TWI801955B - 焊接裝置以及焊接方法 - Google Patents
焊接裝置以及焊接方法 Download PDFInfo
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- TWI801955B TWI801955B TW110128585A TW110128585A TWI801955B TW I801955 B TWI801955 B TW I801955B TW 110128585 A TW110128585 A TW 110128585A TW 110128585 A TW110128585 A TW 110128585A TW I801955 B TWI801955 B TW I801955B
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000003466 welding Methods 0.000 claims abstract description 203
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- 238000005476 soldering Methods 0.000 claims description 15
- 238000012417 linear regression Methods 0.000 claims description 13
- 238000007476 Maximum Likelihood Methods 0.000 claims description 8
- 238000005070 sampling Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
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- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
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Abstract
本發明的實施例提供一種焊接裝置以及焊接方法。根據本發明的實施例的焊接裝置包括:作業台,被安放基板;門吊,設置於所述作業台的上方;焊接單元,沿著所述門吊移動並在所述基板上焊接晶片;以及控制部,爲了使所述焊接單元位於所述基板上的焊接位置而使所述焊接單元移動,並控制焊接單元在所述焊接位置焊接晶片。所述控制部可基於所述焊接單元的連續驅動次數以及閒置時間的加權和來確定所述焊接單元的移動距離。
Description
本發明涉及用於在基板上焊接晶片的焊接裝置以及焊接方法,更具體地涉及基於焊接單元的驅動記錄執行焊接位置的確定及校正的焊接裝置以及焊接方法。
半導體(或者顯示器)製造工藝是用於在基板(例如:晶圓)上製造半導體元件的工藝,例如包括曝光、沉積、蝕刻、離子植入、清洗、封裝等。尤其,在封裝工藝中,作為替代用於電連接層疊的晶片間的線焊接的技術,披露有在晶片開通微細的孔洞並在相應孔洞中插入導電體來電連接下晶片和上晶片的TSV(Through Silicon Via;穿矽通孔)技術。
作為TSV焊接過程的一環,可以執行用於在基板上焊接晶片的晶片焊接工藝。通常,焊接單元的焊接頭提取晶片之後向基板上的焊接位置移動,將晶片焊接到相應焊接位置。在此,使用設置於焊接單元中的視覺單元(例如:相機)來檢查相應焊接位置和焊接頭是否對準,使用視覺單元進行焊接頭的校位後執行焊接。
另一方面,為了提高半導體製造工藝的效率,被要求在基板上迅速焊接晶片的方法,但由於如上述那樣使用視覺單元的校正等的順序,焊接時間可能延遲。
因此,本發明的實施例提供用於準確且迅速地在基板上焊接晶片的焊接裝置以及焊接方法。
本發明的解决課題不限於以上所提及的,本領域技術人員會從下面的記載能够明確地理解未被提及的其它解决課題。
根據本發明的實施例的焊接裝置包括:作業台,被安放基板;門吊,設置於所述作業台的上方;焊接單元,沿著所述門吊移動並在所述基板上焊接晶片;以及控制部,為了使所述焊接單元位於所述基板上的焊接位置而使所述焊接單元移動,並控制焊接單元在所述焊接位置焊接晶片。所述控制部可基於所述焊接單元的連續驅動次數以及閒置時間的加權和來確定所述焊接單元的移動距離。
