TWI802242B - 晶圓載台 - Google Patents

晶圓載台 Download PDF

Info

Publication number
TWI802242B
TWI802242B TW111102751A TW111102751A TWI802242B TW I802242 B TWI802242 B TW I802242B TW 111102751 A TW111102751 A TW 111102751A TW 111102751 A TW111102751 A TW 111102751A TW I802242 B TWI802242 B TW I802242B
Authority
TW
Taiwan
Prior art keywords
wafer
peripheral
clamping elements
nozzle assembly
nozzle
Prior art date
Application number
TW111102751A
Other languages
English (en)
Other versions
TW202331905A (zh
Inventor
王滄毅
劉茂林
Original Assignee
辛耘企業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 辛耘企業股份有限公司 filed Critical 辛耘企業股份有限公司
Priority to TW111102751A priority Critical patent/TWI802242B/zh
Priority to KR1020220027826A priority patent/KR20230113482A/ko
Application granted granted Critical
Publication of TWI802242B publication Critical patent/TWI802242B/zh
Publication of TW202331905A publication Critical patent/TW202331905A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B05B1/185—Roses; Shower heads characterised by their outlet element; Mounting arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本發明提供一種晶圓載台，其包含一座體、一夾具及一背壓噴嘴組件。夾具設置在座體，夾具具有背向座體延伸的複數夾持元件，且夾持元件環列配置。背壓噴嘴組件設置在座體且被夾持元件圍繞且背壓噴嘴組件配置位置不超出各夾持元件之末端。背壓噴嘴組件而能夠在進行製程時向夾具上的晶圓的背面噴射壓力流體以平衡製程流體施於晶圓於之壓力而能夠避免晶圓彎曲變形而破裂。

