TWI814256B - 導電接觸針與其製造方法 - Google Patents

導電接觸針與其製造方法 Download PDF

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Publication number
TWI814256B
TWI814256B TW111106146A TW111106146A TWI814256B TW I814256 B TWI814256 B TW I814256B TW 111106146 A TW111106146 A TW 111106146A TW 111106146 A TW111106146 A TW 111106146A TW I814256 B TWI814256 B TW I814256B
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TW
Taiwan
Prior art keywords
conductive contact
metal
opening pattern
contact pin
contact tip
Prior art date
Application number
TW111106146A
Other languages
English (en)
Chinese (zh)
Other versions
TW202234071A (zh
Inventor
安範模
朴勝浩
宋台煥
Original Assignee
南韓商普因特工程有限公司
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Publication date
Application filed by 南韓商普因特工程有限公司 filed Critical 南韓商普因特工程有限公司
Publication of TW202234071A publication Critical patent/TW202234071A/zh
Application granted granted Critical
Publication of TWI814256B publication Critical patent/TWI814256B/zh

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • G01R1/06761Material aspects related to layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)
TW111106146A 2021-02-22 2022-02-21 導電接觸針與其製造方法 TWI814256B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210023287A KR102519285B1 (ko) 2021-02-22 2021-02-22 전기 전도성 접촉핀 및 이의 제조방법
KR10-2021-0023287 2021-02-22

Publications (2)

Publication Number Publication Date
TW202234071A TW202234071A (zh) 2022-09-01
TWI814256B true TWI814256B (zh) 2023-09-01

Family

ID=82930984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111106146A TWI814256B (zh) 2021-02-22 2022-02-21 導電接觸針與其製造方法

Country Status (3)

Country Link
KR (1) KR102519285B1 (ko)
TW (1) TWI814256B (ko)
WO (1) WO2022177390A1 (ko)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030210063A1 (en) * 2000-06-01 2003-11-13 Sumitomo Electric Industries, Ltd. Contact probe with guide unit and fabrication method thereof
TWI221191B (en) * 2001-04-23 2004-09-21 Chipmos Technologies Inc Method of making the resilient probe needles
KR20100027740A (ko) * 2008-09-03 2010-03-11 윌테크놀러지(주) 프로브 본딩 방법
JP2013101043A (ja) * 2011-11-08 2013-05-23 Renesas Electronics Corp 半導体装置の製造方法
JP6029764B2 (ja) * 2013-08-30 2016-11-24 富士フイルム株式会社 金属充填微細構造体の製造方法
KR20170061314A (ko) * 2015-11-26 2017-06-05 한국기계연구원 프로브 핀 및 이의 제조방법
TW201729969A (zh) * 2015-10-20 2017-09-01 日本電子材料股份有限公司 立體構造體的製作方法、使用於該製造方法的模具及電性接觸件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG75186A1 (en) 1998-11-30 2000-09-19 Advantest Corp Method for producing contact structures
KR20080110037A (ko) * 2007-06-14 2008-12-18 서수정 프로브 카드용 버티칼형 프로브 어셈블리 및 그의 제조방법
KR100977207B1 (ko) 2008-09-03 2010-08-20 윌테크놀러지(주) 프로브 및 프로브 카드의 제조 방법
KR101496706B1 (ko) 2008-10-31 2015-02-27 솔브레인이엔지 주식회사 프로브 구조물 및 프로브 구조물 제조 방법
WO2016185994A1 (ja) 2015-05-15 2016-11-24 住友ベークライト株式会社 電子装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030210063A1 (en) * 2000-06-01 2003-11-13 Sumitomo Electric Industries, Ltd. Contact probe with guide unit and fabrication method thereof
TWI221191B (en) * 2001-04-23 2004-09-21 Chipmos Technologies Inc Method of making the resilient probe needles
KR20100027740A (ko) * 2008-09-03 2010-03-11 윌테크놀러지(주) 프로브 본딩 방법
JP2013101043A (ja) * 2011-11-08 2013-05-23 Renesas Electronics Corp 半導体装置の製造方法
JP6029764B2 (ja) * 2013-08-30 2016-11-24 富士フイルム株式会社 金属充填微細構造体の製造方法
TW201729969A (zh) * 2015-10-20 2017-09-01 日本電子材料股份有限公司 立體構造體的製作方法、使用於該製造方法的模具及電性接觸件
KR20170061314A (ko) * 2015-11-26 2017-06-05 한국기계연구원 프로브 핀 및 이의 제조방법

Also Published As

Publication number Publication date
KR102519285B1 (ko) 2023-04-17
KR20220119880A (ko) 2022-08-30
WO2022177390A1 (ko) 2022-08-25
TW202234071A (zh) 2022-09-01

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