TWI805905B - Shape measuring device and shape measuring method - Google Patents
Shape measuring device and shape measuring method Download PDFInfo
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- TWI805905B TWI805905B TW109108763A TW109108763A TWI805905B TW I805905 B TWI805905 B TW I805905B TW 109108763 A TW109108763 A TW 109108763A TW 109108763 A TW109108763 A TW 109108763A TW I805905 B TWI805905 B TW I805905B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
- Golf Clubs (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Soft Magnetic Materials (AREA)
Abstract
[課題]減少外部之溫度變化的影響,並實現高精度的形狀測量。 [解決手段]一種形狀測量裝置(40),其藉由沿著掃描方向並排設置之三個量測探頭(41)在掃描方向上進行掃描來計測測量對象物(W)的表面形狀,該形狀測量裝置(40)中,將三個量測探頭(41)內包於隔熱構件(43)中。藉由將三個量測探頭(41)內包於隔熱材料(43)中而進行測量,即使在每一個量測探頭(41)的溫度特性不同之情形下,亦抑制外部之溫度變化的影響,因此能夠保持高精度而進行形狀測量。[Problem] Reduce the influence of external temperature changes and achieve high-precision shape measurement. [Solution] A shape measuring device (40), which measures the surface shape of a measurement object (W) by scanning in the scanning direction with three measuring probes (41) arranged side by side along the scanning direction. In the measuring device (40), three measuring probes (41) are enclosed in a heat insulating member (43). Measurement is performed by enclosing three measuring probes (41) in a heat insulating material (43), which suppresses external temperature changes even when the temperature characteristics of each measuring probe (41) are different Therefore, it is possible to perform shape measurement with high precision.
Description
本申請案係主張基於2019年3月18日申請之日本專利申請第2019-050154號的優先權。該日本申請案的全部內容係藉由參閱援用於本說明書中。 本發明係有關一種進行真直度的測量之形狀測量裝置及形狀測量方法。This application claims priority based on Japanese Patent Application No. 2019-050154 filed on March 18, 2019. The entire content of this Japanese application is incorporated in this specification by reference. The invention relates to a shape measuring device and a shape measuring method for measuring straightness.
已知有一種藉由順序3點法求出計測對象物的表面形狀並進行真直度的測量之形狀測量裝置(例如,參閱專利文獻1)。 [先前技術文獻]There is known a shape measuring device that obtains the surface shape of a measurement object by a sequential three-point method and measures straightness (for example, refer to Patent Document 1). [Prior Art Literature]
[專利文獻1]日本特開2013-195082號公報[Patent Document 1] Japanese Patent Laid-Open No. 2013-195082
[發明所欲解決之問題][Problem to be solved by the invention]
在上述形狀測量裝置中,例如,藉由三個檢測光的發光受光部進行掃描,並進行檢測光的射出方向的位移的檢測。 在上述測量中,對高分辨率且高精度的位移檢測要求高,但是各發光受光部的光學系統有時會受到外部之溫度變化的影響,這有可能導致檢測精度的下降。In the shape measuring device described above, for example, three light-emitting and light-receiving parts for detection light scan to detect displacement in the direction in which the light is emitted. In the above-mentioned measurement, high-resolution and high-precision displacement detection is required, but the optical system of each light-emitting and light-receiving unit may be affected by external temperature changes, which may lead to a decrease in detection accuracy.
本發明的目的為減少外部之溫度變化的影響。 [解決問題之技術手段]The purpose of the present invention is to reduce the influence of external temperature changes. [Technical means to solve the problem]
本發明為一種形狀測量裝置,其藉由沿著掃描方向並排設置之三個量測探頭在前述掃描方向上進行掃描來計測測量對象物的表面形狀,前述形狀測量裝置構成為將前述三個量測探頭內包於隔熱材料或隔熱構件中。The present invention is a shape measuring device that measures the surface shape of an object to be measured by scanning in the scanning direction with three measuring probes arranged side by side along the scanning direction. The measuring probe is wrapped in heat insulating material or heat insulating member.
