TWI797344B - Sealant for display element and hardened product thereof - Google Patents

Sealant for display element and hardened product thereof Download PDF

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TWI797344B
TWI797344B TW108121328A TW108121328A TWI797344B TW I797344 B TWI797344 B TW I797344B TW 108121328 A TW108121328 A TW 108121328A TW 108121328 A TW108121328 A TW 108121328A TW I797344 B TWI797344 B TW I797344B
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sealant
compound
epoxy compound
oxygen atom
display elements
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TW108121328A
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TW202000844A (en
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白石巧充
岡部潤
山本祐五
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日商三井化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Abstract

本發明的顯示元件用密封劑包含:(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、(C)脂肪族環氧化合物(其中,與所述脂環式環氧化合物不同)及(D)陽離子聚合起始劑,所述(A)脂環式環氧化合物、所述(B)氧雜環丁烷化合物、及所述(C)脂肪族環氧化合物的重量平均分子量分別為180以上,且式(1)所表示的氧原子含有率分別為15%以上。氧原子含有率(%)=1分子中的氧原子的合計質量/重量平均分子量×100…(1)The sealant for display elements of the present invention contains: (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, (C) an aliphatic epoxy compound (wherein, with the The alicyclic epoxy compound is different) and (D) cationic polymerization initiator, the (A) alicyclic epoxy compound, the (B) oxetane compound, and the (C) fatty The weight-average molecular weights of the epoxy compounds are 180 or more, and the oxygen atom contents represented by the formula (1) are 15% or more. Oxygen atom content rate (%) = total mass of oxygen atoms in 1 molecule / weight average molecular weight × 100... (1)

Description

顯示元件用密封劑及其硬化物Sealant for display element and hardened product thereof

本發明是有關於一種顯示元件用密封劑及其硬化物。The present invention relates to a sealant for display elements and its hardened product.

近年來,使用有機電致發光元件(以下,稱為有機EL(electroluminescence)元件)等顯示元件的光半導體器件的開發得到進展。有機EL元件等顯示元件容易因大氣中的水分或氧而劣化。因此,有機EL元件等顯示元件通常由密封劑密封(面密封)而使用。In recent years, the development of optical semiconductor devices using display elements such as organic electroluminescent elements (hereinafter referred to as organic EL (electroluminescence) elements) has progressed. Display elements such as organic EL elements are easily degraded by moisture or oxygen in the air. Therefore, display elements such as organic EL elements are usually sealed with a sealant (surface seal) and used.

有機EL元件的面密封例如是藉由如下方法進行:於配置於基材上的有機EL元件上塗佈包含硬化性樹脂組成物的密封劑後,使該密封劑硬化。先前,密封劑的塗佈是利用網版印刷法來進行。另一方面,伴隨顯示器件的柔性化,而要求密封層的平坦化、薄膜化。伴隨於此,就可高速且均勻地形成平坦性高、且薄膜的密封層的觀點而言,研究有利用噴墨法進行密封劑的塗佈。The surface sealing of the organic EL element is performed, for example, by applying a sealant containing a curable resin composition on the organic EL element disposed on the substrate, and then curing the sealant. Conventionally, the coating of the sealant has been performed using a screen printing method. On the other hand, flattening and thinning of the sealing layer are required along with the flexibility of the display device. Along with this, from the viewpoint of being able to uniformly form a high-flatness, thin-film sealing layer at high speed, application of a sealing agent by an inkjet method has been studied.

關於利用噴墨法進行的塗佈中所使用的密封劑,為了自頭部的噴嘴穩定地噴出,而要求為低黏度。另外,要求抑制噴墨裝置的頭部分中所使用的接著劑或橡膠材料的膨潤,且對裝置的損傷(damage)少。The sealant used for coating by the inkjet method is required to have a low viscosity in order to be ejected stably from the nozzles of the head. In addition, it is required to suppress swelling of an adhesive or a rubber material used in a head portion of an inkjet device and reduce damage to the device.

作為此種利用噴墨法進行的塗佈中所使用的密封劑,提出有包含作為硬化性樹脂的特定的矽酮環氧化合物、及聚合起始劑的電子器件用密封劑(例如,專利文獻1)。該密封劑藉由包含矽酮環氧化合物,而不會過度提高黏度,並抑制噴墨裝置的頭部分的接著劑或橡膠材料的膨潤,且可減少對裝置的損傷。As a sealant used in coating by such an inkjet method, a sealant for electronic devices containing a specific silicone epoxy compound as a curable resin and a polymerization initiator has been proposed (for example, Patent Document 1). The sealant does not excessively increase the viscosity by containing the silicone epoxy compound, suppresses swelling of the adhesive or rubber material of the head portion of the inkjet device, and reduces damage to the device.

另外,作為有機EL元件的面密封劑,提出有包含苄基鋶鹽、及具有芳香族基的環氧樹脂或氧雜環丁烷樹脂的有機EL面密封用樹脂組成物(例如,專利文獻2)。 [現有技術文獻] [專利文獻]In addition, as a surface sealing agent for an organic EL element, a resin composition for organic EL surface sealing containing a benzyl cobaltium salt and an epoxy resin or an oxetane resin having an aromatic group has been proposed (for example, Patent Document 2 ). [Prior art literature] [Patent Document]

[專利文獻1]國際公開第2016/167347號公報 [專利文獻2]日本專利特開2016-108512號公報[Patent Document 1] International Publication No. 2016/167347 [Patent Document 2] Japanese Patent Laid-Open No. 2016-108512

[發明所欲解決之課題] 但是,專利文獻1中所示般的包含矽酮環氧化合物的密封劑存在硬化速度低(硬化性低)的問題。硬化性低的密封劑於被賦予至被塗佈物上後,在直至進行硬化的期間內於被塗佈物(顯示元件)上容易受到排斥,無法充分地進行調平,從而無法形成均勻的密封層。因此,要求不會損及硬化性且可減少對裝置的損傷。[Problem to be Solved by the Invention] However, the sealant containing a silicone epoxy compound as disclosed in Patent Document 1 has a problem of low curing speed (low curability). After the sealant with low curability is applied to the object to be coated, it is easy to be repelled on the object to be coated (display element) until it hardens, and cannot be sufficiently leveled to form a uniform sealant. Sealing layer. Therefore, it is required to reduce the damage to the device without impairing the hardenability.

另外,亦要求利用噴墨法進行的塗佈中使用的密封劑為低黏度。但是,專利文獻2中所示的密封劑的硬化性並不充分,而且黏度亦不充分低。In addition, the sealant used for coating by the inkjet method is also required to have a low viscosity. However, the sealant disclosed in Patent Document 2 is not sufficiently curable, and its viscosity is not sufficiently low.

本發明是鑑於所述情況而成者,目的在於提供一種顯示元件用密封劑及其硬化物,所述顯示元件用密封劑具有適合於利用噴墨法進行的塗佈的低的黏度、低的揮發性及高的硬化性,且對噴墨裝置的損傷少。 [解決課題之手段]The present invention is made in view of the above circumstances, and an object of the present invention is to provide a sealant for a display element having a low viscosity and a low Volatility and high curability, and less damage to inkjet devices. [Means to solve the problem]

[1] 一種顯示元件用密封劑,包含:(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、(C)脂肪族環氧化合物(其中,與所述脂環式環氧化合物不同)及(D)陽離子聚合起始劑,所述(A)脂環式環氧化合物、所述(B)氧雜環丁烷化合物、及所述(C)脂肪族環氧化合物的重量平均分子量分別為180以上,且下述式(1)所表示的氧原子含有率分別為15%以上, 氧原子含有率(%)=1分子中的氧原子的合計質量/重量平均分子量×100…(1)。 [2] 如[1]所述的顯示元件用密封劑,其中所述(C)脂肪族環氧化合物的含量比所述(A)脂環式環氧化合物的含量多。 [3] 如[1]或[2]所述的顯示元件用密封劑,其中所述(B)氧雜環丁烷化合物的含量比所述(C)脂肪族環氧化合物的含量多。 [4] 如[1]至[3]中任一項所述的顯示元件用密封劑,其中所述(A)脂環式環氧化合物、所述(B)氧雜環丁烷化合物、及所述(C)脂肪族環氧化合物分別為多官能化合物。 [5] 如[1]至[4]中任一項所述的顯示元件用密封劑,其中所述(A)脂環式環氧化合物、所述(B)氧雜環丁烷化合物、及所述(C)脂肪族環氧化合物中的一者以上具有羰基氧基。 [6] 如[1]至[5]中任一項所述的顯示元件用密封劑,其中利用E型黏度計於25℃、20 rpm的條件下測定的黏度為50 mPa·s以下。 [7] 如[1]至[6]中任一項所述的顯示元件用密封劑,其用於利用噴墨法進行的塗佈中。 [8] 如[1]至[7]中任一項所述的顯示元件用密封劑,其中將作為所述顯示元件的有機EL元件密封為面狀。 [9] 一種硬化物,其為如[1]至[8]中任一項所述的顯示元件用密封劑的硬化物。 [發明的效果][1] A sealant for display elements, comprising: (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, (C) an aliphatic epoxy compound (wherein, different from the alicyclic epoxy compound) and (D) a cationic polymerization initiator, the (A) alicyclic epoxy compound, the (B) oxetane compound, and the (C ) the weight average molecular weight of the aliphatic epoxy compound is 180 or more, and the oxygen atom content represented by the following formula (1) is 15% or more, Oxygen atom content rate (%)=total mass of oxygen atoms in 1 molecule/weight average molecular weight×100...(1). [2] The sealing compound for display elements according to [1], wherein the content of the (C) aliphatic epoxy compound is larger than the content of the (A) alicyclic epoxy compound. [3] The sealing agent for a display element according to [1] or [2], wherein the content of the (B) oxetane compound is larger than the content of the (C) aliphatic epoxy compound. [4] The sealant for a display element according to any one of [1] to [3], wherein the (A) alicyclic epoxy compound, the (B) oxetane compound, and The (C) aliphatic epoxy compounds are respectively polyfunctional compounds. [5] The sealant for a display element according to any one of [1] to [4], wherein the (A) alicyclic epoxy compound, the (B) oxetane compound, and One or more of the (C) aliphatic epoxy compounds have a carbonyloxy group. [6] The sealant for a display element according to any one of [1] to [5], wherein the viscosity measured with an E-type viscometer at 25° C. and 20 rpm is 50 mPa·s or less. [7] The sealing agent for a display element according to any one of [1] to [6], which is used for coating by an inkjet method. [8] The sealing compound for a display element according to any one of [1] to [7], wherein an organic EL element as the display element is sealed in a planar shape. [9] A cured product of the sealant for a display element according to any one of [1] to [8]. [Effect of the invention]

根據本發明,可提供一種顯示元件用密封劑及其硬化物,所述顯示元件用密封劑具有適合於利用噴墨法進行的塗佈的低黏度、低揮發性及良好的硬化性,且對噴墨裝置的損傷少。According to the present invention, there can be provided a sealant for a display element having low viscosity, low volatility, and good curability suitable for coating by an inkjet method, and a cured product thereof, and a cured product thereof. There is less damage to the inkjet device.