Description

晶圓載台
本發明係有關於晶圓製程，尤其是一種具有晶背液壓支撐機制的晶圓載台。
現有的晶圓加工製程中常使用噴嘴對晶圓的表面噴灑藥液，隨著晶圓加工技術的進步，晶圓的厚度也日益縮減而能夠縮減其製成晶片之尺寸。因此，現今的晶圓常不具有足夠的結構強度以抵抗噴灑藥液時施於晶圓表面之壓力，該壓力可導致晶圓變形彎曲而影響製程良率，甚至致使晶圓破裂。
有鑑於此，本發明人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本發明人改良之目標。
本發明提供一種具有晶背液壓支撐機制的晶圓載台。
本發明提供一種晶圓載台，其包含一座體、一夾具及一背壓噴嘴組件。夾具設置在座體，夾具具有背向座體延伸的複數夾持元件，且夾持元件環列配置。背壓噴嘴組件設置在座體且被夾持元件圍繞且背壓噴嘴組件配置位置不超出各夾持元件之末端，背壓噴嘴組件設置有複數外圍噴嘴，外圍噴嘴則 以夾持元件的環列中心軸為中心呈環列配置，而且任一外圍噴嘴與相鄰另一外圍噴嘴間距介於10mm至15mm之間。
本發明的晶圓載台，其背壓噴嘴組件設置有至少一中心噴嘴。而且，夾持元件可水平配置或直立排列配置。
本發明的晶圓載台，其外圍噴嘴可呈單列環列配置。外圍噴嘴呈等間距配置。
本發明的晶圓載台，其外圍噴嘴可呈多列同心環列配置。在各列之中的該些外圍噴嘴呈等間距配置而具有一第一間距，任一該外圍噴嘴與相鄰另一列之中的最近的另一該外圍噴嘴之間具有一第二間距，且該第一間距與該第二間距介於10mm至15mm之間。
本發明的晶圓載台具有背壓噴嘴組件而能夠在進行製程時向晶圓的背面噴射壓力流體，藉以產生水膜效應，以平衡製程噴嘴對晶圓的正面噴灑製程流體時施於晶圓於之壓力，或提供低轉速水流而能夠避免製程噴嘴的噴射壓力致使晶圓彎曲變形而破裂。
10:晶圓
11:正面
12:背面
100:座體
200:夾具
210:夾持元件
211:抵靠部
220:旋轉機構
221:環架
222:滾輪
223:驅動單元
300:背壓噴嘴組件
301:中心噴嘴
302:外圍噴嘴
310:噴嘴座
310a:工作面
311:中心管路
312:外圍管路
400:製程噴嘴
L1:第一間距
L2:第二間距
L3:第三間距
圖1 係本發明較佳實施例之晶圓載台之立體示意圖。
圖2 係本發明較佳實施例之晶圓載台之側視圖。
圖3 係本發明較佳實施例之晶圓載台其背壓噴嘴組件之立體示意圖。
圖4 係本發明較佳實施例之晶圓載台用於立置晶圓製程之使用狀態示意圖。
圖5 係本發明較佳實施例之晶圓載台用於平置晶圓製程之使用狀態示意圖。
參閱圖1至圖3，本發明的較佳實施例提供一種晶圓載台，其用於承載一晶圓10以供進行晶圓10加工製程。於本實施例中，本發明的晶圓載台包含一座體100、一夾具200及一背壓噴嘴組件300。於本實施例中，座體100以一平板作為代表，但本發明並不限定座體100之形式。
於本實施例中，夾具200設置在座體100，夾具200至少具有複數夾持元件210以供夾持晶圓10的邊緣，且夾持元件210數量至少為三。晶圓10的二面分別為一正面11以及與正面11相背的一背面12，且其正面11上供進行加工製程。具體而言，各夾持元件210分別遠離座體100延伸而且該些夾持元件210環列配置。於本實施例中，各夾持元件210皆呈柱狀且其外壁可抵靠於晶圓10之邊緣以供晶圓10徑向定位，各夾持元件210分別具有一抵靠部211以抵靠晶圓10，抵靠部211凸出於夾持元件210的側面而呈凸階狀，因此抵靠部211抵靠於晶圓10的背面12而正向定位晶圓10。然而，本明所指夾持元件210之形態不僅限於前述。