在一實施例中,所述控制部可使用向與所述焊接單元的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和相加偏移值的線性回歸式,確定所述焊接單元的移動距離。
在一實施例中,所述控制部可基於針對所述基板上的晶片的焊接檢查結果,校正適用於與所述連續驅動次數有關的參數的第一加權值以及適用於與所述閒置時間有關的參數的第二加權值。
在一實施例中,當基於焊接後檢查結果的焊接誤差的波幅在基準範圍以內時,所述控制部可校正所述第一加權值以及所述第二加權值。
在一實施例中,所述第一加權值以及所述第二加權值可基於最小平方近似法(Least Square Approximation)、ML(Maximum Likelihood;最大似
然)估計或者RANSAC(Random Sample Consensus;隨機抽樣一致算法)來確定。
在一實施例中,所述連續驅動次數可相當於所述焊接單元無閒置時間地執行基準次數以上焊接的次數。
在一實施例中,當所述焊接單元以待機狀態工作的時間超過基準時間時,所述閒置時間可確定為所述基準時間。
根據本發明的實施例的焊接方法包括:使基板位於作業台上的步驟;確定焊接位置的步驟;為了使焊接單元位於所述焊接位置上而使所述焊接單元移動的步驟;以及在所述基板上的焊接位置焊接晶片的步驟。使所述焊接單元移動的步驟可包括:基於與所述焊接單元的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和來確定所述焊接單元的移動距離的步驟。
在一實施例中,確定所述焊接單元的移動距離的步驟可包括:使用向與所述焊接單元的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和相加偏移值的線性回歸式來確定所述焊接單元的移動距離的步驟。
在一實施例中,焊接方法還可以包括:基於針對所述基板上的晶片的焊接檢查結果來校正適用於與所述連續驅動次數有關的參數的第一加權值以及適用於與所述閒置時間有關的參數的第二加權值的步驟。
在一實施例中,校正所述第一加權值以及所述第二加權值的步驟可包括:當基於焊接後檢查結果的焊接誤差的波幅在基準範圍以內時校正所述第一加權值以及所述第二加權值的步驟。
根據本發明的實施例的焊接設備包括:裝載部,被安放用於容納基板的容器;基板轉送部,從安放在所述裝載部中的容器轉送所述基板;焊接處
理部,在從所述基板轉送部提供的基板上焊接晶片;以及檢查部,從所述基板轉送部接收通過所述焊接處理部處理的基板,並檢查焊接在被處理的基板上的晶片。所述焊接處理部包括:作業台,被安放基板;門吊,設置於所述作業台的上方;焊接單元,沿著所述門吊移動並在所述基板上焊接晶片;以及控制部,為了使所述焊接單元位於所述基板上的焊接位置而使所述焊接單元移動,並控制焊接單元在所述焊接位置焊接晶片。所述控制部可基於所述焊接單元的連續驅動次數以及閒置時間的加權和來確定所述焊接單元的移動距離。
根據本發明的實施例,使用焊接單元的驅動記錄來確定及校正焊接單元的移動距離,從而焊接單元能够迅速移動到準確的位置並迅速地在基板上焊接晶片。
本發明的效果不限於以上提及的,本領域技術人員會從下面的記載能够明確地理解未提及的其它效果。
10:焊接設備
20:基板
22:容器
30:第一載體帶
32:晶片
38:第二載體帶
40:晶圓
42:晶片
50:容器
100A、100B:焊接處理部
101:控制部
102:作業台
104:作業台驅動部
110:第一載體帶供應部
124:第二載體帶供應部
130:焊接單元
132:焊接頭
136、138:門吊
141、142:移動導向件
146:上排列相機
148:上排列相機驅動部
150:第一下相機
152:清潔單元
154:門吊
160:晶圓作業台
168:作業台驅動單元
170:第一晶片轉送單元
172:採摘器
174:採摘器驅動部
180:第二晶片轉送單元
182:晶片梭
184:梭驅動部
190:晶片載體裝載部
192:晶圓轉送單元
194:夾具
196:夾具驅動部
200:第一上相機
202:第二上相機
204:第三上相機
206:第二相機驅動部
210:第二下相機
300:裝載部
400:檢查部