本發明者等人進行了努力研究,結果發現,藉由組合(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、及(C)脂肪族環氧化合物,並且將各成分的氧原子含有率與重量平均分子量分別設為一定以上,而可獲得具有低黏度、低揮發性及高硬化性且可減少對裝置的損傷的密封劑。The inventors of the present invention conducted diligent research and found that by combining (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, and (C) an alicyclic Oxygen compounds, and by setting the oxygen atom content and weight average molecular weight of each component to a certain level or more, a sealant having low viscosity, low volatility, and high curability and reducing damage to devices can be obtained.

其理由並未明瞭,但如以下般進行推測。首先,藉由組合(A)成分~(C)成分,可高度兼顧低黏度與高硬化性。另外,噴墨裝置的頭部分中所使用的接著劑或橡膠材料大多包含例如乙烯-丙烯-二烯單體(ethylene-propylene-diene monomer,EPDM)橡膠等極性低的材料。相對於此,藉由將(A)成分~(C)成分的氧原子含有率設為一定以上並提高極性,而使該些成分難以與噴墨裝置的頭部分中所使用的極性低的材料親和,並且難以膨潤,藉此可抑制該些材料的劣化。進而,藉由適度提高(A)成分~(C)成分的重量平均分子量,而可難以揮發。The reason for this is not clear, but it is presumed as follows. First, by combining components (A) to (C), both low viscosity and high curability can be achieved at a high level. In addition, many adhesives and rubber materials used in the head portion of the inkjet device include low-polarity materials such as ethylene-propylene-diene monomer (EPDM) rubber, for example. On the other hand, by setting the oxygen atom content of the (A) component to (C) component at a certain level or higher and increasing the polarity, it is difficult for these components to mix with a low-polarity material used in the head part of the inkjet device. Affinity, and difficult to swell, thereby suppressing the deterioration of these materials. Furthermore, it becomes hard to volatilize by raising moderately the weight average molecular weight of (A) component - (C)component.

藉此,本發明的密封劑可利用噴墨法而容易地塗佈。藉此,可高速且均勻地形成平坦性高且薄的硬化物層。本發明是基於該些見解而成者。Thereby, the sealing agent of this invention can be applied easily by the inkjet method. Thereby, a highly flat and thin hardened material layer can be formed uniformly at high speed. The present invention is based on these findings.

1. 顯示元件用密封劑 本發明的顯示元件用密封劑包含:(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、(C)脂肪族環氧化合物、及(D)陽離子聚合起始劑。1. Sealant for display elements The sealant for display elements of the present invention contains: (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, (C) an aliphatic epoxy compound, and (D) Cationic polymerization initiator.

<(A)具有環烯烴氧化物結構的脂環式環氧化合物> (A)具有環烯烴氧化物結構的脂環式環氧化合物可具有提高顯示元件用密封劑的硬化性的功能。(A)具有環烯烴氧化物結構的脂環式環氧化合物為具有環烯烴氧化物結構的化合物,並且是指重量平均分子量為180以上且下述式(1)所表示的氧原子含有率為15%以上的化合物。 氧原子含有率(%)=1分子中的氧原子的合計質量/重量平均分子量×100…(1)<(A) Alicyclic epoxy compound having cycloolefin oxide structure> (A) The alicyclic epoxy compound which has a cycloolefin oxide structure can have the function of improving the curability of the sealing compound for display elements. (A) The alicyclic epoxy compound having a cycloolefin oxide structure is a compound having a cycloolefin oxide structure, and means that the weight average molecular weight is 180 or more and the oxygen atom content represented by the following formula (1) is Compounds above 15%. Oxygen atom content rate (%) = total mass of oxygen atoms in 1 molecule / weight average molecular weight × 100... (1)

若(A)具有環烯烴氧化物結構的脂環式環氧化合物的重量平均分子量為180以上,則可降低該化合物的揮發性。因此,可減少利用噴墨法塗佈密封劑時的作業環境的惡化或對被塗佈物(顯示元件)的損傷。就所述觀點而言,(A)具有環烯烴氧化物結構的脂環式環氧化合物的重量平均分子量較佳為190以上,更佳為200以上。重量平均分子量的上限只要為不損及密封劑的利用噴墨法進行塗佈時的噴出性的程度即可,並無特別限制,例如進而佳為400以下。If the weight average molecular weight of the alicyclic epoxy compound (A) which has a cycloolefin oxide structure is 180 or more, the volatility of this compound can be reduced. Therefore, it is possible to reduce deterioration of the work environment and damage to the object to be coated (display element) when applying the sealant by the inkjet method. From these viewpoints, the weight average molecular weight of the (A) alicyclic epoxy compound having a cycloolefin oxide structure is preferably 190 or more, more preferably 200 or more. The upper limit of the weight average molecular weight is not particularly limited as long as it does not impair the dischargeability of the sealant when it is applied by an inkjet method, and is more preferably 400 or less, for example.

重量平均分子量可利用凝膠滲透層析法(gel permeation chromatography,GPC)並藉由聚苯乙烯換算來測定。管柱較佳為使用昭和電工(Shodex)公司製造的低分子用管柱GPC KF-801。另外,亦可根據化合物的結構式而算出。The weight average molecular weight can be measured in terms of polystyrene using gel permeation chromatography (GPC). As the column, GPC KF-801, a column for low molecular weight manufactured by Shodex, is preferably used. In addition, it can also be calculated from the structural formula of the compound.

若(A)具有環烯烴氧化物結構的脂環式環氧化合物的氧原子含有率為15%以上,則可提高該化合物的極性,因此,可難以與噴墨裝置的頭部分中所使用的極性低的接著劑或橡膠材料(例如,乙烯丙烯二烯橡膠等)親和,並且難以膨潤。藉此,可減少接著劑或橡膠材料的劣化(對裝置的損傷)。就所述觀點而言,氧原子含有率較佳為20%以上。氧原子含有率的上限值只要為所獲得的密封層的介電常數不會過於變大的程度即可,例如較佳為30%以下。(A) If the oxygen atom content of the alicyclic epoxy compound having a cycloolefin oxide structure is 15% or more, the polarity of the compound can be increased, so it can be difficult to mix with the Adhesives or rubber materials with low polarity (eg, ethylene propylene diene rubber, etc.) have affinity and are difficult to swell. Thereby, deterioration of the adhesive or rubber material (damage to the device) can be reduced. From this point of view, the oxygen atom content is preferably 20% or more. The upper limit of the oxygen atom content may be such that the dielectric constant of the obtained sealing layer does not increase too much, for example, it is preferably 30% or less.

(A)具有環烯烴氧化物結構的脂環式環氧化合物的1分子中的氧原子的合計質量可利用氣相層析-質譜(gas chromatography-mass spectrometry,GC-MS)法、核磁共振(Nuclear Magnetic Resonance,NMR)法等確定該脂環式環氧化合物的結構,且確定該化合物的1分子中的氧原子的數量,並對其乘以氧原子的原子量而算出。而且,(A)具有環烯烴氧化物結構的脂環式環氧化合物的氧原子含有率可將獲得的氧原子的合計質量與利用所述GPC法測定的重量平均分子量套用於所述式(1)中來算出。(A) The total mass of the oxygen atoms in one molecule of the alicyclic epoxy compound having a cycloolefin oxide structure can be determined by gas chromatography-mass spectrometry (GC-MS), nuclear magnetic resonance ( The structure of the alicyclic epoxy compound is determined by the Nuclear Magnetic Resonance (NMR) method, etc., and the number of oxygen atoms in one molecule of the compound is determined, and multiplied by the atomic weight of the oxygen atom to calculate. Furthermore, (A) the oxygen atom content of the alicyclic epoxy compound having a cycloolefin oxide structure can be applied to the formula (1 ) to calculate.

(A)具有環烯烴氧化物結構的脂環式環氧化合物的氧原子含有率例如可藉由1分子中的環烯烴氧化物結構的數量、或具有氧原子的連結基(例如,-CO-(羰基)、-O-CO-O-(碳酸酯基)、-COO-(羰基氧基或酯基)、-O-(醚基)、-CONH-(醯胺基)等)的數量來調整。即,為了提高氧原子含有率,較佳為將1分子中的環烯烴氧化物結構的數量設為2以上,或者導入具有氧原子的連結基。(A) The oxygen atom content of an alicyclic epoxy compound having a cycloolefin oxide structure can be determined by, for example, the number of cycloolefin oxide structures in one molecule, or a linking group having an oxygen atom (for example, -CO- (carbonyl group), -O-CO-O-(carbonate group), -COO-(carbonyloxy or ester group), -O-(ether group), -CONH-(amide group), etc.) Adjustment. That is, in order to increase the oxygen atom content, it is preferable to set the number of cycloolefin oxide structures in 1 molecule to 2 or more, or to introduce a linking group having an oxygen atom.

所謂此種(A)具有環烯烴氧化物結構的脂環式環氧化合物中的、環烯烴氧化物結構,是指利用過氧化物等氧化劑對環烯烴進行環氧化而獲得的結構,為包含構成脂肪族環的鄰接的兩個碳原子與氧原子的環氧基。環烯烴氧化物的例子包含環己烯氧化物、或環戊烯氧化物,較佳為環己烯氧化物。The so-called (A) cycloalkene oxide structure in the alicyclic epoxy compound having a cycloalkene oxide structure refers to a structure obtained by epoxidizing a cycloalkene with an oxidizing agent such as a peroxide. An epoxy group consisting of two adjacent carbon atoms and an oxygen atom in an aliphatic ring. Examples of cycloalkene oxides include cyclohexene oxide, or cyclopentene oxide, preferably cyclohexene oxide.

(A)具有環烯烴氧化物結構的脂環式環氧化合物的1分子中的環烯烴氧化物結構的數量可為一個(單官能),亦可為兩個以上(多官能)。其中,就容易提高氧原子含有率且透明性或耐熱性、耐光性等亦優異的方面而言,(A)具有環烯烴氧化物結構的脂環式環氧化合物的1分子中的環烯烴氧化物結構的數量較佳為兩個以上(多官能)。(A) The number of cycloolefin oxide structures in one molecule of the alicyclic epoxy compound having a cycloolefin oxide structure may be one (monofunctional) or two or more (polyfunctional). Among them, from the viewpoint of being easy to increase the oxygen atom content and being excellent in transparency, heat resistance, and light resistance, (A) cycloolefin oxidation in one molecule of an alicyclic epoxy compound having a cycloolefin oxide structure The number of object structures is preferably two or more (multifunctional).

即,(A)具有環烯烴氧化物結構的脂環式環氧化合物例如較佳為下述式(A-1)所表示的化合物。That is, the (A) alicyclic epoxy compound having a cycloolefin oxide structure is preferably, for example, a compound represented by the following formula (A-1).

[化1]

Figure 02_image001
…式(A-1)[chemical 1]
Figure 02_image001
...Formula (A-1)

式(A-1)的X為單鍵或連結基。其中,X是以式(A-1)所表示的化合物的重量平均分子量及氧原子含有率滿足所述範圍的方式進行選擇。連結基可為二價烴基、羰基、醚基(醚鍵)、硫醚基(硫醚鍵)、酯基(酯鍵)、碳酸酯基(碳酸酯鍵)、醯胺基(醯胺鍵)、或將該些的多個連結而成的基。X in formula (A-1) is a single bond or a linking group. However, X is selected so that the weight average molecular weight and oxygen atom content rate of the compound represented by formula (A-1) satisfy the said range. The linking group can be divalent hydrocarbon group, carbonyl group, ether group (ether bond), thioether group (thioether bond), ester group (ester bond), carbonate group (carbonate bond), amide group (amide bond) , or a base formed by connecting a plurality of these.

