TWI816185B - 用於囊封半導體元件的環氧樹脂組成物和半導體元件 - Google Patents
用於囊封半導體元件的環氧樹脂組成物和半導體元件 Download PDFInfo
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- TWI816185B TWI816185B TW110135593A TW110135593A TWI816185B TW I816185 B TWI816185 B TW I816185B TW 110135593 A TW110135593 A TW 110135593A TW 110135593 A TW110135593 A TW 110135593A TW I816185 B TWI816185 B TW I816185B
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- epoxy resin
- formula
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 127
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 127
- 239000000203 mixture Substances 0.000 title claims abstract description 77
- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 239000011256 inorganic filler Substances 0.000 claims abstract description 21
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 12
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 125000003277 amino group Chemical group 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 12
- 239000005011 phenolic resin Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- -1 dicarboxylic acid compound Chemical class 0.000 description 5
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 2
- DEPDDPLQZYCHOH-UHFFFAOYSA-N 1h-imidazol-2-amine Chemical compound NC1=NC=CN1 DEPDDPLQZYCHOH-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002249 anxiolytic agent Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 150000002903 organophosphorus compounds Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- XLOLWBTYFFTMCW-UHFFFAOYSA-N 1,2,3,5,6,7-hexahydroimidazo[1,5-a]pyridine Chemical compound C1CCN2CNCC2=C1 XLOLWBTYFFTMCW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- BDHGFCVQWMDIQX-UHFFFAOYSA-N 1-ethenyl-2-methylimidazole Chemical compound CC1=NC=CN1C=C