表示的9,10-二丁氧基蒽)) [化8] (E) Sensitizer UVS-1331 (Anthracure UVS-1331 (9,10-dibutoxyanthracene represented by the following formula) manufactured by Kawasaki Chemical Industry Co., Ltd.) [Chemical 8]
(F)環氧化脂肪酸酯 ·D-32:(艾迪科(ADEKA)股份有限公司製造,艾迪科依紮(Adekaiza)D-32(環氧化脂肪酸辛基酯),黏度:52 mPa·s) ·D-55:(艾迪科(ADEKA)股份有限公司製造,艾迪科依紮(Adekaiza)D-55(環氧化脂肪酸烷基酯),黏度:20 mPa·s)(F) Epoxidized fatty acid ester ·D-32: (manufactured by ADEKA Co., Ltd., Adekaiza D-32 (epoxidized fatty acid octyl ester), viscosity: 52 mPa·s) ·D-55: (manufactured by ADEKA Co., Ltd., Adekaiza D-55 (epoxidized fatty acid alkyl ester), viscosity: 20 mPa·s)
2. 密封劑的製備 以成為表1所示的組成的方式,將(A)具有兩個以上的乙基己基的脂環式環氧化合物、(B)多官能氧雜環丁烷化合物、(C)單官能縮水甘油醚、(E)增感劑、以及(F)環氧化脂肪酸酯放入燒瓶中,進行混合。於所獲得的混合物中放入表1所示的量的(D)陽離子聚合起始劑,進而進行混合。其後,進行攪拌,直至看不到粉狀物為止,獲得密封劑。再者,與表1中所示的各成分的組成相關的單位為質量份。2. Preparation of sealant (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a polyfunctional oxetane compound, and (C) a monofunctional glycidyl compound so as to have the composition shown in Table 1. Ether, (E) sensitizer, and (F) epoxidized fatty acid ester are put into a flask and mixed. The cationic polymerization initiator (D) in the amount shown in Table 1 was added to the obtained mixture and further mixed. Thereafter, the mixture is stirred until powdery matter is no longer visible, thereby obtaining a sealant. In addition, the unit related to the composition of each component shown in Table 1 is a mass part.
3. 評價 如以下般評價所獲得的密封劑的黏度、EPDM膨潤率B及介電常數。3. Evaluation The viscosity, EPDM swelling ratio B, and dielectric constant of the obtained sealant were evaluated as follows.
[黏度] 使用E型黏度計(博勒菲(BROOKFIELD)公司製造,LV-DV-II+),於25℃、20 rpm下測定所獲得的密封劑的黏度。另外,根據密封劑的塗佈中或塗佈後的情況,如以下般進行評價。 〇:可自噴墨裝置穩定地進行塗佈,且可製作所需的厚度的硬化物 ×:於噴墨的噴出時產生薄霧(mist)[viscosity] The viscosity of the obtained sealant was measured at 25°C and 20 rpm using an E-type viscometer (LV-DV-II+ manufactured by BROOKFIELD). In addition, evaluation was performed as follows depending on the situation during or after application of the sealant. 〇: Coating can be performed stably from an inkjet device, and a hardened product of the required thickness can be produced. ×: Mist is generated when inkjet is ejected
[EPDM膨潤率B] 準備重量0.5 g(W1 )的乙烯-丙烯-二烯橡膠(EPDM)試驗片,放入螺口管中,於其中添加所獲得的密封劑,浸漬EPDM試驗片。對螺口管蓋上蓋後,於40℃下放置一週。其後,自密封劑取出EPDM試驗片,對其表面利用破布進行擦拭,之後,測量重量(W2 )。基於下述式,並根據浸漬於密封劑後的EPDM試驗片的重量變化,計算EPDM膨潤率B。 EPDM膨潤率B=(W2 -W1 )/W1 ×100 進而,依照如下基準來評價EPDM膨潤率。 〇:EPDM膨潤率≦10% ×:EPDM膨潤率>10%[EPDM Swelling Rate B] Prepare an ethylene-propylene-diene rubber (EPDM) test piece with a weight of 0.5 g (W 1 ), place it in a screw-top tube, add the obtained sealant thereto, and immerse the EPDM test piece. Cap the screw-top tube and place it at 40°C for one week. Thereafter, the EPDM test piece was taken out from the sealant, its surface was wiped with a rag, and then the weight (W 2 ) was measured. Based on the following formula, the EPDM swelling rate B is calculated from the weight change of the EPDM test piece after being immersed in the sealant. EPDM swelling rate B=(W 2 -W 1 )/W 1 ×100 Furthermore, the EPDM swelling rate was evaluated based on the following criteria. 〇: EPDM swelling rate ≦10% ×: EPDM swelling rate > 10%