又,本發明為一種形狀測量方法,其藉由沿著掃描方向並排設置之三個量測探頭在前述掃描方向上進行掃描來計測測量對象物的表面形狀,前述形狀測量方法構成為在將前述三個量測探頭內包於隔熱材料或隔熱構件中之狀態下進行計測。 [發明之效果]Also, the present invention is a shape measuring method for measuring the surface shape of an object to be measured by scanning in the scanning direction with three measuring probes arranged side by side along the scanning direction. The measurement is carried out with the three measuring probes wrapped in the heat insulating material or the heat insulating member. [Effect of Invention]
依據本發明,能夠減少外部之溫度變化的影響。According to the present invention, the influence of external temperature changes can be reduced.
依據圖式,對本發明的實施形態進行說明。
圖1係表示搭載有作為發明的實施形態的形狀測量裝置40之機床1之立體圖,圖2係表示機床1的控制系統之方塊圖。圖中,X軸方向及Y軸方向均為水平且相互正交,Z軸方向為與X軸方向及Y軸方向正交之垂直上下方向。Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a machine tool 1 equipped with a
[機床的概要]
機床1為磨削工件的一個表面的所謂的磨床,並且具備基底部31a、31b、第一支柱10、第二支柱20、平交軌32、床鞍331、磨石頭332、磨削裝置34、形狀測量裝置40、以及配置有作為測量對象物的工件之工作台36及底座35、控制裝置60。工件為進行磨削之加工對象物。[Overview of Machine Tool]
The machine tool 1 is a so-called grinding machine that grinds one surface of a workpiece, and includes
[底座]
底座35具備沿著X軸方向的未圖示的一對直線導軌,並且將工作台36支承為能夠沿著X軸方向移動。又,在底座35上搭載有沿著X軸方向輸送工作台36之未圖示的輸送機構。輸送機構將能夠任意地控制運轉量之工作台進給馬達351(參閱圖2)作為驅動源,並且能夠在工作台36上保持工件而沿著X軸方向輸送。
另外,該輸送機構還作為使後述之三個量測探頭41相對於工件W沿著掃描方向(X軸方向)相對移動之掃描機構而發揮作用。[base]
The
又,一對基底部31a、31b以突出之方式連結裝配於底座35的Y軸方向的兩側。在其中一個基底部31a載置裝配有第一支柱10,在另一個基底部31b載置裝配有第二支柱20,各支柱10、20的下端部藉由螺栓、熔接等公知的方法固定於基底部31a、31b。Moreover, a pair of
[第一支柱及第二支柱]
第一支柱10及第二支柱20以夾著底座35沿著Y軸方向排列之配置立設。又,經由托架32a(第二支柱20側的托架省略圖示),平交軌32以朝向Y軸方向之狀態固定支承於該等支柱10、20的上端部。又,各支柱10、20的上端部藉由螺栓、熔接等公知的方法固定於平交軌32。[Pillar 1 and Pillar 2]
The
[平交軌]
平交軌32在Y軸方向上較長,並且經由未圖示的直線導軌將床鞍331支承於其前表面側以能夠沿著Y軸方向移動。
又,在平交軌32上搭載有沿著Y軸方向移動並定位床鞍331的未圖示的輸送機構。該輸送機構將能夠任意地控制運轉量之床鞍進給馬達321(參閱圖2)作為驅動源,並且能夠沿著Y軸方向任意地移動並定位床鞍331。[level rail]
The
床鞍331支承磨石頭332,磨石頭332支承磨削裝置34。另一方面,協同進行基於平交軌32的床鞍進給馬達321的床鞍331在Y軸方向上的移動控制及基於底座35的工作台進給馬達351的工件在X軸方向上的移動控制。藉此,將磨削裝置34的磨石34a相對於工件,能夠相對地移動而定位在X-Y平面的任意位置,亦能夠在工件的整個表面或任何位置進行磨削加工。The