BDHGFCVQWMDIQX-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- XUZIWKKCMYHORT-UHFFFAOYSA-N 2,4,6-tris(diaminomethyl)phenol Chemical compound NC(N)C1=CC(C(N)N)=C(O)C(C(N)N)=C1 XUZIWKKCMYHORT-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- JHUAQUXEQIWAHX-UHFFFAOYSA-L 2,4-dioxopentanoate;nickel(2+) Chemical compound [Ni+2].CC(=O)CC(=O)C([O-])=O.CC(=O)CC(=O)C([O-])=O JHUAQUXEQIWAHX-UHFFFAOYSA-L 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XIBDLGXWRKZUJO-UHFFFAOYSA-N C(C=1C(C(=O)O)=CC=CC1)(=O)O.C(=O)OC=O Chemical compound C(C=1C(C(=O)O)=CC=CC1)(=O)O.C(=O)OC=O XIBDLGXWRKZUJO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- YSQIHBDGANIIJA-UHFFFAOYSA-K chromium(3+) 2,4-dioxopentanoate Chemical compound [Cr+3].CC(=O)CC(=O)C([O-])=O.CC(=O)CC(=O)C([O-])=O.CC(=O)CC(=O)C([O-])=O YSQIHBDGANIIJA-UHFFFAOYSA-K 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- RGBIPJJZHWFFGE-UHFFFAOYSA-N cyclohexa-2,5-diene-1,4-dione;triphenylphosphane Chemical compound O=C1C=CC(=O)C=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RGBIPJJZHWFFGE-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000004404 heteroalkyl group Chemical group 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000000592 heterocycloalkyl group Chemical group 0.000 description 1
- AVGTYNJIWPQPIH-UHFFFAOYSA-N hexan-1-amine;trifluoroborane Chemical compound FB(F)F.CCCCCCN AVGTYNJIWPQPIH-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- VSWALKINGSNVAR-UHFFFAOYSA-N naphthalen-1-ol;phenol Chemical compound OC1=CC=CC=C1.C1=CC=C2C(O)=CC=CC2=C1 VSWALKINGSNVAR-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QLAGHGSFXJZWKY-UHFFFAOYSA-N triphenylborane;triphenylphosphane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QLAGHGSFXJZWKY-UHFFFAOYSA-N 0.000 description 1