[介電常數] 將所獲得的密封劑導入噴墨盒DMC-11610(富士軟片德邁特克斯(Fuji Film Dimatix)公司製造)中。將該噴墨盒設置於噴墨裝置DMP-2831(富士軟片德邁特克斯(Fuji Film Dimatix)公司製造)中,進行噴出狀態的調整,之後,於在無鹼玻璃上以100 nm的厚度蒸鍍鋁而成的基板上,以硬化後的厚度為10 μm的方式以5 cm×5 cm的尺寸進行塗佈。將所獲得的塗膜於室溫(25℃)下放置1分鐘,之後,利用波長395 nm的UV-LED以照度1000 mW/cm2 、累計光量1500 mJ/cm2 進行硬化。將所獲得的硬化物設為「僅UV硬化」的硬化物。 其次,對「僅UV硬化」的硬化物施加100℃、30分鐘的熱硬化。將所獲得的硬化物設為「UV硬化+熱硬化」的硬化物 對於所獲得的各硬化物,於噴墨塗佈面上以100 nm的厚度蒸鍍鋁,並利用LCR計HP4284A(安捷倫科技(Agilent Technologies)公司製造)且利用自動平衡橋法以條件100 kHz測定介電常數。 進而,依照如下基準來評價介電常數。 〇:介電常數≦3.10 ×:介電常數>3.10[Dielectric constant] The obtained sealant was introduced into an inkjet cartridge DMC-11610 (manufactured by Fuji Film Dimatix). The inkjet cartridge was installed in an inkjet device DMP-2831 (manufactured by Fuji Film Dimatix), the ejection state was adjusted, and then the inkjet cartridge was printed on alkali-free glass with a thickness of 100 nm. On a substrate made of vapor-deposited aluminum, the coating is applied in a size of 5 cm × 5 cm so that the thickness after hardening is 10 μm. The obtained coating film was left at room temperature (25°C) for 1 minute, and then hardened using UV-LED with a wavelength of 395 nm at an illumination intensity of 1000 mW/cm 2 and a cumulative light amount of 1500 mJ/cm 2 . The obtained cured product was designated as a "UV-cured only" cured product. Next, the cured product of "UV curing only" was thermally cured at 100°C for 30 minutes. The obtained hardened product was designated as a "UV cured + thermal hardened" cured product. For each cured product obtained, aluminum was evaporated to a thickness of 100 nm on the inkjet coating surface, and an LCR meter HP4284A (Agilent Technologies) was used. (manufactured by Agilent Technologies) and the dielectric constant was measured using the automatic balanced bridge method at a condition of 100 kHz. Furthermore, the dielectric constant was evaluated based on the following standards. 〇: Dielectric constant ≦3.10 ×: Dielectric constant > 3.10
[表1]
如表1所示,包含(A)具有兩個以上的乙基己基的脂環式環氧化合物、(B)多官能氧雜環丁烷化合物、(C)單官能縮水甘油醚的實施例1及實施例2的密封劑無論(C)單官能縮水甘油醚的種類如何,黏度及EPDM膨潤率B的評價均良好,進而,UV硬化後的密封劑的介電常數亦為3.10以下而良好。另外,藉由在UV硬化後進行熱硬化,可進而降低介電常數。As shown in Table 1, Example 1 containing (A) an alicyclic epoxy compound having two or more ethylhexyl groups, (B) a polyfunctional oxetane compound, and (C) a monofunctional glycidyl ether Regardless of the type of the (C) monofunctional glycidyl ether, the sealant of Example 2 was evaluated favorably in terms of viscosity and EPDM swelling ratio B. Furthermore, the dielectric constant of the UV-cured sealant was also good at 3.10 or less. In addition, by performing thermal curing after UV curing, the dielectric constant can be further reduced.
