TWI808996B - 即時監視具有加熱區早期檢測的多區立式爐 - Google Patents

即時監視具有加熱區早期檢測的多區立式爐 Download PDF

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Publication number
TWI808996B
TWI808996B TW107133185A TW107133185A TWI808996B TW I808996 B TWI808996 B TW I808996B TW 107133185 A TW107133185 A TW 107133185A TW 107133185 A TW107133185 A TW 107133185A TW I808996 B TWI808996 B TW I808996B
Authority
TW
Taiwan
Prior art keywords
resistance
heating
resistance value
detection
voltage
Prior art date
Application number
TW107133185A
Other languages
English (en)
Chinese (zh)
Other versions
TW201923368A (zh
Inventor
斯凡 古拉柏
Original Assignee
德商Ｘ Ｆａｂ半導體鑄造公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商Ｘ Ｆａｂ半導體鑄造公司 filed Critical 德商Ｘ Ｆａｂ半導體鑄造公司
Publication of TW201923368A publication Critical patent/TW201923368A/zh
Application granted granted Critical
Publication of TWI808996B publication Critical patent/TWI808996B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangement of monitoring devices; Arrangement of safety devices
    • F27D21/0014—Devices for monitoring temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/14—Measuring resistance by measuring current or voltage obtained from a reference source
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0006—Monitoring the characteristics (composition, quantities, temperature, pressure) of at least one of the gases of the kiln atmosphere and using it as a controlling value
    • F27D2019/0025—Monitoring the temperature of a part or of an element of the furnace structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08—Measuring resistance by measuring both voltage and current

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Resistance Heating (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Electric Stoves And Ranges (AREA)
TW107133185A 2017-09-25 2018-09-20 即時監視具有加熱區早期檢測的多區立式爐 TWI808996B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102017122205 2017-09-25
??102017122205.7 2017-09-25
DE102017122205.7 2017-09-25
DE102018101010.9A DE102018101010B4 (de) 2017-09-25 2018-01-18 Echtzeit Monitoring eines Mehrzonen-Vertikalofens mit frühzeitiger Erkennung eines Ausfalls eines Heizzonen-Elements
??102018101010.9 2018-01-18
DE102018101010.9 2018-01-18

Publications (2)

Publication Number Publication Date
TW201923368A TW201923368A (zh) 2019-06-16
TWI808996B true TWI808996B (zh) 2023-07-21

Family

ID=65638366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107133185A TWI808996B (zh) 2017-09-25 2018-09-20 即時監視具有加熱區早期檢測的多區立式爐

Country Status (8)

Country Link
US (1) US20200411343A1 (enExample)
EP (1) EP3688394A1 (enExample)
JP (2) JP7271520B2 (enExample)
KR (1) KR102598971B1 (enExample)
CN (1) CN111433547A (enExample)
DE (1) DE102018101010B4 (enExample)
TW (1) TWI808996B (enExample)
WO (1) WO2019058358A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113063999B (zh) * 2021-03-11 2023-08-18 北京北方华创微电子装备有限公司 半导体工艺设备中加热器的诊断方法及系统
CN115902444A (zh) * 2021-08-04 2023-04-04 浙江驰拓科技有限公司 阻性器件的测试方法、测试装置与计算机可读存储介质
CN116302773A (zh) * 2021-12-03 2023-06-23 株洲瑞德尔智能装备有限公司 一种烧结设备的故障监测方法及装置

Citations (5)

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JP2006085907A (ja) * 2004-09-14 2006-03-30 Kokusai Electric Semiconductor Service Inc 電源装置及び半導体製造装置
JP2006165200A (ja) * 2004-12-06 2006-06-22 Kokusai Electric Semiconductor Service Inc 半導体製造装置における抵抗加熱ヒータの抵抗値検出装置、半導体製造装置における抵抗加熱ヒータの劣化診断装置及びネットワークシステム
TWI348726B (en) * 2007-08-07 2011-09-11 United Microelectronics Corp Semiconductor equipment and breakdown precautionary system and method thereof
US20120097661A1 (en) * 2010-10-22 2012-04-26 Lam Research Corporation Methods of fault detection for multiplexed heater array
TW201723218A (zh) * 2015-10-08 2017-07-01 Nuflare Technology Inc 氣相成長裝置以及異常檢測方法