[磨石頭及床鞍]
磨石頭332經由床鞍331藉由平交軌32被支承為能夠沿著Y軸方向移動,並且藉由床鞍331被支承為能夠沿著Z軸方向升降。又,將磨削裝置34支承於磨石頭332的下端部。[grindstone and saddle]
The
床鞍331為擔負使磨石頭332沿著Z軸方向升降之作用者。
因此,床鞍331藉由未圖示的直線導軌將磨石頭332支承為能夠沿著Z軸方向移動。又,在床鞍331上搭載有沿著Z軸方向移動並定位磨石頭332的未圖示的輸送機構。該輸送機構將能夠任意地控制運轉量之磨石升降馬達333作為驅動源,並且能夠沿著Z軸方向任意地移動並定位磨石頭332。The
[磨削裝置]
磨削裝置34支承於磨石頭332的下端部。
該磨削裝置34具有繞Y軸旋轉驅動之圓板狀或圓筒狀的磨石34a及使磨石34a進行旋轉之磨石旋轉馬達341作為工具。磨石34a配置於磨石頭332的下端部的右端。該磨石34a藉由基於磨石旋轉馬達341的旋轉驅動使其外周與工件接觸而進行磨削。[grinding device]
The
[形狀測量裝置]
形狀測量裝置40為所謂的分光干涉儀,藉由3點法對藉由磨削裝置34進行了磨削之工件的磨削面測量表面形狀。
形狀測量裝置40具備具有三個量測探頭41之頭部42、三個光源411及三個受光元件412。[Shape Measuring Device]
The
量測探頭41經由作為光傳導構件的光纖413連接於光源411及受光元件412。亦即,光纖413介入而光源411及受光元件412與量測探頭41隔離設置。The
光源411例如為SLD元件(Super Luminescent Diode:超輻射發光二極體),並且輸出預先設定之複數種波長的檢測光。檢測光藉由光纖413被發送到量測探頭41。
量測探頭41為透光元件,從朝向工件的輸出面向工件投射來自光源411的檢測光,並且在輸出面接收來自工件的反射光。
在量測探頭41的內部,產生在輸出面內部反射的檢測光和來自工件的反射光的干涉光。該干涉光藉由光纖413被發送到受光元件412。
受光元件412例如為CCD,並且經由未圖示的分光器接收來自量測探頭41的干涉光。分光器分光為預先設定之複數種波長光,受光元件412分別檢測各波長光的光強度並且輸入到控制裝置60。
量測探頭41能夠依據干涉光的各波長光的光強度來檢測從輸出面至工件的表面的Z軸方向的距離。The
圖3係頭部42的立體圖,圖3(A)表示去除了由隔熱材料製成之隔熱構件43之狀態,圖3(B)表示具有隔熱構件43之狀態。圖3中的X軸方向、Y軸方向及Z軸方向的記載表示在磨石頭332安裝有頭部42之狀態下的方向。FIG. 3 is a perspective view of the
如圖所示,頭部42具備:三個量測探頭41;固定夾具414,保持為獨立地夾著該三個量測探頭41;夾具421,經由各固定夾具414一體支承三個量測探頭41;支承構件422,固定裝配於夾具421;基台423,經由支承構件422支承各量測探頭41;及吸附塊424,在磨石頭332的表面安裝基台423。As shown in the figure, the
夾具421為長尺寸的矩形功能塊,在藉由設置於底部的開口部暴露了輸出面之狀態下嵌入裝配三個量測探頭41。
夾具421的長邊方向與Y軸方向平行。又,藉由該夾具421,三個量測探頭41在Y軸方向上以均勻間隔配置。
又,夾具421均以檢測光的光軸與Z軸方向平行之方式保持三個量測探頭41。
藉此,三個量測探頭41能夠進行Z軸方向上的距離檢測。The
又,夾具421例如由如Super Invar(註冊商標)那樣的熱膨脹率非常小的不變鋼等金屬材料形成。藉此,抑制了由周圍的環境溫度產生之各量測探頭41的間隔、輸出面的相對位置變動。Also, the
支承構件422為梯形的板狀構件,藉由螺栓、螺釘固定等方式固定地連結於夾具421。又,支承構件422還能夠從夾具421卸下。The supporting
基台423包括沿著X-Y平面的平板狀的底座和從該底座下垂之兩個臂,支承構件422連結於臂的下端部。
基台423能夠藉由螺釘和未圖示的長孔等結構繞Y軸調節支承構件422的角度。藉由該角度調節,能夠經由支承構件422使夾具421進行轉動,能夠調整各量測探頭41的檢測光的光軸的朝向、各量測探頭41的輸出面的Z軸方向的高度。The