二價烴基可為碳原子數為1~18的伸烷基、或二價脂環式烴基。碳原子數為1~18的伸烷基的例子包含:亞甲基、甲基亞甲基、二甲基亞甲基、伸乙基、伸丙基、三亞甲基。二價脂環式烴基的例子包含:1,2-伸環戊基、1,3-伸環戊基、亞環戊基、1,2-伸環己基、1,3-伸環己基、1,4-伸環己基、亞環己基等二價伸環烷基(包含亞環烷基)。The divalent hydrocarbon group may be an alkylene group having 1 to 18 carbon atoms, or a divalent alicyclic hydrocarbon group. Examples of the alkylene group having 1 to 18 carbon atoms include methylene, methylmethylene, dimethylmethylene, ethylylene, propylylene and trimethylene. Examples of divalent alicyclic hydrocarbon groups include: 1,2-cyclopentyl, 1,3-cyclopentyl, cyclopentylene, 1,2-cyclohexyl, 1,3-cyclohexyl, 1 , 4-cyclohexylene, cyclohexylene and other divalent cycloalkylene groups (including cycloalkylene groups).

其中,X較佳為單鍵、或具有氧原子的連結基。具有氧原子的連結基更佳為-CO-(羰基)、-O-CO-O-(碳酸酯基)、-COO-(酯基)、-O-(醚基)、-CONH-(醯胺基)、將該些基的多個連結而成的基、或者該些基的一個以上與二價烴基的一個以上連結而成的基。Among them, X is preferably a single bond or a linking group having an oxygen atom. The linking group with an oxygen atom is more preferably -CO- (carbonyl), -O-CO-O- (carbonate group), -COO- (ester group), -O- (ether group), -CONH- (acyl group) amino group), a group in which a plurality of these groups are connected, or a group in which one or more of these groups are connected to one or more divalent hydrocarbon groups.

式(A-1)所表示的脂環式環氧化合物的例子包含以下的化合物。再者,下述式中,l為1~10的整數,m為1~30的整數,R為碳原子數1~8的伸烷基,較佳為亞甲基、伸乙基、伸丙基、伸異丙基等碳原子數1~3的伸烷基。n1及n2分別為1~30的整數。Examples of the alicyclic epoxy compound represented by formula (A-1) include the following compounds. Furthermore, in the following formulae, l is an integer of 1 to 10, m is an integer of 1 to 30, and R is an alkylene group with 1 to 8 carbon atoms, preferably methylene, ethylene, or propylene An alkylene group having 1 to 3 carbon atoms such as an isopropyl group and an isopropyl group. n1 and n2 are integers of 1-30, respectively.

[化2]

Figure 02_image003
[Chem 2]
Figure 02_image003

(A)具有環烯烴氧化物結構的脂環式環氧化合物的市售品的例子包含賽羅西德(Celloxide)2021P、賽羅西德(Celloxide)2081、賽羅西德(Celloxide)8000(大賽璐(Daicel)公司製造)等。(A) Commercially available examples of alicyclic epoxy compounds having a cycloolefin oxide structure include Celloxide 2021P, Celloxide 2081, and Celloxide 8000 ( Daicel (manufactured by Daicel), etc.

(A)具有環烯烴氧化物結構的脂環式環氧化合物的含量相對於密封劑的總質量而較佳為10質量%~70質量%。若(A)具有環烯烴氧化物結構的脂環式環氧化合物的含量為10質量%以上,則容易充分提高硬化性,若為70質量%以下,則難以損及硬化物的柔軟性或密接性。就所述觀點而言,(A)具有環烯烴氧化物結構的脂環式環氧化合物的含量相對於密封劑的總質量而更佳為10質量%~50質量%,進而佳為10質量%~30質量%。(A) It is preferable that content of the alicyclic epoxy compound which has a cycloolefin oxide structure is 10 mass % - 70 mass % with respect to the gross mass of a sealant. (A) When the content of the alicyclic epoxy compound having a cycloolefin oxide structure is 10% by mass or more, it is easy to sufficiently improve the curability, and when it is 70% by mass or less, it is difficult to impair the flexibility or adhesion of the cured product. sex. From this point of view, the (A) content of the alicyclic epoxy compound having a cycloolefin oxide structure is more preferably 10% by mass to 50% by mass, more preferably 10% by mass, based on the total mass of the sealant ~30% by mass.

<(B)氧雜環丁烷化合物> (B)氧雜環丁烷化合物可具有使密封劑為低黏度並且提高硬化性的功能。(B)氧雜環丁烷化合物為具有氧雜環丁基的化合物,並且是指重量平均分子量為180以上且所述式(1)所表示的氧原子含有率為15%以上的化合物。<(B) Oxetane compound> (B) The oxetane compound may have a function of making the sealant low in viscosity and improving hardenability. (B) The oxetane compound is a compound having an oxetanyl group, and refers to a compound having a weight average molecular weight of 180 or more and an oxygen atom content represented by the above formula (1) of 15% or more.

若(B)氧雜環丁烷化合物的重量平均分子量為180以上,則與所述同樣地,可降低該化合物的揮發性。因此,可減少利用噴墨法塗佈密封劑時的作業環境的惡化或對被塗佈物(顯示元件)的損傷。就降低密封劑的揮發性的觀點而言,(B)氧雜環丁烷化合物的重量平均分子量較佳為190以上,更佳為200以上。重量平均分子量的上限只要為不損及密封劑的利用噴墨法進行塗佈時的噴出性的程度即可,例如進而佳為400以下。重量平均分子量可利用與所述相同的方法測定。If the weight average molecular weight of the (B) oxetane compound is 180 or more, the volatility of the compound can be reduced in the same manner as above. Therefore, it is possible to reduce deterioration of the work environment and damage to the object to be coated (display element) when applying the sealant by the inkjet method. From the viewpoint of reducing the volatility of the sealant, the weight average molecular weight of the (B) oxetane compound is preferably 190 or more, more preferably 200 or more. The upper limit of the weight average molecular weight should just be the level which does not impair the dischargeability of the sealant when it applies by the inkjet method, For example, it is more preferably 400 or less. The weight average molecular weight can be measured by the same method as mentioned above.

若(B)氧雜環丁烷化合物的氧原子含有率為15%以上,則與所述同樣地,可提高該化合物的極性,因此,可減少噴墨裝置的頭部分中所使用的極性低的接著劑等的劣化(對裝置的損傷)。就減少對裝置的損傷的觀點而言,(B)氧雜環丁烷化合物的氧原子含有率較佳為20%以上。就密封層的介電常數不會過於變大的觀點而言,氧原子含有率例如較佳為30%以下。氧原子含有率可與所述同樣地進行定義及測定。If the oxygen atom content of the (B) oxetane compound is 15% or more, the polarity of the compound can be increased in the same manner as described above, so that the polarity of the compound used in the head part of the inkjet device can be reduced. Deterioration of the adhesive, etc. (damage to the device). From the viewpoint of reducing damage to the device, the oxygen atom content of the (B) oxetane compound is preferably 20% or more. From the viewpoint that the dielectric constant of the sealing layer does not increase too much, the oxygen atom content is preferably, for example, 30% or less. The oxygen atom content can be defined and measured in the same manner as above.

為了提高(B)氧雜環丁烷化合物的氧原子含有率,例如只要增多該化合物的1分子中的氧雜環丁基的數量、含氧原子的基(例如,後述的式(B-1)的R2 所表示的聚氧伸烷基、或R2 中所含的氧原子、或者羰基或磺醯基等含氧原子的基的數量即可。In order to increase the oxygen atom content of the (B) oxetane compound, for example, the number of oxetanyl groups in one molecule of the compound, the group containing an oxygen atom (for example, the formula (B-1 ) The polyoxyalkylene group represented by R2 , or the oxygen atom contained in R2 , or the number of oxygen-atom-containing groups such as carbonyl or sulfonyl group is sufficient.

此種(B)氧雜環丁烷化合物的1分子中的氧雜環丁基的數量可為一個(單官能),亦可為兩個以上(多官能)。其中,就容易提高氧原子含有率、容易提高硬化性的觀點等而言,較佳為兩個以上(多官能)。The number of oxetanyl groups in one molecule of such (B) oxetane compound may be one (monofunctional), or two or more (polyfunctional). Among them, two or more are preferable (polyfunctional) from the viewpoints of easily increasing the oxygen atom content and improving curability.

(B)氧雜環丁烷化合物較佳為下述式(B-1)或式(B-2)所表示的化合物。(B) The oxetane compound is preferably a compound represented by the following formula (B-1) or formula (B-2).

[化3]

Figure 02_image005
…式(B-1)
Figure 02_image007
…式(B-2)[Chem 3]
Figure 02_image005
...Type (B-1)
Figure 02_image007
...Type (B-2)

式(B-1)及式(B-2)的R1 分別為氫原子、碳原子數1~6的烷基、烯丙基、芳基、芳烷基、呋喃基或噻吩基。R2 分別為二價有機殘基。其中,R1 及R2 是以式(B-1)及式(B-2)所表示的化合物的重量平均分子量及氧原子含有率滿足所述範圍的方式進行選擇。R 1 of formula (B-1) and formula (B-2) is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an allyl group, an aryl group, an aralkyl group, a furyl group or a thienyl group, respectively. R 2 are respectively divalent organic residues. Among them, R 1 and R 2 are selected so that the weight average molecular weight and oxygen atom content of the compounds represented by formula (B-1) and formula (B-2) satisfy the above-mentioned range.

碳原子數1~6的烷基的例子包含:甲基、乙基、丙基、丁基、戊基、己基、環己基。芳基的例子包含:苯基、萘基、甲苯基、二甲苯基。芳烷基的例子包含苄基、苯乙基。Examples of the alkyl group having 1 to 6 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, and cyclohexyl. Examples of aryl groups include: phenyl, naphthyl, tolyl, xylyl. Examples of aralkyl groups include benzyl, phenethyl.

二價有機殘基的例子包含:伸烷基、聚氧伸烷基、伸苯基、伸二甲苯基、下述式所表示的結構。 [化4]

Figure 02_image009
Figure 02_image011
Examples of divalent organic residues include alkylene groups, polyoxyalkylene groups, phenylene groups, xylylene groups, and structures represented by the following formulae. [chemical 4]
Figure 02_image009
,
Figure 02_image011

式中的R3 為氧原子、硫原子、-CH2 -、-NH-、-SO-、-SO2 -、-C(CF3 )2 -或-C(CH3 )2 -。In the formula, R 3 is an oxygen atom, a sulfur atom, -CH 2 -, -NH-, -SO-, -SO 2 -, -C(CF 3 ) 2 - or -C(CH 3 ) 2 -.

