TWI814953B - 異向性導電膜、連接構造體、及連接構造體之製造方法 - Google Patents
異向性導電膜、連接構造體、及連接構造體之製造方法 Download PDFInfo
- Publication number
- TWI814953B TWI814953B TW108143135A TW108143135A TWI814953B TW I814953 B TWI814953 B TW I814953B TW 108143135 A TW108143135 A TW 108143135A TW 108143135 A TW108143135 A TW 108143135A TW I814953 B TWI814953 B TW I814953B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive particles
- anisotropic conductive
- conductive film
- arrangement
- axis
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 title description 10
- 239000002245 particle Substances 0.000 claims abstract description 238
- 239000011347 resin Substances 0.000 claims abstract description 80
- 229920005989 resin Polymers 0.000 claims abstract description 80
- 239000012528 membrane Substances 0.000 claims 1
- 230000000717 retained effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 73
- 239000011295 pitch Substances 0.000 description 50
- 239000003505 polymerization initiator Substances 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 238000002788 crimping Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 acrylate compound Chemical class 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2018-234746 | 2018-12-14 | ||
| JP2018234746A JP2020095922A (ja) | 2018-12-14 | 2018-12-14 | 異方性導電フィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202029223A TW202029223A (zh) | 2020-08-01 |
| TWI814953B true TWI814953B (zh) | 2023-09-11 |
Family
ID=71075694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108143135A TWI814953B (zh) | 2018-12-14 | 2019-11-27 | 異向性導電膜、連接構造體、及連接構造體之製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2020095922A (fr) |
| KR (2) | KR20210082230A (fr) |
| CN (1) | CN113056844B (fr) |
| TW (1) | TWI814953B (fr) |
| WO (1) | WO2020121787A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240090571A (ko) | 2021-11-30 | 2024-06-21 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201535897A (zh) * | 2013-11-19 | 2015-09-16 | Dexerials Corp | 異向導電性膜及連接構造體 |
| TW201635313A (zh) * | 2014-10-28 | 2016-10-01 | Dexerials Corp | 異向導電性膜及連接構造體 |
| WO2016190432A1 (fr) * | 2015-05-27 | 2016-12-01 | デクセリアルズ株式会社 | Film conducteur anisotrope et structure de connexion |
| TW201833944A (zh) * | 2016-12-01 | 2018-09-16 | 日商迪睿合股份有限公司 | 異向性導電膜 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58146490A (ja) | 1982-02-26 | 1983-09-01 | Mitsubishi Metal Corp | 硫酸酸性銅電解液中のアンチモンの除去方法 |
| JPS6119718U (ja) | 1984-07-11 | 1986-02-05 | カルソニックカンセイ株式会社 | 表示装置 |
| JP6119718B2 (ja) * | 2013-11-19 | 2017-04-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
| JP2015232660A (ja) * | 2014-06-10 | 2015-12-24 | 株式会社Ｊｏｌｅｄ | 表示装置の製造方法及び表示装置 |
| JP6661997B2 (ja) * | 2015-11-26 | 2020-03-11 | デクセリアルズ株式会社 | 異方性導電フィルム |
-
2018
- 2018-12-14 JP JP2018234746A patent/JP2020095922A/ja active Pending
-
2019
- 2019-11-22 WO PCT/JP2019/045813 patent/WO2020121787A1/fr active Application Filing
- 2019-11-22 KR KR1020217016073A patent/KR20210082230A/ko active Application Filing
- 2019-11-22 CN CN201980079141.8A patent/CN113056844B/zh active Active
- 2019-11-22 KR KR1020247018255A patent/KR20240091271A/ko not_active Application Discontinuation
- 2019-11-27 TW TW108143135A patent/TWI814953B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201535897A (zh) * | 2013-11-19 | 2015-09-16 | Dexerials Corp | 異向導電性膜及連接構造體 |
| TW201635313A (zh) * | 2014-10-28 | 2016-10-01 | Dexerials Corp | 異向導電性膜及連接構造體 |
| WO2016190432A1 (fr) * | 2015-05-27 | 2016-12-01 | デクセリアルズ株式会社 | Film conducteur anisotrope et structure de connexion |
| TW201833944A (zh) * | 2016-12-01 | 2018-09-16 | 日商迪睿合股份有限公司 | 異向性導電膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020095922A (ja) | 2020-06-18 |
| TW202029223A (zh) | 2020-08-01 |
| WO2020121787A1 (fr) | 2020-06-18 |
| KR20210082230A (ko) | 2021-07-02 |
| CN113056844A (zh) | 2021-06-29 |
| KR20240091271A (ko) | 2024-06-21 |
| CN113056844B (zh) | 2023-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7356046B2 (ja) | 異方導電性フィルム及び接続構造体 | |
| US11794444B2 (en) | Anisotropic conductive film | |
| JP2023001341A (ja) | 異方導電性フィルム及び接続構造体 | |
| TWI776778B (zh) | 異向性導電膜、連接結構體、及連接結構體之製造方法 | |
| US10854571B2 (en) | Anisotropic conductive film with conductive particles forming repeating units of polygons | |
| JP2017175093A (ja) | 電子部品、接続体、電子部品の設計方法 | |
| JP2022069457A (ja) | 異方性導電フィルム | |
| TWI814953B (zh) | 異向性導電膜、連接構造體、及連接構造體之製造方法 | |
| CN112534650B (zh) | 各向异性导电薄膜 | |
| TWI764821B (zh) | 異向性導電膜 | |
| TWI823170B (zh) | 異向性導電膜之製造方法、異向性導電膜之設計方法、異向性導電膜、連接結構體、及連接結構體之製造方法 | |
| WO2023153313A1 (fr) | Procédé de conception pour film conducteur | |
| KR20240134339A (ko) | 도전 필름의 설계 방법 |