500:基板轉送部
510:基板搬運機械臂
600:基板排列單元
S505、S510、S515、S520:步驟
圖1示出根據本發明的實施例的焊接設備的概要結構。
圖2示出根據本發明的實施例的焊接設備內焊接處理裝置的概要結構。
圖3以及圖4示出根據本發明的實施例的焊接裝置的例子。
圖5是示出根據本發明的實施例的焊接方法的流程圖。
以下,參照附圖來詳細說明本發明的實施例,以使得本發明所屬技術領域中具有通常知識的人能够容易地實施。本發明可以以各種不同方式實現,不限於在此說明的實施例。
為了清楚地說明本發明,省略了與說明無關的部分,貫穿說明書整體對相同或類似的構成要件標註相同的附圖標記。
另外,在多個實施例中,對具有相同結構的構成要件,使用相同的附圖標記來僅說明代表性實施例,在其餘的其它實施例中僅說明與代表性實施例不同的結構。
在說明書整體中,當表述某部分與其它部分“連接(或者結合)”時,其不僅是“直接連接(或者結合)”的情况,還包括將其它部件置於中間“間接連接(或者結合)”的情况。另外,當表述某部分“包括”某構成要件時,只要沒有特別相反記載,其意指可以還包括其它構成要件而不是排除其它構成要件。
只要沒有不同地定義,包括技術或科學術語在內在此使用的所有術語具有與本發明所屬技術領域中具有通常知識的人一般所理解的含義相同的含義。在通常使用的詞典中定義的術語之類的術語應解釋為具有與相關技術文脉上具有的含義一致的含義,只要在本申請中沒有明確定義,不會理想性或過度地解釋為形式性含義。
圖1示出根據本發明的實施例的焊接設備的概要結構。根據本發明的實施例的焊接設備10可以用於在基板20上焊接晶片32。在此,晶片32、42也可以通過托盤或者載體帶30供應,並可以從晶圓40供應。
焊接設備10可以包括:裝載部300,用於安放容納基板20的容器22;基板轉送部500,從安放於裝載部300的容器轉送基板20;焊接處理部100A、100B,在從基板轉送部500提供的基板20上焊接晶片32、42;以及檢查部400,從基板轉送部500接收通過焊接處理部100A、100B焊接處理的基板20,並檢查焊接在被處理的基板20上的晶片32、42。另外,可以具備用於供應附著有要焊接到基
板20上的晶片32、42的載體帶的載體帶供應部110、124、供投放容納載體帶供應部110、124和晶片供應用晶圓40的容器50的晶片載體裝載部190。
作為一例,焊接處理部可以包括具有相同結構的第一焊接處理部100A和第二焊接處理部100B。如圖1所示,可以以基板轉送部500作為中心對稱配置。另外,裝載部300和檢查部400可以以基板轉送部500作為中心背向配置。
參照圖1,若在裝載部300安放用於容納基板20的容器22,則容納在容器22中的基板20通過基板轉送部500的基板搬運機械臂510向焊接處理部100A、100B傳遞。另外,可以從作為晶片裝載部提供的載體帶供應部110、124或者安放於晶片載體裝載部190的容器50向焊接處理部100A、100B供應晶片供應用晶圓40。提供用於在安放於作業台102中的基板20上焊接晶片32、42的焊接單元130,後面說明焊接單元130的工作以及焊接方法。
若結束在基板20上焊接晶片32、42,則基板20通過基板搬運機械臂510從焊接處理部100A、100B焊接後為了檢查(PBI:Post Bonding Inspection)而向檢查部400傳遞。在檢查部400中具備基板排列單元600,基板排列單元600可以在檢查台以及檢查裝置中排列基板20。在檢查部400結束檢查之後,基板20可以通過基板搬運機械臂510收納在裝載部300的容器22中並為了之後的處理而搬出。
圖2示出根據本發明的實施例的焊接設備內焊接處理部的概要結構。圖2示出圖1的焊接處理部100A的詳細結構。
參照圖2,焊接處理部100A提供用於安放基板20的作業台102、設置於作業台102的上方的門吊136、138以及沿著門吊136、138移動並在基板20上
焊接晶片32的焊接單元130。可以提供控制焊接單元的驅動(水平移動、垂直移動)的控制部101。