R4 為碳原子數1~6的伸烷基或伸芳基。伸烷基的例子包含:亞甲基、伸乙基、伸丙基、伸丁基、伸環己基等碳原子數1~15的伸烷基。聚氧伸烷基較佳為碳原子數為4~30、較佳為4~8的聚氧伸烷基,其例子包含聚氧伸乙基、聚氧伸丙基。R 4 is an alkylene or arylylene group having 1 to 6 carbon atoms. Examples of the alkylene group include an alkylene group having 1 to 15 carbon atoms, such as a methylene group, an ethylidene group, a propylidene group, a butylene group, and a cyclohexylene group. The polyoxyalkylene group is preferably a polyoxyalkylene group having 4 to 30 carbon atoms, preferably 4 to 8, and examples thereof include polyoxyethylene groups and polyoxypropylene groups.

(B)氧雜環丁烷化合物的含量相對於密封劑的總質量而較佳為20質量%~80質量%。若(B)氧雜環丁烷化合物的含量為20質量%以上,則容易充分降低密封劑的黏度並且容易提高硬化性,若為80質量%以下,則容易抑制(A)成分或(C)成分過於變少而導致的硬化性降低。就所述觀點而言,(B)氧雜環丁烷化合物的含量相對於密封劑的總質量而更佳為25質量%~80質量%,進而佳為30質量%~70質量%。(B) It is preferable that content of an oxetane compound is 20 mass % - 80 mass % with respect to the gross mass of a sealing agent. When the content of the (B) oxetane compound is 20% by mass or more, it is easy to sufficiently reduce the viscosity of the sealant and improve the hardenability, and if it is 80% by mass or less, it is easy to suppress (A) component or (C) Decreased curability due to excessive reduction of components. From such viewpoints, the content of the (B) oxetane compound is more preferably from 25% by mass to 80% by mass, more preferably from 30% by mass to 70% by mass, based on the total mass of the sealant.

<(C)脂肪族環氧化合物> (C)脂肪族環氧化合物可具有容易使密封劑為低黏度且提高硬化物的柔軟性或密接性的功能。(C)脂肪族環氧化合物為不具有芳香環的脂肪族醇(包含多元醇)的縮水甘油醚,並且是指重量平均分子量為180以上且所述式(1)所表示的氧原子含有率為15%以上的化合物。<(C) Aliphatic epoxy compound> (C) The aliphatic epoxy compound can easily make the sealant low-viscosity and improve the flexibility or adhesiveness of the cured product. (C) The aliphatic epoxy compound is a glycidyl ether of an aliphatic alcohol (including polyhydric alcohol) not having an aromatic ring, and refers to a weight average molecular weight of 180 or more and an oxygen atom content represented by the above formula (1) For more than 15% of the compound.

若(C)脂肪族環氧化合物的重量平均分子量為180以上,則與所述同樣地,可降低該化合物的揮發性。因此,可減少利用噴墨法塗佈密封劑時的作業環境的惡化或對被塗佈物(顯示元件)的損傷。就進一步降低密封劑的揮發性的觀點而言,(C)脂肪族環氧化合物的重量平均分子量較佳為190以上,更佳為200以上。重量平均分子量的上限只要為不損及密封劑的利用噴墨法進行塗佈時的噴出性的程度即可,例如進而佳為400以下。重量平均分子量可利用與所述相同的方法測定。If the weight average molecular weight of (C) aliphatic epoxy compound is 180 or more, the volatility of this compound can be reduced similarly to the above. Therefore, it is possible to reduce deterioration of the work environment and damage to the object to be coated (display element) when applying the sealant by the inkjet method. From the viewpoint of further reducing the volatility of the sealant, the weight average molecular weight of the (C) aliphatic epoxy compound is preferably 190 or more, more preferably 200 or more. The upper limit of the weight average molecular weight should just be the level which does not impair the dischargeability of the sealant when it applies by the inkjet method, For example, it is more preferably 400 or less. The weight average molecular weight can be measured by the same method as mentioned above.

若(C)脂肪族環氧化合物的氧原子含有率為15%以上,則與所述同樣地,可提高該化合物的極性,因此,可減少噴墨裝置的頭部分中所使用的極性低的接著劑等的劣化(對裝置的損傷)。就進一步減少對裝置的損傷的觀點而言,(C)脂肪族環氧化合物的氧原子含有率較佳為20%以上。就不會使密封層的介電常數過於大的觀點而言,氧原子含有率例如較佳為30%以下。氧原子含有率可與所述同樣地進行定義及測定。If the oxygen atom content of the (C) aliphatic epoxy compound is 15% or more, the polarity of the compound can be increased in the same manner as described above, so that the number of low-polarity components used in the head portion of the inkjet device can be reduced. Deterioration of adhesives, etc. (damage to the device). From the viewpoint of further reducing damage to the device, the oxygen atom content of the (C) aliphatic epoxy compound is preferably 20% or more. From the viewpoint of not increasing the dielectric constant of the sealing layer too much, the oxygen atom content is preferably, for example, 30% or less. The oxygen atom content can be defined and measured in the same manner as above.

為了提高(C)脂肪族環氧化合物的氧原子含有率,例如只要增多該化合物的1分子中的環氧基的數量、含氧原子的基(例如,聚氧伸烷基等)的數量即可。In order to increase the oxygen atom content of the (C) aliphatic epoxy compound, for example, the number of epoxy groups and the number of oxygen atom-containing groups (for example, polyoxyalkylene groups, etc.) in one molecule of the compound can be increased. Can.

如上所述,此種(C)脂肪族環氧化合物為不具有芳香環的脂肪族醇(包含多元醇)的縮水甘油醚。脂肪族醇(包含脂肪族多元醇)可為鏈狀,亦可為環狀。其中,(C)脂肪族環氧化合物並不具有環烯烴氧化物結構。其中,就更容易使密封劑為低黏度的觀點而言,脂肪族醇(包含脂肪族多元醇)較佳為鏈狀。Such (C) aliphatic epoxy compounds are glycidyl ethers of aliphatic alcohols (including polyhydric alcohols) not having an aromatic ring as described above. Aliphatic alcohols (including aliphatic polyhydric alcohols) may be chain or cyclic. Among them, the (C) aliphatic epoxy compound does not have a cycloolefin oxide structure. Among these, aliphatic alcohols (including aliphatic polyhydric alcohols) are preferably chain-like from the viewpoint of making the sealing agent more easily low-viscosity.

(C)脂肪族環氧化合物的1分子中的環氧基的數量可為一個(單官能),亦可為兩個以上(多官能)。其中,就容易提高氧原子含有率、容易提高硬化性的觀點等而言,較佳為兩個以上(多官能)。(C) The number of epoxy groups in one molecule of the aliphatic epoxy compound may be one (monofunctional) or two or more (polyfunctional). Among them, two or more are preferable (polyfunctional) from the viewpoints of easily increasing the oxygen atom content and improving curability.

即,(C)脂肪族環氧化合物較佳為脂肪族多元醇或其環氧烷加成物的聚縮水甘油醚,更佳為烷烴二醇或其環氧烷加成物的二縮水甘油醚。That is, (C) the aliphatic epoxy compound is preferably polyglycidyl ether of aliphatic polyhydric alcohol or its alkylene oxide adduct, more preferably diglycidyl ether of alkanediol or its alkylene oxide adduct .

(C)脂肪族環氧化合物的例子包含:1,4-丁二醇二縮水甘油醚、新戊二醇二縮水甘油醚及1,6-己二醇二縮水甘油醚等碳原子數4~6的烷烴二醇的二縮水甘油醚;甘油、三羥甲基丙烷等三縮水甘油醚;山梨糖醇的四縮水甘油醚;二季戊四醇的六縮水甘油醚;聚乙二醇或聚丙二醇等二縮水甘油醚;丙二醇或三羥甲基丙烷等環氧烷加成物(聚醚多元醇)的聚縮水甘油醚中的、重量平均分子量及氧原子含有率滿足所述範圍者。市售品的例子包含:SR-PG、SR-2EGS、SR-8EGS、SR-14BJ、SY-25L(阪本藥品工業公司製造),艾博高賽(Epogosey)2EH、艾博高賽(Epogosey)HD(D)、艾博高賽(Epogosey)NPG(D)、艾博高賽(Epogosey)BD(D)(四日市合成公司製造),代那科(Denacol)EX-121、代那科(Denacol)EX-212L、代那科(Denacol)EX-214L(長瀨化成(Nagase ChemteX)公司製造)。(C) Examples of aliphatic epoxy compounds include: 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and 1,6-hexanediol diglycidyl ether, etc. Diglycidyl ether of alkane diol; triglycidyl ether of glycerin and trimethylolpropane; tetraglycidyl ether of sorbitol; hexaglycidyl ether of dipentaerythritol; Glycidyl ether; a polyglycidyl ether of an alkylene oxide adduct (polyether polyol) such as propylene glycol or trimethylolpropane, in which the weight average molecular weight and oxygen atom content satisfy the above-mentioned ranges. Examples of commercially available products include: SR-PG, SR-2EGS, SR-8EGS, SR-14BJ, SY-25L (manufactured by Sakamoto Pharmaceutical Co., Ltd.), Epogosey 2EH, Epogosey HD (D), Epogosey NPG (D), Epogosey BD (D) (manufactured by Yokkaichi Gosei Co., Ltd.), Denacol EX-121, Denacol ) EX-212L, Denacol EX-214L (manufactured by Nagase ChemteX).

(C)脂肪族環氧化合物的含量相對於密封劑的總質量而較佳為5質量%~60質量%。若(C)脂肪族環氧化合物的含量為5質量%以上,則容易充分降低密封劑的黏度並且容易對硬化物充分地賦予柔軟性或密接性,若為60質量%以下,則難以損及硬化性。就所述觀點而言,(C)脂肪族環氧化合物的含量相對於密封劑的總質量而更佳為5質量%~50質量%,進而佳為10質量%~40質量%。(C) It is preferable that content of an aliphatic epoxy compound is 5 mass % - 60 mass % with respect to the gross mass of a sealing agent. When the content of the (C) aliphatic epoxy compound is 5% by mass or more, it is easy to sufficiently reduce the viscosity of the sealant and to provide sufficient flexibility or adhesiveness to the cured product. If it is 60% by mass or less, it is difficult to damage sclerosis. From such viewpoints, the content of the (C) aliphatic epoxy compound is more preferably from 5% by mass to 50% by mass, more preferably from 10% by mass to 40% by mass, relative to the total mass of the sealant.

如此,藉由組合(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、及(C)脂肪族環氧化合物,不會過度提高密封劑的揮發性且可設為充分低的黏度,可有效地提高硬化性。另外,難以使噴墨裝置的頭部分的橡膠材料等膨潤,並可減少對噴墨裝置的損傷。In this way, by combining (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, and (C) an aliphatic epoxy compound, the volatilization of the sealant will not be excessively increased. Viscosity can be set to sufficiently low, which can effectively improve hardenability. In addition, it is difficult to swell the rubber material and the like of the head portion of the inkjet device, and damage to the inkjet device can be reduced.