於本實施例中，夾具200還具有一旋轉機構220以旋轉還些夾持元件210。旋轉機構220為能夠旋轉晶圓之機構，旋轉機構220在此舉例說明如後，但並不僅限於此，旋轉機構220包含一環架221以及至少一滾輪222，該些夾持元件210設置在該環架221上，滾輪222可以設置在座體100上且抵接環架221的邊緣，於本實施例中較佳地設置有複數滾輪222，但本發明不限定滾輪222之數 量，而且至少其中一個滾輪222連動一驅動單元223。當進行晶圓10加工製程時，藉由驅動單元223驅動相連動的滾輪222旋轉而帶動環架221旋轉，進而旋轉晶圓10，同時藉由一製程噴嘴400朝向晶圓10的正面11噴灑製程流體以加工晶圓10，其製程流體可能是蝕刻藥液、溶劑、清洗液等。
背壓噴嘴組件300設置在該座體100且被該些夾持元件210圍繞且背壓噴嘴組件300配置位置不超出各該夾持元件210之末端。具體而言，背壓噴嘴組件300且有一噴嘴座310，噴嘴座310具有一工作面310a，工作面310a上佈設有至少一中心噴嘴301以及複數外圍噴嘴302，中心噴嘴301及外圍噴嘴302的孔徑皆介於0.5mm至2.5mm。環架221圍繞該背壓噴嘴組件300，且噴嘴座310的工作面310a不超出夾持元件210之接觸部。噴嘴座310內設有連通各中心噴嘴301的中心管路311以及連通各外圍噴嘴302的外圍管路312，通過中心管路311以及外圍管路312能夠供應壓力流體至中心噴嘴301及外圍噴嘴302。而且，流過晶圓10正面11的製程流體可以泵入中心管路311以及外圍管路312作為壓力流體，因此無需分流不同的流體，且該製程流體亦可泵入可稀釋流體(如水)，以便於排放或再利用。
中心噴嘴301鄰近或重合於旋轉機構220的旋轉中心軸，該些外圍噴嘴302則以旋轉機構220的旋轉中心軸為中心呈環列配置，而且該些外圍噴嘴302可以呈單列環列配置或是多列同心環列配置。在各列之中的外圍噴嘴302呈等間距配置而具有一第一間距L1，任一外圍噴嘴302與相鄰另一列之中的最近的外圍噴嘴302之間具有一第二間距L2，第一間距L1與第二間距L2皆介於10mm至15mm之間。
前述各夾持元件210的抵靠部211配至在同一平面，也就是說此平面與晶圓10的背面12重疊，且此平面與工作面310a之間具有一第三間距L3，第三間距介於0.5mm至3mm之間。藉此第一間距L1、第二間距L2及第三間距L3相互配合之配置使得壓力流體能均勻分散至晶圓10的背面12而形成液膜，且液膜之表面張力能有效地支撐晶圓10的背面12。
參閱圖4所示，環架221直立配置而將晶圓10直立放置以進行立式製程。背壓噴嘴組件300通過外圍噴嘴302向晶圓10的背面12噴射壓力流體而使壓力流體橫跨而構成佈滿晶圓10的背面12的一液膜，藉此支撐晶圓10以平衡製程噴嘴400對晶圓10的正面11噴灑製程流體時施於晶圓10於之壓力。
參閱圖5所示，環架221水平配置而將晶圓10水平放置以進行臥式製程。背壓噴嘴組件300通過中心噴嘴301向晶圓10的背面12噴射壓力流體而使壓力流體向外擴散溢流而構成佈滿晶圓10的背面12的一液膜，藉此支撐晶圓10以平衡製程噴嘴400對晶圓10的正面11噴灑製程流體時施於晶圓10於之壓力。
綜上所述，本發明的晶圓載台具有背壓噴嘴組件300而能夠在進行製程時向晶圓10的背面12噴射壓力流體，藉以產生水膜效應，以平衡製程噴嘴400對晶圓10的正面11噴灑製程流體時施於晶圓10於之壓力，或提供低轉速水流而能夠避免製程噴嘴400的噴射壓力致使晶圓10彎曲變形而破裂。
以上所述僅為本發明之較佳實施例，非用以限定本發明之專利範圍，其他運用本發明之專利精神之等效變化，均應俱屬本發明之專利範圍。
10:晶圓
11:正面
12:背面
100:座體
200:夾具
210:夾持元件
211:抵靠部
220:旋轉機構
221:環架
222:滾輪
223:驅動單元
300:背壓噴嘴組件
310:噴嘴座
310a:工作面
400:製程噴嘴