- JABYJIQOLGWMQW-UHFFFAOYSA-N undec-4-ene Chemical compound CCCCCCC=CCCC JABYJIQOLGWMQW-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- YGOMVBPFJWLDMJ-UHFFFAOYSA-L zinc;2,4-dioxopentanoate Chemical compound [Zn+2].CC(=O)CC(=O)C([O-])=O.CC(=O)CC(=O)C([O-])=O YGOMVBPFJWLDMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
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Abstract
本發明提供一種用於囊封半導體元件的環氧樹脂組成物和一種使用其囊封的半導體元件。環氧樹脂組成物包含環氧樹脂、固化劑、無機填充劑以及固化催化劑,其中環氧樹脂包含由式1表示的環氧樹脂。
Description
本發明是有關於一種用於囊封半導體元件的環氧樹脂組成物和一種使用其囊封的半導體元件。更具體地說,本發明是有關於一種用於囊封半導體元件的環氧樹脂組成物和一種使用其囊封的半導體元件,所述環氧樹脂組成物由於高熱導率而具有良好的散熱能力,同時展現良好的流動性。
近來,已經改進了半導體元件的集成度。在將多層高密度半導體元件囊封在小型且薄的封裝中的半導體裝置中,由於在操作中從半導體元件產生的熱量,可能頻繁地發生如封裝破裂或失靈的故障。
作為解決由於熱量產生引起的問題的解決方案,在模制用於囊封的環氧樹脂時,將由如金屬的散熱材料形成的散熱片添加到半導體裝置。然而,這種散熱片僅可用於如細節距球柵陣列(fine pitch ball grid array;FBGA)和四方扁平封裝(quad flat package;QFP)的一些封裝中,且由於需要額外的裝配製程而具有巨大費用和生產率降低的問題。因此,迫切需要用於囊封半導體元件的環氧樹脂材料,所述環氧樹脂材料具有高熱導率且因此具有良好的散熱能力。一些半導體封裝使用球形氧化鋁(aluminum oxide/alumina)。
氧化鋁的熱導率是約25瓦特/米·開爾文到約30瓦特/米·開爾文。然而,由於包含在用於囊封半導體元件的環氧樹脂組成物中的環氧樹脂具有0.2瓦特/米·開爾文的極低熱導率,所以即使使用氧化鋁也難以將由組成物形成的囊封層的熱導率增加到大於6瓦特/米·開爾文。另外,儘管銅、鋁以及銀粒子具有高熱導率,但具有不良的絕緣性能,且儘管氮化鋁、氮化硼以及碳化矽填充劑具有相對良好的絕緣性能,但由於其不良的流動性而無法確保高的填充劑負載率。儘管近年來已報告了關於增加環氧樹脂的熱導率的許多成功案例,但尚未實現利用壓縮的絕緣熱固性樹脂囊封的半導體材料的商業化。
因此,需要一種用於囊封半導體元件的環氧樹脂組成物,所述環氧樹脂組成物包含在熱導率和流動性方面具有比常規環氧樹脂更好特性的環氧樹脂,且可具有高熱導率且因此具有改進的散熱能力,由此抑制半導體封裝的熱引發的失靈或缺陷。
本發明的方面提供一種用於囊封半導體元件的環氧樹脂組成物,所述環氧樹脂組成物由於高熱導率而具有顯著改進的散熱能力,同時展現改進的流動性。
根據本發明的一個方面,提供一種用於囊封半導體元件的環氧樹脂組成物,所述環氧樹脂組成物包含環氧樹脂;固化劑;無機填充劑;以及固化催化劑,其中環氧樹脂包含由式1表示的環氧樹脂:
[式1]
其中X是O、S、C(=O)、C
1到C
5伸烷基或NH;
R
1、R
2、R
3、R
4以及R
5中的一個由式2表示且其餘的各自獨立地是氫、鹵素、胺基(-NH
2)、氰基(-CN)、羥基(-OH)、取代或未取代的C
1到C
20烷基、取代或未取代的C
3到C
20環烷基、取代或未取代的C
6到C
20芳基或取代或未取代的C
7到C
20芳烷基;以及
R
6、R
7、R
8、R
9以及R
10中的一個由式2表示且其餘的各自獨立地是氫、鹵素、胺基、氰基、羥基、取代或未取代的C
1到C
20烷基、取代或未取代的C