焊接單元130可以包括用於將晶片32、42焊接到基板20上的焊接頭132以及用於使焊接頭132向水平以及垂直方向移動的頭驅動部。在焊接頭132可以安裝具有與晶片32、42對應的尺寸的焊接工具(tool)。焊接單元130可以利用真空壓力而提取晶片32、42,在焊接頭132中可以具備用於加熱晶片32、42的加熱器(未圖示)。作業台102可以通過作業台驅動部104向水平方向移動。例如,作業台102可以通過作業台驅動部104向X軸方向移動,焊接頭132可以通過頭驅動部向Y軸方向移動。即,基板20上的焊接位置和焊接頭132之間的排列可以通過作業台驅動部104和頭驅動部來執行。另外,作業台102可以構成為能够為了基板20的排列而旋轉。
在作業台102的上方可以配置用於檢測基板20上的焊接位置的上排列相機146。作為一例,上排列相機146可以構成為在第一門吊136上能够通過上排列相機驅動部148向Y軸方向移動,並可以用於焊接位置和焊接頭132的排列。即,基板20上的焊接位置可以通過上排列相機146檢測,可以利用檢測到的焊接位置的位置座標來調節焊接頭132的位置。
可以在門吊136、138之間配置第一下相機150,可以通過第一下相機150觀測晶片32、42真空吸附於焊接工具的下表面的狀態。第一下相機150可以用於糾正被焊接工具吸附的晶片32、42的姿勢。門吊136、138包括用於使焊接單元130的水平方移動的移動導向件141、142。焊接單元130可以沿著移動導向件141、142移動。可以提供用於控制焊接單元130的焊接的控制部101。控制部101可以通過一個或其以上的處理器實現。如下說明,控制部101可以控制焊接單元
130以為了使焊接單元130位於焊接位置而使焊接單元130移動,並在焊接位置焊接晶片32、42。根據本發明的實施例,控制部101可以使用焊接單元130的驅動記錄(連續驅動次數、閒置時間)來補償移動量誤差。
另外,可以設置供應具有用於分別收納要焊接到基板20上的晶片32的小容器的第一載體帶30的第一載體帶供應部110以及供應第二載體帶38的第二載體帶供應部124。尤其,可以選擇性地使用第一載體帶供應部110和第二載體帶供應部124中的任一個。例如,可以在收納在第一載體帶30中的晶片32全部供應之後,供應收納在第二載體帶38中的晶片32。另外,第一載體帶供應部110和第二載體帶供應部124也可以分別供應彼此不同種類的帶。與圖2的示例不同,也可以僅提供一個載體帶供應部110、124。
另外,作為用於供應晶片42的手段,可以提供設置有晶片42的晶圓40。晶圓40安放於晶圓作業台160,在晶圓作業台160的一側可以具備用於對收納有晶片供應用晶圓40的容器50進行支承的晶片載體裝載部190。另外,在晶片載體裝載部190的一側可以具備用於從容器50取出晶圓40並轉送到晶圓作業台160上的晶圓轉送單元192。晶圓轉送單元192可以包括用於把持晶圓40的夾具194以及用於使夾具194向水平方向移動的夾具驅動部196。
在載體帶供應部110、124和晶圓作業台160的上方可以配置用於從載體帶30、38或者晶圓40一個一個提取晶片32、42並轉送的第一晶片轉送單元170。第一晶片轉送單元170可以包括配置於載體帶供應部110、124以及晶圓作業台160上方並用於利用真空壓力提取晶片32、42的採摘器172以及用於使採摘器172向水平方向(例如:X軸方向)移動的採摘器驅動部174。另外,採摘器驅動部174可以為了提取晶片32、42而使採摘器172向垂直方向移動。
在載體帶供應部110、124和晶圓作業台160之間可以配置用於使得被採摘器172轉送的晶片32、42向與作業台102相鄰的位置移動的第二晶片轉送單元180。第二晶片轉送單元180可以包括用於支承晶片32、42的晶片梭182以及用於使晶片梭182在載體帶供應部110、124與晶圓作業台160之間的第一位置和與作業台102相鄰的第二位置之間向水平方向例如Y軸方向移動的梭驅動部184。
在載體帶供應部110、124的上方可以配置用於檢測晶片32的位置的第一上相機200,在晶圓作業台160的上方可以配置用於檢測晶圓40上的晶片42中要提取的晶片的位置的第二上相機202。並且,在第二晶片轉送單元180的上方可以配置用於檢查位於晶片梭182上的晶片32、42的第三上相機204。