(C)脂肪族環氧化合物的含量較佳為比(A)具有環烯烴氧化物結構的脂環式環氧化合物的含量多。具體而言,(C)脂肪族環氧化合物相對於(A)具有環烯烴氧化物結構的脂環式環氧化合物的含有比率(C/A)較佳為0.5~1.5。藉此,可將密封劑設為充分低的黏度並且可進一步提高硬化物的柔軟性或密接性。(C) The content of the aliphatic epoxy compound is preferably larger than the content of the (A) alicyclic epoxy compound having a cycloolefin oxide structure. Specifically, the content ratio (C/A) of the (C) aliphatic epoxy compound to the (A) alicyclic epoxy compound having a cycloolefin oxide structure is preferably from 0.5 to 1.5. Thereby, the sealant can have a sufficiently low viscosity, and the flexibility and adhesiveness of the cured product can be further improved.

(B)氧雜環丁烷化合物的含量較佳為比(C)脂肪族環氧化合物的含量多。具體而言,(B)氧雜環丁烷化合物的含量相對於(C)脂肪族環氧化合物的比率(B/C)較佳為0.5~7。藉此,可將密封劑設為更低的黏度並且可進一步提高硬化性。藉此,可進一步提高噴墨法的噴出性,並且可使塗佈後的硬化迅速進行,容易抑制被塗佈物上的凹陷。The (B) content of the oxetane compound is preferably larger than the content of the (C) aliphatic epoxy compound. Specifically, the ratio (B/C) of the content of the (B) oxetane compound to the (C) aliphatic epoxy compound is preferably 0.5-7. Thereby, the viscosity of the sealant can be set lower and the curability can be further improved. Thereby, the discharge property of the inkjet method can be further improved, and the curing after coating can be rapidly advanced, and the sagging on the object to be coated can be easily suppressed.

另外,就容易進一步減少對噴墨裝置的損傷的觀點而言,較佳為(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、及(C)脂肪族環氧化合物分別為多官能化合物,更佳為二官能化合物。另外,較佳為(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、及(C)脂肪族環氧化合物中的一者以上、較佳為(A)脂環式環氧化合物具有羰基氧基(或酯基)。其原因在於:羰基氧基(或酯基)即便於含氧基中極性亦高,難以使噴墨裝置的頭部中所使用的極性低的橡膠材料等膨潤,可進一步減少損傷。In addition, from the viewpoint of further reducing damage to the inkjet device, (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, and (C ) aliphatic epoxy compounds are respectively polyfunctional compounds, more preferably difunctional compounds. In addition, one or more of (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, and (C) an aliphatic epoxy compound is preferred, preferably (A) The alicyclic epoxy compound has a carbonyloxy group (or an ester group). The reason is that the carbonyloxy group (or ester group) has high polarity even among oxygen-containing groups, and it is difficult to swell low-polarity rubber materials and the like used in the head of the inkjet device, which can further reduce damage.

<(D)陽離子聚合起始劑> (D)陽離子聚合起始劑可為藉由紫外線等的光照射而產生可使陽離子聚合開始的酸的光陽離子聚合起始劑,亦可為藉由加熱而產生酸的熱陽離子聚合起始劑。其中,就減少加熱所致的對顯示元件的損傷的觀點而言,較佳為使密封劑光硬化,(D)陽離子聚合起始劑較佳為光陽離子聚合起始劑。<(D) Cationic polymerization initiator> (D) The cationic polymerization initiator can be a photocationic polymerization initiator that generates an acid that can start cationic polymerization when irradiated with light such as ultraviolet rays, or a thermal cationic polymerization initiator that generates an acid by heating . Among them, from the viewpoint of reducing damage to the display element by heating, it is preferable to photocure the sealing agent, and the (D) cationic polymerization initiator is preferably a photocationic polymerization initiator.

光陽離子聚合起始劑可為陰離子部分為BF4 - 、PF6 - 、SbF6 - 、或BX4 - (X為經至少兩個以上的氟或三氟甲基取代的苯基)的芳香族鋶鹽、芳香族錪鹽、芳香族重氮鎓鹽、芳香族銨鹽。The photocationic polymerization initiator can be an aromatic part with BF 4 - , PF 6 - , SbF 6 - , or BX 4 - (X is a phenyl group substituted by at least two fluorine or trifluoromethyl) Perdium salt, aromatic iodonium salt, aromatic diazonium salt, aromatic ammonium salt.

芳香族鋶鹽的例子包含:雙[4-(二苯基鋶基)苯基]硫醚雙六氟磷酸鹽、雙[4-(二苯基鋶基)苯基]硫醚雙六氟銻酸鹽、雙[4-(二苯基鋶基)苯基]硫醚雙四氟硼酸鹽、雙[4-(二苯基鋶基)苯基]硫醚四(五氟苯基)硼酸鹽、二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽、二苯基-4-(苯硫基)苯基鋶六氟銻酸鹽、二苯基-4-(苯硫基)苯基鋶四氟硼酸鹽等。Examples of aromatic cobaltium salts include: bis[4-(diphenylpermeyl)phenyl]sulfide bishexafluorophosphate, bis[4-(diphenylpermeyl)phenyl]sulfide bishexafluoroantimony bis[4-(diphenylpermeyl)phenyl]sulfide bistetrafluoroborate, bis[4-(diphenylpermeyl)phenyl]sulfide tetrakis(pentafluorophenyl)borate , Diphenyl-4-(phenylsulfanyl)phenylsulfurium hexafluorophosphate, diphenyl-4-(phenylthio)phenylsulfurium hexafluoroantimonate, diphenyl-4-(phenylthio ) Phenyl percite tetrafluoroborate, etc.

芳香族錪鹽的例子包含:二苯基錪六氟磷酸鹽、二苯基錪六氟銻酸鹽、二苯基錪四氟硼酸鹽、二苯基錪四(五氟苯基)硼酸鹽、雙(十二基苯基)錪六氟磷酸鹽、雙(十二基苯基)錪六氟銻酸鹽、雙(十二基苯基)錪四氟硼酸鹽、雙(十二基苯基)錪四(五氟苯基)硼酸鹽等。Examples of aromatic iodonium salts include: diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium tetrafluoroborate, diphenyliodonium tetrakis(pentafluorophenyl)borate, Bis(dodecylphenyl)iodonium hexafluorophosphate, bis(dodecylphenyl)iodonium hexafluoroantimonate, bis(dodecylphenyl)iodonium tetrafluoroborate, bis(dodecylphenyl)iodonium tetrafluoroborate, bis(dodecylphenyl)iodonium ) Tetrakis (pentafluorophenyl) borate, etc.

芳香族重氮鎓鹽的例子包含:苯基重氮鎓六氟磷酸鹽、苯基重氮鎓六氟銻酸鹽、苯基重氮鎓四氟硼酸鹽、苯基重氮鎓四(五氟苯基)硼酸鹽等。Examples of aromatic diazonium salts include: phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, phenyldiazonium tetrakis(pentafluoro Phenyl) borate, etc.

芳香族銨鹽的例子包含:1-苄基-2-氰基吡啶鎓六氟磷酸鹽、1-苄基-2-氰基吡啶鎓六氟銻酸鹽等。Examples of the aromatic ammonium salt include: 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, and the like.

光陽離子聚合起始劑的例子包含:豔佳固(Irgacure)250、豔佳固(Irgacure)270、豔佳固(Irgacure)290(巴斯夫(BASF)公司製造),CPI-100P、CPI-101A、CPI-200K、CPI-210S、CPI-310B、CPI-400PG(聖普羅(San-Apro)公司製造),SP-150、SP-170、SP-171、SP-056、SP-066、SP-130、SP-140、SP-601、SP-606、SP-701(艾迪科(ADEKA)公司製造)。其中,較佳為豔佳固(Irgacure)270、豔佳固(Irgacure)290、CPI-100P、CPI-101A、CPI-200K、CPI-210S、CPI-310B、CPI-400PG、SP-150、SP-170、SP-171、SP-056、SP-066、SP-601、SP-606、SP-701等鋶鹽。Examples of photocationic polymerization initiators include: Irgacure 250, Irgacure 270, Irgacure 290 (manufactured by BASF), CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310B, CPI-400PG (manufactured by San-Apro), SP-150, SP-170, SP-171, SP-056, SP-066, SP-130 , SP-140, SP-601, SP-606, SP-701 (manufactured by ADEKA). Among them, Irgacure 270, Irgacure 290, CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310B, CPI-400PG, SP-150, SP are preferred -170, SP-171, SP-056, SP-066, SP-601, SP-606, SP-701 and other cerium salts.

(D)陽離子聚合起始劑的含量相對於密封劑整體的質量而較佳為0.1質量%~10質量%。若(D)陽離子聚合起始劑的含量為0.1質量%以上,則容易提高密封劑的硬化性,若為10質量%以下,則容易抑制密封層的著色。就所述觀點而言,(D)陽離子聚合起始劑的含量相對於(A)成分、(B)成分、(C)成分及(E)成分的合計質量而更佳為0.1質量%~5質量%,進而佳為0.1質量%~3質量%。(D) It is preferable that content of a cationic polymerization initiator is 0.1 mass % - 10 mass % with respect to the mass of the sealing agent whole. When the content of the (D) cationic polymerization initiator is 0.1% by mass or more, it is easy to improve the curability of the sealant, and when it is 10% by mass or less, it is easy to suppress the coloring of the sealant layer. From such viewpoints, the content of the (D) cationic polymerization initiator is more preferably 0.1% by mass to 5% by mass based on the total mass of the (A) component, (B) component, (C) component, and (E) component. % by mass, more preferably 0.1% by mass to 3% by mass.

<(E)其他成分> 於不損及本發明的效果的範圍內,本發明的顯示元件用密封劑可進而包含(A)成分~(D)成分以外的其他成分。其他成分的例子包含:芳香族環氧化合物、增感劑、矽烷偶合劑、調平劑等。<(E) Other ingredients> The sealing compound for display elements of this invention may further contain other components other than (A) component - (D)component in the range which does not impair the effect of this invention. Examples of other ingredients include: aromatic epoxy compounds, sensitizers, silane coupling agents, leveling agents, and the like.

芳香族環氧化合物為包含芳香環的醇(包含多元醇)的縮水甘油醚。芳香族環氧化合物的例子包含:雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚O型環氧樹脂、2,2'-二烯丙基雙酚A型環氧樹脂、環氧丙烷加成雙酚A型環氧樹脂、間苯二酚型環氧樹脂、聯苯基型環氧樹脂、硫醚型環氧樹脂、二苯基醚型環氧樹脂、萘型環氧樹脂、苯酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、聯苯基酚醛清漆型環氧樹脂、萘苯酚(Naphthalenephenol)酚醛清漆型環氧樹脂等。Aromatic epoxy compounds are glycidyl ethers of alcohols (including polyhydric alcohols) containing aromatic rings. Examples of aromatic epoxy compounds include: bisphenol A type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol O type epoxy resin, 2 ,2'-diallyl bisphenol A type epoxy resin, propylene oxide addition bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, thioether type ring Oxygen resin, diphenyl ether type epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, o-cresol novolac type epoxy resin, biphenyl novolac type epoxy resin, naphthalenephenol ) Novolak type epoxy resin, etc.

