TWI221191B - Method of making the resilient probe needles - Google Patents

Abstract

A method of making the resilient probe needles is disclosed. It comprises: forming a first photoresist layer on a substrate, forming a plurality of connecting boards, forming via holes, forming first metal posts, forming a second photoresist layer, forming via holes, forming second metal posts, and removing the photoresist layers. By photolithography and plating technology, a plurality of resilient probe needles are formed on a substrate with proper fine pitches for fitting into the probe card of test apparatus testing the semiconductor devices with high density of end distribution.

Description

1221191 V. Description of the Invention (1) [Field of the Invention] The present invention relates to a method for manufacturing an elastic probe, and particularly to a method for manufacturing a fine needle-shaped elastic probe. [Previous technology] In the conventional test equipment used to test semiconductor devices, especially wafer test equipment, a probe card is installed on the test head of the test equipment, and the probe card is mounted on the probe card. A plurality of probe needles are formed to contact the input / round-out terminals of the semiconductor device to form electrical continuity for testing the function of the semiconductor device. A method of manufacturing a vertical needle type probe card is disclosed in U.S. Patent No. 6,144,212. As shown in FIG. 7, the probe 50 on the probe card 50 The system includes an upper part 51, an intermediate part 5 2 and a lower part.) 5 3 ', wherein the inner diameter of the middle part 5 2 is smaller than the inner diameter of the upper part 5 and the lower part 5 3, so that the structure is relatively small. Weaker than the upper part 51 and lower part 53, and can produce differential expansion due to thermal expansion, making the lower part 53 of the probe 50 difficult to bend or break, and the upper part 51 of the probe 50 is bent into a [shape, with For fixing 'to the upper guide plate, it focuses on the combined manufacturing process of the probe card. The method of manufacturing the probe 520 has not been disclosed. Generally, the conventional probe manufacturing method = the molding method [molding] , Drawing or rolling forming method, if it is a rule ', need to customize the mold, the cost is higher, if drawing or rolling method, the probe = will be limited by 1' In addition, the current endpoint distribution of semiconductor devices is high Degree, the distance between the endpoints is gradually narrowing. Pins are not suitable for testing semiconductor devices with high density end points /

Page 5 1221191 V. Description of the Invention (2). [Objective and Summary of the Invention] "The main purpose is to provide an elastic probe square f 'to solve the above-mentioned problems, using photographic development and electroplating to prepare a plurality of densely spaced and flexible ^ methods on a substrate, = needle Can be applied to probe cards of test equipment, alpha test :: 丄 :: semiconductor devices with bumps. Evenly distributed cakes or cakes, or a second object of the present invention is to provide a method that can be used in photographic development and electroplating methods. Manufacture a plurality of probes with dense pitch and elasticity. The shortcomings of efficiency and easy error are directly formed on the card. * You π enter U is used in artificial pendulum needles. The shortcomings of Xiao u are the probes that consume pure needles. The card can repeat the present invention. Another object is to provide a f-plate with a -metal & and a second c-pin, which is formed in the -knock-folding portion with a thickness smaller than that of the first metal pillar. Use: Material to provide-test the inner diameter and differentness of the semiconductor device. The buffering bomb of the Ding Shun pressure according to the manufacturing method of the elastic probe of the present invention, a first photoresist layer is formed on a substrate; /, /, The steps are: > A plurality of photoresist layers are formed on the m resist layer to expose and develop the first photoresist layer to form at least-a hole penetrating to the substrate is plated with the first metal pillar to the above hole and invited to form a second photoresist layer to the first photoresist layer ^ f Should be connected by connecting bars; 1221191

V. Description of the invention (3) The hole exposes and develops the second photoresist layer to form at least one hole that contacts the plating second metal pillar to the second photoresist layer; and removes the first photoresist layer and the second light The resistance layer forms at least one elastic probe from the corresponding first metal pillar, the connecting bar and the second metal pillar. [Detailed description of the invention] Division: Refer to the attached drawings < The present invention will enumerate the following examples: The cross-sectional schematic diagrams of the sequential steps according to the elastic tilt detection of the present invention are shown in steps 1 to 7 As shown in the figure, the details are as follows. The manufacturing method of the elastic probe of the present invention first provides a substrate: The substrate 10 is a suitable material suitable for electroplating, such as a metal plate, a ceramic circuit substrate, a printed circuit board, or even a probe card ], As shown in FIG. 1 ^, in this embodiment, the substrate 10 is a probe card having a plurality of conductive, dot 11 [conductive pad], and a first photoresist layer is formed on the substrate 10. 20 [first dielectric iayer], such as spin coating or attaching the first photoresist layer 20 [Photoresist layer], the photoresist layer 20 can produce a photochemical reaction to change the structure, its material It can be a positive photoresist such as novolak, polymethyl methacrylate, or a negative photoresist such as diazide, or it can be a photosensitive dry film [dry fi im]. Afterwards, as shown in FIG. 2, a plurality of L link bars 32 are formed on the first photoresist layer 20, and the link bars 32 are in the shape of a long plate, and the material can be selected from, for example, steel, Hengfan Steel [Invar, kovar], alloy 42 or copper-containing alloys