第一、第二、第三上相機200、202、204可以構成為能够通過第二相機驅動部206向水平方向例如X軸方向移動。另外,在第一晶片轉送單元170的下方可以配置用於觀測被採摘器172提取的晶片32、42的第二下相機210。第二下相機210可以用於糾正被採摘器172提取的晶片32、42的姿勢。藉由作業台驅動單元168,晶圓作業台160可沿水平方向(X軸或Y軸)移動。清潔單元152可設置於作業台102上方,以移除作業台102或基板20上的髒污粒子。清潔單元152可安裝在沿Y軸延伸的門吊154並利用真空壓力移除作業台102或基板20上的髒污粒子。
以下,說明根據本發明的實施例的焊接位置確定及校正方法。當使用普通視覺數據的焊接頭132的對準方法時,使用上排列相機146識別基板20上的圖案後,使焊接單元130移動並將晶片32、42焊接到基板20上。當多層層疊時,識別位於基板20的晶片後,在晶片的上方焊接晶片。當基於普通視覺數據的對準方法時,用於焊接位置確定的校準(calibration)方法按照焊接位置誤差值
的平均數據來設定。在此情况下,存在不能反映隨著持續執行焊接而產生的累積誤差(例如:熱量引起的誤差)的問題。
由此,本發明的實施例提供用於基於焊接單元130的驅動記錄(連續驅動次數、閒置時間)來確定及校正焊接單元130的驅動量(移動距離)的方法。即,本發明提供如下方法:為了在沒有焊接單元130的溫度感測器的情况下補償熱量,在焊接單元130驅動時記錄與連續驅動次數以及閒置時間有關的數據,當焊接單元130的驅動以及對準時進行線性回歸補償。
控制部101記錄焊接單元130的連續驅動次數,並當停止焊接時記錄閒置時間。優選地,將焊接進行至通過焊接後檢查(PBI)而焊接精密度的變化增幅變緩為止。即,焊接優先進行至焊接誤差範圍保持在基準範圍以內為止。
在恆溫空間中,關於閒置時間,一定時間(例如:4小時)以上是相同地記錄為最大閒置時間。當因焊接單元130再次運轉而記錄連續驅動次數時,閒置時間成比例地減小。當在焊接後檢查中焊接位置誤差的變化增幅變緩的時刻記錄連續驅動次數時,閒置時間清零。根據基於這樣的焊接單元130的驅動數據反映有連續驅動次數和閒置時間的線性回歸式,校正用於焊接的驅動量。
根據本發明的實施例,提供如下方法:將通過焊接檢查結果所提取的焊接誤差和焊接單元130的驅動記錄(連續驅動次數、閒置時間)的相互關係實現為線性回歸模型(linear regression model),使用相應線性回歸模型來確定及校正焊接單元130的移動距離。以下,參照圖3以及圖4,以對沿著門吊136、138的移動導向件141、142移動的焊接單元130的移動距離進行校正的情况的例子為中心進行說明。不僅是如圖3以及圖4那樣的一維移動,當然可以在二維以及三維驅動中適用本發明。
圖3以及圖4示出根據本發明的實施例的焊接裝置。圖3示出從上方觀察的焊接裝置,圖4示出從側面觀察的焊接裝置。
參照圖3以及圖4,在作業台102的上方設置門吊136、138,作為門吊136、138的一部分而提供用於焊接單元130的單元的水平方向移動的移動導向件141、142。焊接單元130可以沿著移動導向件141、142向焊接位置移動後將晶片32、42焊接到基板20上。由於隨著焊接單元130沿著移動導向件141、142移動所產生的摩擦等而產生的熱量可能引起在朝向焊接位置的移動距離中產生誤差。
通過焊接單元130的驅動記錄(連續驅動次數、閒置時間)用作參數的線性回歸式而反映熱變形帶來的誤差來校正用於焊接的移動量,從而能够實現焊接精密度的提高以及迅速焊接。例如,在如以下數學式1那樣的線性回歸式中,當移動距離校正量設為y時,x1、x2、...、xn是與包括連續驅動次數、閒置時間的驅動記錄相關的參數,β 1、β 2、...、β 3相當於適用於各參數的加權值。β 0是偏移值,可以相當於事先設定或反映了過去焊接誤差等的值。
[數學式1]y=β 0+β 1 X 1+β 2 X 2+...+β n X n
即,對焊接單元130的驅動進行控制的控制部101可以基於反映有與焊接單元130的驅動記錄(連續驅動次數、閒置時間)有關的參數的加權和的線性回歸式,確定焊接單元130的移動距離。考慮在焊接之後檢查步驟中檢測到的焊接誤差來改變各加權值。作為用於校正線性回歸式的加權值的方法,可以適用各種算法(例如:最小平方近似法(Least Square Approximation),ML(Maximum
Likelihood;最大似然)估計或者RANSAC(Random Sample Consensus;隨機抽樣一致算法))。