芳香族環氧化合物的氧原子含有率或重量平均分子量並無特別限制,但就減少密封劑的揮發性或對裝置的損傷的觀點而言,與(A)成分~(C)成分同樣地,氧原子含有率較佳為15%以上,重量平均分子量較佳為180以上。The oxygen atom content or the weight average molecular weight of the aromatic epoxy compound is not particularly limited, but from the viewpoint of reducing the volatility of the sealant or damage to the device, similarly to (A) component to (C) component, The oxygen atom content is preferably at least 15%, and the weight average molecular weight is preferably at least 180.

其中,若密封劑大量包含例如雙酚A型、F型環氧樹脂等,則黏度容易變高。另外,若密封劑大量包含芳香族環氧樹脂,則密封劑的硬化物有時亦容易著色。因此,較佳為以對密封劑的黏度或硬化物的著色的影響小的程度調整芳香族環氧樹脂的含量。Among them, if the sealing agent contains a large amount of bisphenol A type, F type epoxy resin, etc., the viscosity will become high easily. In addition, when the sealant contains a large amount of aromatic epoxy resin, the cured product of the sealant may be easily colored. Therefore, it is preferable to adjust the content of the aromatic epoxy resin so as to have little influence on the viscosity of the sealant or the coloring of the cured product.

增感劑可具有進一步提高聚合起始劑的聚合起始效率並進一步促進密封劑的硬化反應的功能。增感劑的例子包含:2,4-二乙基噻噸酮等噻噸酮系化合物,或2,2-二甲氧基-1,2-二苯基乙烷-1-酮、二苯甲酮、2,4-二氯二苯甲酮、鄰苯甲醯基苯甲酸甲酯、4,4'-雙(二甲基胺基)二苯甲酮、4-苯甲醯基-4'-甲基二苯基硫化物等。The sensitizer may have a function of further increasing the polymerization initiation efficiency of the polymerization initiator and further accelerating the hardening reaction of the sealant. Examples of sensitizers include: thioxanthone-based compounds such as 2,4-diethylthioxanthone, or 2,2-dimethoxy-1,2-diphenylethan-1-one, diphenyl Methanone, 2,4-dichlorobenzophenone, methyl o-benzoylbenzoate, 4,4'-bis(dimethylamino)benzophenone, 4-benzoyl-4 '-Methyl diphenyl sulfide, etc.

矽烷偶合劑具有進一步提高密封劑與基板等的接著性的功能。矽烷偶合劑可為具有環氧基、羧基、甲基丙烯醯基、異氰酸酯基等反應性基的矽烷化合物。此種矽烷化合物的例子包含:三甲氧基矽烷基苯甲酸、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三甲氧基矽烷、γ-異氰酸基丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷。該些矽烷化合物可單獨使用,亦可併用兩種以上。The silane coupling agent has the function of further improving the adhesion between the sealant and the substrate. The silane coupling agent can be a silane compound having reactive groups such as epoxy groups, carboxyl groups, methacryl groups, and isocyanate groups. Examples of such silane compounds include: trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetyloxysilane, vinyltrimethoxysilane, γ-iso Cyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane. These silane compounds may be used alone or in combination of two or more.

調平劑可具有對密封劑賦予塗膜的平坦性的功能。調平劑的例子包含矽酮系、丙烯酸系、氟系的調平劑。調平劑的市售品的例子包含:BYK-340、BYK-345(均為日本畢克化學(BYK Chemie Japan)公司製造),沙福隆(Surflon)S-611(AGC清美化學(AGC Seimi Chemical)公司製造)。The leveling agent may have a function of imparting flatness to the coating film to the sealant. Examples of leveling agents include silicone-based, acrylic-based, and fluorine-based leveling agents. Examples of commercially available leveling agents include: BYK-340, BYK-345 (all manufactured by BYK Chemie Japan), Surflon S-611 (AGC Seimi Chemical) company).

就抑制密封劑的揮發且減少對裝置的損傷的觀點而言,其他成分(E)的合計含量相對於密封劑的總質量而較佳為20質量%以下,更佳為10質量%以下。From the viewpoint of suppressing volatilization of the sealant and reducing damage to the device, the total content of other components (E) is preferably at most 20% by mass, more preferably at most 10% by mass, based on the total mass of the sealant.

<密封劑的物性> (黏度) 顯示元件用密封劑的、利用E型黏度計於25℃、20 rpm下測定的黏度較佳為50 mPa·s以下,更佳為20 mPa·s以下。若密封劑的黏度為所述範圍,則利用噴墨法塗佈密封劑時的噴出性容易變良好。密封劑的黏度的下限值例如可為5 mPa·s。<Physical properties of sealant> (viscosity) The viscosity of the sealant for a display device measured with an E-type viscometer at 25° C. and 20 rpm is preferably 50 mPa·s or less, more preferably 20 mPa·s or less. When the viscosity of a sealing compound is the said range, the discharge property at the time of apply|coating a sealing compound by an inkjet method becomes favorable easily. The lower limit of the viscosity of the sealant may be, for example, 5 mPa·s.

(光線透過率) 關於顯示元件用密封劑的硬化物的、厚度10 μm時的光線透過率,波長380 nm~800 nm時的光線透過率的平均值較佳為85%以上,更佳為90%以上。若顯示元件用密封劑的硬化物的光線透過率為所述範圍,則具有良好的光透過性,因此作為例如有機EL元件的面密封劑而適宜。平均光線透過率例如可使用紫外可見分光光度計(島津(SHIMADZU)公司製造)並作為波長380 nm~800 nm時針對波長每1 nm而測定的光線透過率的平均值來測定。(light transmittance) The average value of the light transmittance at a wavelength of 380 nm to 800 nm is preferably at least 85%, more preferably at least 90%, of the light transmittance at a thickness of 10 μm of the cured product of the sealant for a display element. If the light transmittance of the hardened|cured material of the sealing compound for display elements is the said range, since it has favorable light transmittance, it is suitable as a surface sealing compound of an organic EL element, for example. The average light transmittance can be measured, for example, using an ultraviolet-visible spectrophotometer (manufactured by Shimadzu Corporation) as an average value of light transmittance measured per 1 nm of wavelength at a wavelength of 380 nm to 800 nm.

(氧原子含有率) 就高度減少對裝置的損傷的觀點而言,顯示元件用密封劑的氧原子含有率與所述同樣地較佳為15%以上,更佳為20%以上。就不會使密封層的介電常數過於大的觀點而言,顯示元件用密封劑的氧原子含有率例如較佳為30%以下。顯示元件用密封劑的氧原子含有率可以(顯示元件用密封劑中所含的氧原子的合計質量/顯示元件用密封劑的總質量)×100(%)的形式算出。顯示元件用密封劑中所含的氧原子的合計質量可藉由如下方式算出:利用元素分析來算出顯示元件用密封劑中所含的氧原子的比例並對其乘以氧原子的原子量。(Oxygen atom content rate) From the viewpoint of highly reducing damage to the device, the oxygen atom content of the sealing agent for a display device is preferably 15% or more, more preferably 20% or more, as described above. From the viewpoint of not making the dielectric constant of the sealing layer too large, the oxygen atom content of the sealing compound for display elements is preferably, for example, 30% or less. The oxygen atom content of the sealant for display elements can be calculated as (total mass of oxygen atoms contained in sealant for display elements/total mass of sealant for display elements)×100 (%). The total mass of oxygen atoms contained in the sealant for display elements can be calculated by calculating the ratio of oxygen atoms contained in the sealant for display elements by elemental analysis and multiplying this by the atomic weight of oxygen atoms.

<密封劑的製備方法> 顯示元件用密封劑可使用例如均質分散機、均質混合器、萬能混合器、行星式混合器、捏合機、三根輥等混合機至少將(A)成分~(D)成分混合而獲得。再者,就穩定地混合密封劑的觀點而言,較佳為於混合(A)成分~(C)成分後,添加(D)成分並進行混合。<Preparation method of sealant> The sealing agent for display elements can be obtained by mixing at least (A) component - (D) component using mixers, such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and three rolls, for example. Furthermore, after mixing (A) component - (C)component, it is preferable to add (D)component and mix from a viewpoint of mixing a sealing agent stably.

顯示元件用密封劑可作為顯示元件用的面密封劑、較佳為有機EL元件的面密封劑而使用。The sealing agent for display elements can be used as a surface sealing agent for display elements, preferably a surface sealing agent for organic EL elements.

2. 顯示器件 本發明的顯示器件包括配置於基板上的顯示元件、及將所述顯示元件密封為面狀的本發明的顯示元件用密封劑的硬化物層。2. Display device The display device of the present invention includes a display element disposed on a substrate, and a cured product layer of the sealing agent for display elements of the present invention that seals the display element in a planar shape.

基板可為玻璃基板,亦可為樹脂基板。就獲得柔性的光半導體器件的觀點而言,較佳為樹脂基板(樹脂膜)。The substrate can be a glass substrate or a resin substrate. From the viewpoint of obtaining a flexible optical semiconductor device, a resin substrate (resin film) is preferable.

顯示元件是將電轉換為光或將光轉換為電的元件。顯示元件的例子包含有機EL元件或發光二極體(Light Emitting Diode,LED)元件等。其中,顯示元件較佳為有機EL元件。A display element is an element that converts electricity into light or light into electricity. Examples of display elements include organic EL elements, light emitting diode (Light Emitting Diode, LED) elements, and the like. Among them, the display element is preferably an organic EL element.

顯示元件用密封劑的硬化物層的厚度只要為可充分密封顯示元件且可實現平坦性或薄膜性的程度即可,並無特別限制,例如較佳為5 μm~20 μm,亦可為5 μm~10 μm。The thickness of the hardened layer of the sealant for display elements is not particularly limited as long as it can sufficiently seal the display elements and achieve flatness or thin film properties. For example, it is preferably 5 μm to 20 μm, and may be 5 μm μm~10 μm.

此種顯示器件可利用任意的方法來製造。例如,顯示器件可經過如下步驟來製造:1)獲得配置於基板上的顯示元件的步驟;2)將本發明的顯示元件用密封劑以面狀塗佈於顯示元件上的步驟;以及3)使經塗佈的顯示元件用密封劑硬化的步驟。Such a display device can be produced by any method. For example, a display device can be manufactured through the following steps: 1) a step of obtaining a display element arranged on a substrate; 2) a step of applying the sealant for a display element of the present invention in a planar form on the display element; and 3) A step of hardening the applied encapsulant for display elements.

1)步驟中,準備配置有顯示元件的基板。於顯示元件為有機EL元件的情況下,有機EL元件通常包括反射畫素電極層、有機EL層、及透明相向電極層,且視需要可進而包括其他功能層。1) In the step, a substrate on which a display element is arranged is prepared. When the display element is an organic EL element, the organic EL element generally includes a reflective pixel electrode layer, an organic EL layer, and a transparent opposite electrode layer, and may further include other functional layers as required.