Page 7 Ϊ221191 V. Description of the invention (4) A '--- As shown in Figure 2a, one end of the connecting bar 32 has an opening 321 corresponding to the conductive contact U, and the other end preferably forms an As for the rough surface 322, there are two methods for forming the 32 on the first photoresist layer 20, which can be before the exposure is shown or after the exposure development .. First, first on the first photoresist layer 2 [ The first photoresist layer 20 for exposure is attached to a metal plate, and a photolithography technique is used to form a photoperiod on the metal plate to selectively engrav the protected area to constitute A plurality of. ° 疋, first, directly attach a lead frame having a plurality of connecting bars 32 to the first photoresist layer 20. As shown in the figure Λ, the first photoresist layer 20 is exposed and developed to form at least holes 21 to substrate 10, including exposure [expos rainbow e], development eVe opmen1:], cleaning and hardening. Bake [hard bake] and other cattle, such as the developer, such as alkali metals suitable for positive photoresistance or: alkali two f or 阻 negative photoresistance dimethyl A organic test / valley hole 321 and exposed corresponding The original conductive connection ^ The hole 21 is formed through the open substrate of the connection bar 32. The fourth_circle first place immerses the substrate 10 in the electric money slot chamber and the electric money is formed. The metal column is formed by the hole 21 of the material. The first-metal pillar, such as copper, Hengfan steel [invar, kova ", alloy 42 :: the same, selected from the material 'preferably select a metal material that is more rigid than the joint bar 32: 3: the thickness of the alloy bar 32 It is smaller than the first flesh 'wherein the connection is in phase with the first-golden eyebrow pillar 31, which is an internal control of the pillar 31. At this time, after the connecting strip 32, as shown in Fig. 5, a second photoresist layer is formed in the first attachment mode. 4. Secondly, spin-coating or pasting of the binocular layer is shown on page 81221191 5. Description of the invention (5) [photolithography] technology and the through holes after the above connection belong to the column 3 3 series 3 1 mutual electrical properties, when compared with Sputtering 21, 41, surface ° layer 40 is exposed and exposed to the second photoresist layer 40. In the example, the second gold and the first metal pillar layer 40 have non-conductive metal pillars 31 and 33 deposited in the hole photoresist The surface of layer 40 has at least one hole 4 1 and one end of 32 [with a thick, as shown in FIG. 6, i hole 41 is filled with the second metal and the first metal pillar 31, because the first photoresistive substrate 10 is connected The upper cathode (sputtering) is fast and will not be deposited on the first 'system to the second light' (where the hole 4 1 is a rough surface 32 2). In the plating method, the corner post 3 3 ′ has an approximate inner diameter and is layered with 20 and a second photoresist for electroplating. The photoresist layer 20 and the second photoresist are plated at a much higher speed.

Finally, the first photoresist layer 4G is removed by wet cleaning at a time, and a suitable cleaning agent is used, such as the first peroxy layer.

[H2S05], butanone, or hydroxylamine [NH2〇H] and other solvents, as shown in Figure 7 'to remove the photoresist layer 20, 40, and can form a plurality of The elastic probe 30 composed of the first metal post 31, the connecting bar 32 and the second metal post 33, because the connecting bar 32 is a bent portion of the elastic probe, so as to provide a cushioning elasticity for pressure absorption, and can A plurality of elastic probes 30 having a suitable size and a fine pitch are formed on a substrate 10, and using the elastic probe manufacturing method of the present invention, the connecting strip 32 of each probe 30 can be connected to the first metal pillar 31 And the second metal pillar 33 is different in material selection. And, even, the method for manufacturing the elastic probe of the present invention can directly prolong the needle on the probe card, which solves the low efficiency of manual pendulum in the past.