根據本發明的實施例,控制部101可以基於焊接單元130的連續驅動次數以及閒置時間的加權和來確定焊接單元130的移動距離。即,推斷焊接單元130的驅動數據和焊接誤差的相互關係,根據相互關係來校正用於基於焊接單元130的驅動數據來焊接的移動距離,從而能够更迅速且準確地執行焊接。
在本發明的實施例中,控制部101可以使用向與焊接單元130的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和相加偏移值的線性回歸式,確定焊接單元的移動距離。
在本發明的實施例中,控制部101可以基於針對基板20上的晶片32、42的焊接檢查結果,校正適用於與連續驅動次數有關的參數的第一加權值以及適用於與閒置時間有關的參數的第二加權值。
在本發明的實施例中,當基於焊接後檢查結果的焊接誤差的波幅在基準範圍以內時,控制部101可以校正適用於與連續驅動次數有關的參數以及與閒置時間有關的參數的第一加權值以及第二加權值。
在本發明的實施例中,連續驅動次數可以相當於焊接單元130無閒置時間地執行基準次數(例如:3次)以上焊接的次數。
在本發明的實施例中,當焊接單元130以待機狀態工作的時間超過基準時間(例如:4小時)時,所述閒置時間不再增加而可以確定為基準時間。
圖5示出根據本發明的實施例的焊接方法的流程圖。圖5的工作可以通過上述的控制部101(處理器)來執行。
根據本發明的實施例的焊接方法可以包括使基板20位於作業台102上的步驟(S505)、確認基板20上的焊接位置的步驟(S510)、為了使焊接單元130位於焊接位置上而使焊接單元130移動的步驟(S515)以及在基板20上的焊接位置焊接晶片32、42的步驟(S520)。根據本發明的實施例,使焊接單元130移動的步驟(S515)可以包括基於與焊接單元130的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和來確定焊接單元130的移動距離的步驟。
在一實施例中,確定焊接單元130的移動距離的步驟可以包括使用向與焊接單元130的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和相加偏移值的線性回歸式來確定焊接單元130的移動距離的步驟。
在一實施例中,焊接方法可以還包括基於針對基板20上的晶片32、42的焊接檢查結果來校正適用於與連續驅動次數有關的參數的第一加權值以及與閒置時間有關的參數的第二加權值的步驟。
在一實施例中,校正第一加權值以及第二加權值的步驟可以當基於焊接後檢查結果的焊接誤差的波幅在基準範圍以內時校正第一加權值以及第二加權值。
在一實施例中,第一加權值以及第二加權值可以基於最小平方近似法(Least Square Approximation)、ML(Maximum Likelihood;最大似然)估計或者RANSAC(Random Sample Consensus;隨機抽樣一致算法)來確定。
在一實施例中,連續驅動次數可以相當於焊接單元130無閒置時間地執行基準次數以上焊接的次數。
在一實施例中,當焊接單元130以待機狀態工作的時間超過基準時間時,閒置時間可以確定為基準時間。
以上,說明了本發明的各種實施例,到此為止參照的附圖和記載的發明的詳細說明只是本發明的示例,其僅用作用於說明本發明的目的,並不是用於意義限定或限制申請專利範圍中記載的本發明的範圍。因而本技術領域的具有通常知識的人將會理解根據其能够進行各種變形及等同的其它實施例。因此,本發明的真實技術保護範圍應通過所附的申請專利範圍的技術構思來定。
130:焊接單元
132:焊接頭
136、138:門吊
141、142:移動導向件
Claims (20)
- 一種焊接裝置,包括: 作業台,被安放基板; 門吊,設置於該作業台的上方; 焊接單元,沿著該門吊移動並在該基板上焊接晶片;以及 控制部,爲了使該焊接單元位於該基板上的焊接位置而使該焊接單元移動,並控制焊接單元在該焊接位置焊接晶片, 該控制部基於該焊接單元的連續驅動次數以及閒置時間的加權和來確定該焊接單元的移動距離。
- 根據請求項1所述的焊接裝置,其中,該控制部使用向與該焊接單元的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和相加偏移值的線性回歸式,確定該焊接單元的移動距離。