2)步驟中,以覆蓋配置於基板上的顯示元件的方式塗佈本發明的顯示元件用密封劑。顯示元件用密封劑的塗佈可利用任意方法、例如網版印刷法或噴墨法等進行。其中,就可高速形成平坦性高、且為薄膜的均勻的塗佈層的觀點而言,較佳為噴墨法。即,較佳為利用噴墨法將本發明的顯示元件用密封劑賦予至顯示元件上,並塗佈為面狀。2) In the process, the sealing compound for display elements of this invention is apply|coated so that the display element arrange|positioned on the board|substrate may be covered. The application|coating of the sealing agent for display elements can be performed by arbitrary methods, for example, a screen printing method, an inkjet method, etc. are performed. Among these, the inkjet method is preferable from the viewpoint of being able to form a uniform coating layer having high flatness and a thin film at high speed. That is, it is preferable to provide the sealing compound for display elements of this invention on a display element by the inkjet method, and to coat it in a planar shape.

3)步驟中,使塗佈於顯示元件上的密封劑硬化,獲得硬化物層。密封劑的硬化較佳為光硬化,亦可進一步進行熱硬化。3) In the step, the sealant coated on the display element is hardened to obtain a hardened layer. The curing of the sealant is preferably photocuring, and may be further thermally cured.

於光硬化的情況下,作為光照射中使用的光源,例如可使用氙燈、碳弧燈等公知的光源。光照射只要進行至可使密封劑充分硬化的程度即可,並無特別限制,例如可藉由以300 mJ/m2 ~3000 mJ/m2 的累計光量照射300 nm~400 nm波長的光而適宜地硬化。In the case of photocuring, well-known light sources, such as a xenon lamp and a carbon arc lamp, can be used as a light source used for light irradiation, for example. The light irradiation is not particularly limited as long as it can sufficiently harden the sealant. For example, it can be irradiated with light with a wavelength of 300 nm to 400 nm at a cumulative light intensity of 300 mJ/m 2 to 3000 mJ/m 2 . Properly hardened.

於進一步進行熱硬化的情況下,就減少對顯示元件的損傷並且充分硬化的觀點而言,加熱溫度例如較佳為50℃~120℃。In the case of further thermosetting, the heating temperature is preferably, for example, 50° C. to 120° C. from the viewpoint of reducing damage to a display element and sufficiently curing.

獲得的顯示器件例如為有機EL器件等,可作為各種顯示裝置或照明裝置而較佳地使用。 [實施例]The obtained display device is, for example, an organic EL device or the like, and can be preferably used as various display devices or lighting devices. [Example]

以下,參照實施例來對本發明進行更詳細的說明。本發明的範圍並不由該些實施例限定地解釋。Hereinafter, the present invention will be described in more detail with reference to examples. The scope of the present invention is not limitedly interpreted by these Examples.

1. 密封劑的材料 (A)具有環烯烴氧化物結構的脂環式環氧化合物 ·賽羅西德(Celloxide)CEL 2021P(大賽璐(Daicel)公司製造,3',4'-環氧環己基甲基3,4-環氧環己烷羧酸酯,氧原子含有率25.4%,分子量252) [化5]

Figure 02_image013
·賽羅西德(Celloxide)CEL 8000(大賽璐(Daicel)公司製造,氧原子含有率16.49%,分子量194) [化6]
Figure 02_image015
1. Material of sealant (A) Alicyclic epoxy compound having cycloolefin oxide structure Celloxide CEL 2021P (manufactured by Daicel, 3',4'-epoxy ring Hexylmethyl 3,4-epoxycyclohexanecarboxylate, oxygen atom content 25.4%, molecular weight 252) [Chem. 5]
Figure 02_image013
・Celloxide CEL 8000 (manufactured by Daicel, oxygen atom content 16.49%, molecular weight 194) [Chemical 6]
Figure 02_image015

(A')比較用化合物 ·LDO(德之馨(Symrise)公司製造,檸檬烯二氧化物,氧原子含有率19.05%,分子量168) [化7]

Figure 02_image017
·賽羅西德(Celloxide)CEL 2000(大賽璐(Daicel)公司製造,1,2-環氧-4-乙烯基環己烷,氧原子含有率12.9%,分子量124) [化8]
Figure 02_image019
(A') Comparative compound LDO (manufactured by Symrise, limonene dioxide, oxygen atom content 19.05%, molecular weight 168) [Chemical 7]
Figure 02_image017
・Celloxide CEL 2000 (manufactured by Daicel, 1,2-epoxy-4-vinylcyclohexane, oxygen atom content 12.9%, molecular weight 124) [Chem. 8]
Figure 02_image019

(B)氧雜環丁烷化合物 ·OXT-221(東亞合成公司製造,3-乙基-3{[(3-乙基氧雜環丁烷-3-基)甲氧基]甲基}氧雜環丁烷,氧原子含有率22.43%,分子量214) [化9]

Figure 02_image021
(B) Oxetane compound OXT-221 (manufactured by Toagosei Co., Ltd., 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxy Heterocyclobutane, oxygen atom content 22.43%, molecular weight 214) [Chemical 9]
Figure 02_image021

(B')比較用化合物 ·AL-OX(四日市合成公司製造,氧原子含有率28.07%,分子量114) [化10]

Figure 02_image023
·OXT-212 (東亞合成公司製造,2-乙基己基氧雜環丁烷,氧原子含有率14.04%,分子量228)(B') Comparative compound AL-OX (manufactured by Yokkaichi Gosei Co., Ltd., oxygen atom content 28.07%, molecular weight 114) [Chem. 10]
Figure 02_image023
・OXT-212 (manufactured by Toagosei Co., Ltd., 2-ethylhexyloxetane, oxygen atom content 14.04%, molecular weight 228)

(C)脂肪族環氧化合物 ·SR-16HL(阪本藥品工業公司製造,1,6-己二醇二縮水甘油醚,環氧當量125 g/eq,氧原子含有率27.83%,分子量230)(C) Aliphatic epoxy compound ・SR-16HL (manufactured by Sakamoto Pharmaceutical Co., Ltd., 1,6-hexanediol diglycidyl ether, epoxy equivalent 125 g/eq, oxygen atom content 27.83%, molecular weight 230)

(C')比較用化合物 ·EX-111(長瀨化成(Nagase ChemteX)公司製造,烯丙基縮水甘油醚,氧原子含有率13.22%,分子量242) ·SY-35M(阪本藥品工業公司製造,高級醇縮水甘油醚,氧原子含有率28.07%,分子量114,環氧當量280 g/eq)(C') Compounds for comparison ・EX-111 (manufactured by Nagase ChemteX Co., Ltd., allyl glycidyl ether, oxygen atom content 13.22%, molecular weight 242) ・SY-35M (manufactured by Sakamoto Pharmaceutical Co., Ltd., high-grade alcohol glycidyl ether, oxygen atom content 28.07%, molecular weight 114, epoxy equivalent 280 g/eq)

再者,化合物的氧原子含有率是根據結構式算出。另外,化合物的分子量是根據結構式算出。In addition, the oxygen atom content rate of a compound is calculated from a structural formula. In addition, the molecular weight of a compound is calculated from a structural formula.

(D)陽離子聚合起始劑 ·CPI-200K(聖普羅(San-Apro)公司製造,二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽,參照下述式) [化11]

Figure 02_image025
X- =PF6 - (D) Cationic polymerization initiator CPI-200K (manufactured by San-Apro, diphenyl-4-(phenylsulfanyl)phenyl percolium hexafluorophosphate, refer to the following formula) [Chem. 11 ]
Figure 02_image025
X - =PF 6 -

(E)芳香族環氧化合物 ·EX-201(長瀨化成(Nagase ChemteX)公司製造,間苯二酚二縮水甘油醚,氧原子含有率28.8%,分子量222)(E) Aromatic epoxy compounds ・EX-201 (manufactured by Nagase ChemteX Co., Ltd., resorcinol diglycidyl ether, oxygen atom content 28.8%, molecular weight 222)

2. 密封劑的製備與評價 (實施例1~實施例4、比較例1~比較例9) 以成為表1所示的組成的方式,將具有環烯烴氧化物結構的脂環式環氧化合物、氧雜環丁烷化合物、脂肪族環氧化合物、及視需要的芳香族環氧化合物放入燒瓶中並混合。於所獲得的混合物中放入表1所示的量的陽離子聚合起始劑,進而進行混合。於所獲得的混合物中,進行攪拌直至看不到粉狀物為止,從而獲得密封劑。2. Preparation and Evaluation of Sealants (Example 1 to Example 4, Comparative Example 1 to Comparative Example 9) In such a manner that the composition shown in Table 1 was obtained, an alicyclic epoxy compound having a cycloolefin oxide structure, an oxetane compound, an aliphatic epoxy compound, and an aromatic epoxy compound as needed were put into flask and mix. The cationic polymerization initiator of the quantity shown in Table 1 was put into the obtained mixture, and it mixed. In the obtained mixture, stirring was performed until no powdery matter was seen, thereby obtaining a sealant.

利用以下方法評價所獲得的密封劑的黏度、膨潤性(對裝置的損傷)、揮發性及硬化性。The viscosity, swelling property (damage to the device), volatility, and curability of the obtained sealant were evaluated by the following methods.

[黏度] 使用E型黏度計(博勒飛(BROOKFIELD)公司製造,LV-DV-II+),於25℃下以20 rpm測定獲得的密封劑的黏度。 ○:10 mPa·s以上且20 mPa·s以下 △:超過20 mPa·s且50 mPa·s以下 ×:超過50 mPa·s[viscosity] The viscosity of the obtained sealant was measured at 25° C. and 20 rpm using an E-type viscometer (manufactured by Brookfield, LV-DV-II+). ○: 10 mPa·s or more and 20 mPa·s or less △: More than 20 mPa·s and less than 50 mPa·s ×: over 50 mPa·s

[膨潤性] 測定噴墨裝置的頭部分中所使用的橡膠材料即EPDM O形環(EPDM-70,AS568-009規格)的重量。繼而,將測定了重量的EPDM O形環浸漬於密封劑中,於25℃的遮光下保存1週。保存後,取出EPDM O形環,測定重量。而且,套用於下述式中,算出重量變化率。 重量變化率(%)=[(保存後的重量-保存前的重量)/保存前的重量]×100 而且,基於以下的基準,評價膨潤性。 ◎:重量變化率為5%以下 ○:重量變化率超過5%且為10%以下 △:重量變化率超過10%且為15%以下 ×:重量變化率超過15%[swellability] The weight of an EPDM O-ring (EPDM-70, AS568-009 specification), which is a rubber material used in the head portion of the inkjet device, was measured. Next, the EPDM O-ring whose weight was measured was immersed in the sealant, and it stored at 25 degreeC under light-shielding for 1 week. After storage, take out the EPDM O-ring and measure the weight. Then, the weight change rate was calculated by applying it to the following formula. Weight change rate (%) = [(weight after storage - weight before storage) / weight before storage] × 100 And, swelling property was evaluated based on the following criteria. ◎: The weight change rate is less than 5% ○: Weight change rate exceeds 5% and is 10% or less △: The weight change rate exceeds 10% and is 15% or less ×: Weight change rate exceeds 15%