各吸附塊424內置有永久磁鐵,藉由對設置於外部之旋鈕進行旋轉操作,能夠切換由永久磁鐵產生之吸引力的有無。
Each
亦即,頭部42能夠相對於機床1裝卸,並且能夠使用各吸附塊424,將頭部42安裝於磨石頭332等的表面的適當的位置。
That is, the
在藉由各吸附塊424安裝頭部42時,夾具421及各量測探頭41被適當地調整成適合的朝向及配置,藉由調整基台423、支承構件422之間的角度來進一步準確地調整。
When the
又,對頭部42的三個量測探頭41、固定夾具414及夾具421實施隔熱結構。
In addition, a heat insulating structure is given to the three measuring
具體而言,如圖3(B)所示,三個量測探頭41、固定夾具414及夾具421成為內包於隔熱構件43中之狀態。
Specifically, as shown in FIG. 3(B), the three measuring
隔熱構件43包覆三個量測探頭41、固定夾具414及夾具421的整個表面(去除各量測探頭41的光纖的連接部分)。在該隔熱構件43形成有用於在各量測探頭41的輸出面的射出側進行檢測光的射出或反射光的射入的開口部431。
The
另外,如圖所示,隔熱構件43可以設為在塊狀的隔熱構件43的內側形成供三個量測探頭41及夾具421嵌合之凹部並將三個量測探頭41及夾具421儲存於該凹部中之結構,亦可以設為由板狀的一個隔熱構件43包裹三個量測探頭41及夾具421的整個表面之結構。此時,在三個量測探頭41之間形成空間,因此在相同空間內對各量測探頭41之間的測量環境進行平均化,減少各量測探頭41之間的偏差。
又,可以在三個量測探頭41及夾具421的表面上噴塗起泡性隔熱材料。此時,能夠簡單地由隔熱材料包覆量測探頭41。
又,雖然未圖示,但是可以設為分別獨立地由隔熱材料或隔熱構件包裹量測探頭41之結構。但是,此時,在校正感測器自身的偏差之後進行計測為較佳。
作為包覆各量測探頭41的隔熱材料,作為纖維系隔熱材料的玻璃棉、巖棉、纖維素纖維、碳化軟木、羊毛隔熱材料等、作為起泡系隔熱材料的胺基甲酸酯泡沫、酚醛泡沫、聚苯乙烯泡沫等所謂的稱為隔熱材料之材料為較佳,但是並不限於此。例如,可以利用導熱系數為5.0[W/mk]以下、較佳為1.0[W/mk]以下、更佳為0.5[W/mk]以下的其他隔熱性材料。In addition, as shown in the figure, the
藉由該隔熱構件43,三個量測探頭41、固定夾具414及夾具421與外部氣體隔熱,可實現從外部之環境溫度受到之影響的減少。With the
[控制裝置]
控制裝置60為用於在整體上集中控制機床1之裝置,例如為具備CPU(Central Processing Unit:中央處理器)、RAM(Random Access Memory:隨機存取記憶體)、ROM (Read OnlyMemory:唯讀記憶體)、其他非揮發性記憶體等之電腦。
如圖2所示,控制裝置60與前述之工作台進給馬達351、床鞍進給馬達321、磨石升降馬達333、磨石旋轉馬達341電連接,並且能夠控制該等的驅動。
又,控制裝置60與形狀測量裝置40、顯示裝置61、輸入裝置62連接。
顯示裝置61為用於顯示各種資訊之裝置,例如為液晶顯示器等。
輸入裝置62為用於向機床1輸入各種資訊、各種指令的輸入介面。[control device]
The
上述控制裝置60具備磨削控制部63及形狀測量處理部64。
控制裝置60例如藉由將與作為磨削控制部63及形狀測量處理部64之功能相對應之各種程式儲存於ROM中並由CPU執行每一個程式來實現作為磨削控制部63及形狀測量處理部64之功能。另外,可以設為獨立地設置作為磨削控制部63、形狀測量處理部64的電路並藉由硬體來實現之結構。The
磨削控制部63執行基於機床1的工件的磨削加工中的運轉控制。
例如,若藉由前述之輸入裝置62預先輸入磨石的轉速、磨削深度、磨削範圍等各種加工條件,則磨削控制部63控制工作台進給馬達351、床鞍進給馬達321、磨石升降馬達333、磨石旋轉馬達341,並依據所輸入之加工條件來執行磨削加工。The grinding
形狀測量處理部64進行依據在Y軸方向上掃描三個量測探頭41時的檢測輸出藉由3點法測量工件的表面形狀之處理。
圖4係對工件W的表面進行掃描時的示意圖,圖5(A)及圖5(B)係計算至工件W的表面的距離及曲率之說明圖。另外,在圖4及圖5中,為了區分三個量測探頭41,將該等的符號從掃描方向上游側(工件W的輸送方向下游側)依次設為41a、41b、41c。
