TWI808691B - 光學感測器封裝組件 - Google Patents

光學感測器封裝組件 Download PDF

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TWI808691B
TWI808691B TW111110482A TW111110482A TWI808691B TW I808691 B TWI808691 B TW I808691B TW 111110482 A TW111110482 A TW 111110482A TW 111110482 A TW111110482 A TW 111110482A TW I808691 B TWI808691 B TW I808691B
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light
photosensitive
optical sensor
emitting unit
substrate
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TW202339165A (zh
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李盛城
林文勝
蕭朝陽
林智偉
席振華
侯岳宏
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神煜電子股份有限公司
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Priority to TW111110482A priority Critical patent/TWI808691B/zh
Priority to CN202310049591.0A priority patent/CN116798991A/zh
Priority to US18/188,186 priority patent/US20230309245A1/en
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Abstract

本發明提供一種光學感測器封裝組件，將佈線設置於發光單元與感光元件之間的基板上，並將光遮擋件設置在封裝殼體的凹槽中，縮小封裝的尺寸。

Description

光學感測器封裝組件
本發明涉及感測器領域，特別是小尺寸的光學感測器封裝結構。
近接感測器(Proximity Sensor，PS)用來感測物體接近的程度，廣泛應用在智慧型手機或配戴裝置上，其利用發光元件照射到物體上，收集其反射光強度，而可推算出物體距離。為避免發光元件與感光元件間的串擾(Cross-talk, CT)，需在發光元件與感光元件間設置遮光擋件，進而限制佈線的方式及區域，不易縮小封裝尺寸。
鑒於上述問題，本發明提供一種光學感測器封裝組件，利用封裝殼體部分形成凹槽，再填充不透光材料作為光遮擋件，從上方形成的光遮擋件不會佔基板表面面積，多出的表面積可供近接感測器及發光元件的金屬佈線設置，進一步縮小封裝尺寸，可應用於小型穿戴式裝置如手錶、耳機等。
本發明提供一種光學感測器封裝組件，包含： 一基板； 一發光單元及一感光結構，相鄰設置於該基板的表面上，其中該感光結構包含一感光元件； 一第一焊墊，設置於該發光單元與該感光結構之間的該基板的表面上，透過一第一焊線與該感光結構連接；以及 一透明封裝殼體，覆蓋該基板、該發光單元、該感光結構、該第一焊墊及該第一焊線，其中該透明封裝殼體具一溝槽介於該發光單元與該感光元件之間，該溝槽朝該基板方向延伸並以一不透光材料填滿。
本發明提供一種光學感測器封裝組件，包含： 一基板； 一發光單元及一感光結構，相鄰設置於該基板的表面上，其中該感光結構包含一感光元件； 一電路佈線，設置於該發光單元與該感光結構之間的該基板的表面上，與該發光單元及該感光結構連接；以及 一透明封裝殼體，覆蓋該基板、該發光單元、該感光結構以及該電路佈線，其中該透明封裝殼體具一溝槽介於該發光單元與該感光元件之間，該溝槽朝該基板延伸並以一不透光材料填滿。
以下各實施例配合圖式，用以說明本發明之精神，讓本技術領域之人士能清楚理解本發明之技術，但非用以限制本發明的範圍，本發明之專利權範圍應由請求項界定。特別強調，圖式僅為示意之用，並非代表元件實際之尺寸或數量，部份細節可能也不完全繪出，以求圖式之簡潔。
本發明提供的光學感測器封裝組件，將擋光件整合至封裝殼體，以及將金屬佈線與焊墊設於發光單元及感光元件之間(金線反打)，即可達到減少光串擾的影響，又可進一步縮小封裝面積和體積，可應用於耳機或手錶等小型穿戴裝置。
圖1及圖2為本發明光學感測器封裝組件的立體及側面透視圖，光學感測器封裝組件包含發光單元2及感光結構相鄰設置於基板1的表面上，其中感光結構包含感光元件3及積體電路晶片4，積體電路晶片4設置於基板1的表面上，感光元件3設置於積體電路晶片4的表面上或內嵌於積體電路晶片4的表面，積體電路晶片4設有多個第二焊墊6。
多個第一焊墊5及至少一第三焊墊7設置於發光單元2與感光結構之間的基板1表面上，其中每一第一焊墊5透過第一焊線9與積體電路晶片4上的其中一第二焊墊6連接，第三焊墊7透過第二焊線10與發光單元2上的第四焊墊8連接。
另一實施例，發光單元2與感光結構之間係透過電路佈線14設置於發光單元2與感光結構之間的基板1表面上，與發光單元2及感光結構中的積體電路晶片4電連接，如圖3所示，取代焊墊和焊線。
以透明封裝殼體11覆蓋基板1、發光單元2、感光結構、所有焊墊及所有焊線，其中透明封裝殼體11具一溝槽12介於發光單元2與感光元件3之間且位於積體電路晶片4上方，溝槽12朝積體電路晶片4方向延伸並以不透光材料13填滿，溝槽12與積體電路晶片4的表面具有50μm~100μm的間距D，溝槽12寬度為150μm~200μm， 深度為20μm~50μm。
較佳地，發光單元2的厚度或高度大於積體電路晶片4的厚度或高度，或溝槽12位置靠近感光元件3，如溝槽12與感光元件3的距離為20μm~50μm，可進一步降低光穿過間距干擾感光元件3。
透明封裝殼體11的材料為低分子量環氧樹脂，其光折射率介於1.55至1.65之間，以及不透光材料13為矽晶圓、金屬、環氧樹脂、樹脂與矽膠混合膠或壓克力膠或其組合。
發光單元2採用垂直共振腔面射型雷射，亦可採用雷射二極體，其具有較小的光發散角，有效降低光散射的情況，相對在封膠傳播的光也減少，隨之降低串音干擾。
在其他實施例中，基板1的表面上可選擇地覆蓋一黑色層，其材料為具高光吸收率，可避免光經基板1反射干擾感光元件3。
接著參閱圖4及圖5，為感光元件在積體電路晶片上不同位置的視場角的光波形圖，以感光元件為中心定義感光平面上的X軸與Y軸，以及垂直於感光平面向上為Z軸。在固定半徑距離下，由Z軸沿X軸及Y軸方向展開，涵蓋不同視野範圍(-90°~ +90°，共180°)量測光的強度，即視角場的光波形圖。Z-X平面不同角度的視角場的強度標記為深灰色，Z-Y平面為淺灰色。
圖4實施例中，感光元件設置在積體電路晶片左上角的邊緣/角落，Z-X平面以及Z-Y平面的視角場在-38°~ +31°為正常光接收範圍，在-50°~ -90°範圍中量測到較多的串擾光次數，且有波形不一致(虛線圈處)的漏光情況。
圖5實施例中，感光元件設置在積體電路晶片上，且與積體電路晶片的相鄰兩側邊具有一距離d，為70μm~100μm，較佳地，兩者距離相同，Z-X平面及Z-Y平面(的視角場形再-30°~ +30°為正常光接收範圍，兩者波形趨近一致，且串擾光次數較少。可知感光元件在積體電路晶片上的位置存在不同程度光串擾的影響。
1:基板 2:發光單元 3:感光元件 4:積體電路晶片 5:第一焊墊 6:第二焊墊 7:第三焊墊 8:第四焊墊 9:第一焊線 10:第二焊線 11:透明封裝殼體 12:溝槽 13:不透光材料 14:電路佈線 D:間距 d:距離
圖1為本發明光學感測器封裝組件的立體透視圖。
圖2為本發明光學感測器封裝組件的側面透視圖。
圖3為本發明另一實施例光學感測器封裝組件的立體透視圖。
圖4為一實施例光學感測器封裝組件中感光元件的視場角(Field of View, FoV)光波形圖。
圖5為另一實施例光學感測器封裝組件中感光元件的視場角光波形圖。
1:基板
2:發光單元
3:感光元件
4:積體電路晶片
5:第一焊墊
6:第二焊墊
7:第三焊墊
8:第四焊墊
9:第一焊線
10:第二焊線
11:透明封裝殼體
12:溝槽
13:不透光材料