- 根據請求項2所述的焊接裝置,其中,該控制部基於針對該基板上的晶片的焊接檢查結果,校正適用於與該連續驅動次數有關的參數的第一加權值以及適用於與該閒置時間有關的參數的第二加權值。
- 根據請求項3所述的焊接裝置,其中,當基於焊接後檢查結果的焊接誤差的波幅在基準範圍以內時,該控制部校正該第一加權值以及該第二加權值。
- 根據請求項3所述的焊接裝置,其中,該第一加權值以及該第二加權值基於最小平方近似法、最大似然估計或者隨機抽樣一致算法來確定。
- 根據請求項1所述的焊接裝置,其中,該連續驅動次數相當於該焊接單元無閒置時間地執行基準次數以上焊接的次數。
- 根據請求項1所述的焊接裝置,其中,當該焊接單元以待機狀態工作的時間超過基準時間時,該閒置時間確定爲該基準時間。
- 一種焊接方法,包括: 使基板位於作業台上的步驟; 確定焊接位置的步驟; 爲了使焊接單元位於該焊接位置上而使該焊接單元移動的步驟;以及 在該基板上的焊接位置焊接晶片的步驟, 使該焊接單元移動的步驟包括: 基於與該焊接單元的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和來確定該焊接單元的移動距離的步驟。
- 根據請求項8所述的焊接方法,其中,確定該焊接單元的移動距離的步驟包括: 使用向與該焊接單元的連續驅動次數有關的參數以及與閒置時間有關的參數的加權和相加偏移值的線性回歸式來確定該焊接單元的移動距離的步驟。
- 根據請求項9所述的焊接方法,其中,該焊接方法還包括: 基於針對該基板上的晶片的焊接檢查結果來校正適用於與該連續驅動次數有關的參數的第一加權值以及適用於與該閒置時間有關的參數的第二加權值的步驟。
- 根據請求項10所述的焊接方法,其中,校正該第一加權值以及該第二加權值的步驟包括: 當基於焊接後檢查結果的焊接誤差的波幅在基準範圍以內時校正該第一加權值以及該第二加權值的步驟。
- 根據請求項10所述的焊接方法,其中,該第一加權值以及該第二加權值基於最小平方近似法、最大似然估計或者隨機抽樣一致算法來確定。
- 根據請求項8所述的焊接方法,其中,該連續驅動次數相當於該焊接單元無閒置時間地執行基準次數以上焊接的次數。
- 根據請求項8所述的焊接方法,其中,當該焊接單元以待機狀態工作的時間超過基準時間時,該閒置時間確定爲該基準時間。
- 一種焊接設備,包括: 裝載部,被安放用於容納基板的容器; 基板轉送部,從安放在該裝載部中的容器轉送該基板; 焊接處理部,在從該基板轉送部提供的基板上焊接晶片;以及 檢查部,從該基板轉送部接收通過該焊接處理部處理的基板,並檢查焊接在被處理的該基板上的晶片, 該焊接處理部包括: 作業台,被安放基板; 門吊,設置於該作業台的上方; 焊接單元,沿著該門吊移動並在該基板上焊接晶片;以及 控制部,爲了使該焊接單元位於該基板上的焊接位置而使該焊接單元移動,並控制焊接單元在該焊接位置焊接晶片, 該控制部基於該焊接單元的連續驅動次數以及閒置時間的加權和來確定該焊接單元的移動距離。
- 根據請求項15所述的焊接設備,其中,該控制部使用向該焊接單元的連續驅動次數以及閒置時間的加權和相加偏移值的線性回歸式,確定該焊接單元的移動距離。
- 根據請求項16所述的焊接設備,其中,該控制部基於針對該基板上的晶片的焊接檢查結果,校正適用於該連續驅動次數的第一加權值以及適用於該閒置時間的第二加權值。
- 根據請求項17所述的焊接設備,其中,當基於焊接後檢查結果的焊接誤差的波幅在基準範圍以內時,該控制部校正該第一加權值以及該第二加權值。
- 根據請求項15所述的焊接設備,其中,該連續驅動次數相當於該焊接單元無閒置時間地執行基準次數以上焊接的次數。
- 根據請求項15所述的焊接設備,其中,當該焊接單元以待機狀態工作的時間超過基準時間時,該閒置時間確定爲該基準時間。
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KR102598578B1 (ko) | 2023-11-03 |
CN114074235A (zh) | 2022-02-22 |
US11705426B2 (en) | 2023-07-18 |
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