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DE19643698C2 (de) * 1996-05-11 2000-04-13 Aeg Hausgeraete Gmbh Vorrichtung zur Abschirmung von für kapazitive Messungen verwendeten Leiterbahnen eines Kochfeldes
JP2002352938A (ja) * 2001-05-28 2002-12-06 Tokyo Electron Ltd 熱処理装置のヒ−タ素線の断線予測方法及び熱処理装置
JP3988942B2 (ja) * 2003-03-31 2007-10-10 株式会社国際電気セミコンダクターサービス ヒータ検査装置及びそれを搭載した半導体製造装置
JP4326570B2 (ja) * 2007-04-17 2009-09-09 東京エレクトロン株式会社 ヒータ素線の寿命予測方法，熱処理装置，記録媒体，ヒータ素線の寿命予測処理システム
US20090035463A1 (en) * 2007-08-03 2009-02-05 Tokyo Electron Limited Thermal processing system and method for forming an oxide layer on substrates
US7675307B2 (en) * 2008-03-18 2010-03-09 Star Technologies Inc. Heating apparatus for semiconductor devices
JP5098806B2 (ja) 2008-05-21 2012-12-12 東京エレクトロン株式会社 電力使用系の断線予測装置及び熱処理装置
FR2934083B1 (fr) * 2008-07-17 2010-09-10 St Microelectronics Rousset Procede et dispositif de reglage de la position de depot d'une plaquette de semi-conducteur dans un four
JP5567318B2 (ja) * 2009-11-20 2014-08-06 株式会社国際電気セミコンダクターサービス 電力供給システム、基板処理装置、半導体製造装置および劣化診断方法
WO2012165174A1 (ja) * 2011-06-01 2012-12-06 シャープ株式会社 抵抗加熱ヒータの劣化検出装置および方法
DE102011077970A1 (de) * 2011-06-22 2012-12-27 Wacker Chemie Ag Vorrichtung und Verfahren zur Temperaturbehandlung von korrosiven Gasen
JP5876348B2 (ja) * 2012-03-27 2016-03-02 東京エレクトロン株式会社 ヒータ素線検査方法
DE102016120569B4 (de) * 2016-10-27 2018-07-19 Hermann Betz Elektrisch einstellbare Temperatursensor-Vorrichtung eines Heizsystems

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006085907A (ja) * 2004-09-14 2006-03-30 Kokusai Electric Semiconductor Service Inc 電源装置及び半導体製造装置
JP2006165200A (ja) * 2004-12-06 2006-06-22 Kokusai Electric Semiconductor Service Inc 半導体製造装置における抵抗加熱ヒータの抵抗値検出装置、半導体製造装置における抵抗加熱ヒータの劣化診断装置及びネットワークシステム
TWI348726B (en) * 2007-08-07 2011-09-11 United Microelectronics Corp Semiconductor equipment and breakdown precautionary system and method thereof
US20120097661A1 (en) * 2010-10-22 2012-04-26 Lam Research Corporation Methods of fault detection for multiplexed heater array
TW201723218A (zh) * 2015-10-08 2017-07-01 Nuflare Technology Inc 氣相成長裝置以及異常檢測方法

Also Published As

Publication number Publication date
DE102018101010B4 (de) 2025-01-09
WO2019058358A1 (de) 2019-03-28
KR20200100602A (ko) 2020-08-26
US20200411343A1 (en) 2020-12-31
JP7271520B2 (ja) 2023-05-11
DE102018101010A1 (de) 2019-03-28
EP3688394A1 (de) 2020-08-05
JP2020535646A (ja) 2020-12-03
TW201923368A (zh) 2019-06-16
KR102598971B1 (ko) 2023-11-03
JP2023109763A (ja) 2023-08-08
CN111433547A (zh) 2020-07-17

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