3到C
20環烷基、取代或未取代的C
6到C
20芳基或取代或未取代的C
7到C
20芳烷基。
[式2]
其中*是元素之間的鍵聯位點且R
11是取代或未取代的C
1到C
10伸烷基。
根據本發明的另一方面,提供一種使用根據本發明的用於囊封半導體元件的環氧樹脂組成物來囊封的根據本發明的半導體元件。
本發明提供一種用於囊封半導體元件的環氧樹脂組成物,所述環氧樹脂組成物由於高熱導率而具有顯著改進的散熱能力,同時展現改進的流動性。
如本文所使用,為了表示特定數值範圍,表述「X到Y」意指「大於或等於X且小於或等於Y」。
如本文中所使用,除非另外陳述,否則表述「取代或未取代的」中的術語「取代的」意指對應官能團的至少一個氫原子由羥基、胺基、硝基、氰基、C
1到C
20烷基、C
1到C
20鹵代烷基、C
6到C
30芳基、C
3到C
30雜芳基、C
3到C
10環烷基、C
3到C
10雜環烷基、C
7到C
30芳烷基或C
1到C
30雜烷基取代。
為了為用於囊封半導體元件的環氧樹脂組成物賦予高熱導率,有必要使用相對大量的無機填充劑。然而,大量使用無機填充劑可使得組成物的黏度增加和組成物的流動性降低,這導致難以形成半導體封裝。為了解決這類問題,可考慮使用作為具有相對高熱導率的無機填充劑的氧化鋁。然而,由於基本上包含在組成物中的環氧樹脂具有約0.2瓦特/米·開爾文的極低熱導率,所以使用氧化鋁增加組成物的熱導率存在限制。
根據本發明的用於囊封半導體元件的環氧樹脂組成物包含環氧樹脂、固化劑、無機填充劑以及固化催化劑,其中環氧樹脂包含由式1表示的環氧樹脂。由式1表示的環氧樹脂具有高熱導率,由此改進組成物的散熱特性,同時展現良好的流動性。
環氧樹脂
環氧樹脂包含由式1表示的環氧樹脂。由式1表示的環氧樹脂可由於其高熱導率而顯著地改進組成物的散熱特性且可由於其良好的流動性而改進組成物的可加工性。
[式1]
其中X是O、S、C(=O)、C
1到C
5伸烷基或NH;
R
1、R
2、R
3、R
4以及R
5中的一個由式2表示且其餘的各自獨立地是氫、鹵素、胺基(-NH
2)、氰基(-CN)、羥基(-OH)、取代或未取代的C
1到C
20烷基、取代或未取代的C
3到C
20環烷基、取代或未取代的C
6到C
20芳基或取代或未取代的C
7到C
20芳烷基;以及
R
6、R
7、R
8、R
9以及R
10中的一個由式2表示且其餘的各自獨立地是氫、鹵素、胺基、氰基、羥基、取代或未取代的C
1到C
20烷基、取代或未取代的C
3到C
20環烷基、取代或未取代的C
6到C
20芳基或取代或未取代的C
7到C
20芳烷基。
[式2]
其中*是元素之間的鍵聯位點且R
11是取代或未取代的C
1到C
10伸烷基。
優選地,X是O或S,更優選地O。
優選地,R
1、R
2、R
3、R
4以及R
5中的一個是由式2表示的官能團且其餘的各自獨立地是氫或取代或未取代的C
1到C
10烷基,更優選地氫或C
1到C
3烷基。
優選地,R
6、R
7、R
8、R
9以及R
10中的一個是由式2表示的官能團,且其餘的各自獨立地是氫或取代或未取代的C
1到C
10烷基,更優選地氫或C
1到C
3烷基。
優選地,R
11是取代或未取代的C
1到C
5伸烷基,更優選地取代或未取代的C
1到C
3伸烷基。
在一個實施例中,由式1表示的環氧樹脂可包含從由式1-1、式1-2以及式1-3表示的化合物當中選出的至少一個:
[式1-1]
[式1-2]
[式1-3]
其中X與式1中所定義的相同;
R
11和R
12各自獨立地是取代或未取代的C
1到C
10伸烷基;
R
1、R
2、R
3、R
4、R
5、R
6、R
7、R
8、R
9以及R
10各自獨立地是氫、鹵素、胺基、氰基、羥基、取代或未取代的C
1到C
20烷基、取代或未取代的C
3到C
20環烷基、取代或未取代的C
6到C
20芳基或取代或未取代的C
7到C
20芳烷基。
在一些實施例中,在式1-1、式1-2以及式1-3中,R
1、R
2、R
3、R
4、R
5、R
6、R
7、R
8、R
9以及R
10可各自獨立地是氫或取代或未取代的C
1到C
3烷基。
