TWI803502B - 化學機械拋光物品、系統、方法及微複製工具 - Google Patents

化學機械拋光物品、系統、方法及微複製工具 Download PDF

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Publication number
TWI803502B
TWI803502B TW107127051A TW107127051A TWI803502B TW I803502 B TWI803502 B TW I803502B TW 107127051 A TW107127051 A TW 107127051A TW 107127051 A TW107127051 A TW 107127051A TW I803502 B TWI803502 B TW I803502B
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TW
Taiwan
Prior art keywords
polishing
offset
plane
polishing pad
working surface
Prior art date
Application number
TW107127051A
Other languages
English (en)
Chinese (zh)
Other versions
TW201910056A (zh
Inventor
肯納斯 安卓 派尼 梅爾
強 喬瑟夫 蘇利文
布萊恩 威廉 魯克
達 卡 雷虎
大衛 傑佛瑞 穆拉迪安
大衛 法蘭克 斯拉瑪
Original Assignee
美商3M新設資產公司
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Publication date
Application filed by 美商3M新設資產公司 filed Critical 美商3M新設資產公司
Publication of TW201910056A publication Critical patent/TW201910056A/zh
Application granted granted Critical
Publication of TWI803502B publication Critical patent/TWI803502B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW107127051A 2017-08-04 2018-08-03 化學機械拋光物品、系統、方法及微複製工具 TWI803502B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762541362P 2017-08-04 2017-08-04
US62/541,362 2017-08-04

Publications (2)

Publication Number Publication Date
TW201910056A TW201910056A (zh) 2019-03-16
TWI803502B true TWI803502B (zh) 2023-06-01

Family

ID=65233633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127051A TWI803502B (zh) 2017-08-04 2018-08-03 化學機械拋光物品、系統、方法及微複製工具

Country Status (6)

Country Link
US (1) US12208483B2 (enExample)
JP (1) JP7165719B2 (enExample)
KR (1) KR102608124B1 (enExample)
CN (1) CN111032284B (enExample)
TW (1) TWI803502B (enExample)
WO (1) WO2019026021A1 (enExample)

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US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
CN114599482A (zh) * 2019-11-04 2022-06-07 3M创新有限公司 抛光制品、抛光系统和抛光方法
CN114630726A (zh) * 2019-11-05 2022-06-14 3M创新有限公司 模制研磨旋转工具
GB2595668B (en) * 2020-06-02 2022-05-25 Illinois Tool Works A contact cleaning surface
JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
CN119927788B (zh) * 2025-04-08 2025-08-01 河北同光半导体股份有限公司 晶圆的研磨抛光加工方法

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CN101795961A (zh) * 2007-09-06 2010-08-04 3M创新有限公司 用于制备微结构化制品的工具
JP2011235425A (ja) * 2010-05-13 2011-11-24 Asahi Glass Co Ltd 研磨パッド及び研磨パッドを用いた研磨装置
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
CN103328158A (zh) * 2011-01-26 2013-09-25 3M创新有限公司 具有复制的微结构化背衬的磨料制品以及其使用方法
TW201436941A (zh) * 2013-01-22 2014-10-01 Nexplanar Corp 具有含連續突出物之拋光表面之拋光墊
CN204277743U (zh) * 2014-10-29 2015-04-22 安阳方圆研磨材料有限责任公司 硬质抛光垫
CN105579194A (zh) * 2013-09-25 2016-05-11 3M创新有限公司 多层抛光垫
WO2016183126A1 (en) * 2015-05-13 2016-11-17 3M Innovative Properties Company Polishing pads and systems for and methods of using same
TW201726316A (zh) * 2015-10-07 2017-08-01 ３Ｍ新設資產公司 拋光墊與系統及其製造與使用方法

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TW362551U (en) * 1994-04-08 1999-06-21 Rodel Inc Polishing pads
US6699115B2 (en) * 1997-05-15 2004-03-02 Applied Materials Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
CN101795961A (zh) * 2007-09-06 2010-08-04 3M创新有限公司 用于制备微结构化制品的工具
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
JP2011235425A (ja) * 2010-05-13 2011-11-24 Asahi Glass Co Ltd 研磨パッド及び研磨パッドを用いた研磨装置
CN103328158A (zh) * 2011-01-26 2013-09-25 3M创新有限公司 具有复制的微结构化背衬的磨料制品以及其使用方法
TW201436941A (zh) * 2013-01-22 2014-10-01 Nexplanar Corp 具有含連續突出物之拋光表面之拋光墊
CN105579194A (zh) * 2013-09-25 2016-05-11 3M创新有限公司 多层抛光垫
CN204277743U (zh) * 2014-10-29 2015-04-22 安阳方圆研磨材料有限责任公司 硬质抛光垫
WO2016183126A1 (en) * 2015-05-13 2016-11-17 3M Innovative Properties Company Polishing pads and systems for and methods of using same
TW201726316A (zh) * 2015-10-07 2017-08-01 ３Ｍ新設資產公司 拋光墊與系統及其製造與使用方法

Also Published As

Publication number Publication date
WO2019026021A1 (en) 2019-02-07
TW201910056A (zh) 2019-03-16
KR102608124B1 (ko) 2023-11-29
US20200164484A1 (en) 2020-05-28
CN111032284B (zh) 2022-11-04
JP2020529332A (ja) 2020-10-08
JP7165719B2 (ja) 2022-11-04
US12208483B2 (en) 2025-01-28
KR20200037269A (ko) 2020-04-08
CN111032284A (zh) 2020-04-17

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