Claims (4)

  1. 一種光學感測器封裝組件，包含：一基板；一發光單元及一感光結構，相鄰設置於該基板的表面上；一第一焊墊以及一第二焊墊，設置於該發光單元與該感光結構之間的該基板的表面上，透過一第一焊線連接該感光結構連接，以及一第二銲線連接該發光單元；以及一透明封裝殼體，覆蓋該基板、該發光單元、該感光結構、該第一焊墊及該第一焊線、該第二焊墊及該第二焊線，其中該感光結構包含一感光元件設置於該第一銲墊相對側，該透明封裝殼體具一溝槽設置於該感光結構表面上方，介於該感光元件與該第一銲墊之間，且與該感光結構表面有一間距，該間距為50μm~100μm，該溝槽填滿一不透光材料，且該發光單元高於該感光結構。
  2. 如請求項1所述之光學感測器封裝組件，其中該感光結構為一積體電路晶片，該感光元件設置於該積體電路晶片的表面上或內嵌於該積體電路晶片的表面。
  3. 如請求項2所述之光學感測器封裝組件，其中該感光元件與該積體電路晶片的相鄰兩側邊具有一距離，該距離為70μm~100μm。
  4. 如請求項1所述之光學感測器封裝組件，其中該發光單元為垂直共振腔面射雷射或發光二極體。
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