作為由式1、式1-1、式1-2以及式1-3表示的環氧樹脂可單獨的或以其組合形式用於環氧樹脂組成物中。由式1表示的環氧樹脂可以約2重量%到約17重量%(例如2重量%、3重量%、4重量%、5重量%、6重量%、7重量%、8重量%、9重量%、10重量%、11重量%、12重量%、13重量%、14重量%、15重量%、16重量%或17重量%),具體來說2重量%到10重量%的量存在於環氧樹脂組成物中。在這一範圍內,環氧樹脂可改進組成物的散熱特性而不降低組成物的可固化性。
由式1表示的環氧樹脂可參考式1通過本領域的技術人員已知的任何典型的方法製備。舉例來說,由式1表示的環氧樹脂可通過使由式4表示的化合物與二羧酸化合物反應來製備,除了R
1、R
2、R
3、R
4以及R
5中的一個是式3且R
6、R
7、R
8、R
9以及R
10中的一個是式3之外,所述二羧酸化合物與由式1表示的環氧樹脂大體上相同。
[式3]
其中*是元素之間的鍵聯位點。
[式4]
其中Y是鹵素且R
11與式2中所定義的相同。
環氧樹脂可更包含除由式1表示的環氧樹脂外的環氧樹脂。為方便起見,由式1表示的環氧樹脂將稱為「第一環氧樹脂」,且除由式1表示的環氧樹脂外的環氧樹脂將稱為「第二環氧樹脂」。
第二環氧樹脂含有每分子至少兩個環氧基,且可包含雙酚A環氧樹脂、雙酚F環氧樹脂、苯酚酚醛清漆環氧樹脂、第三丁基兒茶酚環氧樹脂、萘環氧樹脂、縮水甘油基胺環氧樹脂、甲酚酚醛清漆環氧樹脂、聯苯基環氧樹脂、苯酚芳烷基環氧樹脂、線性脂族環氧樹脂、脂環族環氧樹脂、雜環環氧樹脂、螺環環氧樹脂、環己烷二甲醇環氧樹脂、三羥甲基環氧樹脂、鹵化環氧樹脂等。作為第二環氧樹脂,這些環氧樹脂可單獨使用或以其混合物形式使用。
環氧樹脂可以約2重量%到約17重量%(例如2重量%、3重量%、4重量%、5重量%、6重量%、7重量%、8重量%、9重量%、10重量%、11重量%、12重量%、13重量%、14重量%、15重量%、16重量%或17重量%),具體來說2重量%到10重量%的量存在於環氧樹脂組成物中。在這一範圍內,組成物可避免可固化性的降低。
固化劑
固化劑可包含:多元苯酚化合物,如多官能苯酚樹脂、苯酚芳烷基樹脂、苯酚酚醛清漆樹脂、新苯酚樹脂(Xylok phenol resin)、甲酚酚醛苯酚樹脂、萘酚苯酚樹脂、萜類苯酚樹脂、二環戊二烯苯酚樹脂、從雙酚A和甲階酚醛樹脂合成的酚醛清漆苯酚樹脂、三(羥基苯基)甲烷以及二羥基聯苯;酸酐,如順丁烯二酸酐和鄰苯二甲酸酐;以及芳族胺,如間苯二胺、二胺基二苯基甲烷以及二胺基二苯碸。優選地,固化劑是新苯酚樹脂或苯酚芳烷基樹脂。
固化劑可以約0.5重量%到約13重量%(例如0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%、5重量%、6重量%、7重量%、8重量%、9重量%、10重量%、11重量%、12重量%、或13重量%)的量存在於環氧樹脂組成物中。在這一範圍內,組成物可避免可固化性的降低。
無機填充劑
無機填充劑可改進環氧樹脂組成物的機械特性,同時降低環氧樹脂組成物的應力。另外,根據本發明的無機填充劑可提高環氧樹脂組成物的熱導率且因此提高散熱特性,可改進環氧樹脂組成物的流動性,且可降低環氧樹脂組成物的熱膨脹和吸濕性。
無機填充劑可包含從以下當中選出的至少一種:熔融矽石、結晶矽石、碳酸鈣、碳酸鎂、氧化鋁、氧化鎂、黏土、滑石、矽酸鈣、氧化鈦、氧化銻以及玻璃纖維。
優選地,無機填充劑包含氧化鋁。氧化鋁具有約25瓦特/米·開爾文到約30瓦特/米·開爾文的熱導率且可易於提高組成物的熱導率。
氧化鋁可具有球形或非球形形狀,但不限於此。當氧化鋁具有球形形狀時,氧化鋁可改進組成物的流動性。氧化鋁的平均粒徑(D
50)可以是約0.5微米到約50微米,具體來說約0.5微米到約30微米。在這一範圍內,組成物可在流動性和熱導率方面具有良好特性。在一個實施例中,氧化鋁可包含具有不同平均粒徑(D
50)的兩種類型的氧化鋁的混合物。舉例來說,氧化鋁可以是其中第一類型的氧化鋁和第二類型的氧化鋁以約1:1到約10:1的重量比存在的混合物,其中第一類型的氧化鋁可具有比第二類型的氧化鋁更大的平均粒徑(D
50)。可按需要在併入到組成物中之前用環氧樹脂或固化劑塗布氧化鋁。