依據圖4~圖5(B),對由形狀測量處理部64執行之測量方法的內容進行說明。The shape
如圖4所示,形狀測量處理部64在測量形狀時,控制工作台進給馬達351,以既定的速度沿著Y軸方向輸送工件W。在該狀態下,藉由三個量測探頭41以既定的週期執行形狀測量,藉此對工件W的表面執行掃描。As shown in FIG. 4 , when measuring the shape, the shape
如圖5(A)所示,量測探頭41a、41b、41c在X軸方向上以間隔P配設成一列。計測至此時的工件W的表面上的a點、b點、c點的Z軸方向的距離。
若將藉由量測探頭41a、41b、41c求出之從各量測探頭41a、41b、41c的輸出面至工件W的表面的沿著Z軸方向的距離設為A、B、C,則從b點至線段ac的沿著Z軸方向的距離(設為間隙g)藉由下式(1)來求出。
g=B-(A+C)/2……(1)As shown in FIG. 5(A), the measurement probes 41a, 41b, and 41c are arranged in a row at intervals P in the X-axis direction. The distances in the Z-axis direction to points a, b, and c on the surface of the workpiece W at this time are measured.
If the distances along the Z-axis direction from the output surfaces of the measuring
另一方面,工件W的表面的b點處的位移z的二階微分(d2 z/dx2 )為b點的曲率(1/r),如圖5(B)所示,在線段ab的斜率(dzab /dx)與線段bc的斜率(dzbc /dx)之間成立下式(2)。On the other hand, the second-order differential (d 2 z/dx 2 ) of the displacement z at point b on the surface of the workpiece W is the curvature (1/r) at point b, as shown in FIG. 5(B), on the line segment ab The following formula (2) is established between the slope (dz ab /dx) and the slope (dz bc /dx) of the line segment bc.
[數式1] [Formula 1]
線段ab的斜率(dzab /dx)由下式(3)求出,線段bc的斜率(dzbc /dx)由下式(4)求出。 因此,若將下式(3)、式(4)代入到上式(2)中,進一步代入到式(1)中,則求出下式(5)。因此,作為位移z的二階微分的b點的曲率能夠由間隙g及量測探頭41a、41b、41c的間隔P求出。The slope (dz ab /dx) of the line segment ab is obtained by the following formula (3), and the slope (dz bc /dx) of the line segment bc is obtained by the following formula (4). Therefore, when the following formula (3) and formula (4) are substituted into the above formula (2), and further substituted into the formula (1), the following formula (5) is obtained. Therefore, the curvature at point b which is the second order differential of the displacement z can be obtained from the gap g and the interval P between the measuring probes 41 a , 41 b , and 41 c.
