KR102608124B1 - 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면 - Google Patents

향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면 Download PDF

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Publication number
KR102608124B1
KR102608124B1 KR1020207004255A KR20207004255A KR102608124B1 KR 102608124 B1 KR102608124 B1 KR 102608124B1 KR 1020207004255 A KR1020207004255 A KR 1020207004255A KR 20207004255 A KR20207004255 A KR 20207004255A KR 102608124 B1 KR102608124 B1 KR 102608124B1
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South Korea
Prior art keywords
polishing
offset
delete delete
polishing pad
cell
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English (en)
Korean (ko)
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KR20200037269A (ko
Inventor
케네스 에이 피 메이어
존 제이 설리반
브라이언 더블유 루엑
두이 케이 레후
데이비드 제이. 무라디안
데이비드 에프 슬라마
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20200037269A publication Critical patent/KR20200037269A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020207004255A 2017-08-04 2018-08-02 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면 Active KR102608124B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762541362P 2017-08-04 2017-08-04
US62/541,362 2017-08-04
PCT/IB2018/055815 WO2019026021A1 (en) 2017-08-04 2018-08-02 MICRO-REPLICATED POLISHING SURFACE WITH IMPROVED COPLANARITY

Publications (2)

Publication Number Publication Date
KR20200037269A KR20200037269A (ko) 2020-04-08
KR102608124B1 true KR102608124B1 (ko) 2023-11-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207004255A Active KR102608124B1 (ko) 2017-08-04 2018-08-02 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면

Country Status (6)

Country Link
US (1) US12208483B2 (enExample)
JP (1) JP7165719B2 (enExample)
KR (1) KR102608124B1 (enExample)
CN (1) CN111032284B (enExample)
TW (1) TWI803502B (enExample)
WO (1) WO2019026021A1 (enExample)

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US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
CN114599482A (zh) * 2019-11-04 2022-06-07 3M创新有限公司 抛光制品、抛光系统和抛光方法
CN114630726A (zh) * 2019-11-05 2022-06-14 3M创新有限公司 模制研磨旋转工具
GB2595668B (en) * 2020-06-02 2022-05-25 Illinois Tool Works A contact cleaning surface
JP7435436B2 (ja) * 2020-12-24 2024-02-21 株式会社Sumco キャリアプレートの研磨方法
CN119927788B (zh) * 2025-04-08 2025-08-01 河北同光半导体股份有限公司 晶圆的研磨抛光加工方法

Citations (1)

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WO2017062719A1 (en) 2015-10-07 2017-04-13 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same

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Also Published As

Publication number Publication date
WO2019026021A1 (en) 2019-02-07
TW201910056A (zh) 2019-03-16
TWI803502B (zh) 2023-06-01
US20200164484A1 (en) 2020-05-28
CN111032284B (zh) 2022-11-04
JP2020529332A (ja) 2020-10-08
JP7165719B2 (ja) 2022-11-04
US12208483B2 (en) 2025-01-28
KR20200037269A (ko) 2020-04-08
CN111032284A (zh) 2020-04-17

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