組成物中的無機填充劑的量可根據組成物所需的特性(如熱導率、可模制性、減小的內應力以及高溫下的強度)而變化。在一些實施例中,無機填充劑可以約70重量%到約95重量%(例如70重量%、71重量%、72重量%、73重量%、74重量%、75重量%、76重量%、77重量%、78重量%、79重量%、80重量%、81重量%、82重量%、83重量%、84重量%、85重量%、86重量%、87重量%、88重量%、89重量%、90重量%、91重量%、92重量%、93重量%、94重量%或95重量%)的量存在於環氧樹脂組成物中。在這一範圍內,無機填充劑可確保環氧樹脂組成物的阻燃性、流動性以及可靠性。
固化催化劑
固化催化劑可包含叔胺、有機金屬化合物、有機磷化合物、咪唑化合物以及硼化合物。叔胺的實例可包含苯甲基二甲胺、三乙醇胺、三伸乙基二胺、二乙基胺基乙醇、三(二甲基胺基甲基)苯酚、2,2-(二甲基胺基甲基)苯酚、2,4,6-三(二胺基甲基)苯酚以及己酸三-2-乙酯。有機金屬化合物的實例可包含乙醯丙酮酸鉻、乙醯丙酮酸鋅以及乙醯丙酮酸鎳。有機磷化合物的實例可包含三苯基膦、三-4-甲氧基膦、三苯基膦-三苯基硼烷以及三苯基膦-1,4-苯醌加合物。咪唑化合物的實例可包含2-甲基咪唑、2-苯基咪唑、2-胺基咪唑、2-甲基-1-乙烯基咪唑、2-乙基-4-甲基咪唑以及2-十七烷基咪唑。硼化合物的實例可包含三苯基膦四苯基硼酸酯、四苯基硼鹽、三氟硼烷-正己胺、三氟硼烷單乙胺、四氟硼烷三乙胺以及四氟硼烷胺。除這些化合物之外,1,5-二氮雜雙環[4.3.0]壬-5-烯(1,5-diazabicyclo[4.3.0]non-5-ene;DBN)、1,8-二氮雜雙環[5.4.0]十一-7-烯(1,8-diazabicyclo[5.4.0]undec-7-ene;DBU)以及苯酚酚醛清漆樹脂鹽可用作固化催化劑。
固化催化劑可以通過使固化催化劑與環氧樹脂或固化劑預反應製備的加合物的形式使用。
固化催化劑可以約0.01重量%到約5重量%(例如0.01重量%、0.02重量%、0.03重量%、0.04重量%、0.05重量%、0.06重量%、0.07重量%、0.08重量%、0.09重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%或5重量%)的量存在於環氧樹脂組成物中。在這一範圍內,固化催化劑可確保組成物的流動性,同時防止組成物的固化延遲。
環氧樹脂組成物可更包含可在用於囊封半導體元件的環氧樹脂組成物中使用的任何典型的添加劑。在一些實施例中,添加劑可包含從以下當中選出的至少一個:偶合劑、脫模劑、著色劑、應力緩解劑(stress reliever)、交聯強化劑以及調平劑。
偶合劑用以通過與環氧樹脂和無機填充劑反應來增加環氧樹脂與無機填充劑之間的介面強度,且可包含例如矽烷偶合劑。矽烷偶合劑可包含但不限於可通過與環氧樹脂和無機填充劑反應來增加環氧樹脂與無機填充劑之間的介面強度的任何矽烷偶合劑。矽烷偶合劑的實例可包含環氧矽烷、胺基矽烷、脲基矽烷、巰基矽烷以及烷基矽烷。這些可單獨使用或以其組合形式使用。偶合劑可以約0.01重量%到約5重量%,具體來說約0.05重量%到約3重量%的量存在於用於囊封半導體元件的環氧樹脂組成物中。在這一範圍內,環氧樹脂組成物的固化產物可具有增加的強度。
脫模劑可包含從由以下組成的群組選出的至少一種:石蠟、酯蠟、高級脂肪酸、高級脂肪酸的金屬鹽、天然脂肪酸以及天然脂肪酸的金屬鹽。脫模劑可以約0.1重量%到約1重量%的量存在於環氧樹脂組成物中。
著色劑可包含碳黑。著色劑可以約0.1重量%到約1重量%的量存在於環氧樹脂組成物中。
應力鬆弛劑可包含從由以下組成的群組選出的至少一種:改性的矽酮油、矽酮彈性體、矽酮粉末以及矽酮樹脂,但不限於此。應力鬆弛劑可任選地以約2重量%或小於2重量%、例如約1重量%或小於1重量%,具體來說約0.1重量%到約1重量%的量存在於環氧樹脂組成物中。
添加劑可以約0.1重量%到約5重量%、例如約0.1重量%到約3重量%的量存在於環氧樹脂組成物中。