[數式2] [數式3] [數式4] [Formula 2] [Formula 3] [Formula 4]
量測探頭41a、41b、41c的間隔P係已知的,能夠預先記錄於控制裝置60的記憶體中。
形狀測量處理部64在掃描時從基於各量測探頭41a、41b、41c的檢測輸出獲取距離A、B、C,並依據式(1)來計算間隙g。而且,從記憶體讀出間隔P的值,並且依據式(5)計算曲率。又,以積分節距對所求出之曲率進行二階積分,藉此能夠求出任意x點處的位移z。積分節距例如為掃描時的X方向的各量測探頭41a、41b、41c的數據獲取間隔(掃描速度×採樣週期)等。The interval P of the measuring probes 41 a , 41 b , and 41 c is known and can be recorded in the memory of the
[機床的運轉]
控制裝置60在磨削控制部63的控制下,驅動磨石升降馬達333以成為所設定之磨削深度,並以所設定之磨石的轉速執行磨石旋轉馬達341的驅動。
又,藉由工作台進給馬達351使磨削裝置34的磨石34a相對於工件沿著X軸方向相對進給並且執行磨削。而且,一邊藉由床鞍進給馬達321的驅動使磨石34a以既定的距離單位沿著Y軸方向移動,一邊反覆進行X軸方向的磨削,對工件W執行所設定之磨削範圍的磨削。[Operation of the machine tool]
The
接著,控制裝置60對磨削後的工件W進行加工面的曲率及平面度的檢測。
亦即,藉由工作台進給馬達351及床鞍進給馬達321的驅動,進行頭部42和工件W的相對定位,以安裝於磨石頭332上的頭部42的各量測探頭41的檢測位置成為工件W的搜索範圍的開始位置。又,驅動磨石升降馬達333而調整成各量測探頭41的輸出面成為既定的高度。
又,藉由工作台進給馬達351以既定的速度輸送工件W,並將X軸方向作為掃描方向,在各量測探頭41中以既定的採樣週期檢測Z軸方向的距離A、B、C。依據這種情形,在磨削範圍的掃描方向的總長度上計算間隙g。
而且,一邊藉由床鞍進給馬達321的驅動使磨石34a以既定的距離單位沿著Y軸方向移動,一邊在X軸方向的整個磨削範圍內求出曲率及位移z,並測量整個磨削範圍的平面度。Next, the
[發明的實施形態的技術效果]
上述機床1具備藉由沿著X軸方向(掃描方向)並排設置之三個量測探頭41在掃描方向上進行掃描來計測作為工件的表面形狀的平面度的形狀測量裝置40,該形狀測量裝置40的三個量測探頭41內包於隔熱構件43中。
因此,三個量測探頭41在內包於隔熱構件43中之狀態下進行計測,對於各量測探頭41,減少周圍的環境溫度變化的影響,關於曲率、位移,能夠進行高精度的檢測。[Technical Effects of Embodiments of the Invention]
The above-mentioned machine tool 1 includes a
又,形狀測量裝置40使用三個量測探頭41,藉由3點法計測工件W的表面形狀,因此能夠抵消各量測探頭41的Z軸方向的運動誤差、俯仰運動誤差,並進行高精度的檢測。
而且,即使在如各量測探頭41的溫度特性分別不同之情形下,隔熱構件43亦減少每一個量測探頭41的環境溫度的影響,因此能夠有效地抑制檢測精度的下降。In addition, the
又,隔熱構件43還內包有一體支承三個量測探頭41的夾具421,因此能夠減少環境溫度變化對夾具421的影響,並能夠進行進一步高精度的檢測。
又,隔熱構件43一起包覆支承構件422和夾具421,因此與包覆整個形狀測量裝置40之情形相比還能夠降低成本。而且,基台423未被隔熱構件43包覆,因此,能夠首先由隔熱構件43一起包覆支承構件422及夾具421之後,將該等連接於基台423,與由包覆構件43包覆整個形狀測量裝置40之情形相比還能夠間單地設置隔熱構件43。In addition, the
又,機床1具有藉由工作台進給馬達351使三個量測探頭41相對於工件W沿著掃描方向相對移動之輸送機構,因此能夠良好地進行3點法中的三個量測探頭41的掃描。In addition, the machine tool 1 has a transport mechanism for relatively moving the three measuring
又,三個量測探頭41均設置成光源411經由光纖413與隔熱構件43的外部隔離,因此即使在光源411產生熱之情形下,亦能夠充分地減少隔熱構件43內的溫度的影響,能夠進行高精度的檢測。In addition, the three measuring
[其他]
以上,對本發明的各實施形態進行了說明。但是,本發明並不限於上述實施形態。例如,作為機床1,例示了磨床,但是在具有測量加工後的工件W的表面形狀的用途的其他機床上亦能夠搭載形狀測量裝置40。例如,在切削機等上亦能夠搭載形狀測量裝置40。[other]
Each embodiment of the present invention has been described above. However, the present invention is not limited to the above-mentioned embodiments. For example, a grinding machine is exemplified as the machine tool 1 , but the
又,例如,如圖6所示,可以設為將三個量測探頭41、固定夾具414及夾具421內包於由複數個隔熱構件構成的隔熱結構43A中之結構。
例如,隔熱結構43A設為具有作為將三個量測探頭41、固定夾具414及夾具421儲存於內部之隔熱構件的內側層432A以及作為將整個內側層432A儲存於內側之隔熱構件的外側層433A的雙層結構,並對內側層432A與外側層433A之間的中空區進行真空化而構成真空隔熱結構。又,在該情形下,亦期望在各量測探頭41的輸出面側設置供檢測光、反射光穿過之開口部431A。