[揮發性] 密封劑的揮發性是使用示差熱熱重量同時測定裝置(thermogravimetric-differential thermal analysis,TG-DTA)測定。具體而言,以5℃/分鐘將密封劑自30℃升溫至50℃後,保持50分鐘。而且,測定保持50分鐘後的密封劑的重量減少率((加熱後的重量-加熱前的重量)/加熱前的重量)×100)。而且,以如下基準評價揮發性。 ○:重量減少率小於1% ×:重量減少率為1%以上[volatility] The volatility of the sealant was measured using a differential thermogravimetric simultaneous measurement device (thermogravimetric-differential thermal analysis, TG-DTA). Specifically, after raising the temperature of the sealing agent from 30° C. to 50° C. at 5° C./minute, the temperature was maintained for 50 minutes. And the weight reduction rate ((weight after heating-weight before heating)/weight before heating)×100) of the sealing agent after holding|maintaining for 50 minutes was measured. And the volatility was evaluated by the following reference|standard. ○: Weight reduction rate is less than 1% ×: The weight reduction rate is 1% or more

[硬化性] 於常溫下,使用棒塗機(No.6)於玻璃基板上塗佈密封劑,進行乾燥,形成厚度10 μm的塗膜。將獲得的塗膜放入N2 沖洗箱內,流通1分鐘氮氣,且利用氮氣對系統內進行置換。繼而,利用UV(紫外線,ultraviolet)-LED燈對獲得的塗膜以累計照射量1000 mJ/m2 的方式照射波長365 nm的UV光。而且,用手指觸碰塗膜的照射部分,判斷有無黏性。 ○:無黏性 ×:手指觸碰時殘留有黏性[Curability] At room temperature, the sealant was coated on a glass substrate using a bar coater (No. 6), and dried to form a coating film with a thickness of 10 μm. The obtained coating film was placed in a N 2 flushing box, and nitrogen was circulated for 1 minute, and the system was replaced with nitrogen. Next, the obtained coating film was irradiated with UV light having a wavelength of 365 nm using a UV (ultraviolet)-LED lamp so that the cumulative irradiation dose was 1000 mJ/m 2 . Furthermore, the irradiated part of the coating film was touched with a finger, and the presence or absence of stickiness was judged. ○: No stickiness ×: Stickiness remains when touched with fingers

[硬化物的平均光線透過率] 將獲得的密封劑導入噴墨盒DMC-11610(富士軟片北極星(Dimatix)公司製造)中。將該噴墨盒設置於噴墨裝置DMP-2831(富士軟片北極星(Dimatix)公司製造),並進行噴出狀態的調整後,於SiN基板上以硬化後的厚度為10 μm的方式以5 cm×5 cm的尺寸進行塗佈。將獲得的塗膜於室溫(25℃)下放置1分鐘後,照射UV光(照射強度1000 mJ/cm2 ),進行硬化。 針對每1 nm波長使用紫外可見分光光度計(島津(SHIMADZU)公司製造)測定所獲得的密封劑的硬化物的波長380 nm~800 nm下的光線透過率,並將該些的平均值作為「平均光線透過率」。[Average Light Transmittance of Cured Material] The obtained sealant was introduced into an inkjet cartridge DMC-11610 (manufactured by Fujifilm Dimatix). This inkjet cartridge was installed in an inkjet device DMP-2831 (manufactured by Fujifilm Polaris (Dimatix) Co., Ltd.), and after adjusting the ejection state, it was placed on a SiN substrate so that the thickness after curing was 10 μm at a distance of 5 cm× 5 cm size for coating. After the obtained coating film was left to stand at room temperature (25° C.) for 1 minute, it was irradiated with UV light (irradiation intensity: 1000 mJ/cm 2 ) to be cured. The light transmittance at a wavelength of 380 nm to 800 nm of the obtained cured product of the sealant was measured using an ultraviolet-visible spectrophotometer (manufactured by Shimadzu Corporation) for every wavelength of 1 nm, and the average value thereof was defined as " Average Light Transmittance".

將實施例1~實施例4及比較例1~比較例9的密封劑的組成及評價結果示於表1中。再者,實施例及比較例的數值的單位為質量份。Table 1 shows the compositions and evaluation results of the sealants of Examples 1 to 4 and Comparative Examples 1 to 9. In addition, the unit of the numerical value of an Example and a comparative example is a mass part.

[表1]

Figure 108121328-A0304-0001
[Table 1]
Figure 108121328-A0304-0001

如表1所示,得知:包含(A)~(C)、且該些的氧原子含有率為15%以上且重量平均分子量為180以上的實施例1~實施例4的密封劑具有低黏度、低揮發性及高硬化性,並且膨潤性低,可減少對裝置的損傷。As shown in Table 1, it can be seen that the sealants of Examples 1 to 4 containing (A) to (C) and having an oxygen atom content of 15% or more and a weight average molecular weight of 180 or more have low Viscosity, low volatility and high hardening, and low swelling, can reduce the damage to the device.

相對於此,即便為(A)~(C)的任一者的氧原子含有率小於15%的比較例3、比較例6及比較例9的密封劑,均暗示有膨潤性高,且對裝置的損傷大。即便為(A)~(C)的任一者的重量平均分子量小於180的比較例2、比較例5及比較例8的密封劑,均暗示有揮發性高。另外,得知不含(A)成分的比較例1與不含(B)成分的比較例4的密封劑的硬化性低。另外,得知不含(C)成分的比較例7的膨潤性差。On the other hand, even the sealants of Comparative Example 3, Comparative Example 6, and Comparative Example 9 in which any one of (A) to (C) had an oxygen atom content rate of less than 15% showed a high swelling property, and had a negative effect on The damage to the device is large. Even the sealing agents of Comparative Example 2, Comparative Example 5, and Comparative Example 8 in which any one of (A) to (C) had a weight average molecular weight of less than 180 suggested that volatility was high. Moreover, it turned out that the hardenability of the sealing compound of the comparative example 1 which does not contain (A) component, and the comparative example 4 which does not contain (B) component is low. Moreover, it turned out that the swelling property of the comparative example 7 which does not contain (C)component is inferior.

本申請案主張基於2018年6月20日提出申請的日本專利特願2018-116842的優先權。將該申請案說明書中記載的內容全部引用至本申請案說明書中。 [產業上的可利用性]This application claims priority based on Japanese Patent Application No. 2018-116842 filed on June 20, 2018. All the content described in this application specification is used for this application specification. [industrial availability]

根據本發明,可提供一種顯示元件用密封劑及其硬化物,所述顯示元件用密封劑具有適合於利用噴墨法進行的塗佈的低黏度、低揮發性及良好的硬化性,且對噴墨裝置的損傷少。According to the present invention, there can be provided a sealant for a display element having low viscosity, low volatility, and good curability suitable for coating by an inkjet method, and a cured product thereof, and a cured product thereof. There is less damage to the inkjet device.

none

none

Claims (7)

一種顯示元件用密封劑,包含:(A)具有環烯烴氧化物結構的脂環式環氧化合物、(B)氧雜環丁烷化合物、(C)脂肪族環氧化合物,其中,與所述脂環式環氧化合物不同,及(D)陽離子聚合起始劑,且所述(A)脂環式環氧化合物、所述(B)氧雜環丁烷化合物、及所述(C)脂肪族環氧化合物的重量平均分子量分別為180以上,且下述式(1)所表示的氧原子含有率分別為15%以上;所述(B)氧雜環丁烷化合物相對於所述(C)脂肪族環氧化合物的含有比率(B/C)為3.25~7(質量比),且所述(C)脂肪族環氧化合物相對於所述(A)具有環烯烴氧化物結構的脂環式環氧化合物的含有比率(C/A)為0.5~1.5(質量比),氧原子含有率(%)=1分子中的氧原子的合計質量/重量平均分子量×100...(1)。 A sealant for display elements, comprising: (A) an alicyclic epoxy compound having a cycloolefin oxide structure, (B) an oxetane compound, and (C) an aliphatic epoxy compound, wherein, with the The alicyclic epoxy compound is different, and (D) cationic polymerization initiator, and the (A) alicyclic epoxy compound, the (B) oxetane compound, and the (C) fatty The weight-average molecular weights of the epoxy compounds are respectively more than 180, and the oxygen atom content rates represented by the following formula (1) are respectively more than 15%; the (B) oxetane compound is ) the content ratio (B/C) of the aliphatic epoxy compound is 3.25 to 7 (mass ratio), and the (C) aliphatic epoxy compound has a cycloalkene oxide structure with respect to the (A) alicyclic The content ratio (C/A) of the formula epoxy compound is 0.5~1.5 (mass ratio), the oxygen atom content ratio (%)=the total mass of oxygen atoms in 1 molecule/weight average molecular weight×100...(1) . 如申請專利範圍第1項所述的顯示元件用密封劑,其中所述(A)脂環式環氧化合物、所述(B)氧雜環丁烷化合物、及所述(C)脂肪族環氧化合物分別為多官能化合物。 The sealant for display elements as described in Claim 1 of the patent application, wherein the (A) alicyclic epoxy compound, the (B) oxetane compound, and the (C) alicyclic The oxygen compounds are respectively polyfunctional compounds. 如申請專利範圍第1項所述的顯示元件用密封劑,其中 所述(A)脂環式環氧化合物、所述(B)氧雜環丁烷化合物、及所述(C)脂肪族環氧化合物中的一者以上具有羰基氧基。 The sealant for display elements as described in item 1 of the scope of the patent application, wherein One or more of the (A) alicyclic epoxy compound, the (B) oxetane compound, and the (C) aliphatic epoxy compound have a carbonyloxy group. 如申請專利範圍第1項所述的顯示元件用密封劑,其中利用E型黏度計於25℃、20rpm的條件下測定的黏度為50mPa.s以下。 The sealant for display elements as described in Item 1 of the scope of the patent application, wherein the viscosity measured by an E-type viscometer at 25°C and 20rpm is 50mPa. below s. 如申請專利範圍第1項所述的顯示元件用密封劑,其用於利用噴墨法進行的塗佈中。 The sealing compound for display elements as described in Claim 1 used for coating by the inkjet method. 如申請專利範圍第1項所述的顯示元件用密封劑,其中將作為所述顯示元件的有機電致發光元件密封為面狀。 The sealant for a display element as described in claim 1 of the patent claims, wherein the organic electroluminescence element as the display element is sealed in a planar shape. 一種硬化物,其為如申請專利範圍第1項所述的顯示元件用密封劑的硬化物。 A cured product, which is a cured product of the sealant for display elements described in claim 1 of the patent application.
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Publication number Priority date Publication date Assignee Title
WO2018106089A1 (en) * 2016-12-09 2018-06-14 주식회사 엘지화학 Sealant composition
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Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6200203B2 (en) 2013-05-16 2017-09-20 積水化学工業株式会社 Sealant for organic electroluminescence display element and method for producing organic electroluminescence display element
WO2015027393A1 (en) 2013-08-27 2015-03-05 Ablestik (Shanghai) Limited. Curable composition and use for electronic device
JP2016108512A (en) 2014-12-10 2016-06-20 日本化薬株式会社 Resin composition for organic el element, surface sealing agent and organic el device using the same
KR20170140149A (en) 2015-04-17 2017-12-20 세키스이가가쿠 고교가부시키가이샤 Sealant for electronic device, and method for manufacturing electronic device
US11248142B2 (en) 2016-12-09 2022-02-15 Lg Chem, Ltd. Encapsulating composition
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CN115232511B (en) 2017-06-07 2023-11-24 积水化学工业株式会社 Sealing agent for organic EL display element
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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