儘管環氧樹脂組成物的製備方法不受特定限制,但環氧樹脂組成物可通過以下製程製備:其中將前述組分均一地混合在亨舍爾(Henschel)混合器或羅迪格(Lödige)混合器中,緊接著在輥筒研磨機或捏合機中在約90℃到約120℃下進行熔融捏合,且隨後所得物經歷冷卻和粉碎。
根據本發明的半導體元件使用用於囊封根據本發明的半導體元件的環氧樹脂組成物來囊封。可通過本領域中已知的任何合適的方法用環氧樹脂組成物來囊封半導體元件,所述方法如轉移模制、注射模制、澆鑄以及壓縮模制。在一個實施例中,可通過在低壓下轉移模制用環氧樹脂組成物來囊封半導體元件。在另一實施例中,可通過壓縮模制用環氧樹脂組成物來囊封半導體元件。
接下來,將參考一些實例更詳細地描述本發明。然而,應注意,提供這些實例僅為了說明,且不應以任何方式理解為限制本發明。
製備實例 1 :製備環氧樹脂
將過量的由式5-2表示的化合物添加到由式5-1表示的化合物,接著在加熱到110℃下攪拌的同時進行反應。此後,反應產物冷卻到室溫,接著使用旋轉式蒸發器(浴溫:50℃,壓力:30毫巴)去除由式5-2表示的化合物的未反應殘餘物。此後,所得化合物溶解於甲苯中,接著加熱到80℃。此後,NaOH的水溶液添加到所得物,接著反應,且隨後通過過濾器過濾反應產物,接著使用旋轉式蒸發器去除剩餘溶劑,由此製備由式5表示的環氧樹脂。
[式5-1]
[式5-2]
[式5]
製備實例 2 :製備環氧樹脂
將過量的由式5-2表示的化合物添加到由式6-1表示的化合物,接著在加熱到110℃下進行反應。此後,反應產物冷卻到室溫,接著使用旋轉式蒸發器(浴溫:50℃,壓力:30毫巴)去除由式5-2表示的化合物的未反應殘餘物。此後,所得化合物溶解於甲苯中,接著加熱到80℃。此後,NaOH的水溶液添加到所得物,接著反應,且隨後通過過濾器過濾反應產物,接著使用旋轉式蒸發器去除剩餘溶劑,由此製備由式6表示的環氧樹脂。
[式6-1]
[式6]
實例和比較例中所使用的組分的細節如下:
(A)環氧樹脂
(A1)製備實例1中製備的環氧樹脂
(A2)製備實例2中製備的環氧樹脂
(A3)NC-3000(苯酚芳烷基環氧樹脂,日本化藥株式會社(Nippon Kayaku Co., Ltd.))
(A4)EPPN-501HY(多官能環氧樹脂,日本化藥株式會社)
(A5)由式7表示的環氧樹脂:
(B)固化劑
(B1)KPH-F3065(新苯酚樹脂,可隆化工(Kolon Chemical))
(B2)MEH-7851(苯酚芳烷基樹脂,明和產業株式會社(Meiwa Corporation))
(C)固化催化劑:三苯基膦(北興化學(Hokko Chemical))
(D)無機填充劑:具有20微米的平均粒徑(D50)的球形熔融氧化鋁與具有0.5微米的平均粒徑(D50)的球形熔融氧化鋁的混合物(重量比:9:1)
(E)偶合劑
(E1)甲基三甲氧基矽烷(SZ-6070,道康寧公司(Dow Corning Corporation))
(E2)KBM-573(N-苯基-3-胺基丙基三甲氧基矽烷,信越化學工業(Shinetsu Chemical))
(F)碳黑(MA-600B,三菱化學(Mitsubishi Chemical))
實例
1
到實例
5
以及比較例
1
到比較例
4
將前述組分以表1中所列舉的量(單位:重量份)在亨舍爾混合器(KSM-22,錦星機械有限公司(Keum Sung Machinery Co., Ltd.))中在25℃到30℃下均一地混合30分鐘,且隨後在連續捏合機中在高達110℃的溫度下熔融捏合30分鐘,接著冷卻到10℃到15℃並粉碎,由此製備用於囊封半導體元件的環氧樹脂組成物。在表1中,「-」意指未使用對應組分。
按照以下特性來評估實例1到實例5以及比較例1到比較例4中所製備的環氧樹脂組成物中的每一個。結果顯示於表1中。
(1)流動性(單位:英寸):在175℃的模具溫度、70千克力/平方公分的負載、9兆帕的注入壓力以及90秒的固化時間的條件下,使用低壓轉移模制機將所製備的環氧樹脂組成物中的每一個注入到模具中以用於根據EMMI-1-66測量流動性,接著測量流動長度。流動長度越大指示流動性越好。
(2)熱導率(單位:瓦特/米·開爾文):根據ASTM D5470使用所製備的環氧樹脂組成物中的每一個來製備試樣,接著在25℃下測量試樣的熱導率
