TWI814256B - 導電接觸針與其製造方法 - Google Patents
導電接觸針與其製造方法 Download PDFInfo
- Publication number
- TWI814256B TWI814256B TW111106146A TW111106146A TWI814256B TW I814256 B TWI814256 B TW I814256B TW 111106146 A TW111106146 A TW 111106146A TW 111106146 A TW111106146 A TW 111106146A TW I814256 B TWI814256 B TW I814256B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive contact
- metal
- opening pattern
- contact pin
- contact tip
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000002346 layers by function Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 72
- 239000000463 material Substances 0.000 claims description 30
- 230000000873 masking effect Effects 0.000 claims description 23
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 23
- 230000008569 process Effects 0.000 description 19
- 239000003795 chemical substances by application Substances 0.000 description 18
- 238000001514 detection method Methods 0.000 description 18
- 239000010410 layer Substances 0.000 description 17
- 229910045601 alloy Inorganic materials 0.000 description 14
- 239000000956 alloy Substances 0.000 description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000010948 rhodium Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052703 rhodium Inorganic materials 0.000 description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000007743 anodising Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Contacts (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210023287A KR102519285B1 (ko) | 2021-02-22 | 2021-02-22 | 전기 전도성 접촉핀 및 이의 제조방법 |
KR10-2021-0023287 | 2021-02-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202234071A TW202234071A (zh) | 2022-09-01 |
TWI814256B true TWI814256B (zh) | 2023-09-01 |
Family
ID=82930984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111106146A TWI814256B (zh) | 2021-02-22 | 2022-02-21 | 導電接觸針與其製造方法 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102519285B1 (ko) |
TW (1) | TWI814256B (ko) |
WO (1) | WO2022177390A1 (ko) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030210063A1 (en) * | 2000-06-01 | 2003-11-13 | Sumitomo Electric Industries, Ltd. | Contact probe with guide unit and fabrication method thereof |
TWI221191B (en) * | 2001-04-23 | 2004-09-21 | Chipmos Technologies Inc | Method of making the resilient probe needles |
KR20100027740A (ko) * | 2008-09-03 | 2010-03-11 | 윌테크놀러지(주) | 프로브 본딩 방법 |
JP2013101043A (ja) * | 2011-11-08 | 2013-05-23 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP6029764B2 (ja) * | 2013-08-30 | 2016-11-24 | 富士フイルム株式会社 | 金属充填微細構造体の製造方法 |
KR20170061314A (ko) * | 2015-11-26 | 2017-06-05 | 한국기계연구원 | 프로브 핀 및 이의 제조방법 |
TW201729969A (zh) * | 2015-10-20 | 2017-09-01 | 日本電子材料股份有限公司 | 立體構造體的製作方法、使用於該製造方法的模具及電性接觸件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG75186A1 (en) | 1998-11-30 | 2000-09-19 | Advantest Corp | Method for producing contact structures |
KR20080110037A (ko) * | 2007-06-14 | 2008-12-18 | 서수정 | 프로브 카드용 버티칼형 프로브 어셈블리 및 그의 제조방법 |
KR100977207B1 (ko) | 2008-09-03 | 2010-08-20 | 윌테크놀러지(주) | 프로브 및 프로브 카드의 제조 방법 |
KR101496706B1 (ko) | 2008-10-31 | 2015-02-27 | 솔브레인이엔지 주식회사 | 프로브 구조물 및 프로브 구조물 제조 방법 |
WO2016185994A1 (ja) | 2015-05-15 | 2016-11-24 | 住友ベークライト株式会社 | 電子装置の製造方法 |
-
2021
- 2021-02-22 KR KR1020210023287A patent/KR102519285B1/ko active IP Right Grant
-
2022
- 2022-02-21 WO PCT/KR2022/002516 patent/WO2022177390A1/ko active Application Filing
- 2022-02-21 TW TW111106146A patent/TWI814256B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030210063A1 (en) * | 2000-06-01 | 2003-11-13 | Sumitomo Electric Industries, Ltd. | Contact probe with guide unit and fabrication method thereof |
TWI221191B (en) * | 2001-04-23 | 2004-09-21 | Chipmos Technologies Inc | Method of making the resilient probe needles |
KR20100027740A (ko) * | 2008-09-03 | 2010-03-11 | 윌테크놀러지(주) | 프로브 본딩 방법 |
JP2013101043A (ja) * | 2011-11-08 | 2013-05-23 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP6029764B2 (ja) * | 2013-08-30 | 2016-11-24 | 富士フイルム株式会社 | 金属充填微細構造体の製造方法 |
TW201729969A (zh) * | 2015-10-20 | 2017-09-01 | 日本電子材料股份有限公司 | 立體構造體的製作方法、使用於該製造方法的模具及電性接觸件 |
KR20170061314A (ko) * | 2015-11-26 | 2017-06-05 | 한국기계연구원 | 프로브 핀 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR102519285B1 (ko) | 2023-04-17 |
KR20220119880A (ko) | 2022-08-30 |
WO2022177390A1 (ko) | 2022-08-25 |
TW202234071A (zh) | 2022-09-01 |
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