Claims (9)

  1. 一種晶圓載台，包含：一座體；一夾具，設置在該座體，該夾具具有背向該座體延伸的複數夾持元件，且該些夾持元件環列配置；及一背壓噴嘴組件，設置在該座體且被該些夾持元件圍繞且該背壓噴嘴組件配置位置不超出各該夾持元件之末端，該背壓噴嘴組件設置有複數外圍噴嘴，該些外圍噴嘴則以該些夾持元件的環列中心軸為中心呈環列配置，而且任一該外圍噴嘴與相鄰另一該外圍噴嘴間距介於10mm至15mm之間，其中該背壓噴嘴組件設置有至少一中心噴嘴；其中該噴嘴座內設有連通各該中心噴嘴的一中心管路以及連通各該外圍噴嘴的一外圍管路。
  2. 如請求項1所述的晶圓載台，其中該些夾持元件圍繞該背壓噴嘴組件。
  3. 如請求項1所述的晶圓載台，其中該些夾持元件水平排列配置。
  4. 如請求項1所述的晶圓載台，其中該些夾持元件直立排列配置。
  5. 如請求項1所述的晶圓載台，其中該些外圍噴嘴呈單列環列配置。
  6. 如請求項5所述的晶圓載台，其中該些外圍噴嘴呈等間距配置。
  7. 如請求項1所述的晶圓載台，其中該些外圍噴嘴呈多列同心環列配置。
  8. 如請求項7所述的晶圓載台，其中在各列之中的該些外圍噴嘴呈等間距配置而具有一第一間距，且該第一間距介於10mm至15mm之間。
  9. 如請求項7所述的晶圓載台，其中任一該外圍噴嘴與相鄰另一列之中的最近的另一該外圍噴嘴之間具有一第二間距，且該第二間距介於10mm至15mm之間。
TW111102751A 2022-01-22 2022-01-22 晶圓載台 TWI802242B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111102751A TWI802242B (zh) 2022-01-22 2022-01-22 晶圓載台
KR1020220027826A KR20230113482A (ko) 2022-01-22 2022-03-04 웨이퍼 스테이지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111102751A TWI802242B (zh) 2022-01-22 2022-01-22 晶圓載台

Publications (2)

Publication Number Publication Date
TWI802242B true TWI802242B (zh) 2023-05-11
TW202331905A TW202331905A (zh) 2023-08-01

Family

ID=87424395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111102751A TWI802242B (zh) 2022-01-22 2022-01-22 晶圓載台

Country Status (2)

Country Link
KR (1) KR20230113482A (zh)
TW (1) TWI802242B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283020B (en) * 2001-06-22 2007-06-21 Ses Co Ltd Single wafer type substrate cleaning method and apparatus
TW201938322A (zh) * 2018-03-12 2019-10-01 日商東京威力科創股份有限公司 基板之翹曲修正方法、電腦記錄媒體及粗糙化處理裝置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283020B (en) * 2001-06-22 2007-06-21 Ses Co Ltd Single wafer type substrate cleaning method and apparatus
TW201938322A (zh) * 2018-03-12 2019-10-01 日商東京威力科創股份有限公司 基板之翹曲修正方法、電腦記錄媒體及粗糙化處理裝置

Also Published As

Publication number Publication date
TW202331905A (zh) 2023-08-01
KR20230113482A (ko) 2023-07-31

Similar Documents

Publication Publication Date Title
JP2006289359A (ja) ガス噴射装置
TWI384581B (zh) 用以撐持基材的裝置
US20060086460A1 (en) Developing treatment apparatus
CN111112186B (zh) 一种晶圆片清洗设备
KR100466297B1 (ko) 반도체 제조 장치
TWI802242B (zh) 晶圓載台
TW201820529A (zh) 具有邊緣環的旋轉卡盤
TWI320201B (en) Spin chuck
CN116564877A (zh) 晶圆载台
CN101015049A (zh) 衬底处理装置
CN210117422U (zh) 一种用于基板处理的喷淋装置以及一种基板处理设备
JP2001319912A (ja) 液処理装置および液処理方法
JP4005335B2 (ja) 基板処理装置
KR20090057797A (ko) 기판 세정 장치
JP3973344B2 (ja) 基板処理装置
KR101099591B1 (ko) 기판 세정용 디스크 유닛 및 이를 갖는 기판 세정 장치
KR100727581B1 (ko) 도포 장치용 노즐 및 이를 포함하는 도포 장치
CN210367909U (zh) 一种矩形式液管喷嘴一体排列喷淋机构
KR100930826B1 (ko) 매엽식 세정장치
TWI744966B (zh) 水平濕製程治具
KR100308207B1 (ko) 반도체현상설비의나이프에지링과이너컵및웨이퍼오염방지장치
KR101213967B1 (ko) 기판세정장치
JP3334873B2 (ja) 回転式基板処理装置
JP7154995B2 (ja) 基板処理装置
KR101121194B1 (ko) 기판 처리 장치