1221191 Five 'Invention description (6) = ::::; :: Probe: as the substrate 10 during the above processing, so the present invention :: 2: does not need to discard the probe card. 5 shall prevail, and any changes made within the scope defined by the scope of the patent application for which ί ::: is attached will not depart from the spirit and scope of the present invention. ^ All belong to the protection scope of the present invention 1221191 Brief description of the drawings [Illustration of the drawings] Figure 1: According to the method of manufacturing the elastic probe of the present invention, a first photoresist layer and a cross section of a metal plate are formed on a substrate Schematic diagram; Figure 2: Schematic cross-sectional view of an engagement bar formed by etching the metal plate according to the method of manufacturing an elastic probe of the present invention; Figure 2a: Manufacture method of an elastic probe according to the present invention, without the connection bar viewed from above Intent, FIG. 3 is a schematic cross-sectional view of a hole formed by exposing and developing a first photoresist layer according to the method for manufacturing a flexible probe of the present invention; FIG. 4 is a method for manufacturing a flexible probe according to the present invention by electroplating to form a first Sectional schematic diagram of a metal pillar; Figure 5: Sectional schematic diagram of forming a second photoresist layer and exposing and developing at least one hole of a contact bar according to the method of manufacturing an elastic probe of the present invention; Figure 6: Elasticity according to the present invention The manufacturing method of the probe is not intended to form the cross section of the second metal pillar. Figure 7: According to the manufacturing method of the elastic probe of the present invention, the first photoresist layer and the second photoresist layer are removed to form an elastic probe. Fig. 8 is a schematic cross-sectional view of a needle; and Fig. 8 is a schematic diagram of a probe shape in a method for manufacturing a vertical needle probe card of U.S. Patent No. 6,144,212. [Illustration of drawing number] 10 substrate 11 conductive contact 20 first-photoresist layer 21 hole

1221191

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Claims (1)

[Scope of patent application] 1. A method for manufacturing an elastic probe: forming a first photoresist layer on a substrate; forming a plurality of connecting strips on the first photoresist layer; the first hole; exposure and development of a photoresist layer At least one first metal pillar of the electric ore penetrating to the substrate is formed to the above hole, and a second photoresist layer is formed on the first photoresist layer; a second photoresist layer is exposed and developed to form at least a hole temple; A connection bar connection; a plated second metal post contacting the connection bar to the hole of the second photoresist layer; and removing the first photoresist layer and the second photoresist layer, the corresponding post, connection bar and The two metal pillars form at least one elastic probe. 2 = Please request the method of manufacturing the elastic probe described in item 1 of the patent scope: The steps of forming a plurality of connecting bars in the middle and the bottom can be divided into: forming a plate on the first photoresistor, and the last name Soldiers, smashed to 3 metal plates to form a plurality of connections The elasticity as described in item 1 of the scope of patent application, wherein in the step of forming a plurality of connecting bars, it is taken from a lead frame. The method for manufacturing a probe, the plurality of connecting bars are the method for manufacturing an elastic probe as described in item 1 of the scope of patent application, wherein the substrate is a metal plate. The method for manufacturing an elastic probe as described in item 1 of the scope of patent application, wherein the substrate is a ceramic circuit substrate. / Page 13 1221191 6. Scope of patent application 6. The method for manufacturing an elastic probe as described in item 1 of the scope of patent application, wherein the substrate is a printed circuit board. 7. The method for manufacturing an elastic probe as described in item 1 of the scope of patent application, wherein the substrate is a probe card. 8. The method for manufacturing the elastic probe as described in item 1 of the scope of the patent application, 9 wherein the material of the metal column and the connecting bar is selected from copper, Hengfan steel [Invar, kovar], alloy 42 or copper-containing alloy, etc. Conductive metal. A probe for testing a semiconductor device, comprising a first metal pillar, a second metal pillar, and an adapter bar, wherein the first metal pillar and the second metal pillar are parallel to each other. The thickness of the adapter bar is smaller than that of the first metal pillar and the first metal pillar. An inner hole of the two metal pillars is formed with an opening at one end of the connecting bar to combine with the first metal pillar, and the other end of the connecting bar has a rough surface to combine with the second metal pillar to provide a buffer elasticity. 10. The probe for testing a semiconductor device as described in item 9 of the scope of the patent application, wherein the probe is formed on a substrate. 11 Slope as described in item 9 of the patent scope for testing semiconductor devices, where the material of the probe is selected from copper, Hengfan Steel [Invar, 〇Vai:], alloy 4 2 or copper-containing alloy And other conductive metals. 2. Two kinds of probe cards for testing semiconductor devices, which include: "the substrate" has a plurality of conductive pads; and a probe is formed on the corresponding conductive pads and belongs to a column system; The thickness of the strip is smaller than that of the first metal pillar and the second metal pillar. Page 14 1221191 6. The inner diameter of the patent application, where one end of the connecting bar forms an opening to combine with the first metal post, and the other end of the connecting bar has a rough surface to combine with the second metal post to provide a buffer. elasticity. 1 3. The probe card for testing a semiconductor device as described in item 12 of the scope of the patent application, wherein the material of the probe is selected from copper, Invar, Kovar, alloy 42, or copper-containing alloy. metal. 14. The probe card for testing a semiconductor device according to item 12 of the scope of patent application, wherein the substrate is a ceramic circuit substrate. 15. The probe card for testing a semiconductor device as described in item 12 of the scope of patent application, wherein the substrate is a printed circuit board.