此時,藉由在內側層432A與外側層433A之間設置真空層,能夠有效地實現與外部之隔熱。
又,即使內側層432A及外側層433A其自身不由隔熱材料形成,亦能夠獲得隔熱效果。因此,例如,可以由容易加工且容易獲得強度的金屬材料形成內側層432A及外側層433A。
在該等結構之情形下,三個量測探頭41亦藉由隔熱結構43A減少周圍的環境溫度變化的影響,關於曲率、位移,能夠進行高精度的檢測。Also, for example, as shown in FIG. 6 , a structure may be adopted in which three measuring
又,在前述之頭部42中,例示了夾具421與支承構件422直接接觸而連結之情形,但是亦可以設為在該等之間配置隔熱材料來抑制傳熱之結構。Moreover, in the above-mentioned
又,從各量測探頭41連接光源411及受光元件412的光纖413亦可以藉由隔熱材料等與周圍實現隔熱。In addition, the
1:機床
34:磨削裝置
34a:磨石
35:底座
36:工作台
40:形狀測量裝置
41:量測探頭
41a,41b,41c:量測探頭
42:頭部
421:夾具
43:隔熱構件
43A:隔熱結構
60:控制裝置
63:磨削控制部
64:形狀測量處理部
351:工作台進給馬達
332:磨石頭
411:光源
412:受光元件
413:光纖(光傳導構件)
W:工件(測量對象物)1: machine tool
34: Grinding
[圖1]係表示搭載有本發明的實施形態之形狀測量裝置之機床之立體圖。 [圖2]係表示機床的控制系統之方塊圖。 [圖3]中,圖3(A)係去除了由隔熱材料製成之隔熱構件之狀態的頭部的立體圖,圖3(B)係具有隔熱構件之狀態的頭部的立體圖。 [圖4]係對工件的表面進行掃描時的示意圖。 [圖5]中,圖5(A)及圖5(B)係計算至工件的表面的距離及曲率之說明圖。 [圖6]係表示隔熱構件的例子的剖視圖。[ Fig. 1 ] is a perspective view showing a machine tool equipped with a shape measuring device according to an embodiment of the present invention. [ Fig. 2 ] is a block diagram showing a control system of a machine tool. [Fig. 3], Fig. 3(A) is a perspective view of the head with the heat insulating member made of the heat insulating material removed, and Fig. 3(B) is a perspective view of the head with the state of the heat insulating member. [ Fig. 4 ] is a schematic diagram when scanning the surface of a workpiece. In [ Fig. 5 ], Fig. 5(A) and Fig. 5(B) are explanatory diagrams for calculating the distance and curvature to the surface of the workpiece. [ Fig. 6 ] is a sectional view showing an example of a heat insulating member.
41:量測探頭 41: Measuring probe
42:頭部 42: head
43:隔熱構件 43: Insulation member
414:固定夾具 414: Fixture
421:夾具 421: Fixture
422:支承構件 422: supporting member
423:基台 423: Abutment
424:吸附塊 424: Adsorption block
431:開口部 431: opening
X:X軸方向 X: X axis direction
Y:Y軸方向 Y: Y axis direction
Z:Z軸方向 Z: Z axis direction
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- 2020-03-17 KR KR1020200032698A patent/KR20200111116A/en not_active Application Discontinuation
- 2020-03-18 CN CN202010190997.7A patent/CN111702604A/en active Pending
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Also Published As
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JP7212559B2 (en) | 2023-01-25 |
JP2020153705A (en) | 2020-09-24 |
CN111702604A (en) | 2020-09-25 |
KR20200111116A (en) | 2020-09-28 |
TW202040097A (en) | 2020-11-01 |
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