另一方面,雖包含(A)具有兩個以上的乙基己基的脂環式環氧化合物但不含(B)多官能氧雜環丁烷化合物及(C)單官能縮水甘油醚的比較例1的密封劑的黏度超過40.0 mPa·s而非常高,無法進行利用噴墨裝置進行的塗佈。On the other hand, a comparative example containing (A) an alicyclic epoxy compound having two or more ethylhexyl groups but not containing (B) a polyfunctional oxetane compound and (C) a monofunctional glycidyl ether The viscosity of the sealant in 1 is very high, exceeding 40.0 mPa·s, and cannot be applied with an inkjet device.
另外,雖包含(B)多官能氧雜環丁烷化合物但不含(A)具有兩個以上的乙基己基的脂環式環氧化合物及(C)單官能縮水甘油醚的比較例2的密封劑的黏度為8 mPa·s以上且40 mPa·s以下的範圍內而良好,但EPDM膨潤率B超過10%而高。In addition, Comparative Example 2 which contains (B) a polyfunctional oxetane compound but does not contain (A) an alicyclic epoxy compound having two or more ethylhexyl groups and (C) a monofunctional glycidyl ether The viscosity of the sealant is good in the range of 8 mPa·s or more and 40 mPa·s or less, but the EPDM swelling rate B exceeds 10% and is high.
進而,雖包含(A)具有兩個以上的乙基己基的脂環式環氧化合物及(B)多官能氧雜環丁烷化合物但不含(C)單官能縮水甘油醚的比較例3的密封劑的黏度為8 mPa·s以上且40 mPa·s以下的範圍內而良好,但EPDM膨潤率B超過10%而高。同樣地,包含(B)多官能氧雜環丁烷化合物且代替(A)具有兩個以上的乙基己基的脂環式環氧化合物而包含(F)環氧化脂肪酸酯並且包含(C)單官能縮水甘油醚的比較例4及比較例5的密封劑的黏度為8 mPa·s以上且40 mPa·s以下的範圍內而良好,但EPDM膨潤率B超過10%而高。Furthermore, Comparative Example 3 which contains (A) an alicyclic epoxy compound having two or more ethylhexyl groups and (B) a polyfunctional oxetane compound but does not contain (C) a monofunctional glycidyl ether The viscosity of the sealant is good in the range of 8 mPa·s or more and 40 mPa·s or less, but the EPDM swelling rate B exceeds 10% and is high. Similarly, (B) a polyfunctional oxetane compound and (F) an epoxidized fatty acid ester are included instead of (A) an alicyclic epoxy compound having two or more ethylhexyl groups and (C) The viscosity of the sealants of Comparative Examples 4 and 5 of the monofunctional glycidyl ether is in the range of 8 mPa·s or more and 40 mPa·s or less, which is good, but the EPDM swelling rate B exceeds 10% and is high.
本申請案主張基於2018年8月31日提出申請的日本專利特願2018-163001的優先權。將該申請說明書中記載的內容全部引用至本申請案說明書中。 [產業上的可利用性]This application claims priority based on Japanese Patent Application No. 2018-163001, which was filed on August 31, 2018. All contents described in the application specification are incorporated into this application specification. [Industrial availability]
本發明的密封劑可抑制對噴墨裝置的噴墨頭部的損傷,因此,可利用噴墨法長期穩定地進行塗佈。另外,該密封劑的硬化物的介電常數亦低,因此,於利用該密封劑密封顯示元件的情況下,該顯示元件可與感測器等靠近配置,可製作薄型的顯示裝置、或設計自由度高的顯示裝置。The sealant of the present invention can suppress damage to the inkjet head of an inkjet device, and therefore can be applied stably over a long period of time by the inkjet method. In addition, the dielectric constant of the cured product of the sealant is also low. Therefore, when the sealant is used to seal a display element, the display element can be placed close to a sensor, etc., and a thin display device or design can be produced. A display device with a high degree of freedom.
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