(3)半導體表面溫度(單位:℃):用於測試的半導體元件安裝在板上且隨後通過線接合連接到板。隨後,所製備的環氧樹脂組成物中的每一個以500微米的厚度模制到半導體元件上以用於在175℃下測試120秒。隨後,將所得半導體封裝放置在測試設備中,且隨後半導體元件通過對半導體元件施加電壓而操作1小時,接著使用非接觸式溫度計來測量半導體封裝的表面上的溫度。
表1
實例 | 比較例 | |||||||||
1 | 2 | 3 | 4 | 5 | 1 | 2 | 3 | 4 | ||
A | A1 | 5.6 | 3.6 | 5.6 | 3.6 | - | - | - | - | - |
A2 | - | - | - | - | 5.6 | - | - | - | - | |
A3 | - | - | - | - | - | 5.6 | 5.6 | - | - | |
A4 | - | - | - | - | - | - | - | 5.6 | - | |
A5 | - | - | - | - | - | - | - | - | 5.6 | |
B | B1 | 2 | 4 | - | - | 2 | 2 | - | 2 | 2 |
B2 | - | - | 2 | 4 | - | - | 2 | - | - | |
C | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | |
D | 91 | 91 | 91 | 91 | 91 | 91 | 91 | 91 | 91 | |
E | E1 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
E2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |
F | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | |
流動性 | 68 | 75 | 73 | 84 | 69 | 80 | 76 | 71 | 10 | |
熱導率 | 3.7 | 3.6 | 3.5 | 3.8 | 3.9 | 2.5 | 2.6 | 2.7 | 3.6 | |
半導體表面溫度 | 35 | 37 | 38 | 33 | 32 | 80 | 75 | 73 | 37 |
如表1所示,根據本發明的用於囊封半導體元件的環氧樹脂組成物由於高熱導率而具有良好的流動性且展現良好散熱特性,由此使得操作中的半導體元件的表面溫度能夠保持較低。
相反,不含根據本發明的由式1表示的環氧樹脂的比較例的組成物由於低熱導率而展現不良的散熱特性或由於低流動性而展現不良的可模制性。
應理解,本領域的技術人員可在不脫離本發明的精神和範圍的情況下進行各種修改、變化、更改以及等效實施例。
無
無。
無。
Claims (6)
- 一種用於囊封半導體元件的環氧樹脂組成物,包括:2重量%到17重量%的環氧樹脂;0.5重量%到13重量%的固化劑;70重量%到95重量%的無機填充劑;以及0.01重量%到5重量%的固化催化劑,其中所述環氧樹脂包括由式1表示的環氧樹脂:
- 如請求項2所述的用於囊封半導體元件的環氧樹脂組成物,其中在式1-1、式1-2以及式1-3中,R1、R2、R3、R4、R5、R6、R7、R8、R9以及R10各自獨立地是氫或取代或未取代的C1到C3烷基。
- 如請求項1所述的用於囊封半導體元件的環氧樹脂組成物,其中所述由式1表示的環氧樹脂以2重量%到17重量%的量存在於所述環氧樹脂組成物中。
- 如請求項1所述的用於囊封半導體元件的環氧樹脂組成物,其中所述無機填充劑包括氧化鋁。
- 一種半導體元件,使用如請求項1到請求項5中任一項所述的用於囊封半導體元件的環氧樹脂組成物囊封。
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TW202219170A (zh) | 2022-05-16 |
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