TWI800832B - 記憶體元件、具有其的系統及操作其的方法 - Google Patents

記憶體元件、具有其的系統及操作其的方法 Download PDF

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Publication number
TWI800832B
TWI800832B TW110117642A TW110117642A TWI800832B TW I800832 B TWI800832 B TW I800832B TW 110117642 A TW110117642 A TW 110117642A TW 110117642 A TW110117642 A TW 110117642A TW I800832 B TWI800832 B TW I800832B
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TW
Taiwan
Prior art keywords
same
operating
memory device
memory
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TW110117642A
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English (en)
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TW202238392A (zh
Inventor
鄧佳梁
段竺琴
石蕾
潘月松
劉艷蘭
李博
Original Assignee
大陸商長江存儲科技有限責任公司
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Publication of TW202238392A publication Critical patent/TW202238392A/zh
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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0483Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/26Sensing or reading circuits; Data output circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5621Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
    • G11C11/5642Sensing or reading circuits; Data output circuits
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0602Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
    • G06F3/0604Improving or facilitating administration, e.g. storage management
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0628Interfaces specially adapted for storage systems making use of a particular technique
    • G06F3/0655Vertical data movement, i.e. input-output transfer; data movement between one or more hosts and one or more storage devices
    • G06F3/0659Command handling arrangements, e.g. command buffers, queues, command scheduling
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0668Interfaces specially adapted for storage systems adopting a particular infrastructure
    • G06F3/0671In-line storage system
    • G06F3/0673Single storage device
    • G06F3/0679Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP]
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5671Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge trapping in an insulator
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/08Address circuits; Decoders; Word-line control circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/32Timing circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/12Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/08Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/12Group selection circuits, e.g. for memory block selection, chip selection, array selection
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2207/00Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
    • G11C2207/22Control and timing of internal memory operations
    • G11C2207/2281Timing of a read operation
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/22Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/20Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B41/23Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B41/27Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B43/00EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B43/23EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Read Only Memory (AREA)
  • Static Random-Access Memory (AREA)
  • Memory System (AREA)
TW110117642A 2021-03-29 2021-05-17 記憶體元件、具有其的系統及操作其的方法 TWI800832B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/CN2021/083507 2021-03-29
PCT/CN2021/083507 WO2022204850A1 (en) 2021-03-29 2021-03-29 Memory device and asynchronous multi-plane independent read operation thereof

Publications (2)

Publication Number Publication Date
TW202238392A TW202238392A (zh) 2022-10-01
TWI800832B true TWI800832B (zh) 2023-05-01

Family

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Family Applications (1)

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TW110117642A TWI800832B (zh) 2021-03-29 2021-05-17 記憶體元件、具有其的系統及操作其的方法

Country Status (6)

Country Link
US (1) US11763892B2 (zh)
JP (1) JP7392180B2 (zh)
KR (1) KR20230010764A (zh)
CN (1) CN113892139A (zh)
TW (1) TWI800832B (zh)
WO (1) WO2022204850A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
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CN117079690A (zh) * 2021-03-29 2023-11-17 长江存储科技有限责任公司 存储器器件及其异步多面独立读取操作
CN113892139A (zh) 2021-03-29 2022-01-04 长江存储科技有限责任公司 存储器器件及其异步多面独立读取操作
CN114641762A (zh) * 2022-01-28 2022-06-17 长江存储科技有限责任公司 存储器、存储器的控制方法及存储器系统
TWI819648B (zh) * 2022-06-10 2023-10-21 旺宏電子股份有限公司 積體電路結構以及記憶體元件的製造方法

Citations (4)

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TW200739418A (en) * 2005-11-28 2007-10-16 Atmel Corp Command decoder for microcontroller based flash memory digital controller system
US20160005469A1 (en) * 2008-02-04 2016-01-07 Conversant Intellectual Property Management Inc. Non-volatile memory device having configurable page size
US20170309340A1 (en) * 2016-04-26 2017-10-26 Sandisk Technologies Llc Independent Multi-Plane Read And Low Latency Hybrid Read
CN112513988A (zh) * 2020-11-06 2021-03-16 长江存储科技有限责任公司 伪异步多平面独立读取

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US5748547A (en) 1996-05-24 1998-05-05 Shau; Jeng-Jye High performance semiconductor memory devices having multiple dimension bit lines
US7149119B2 (en) * 2004-09-30 2006-12-12 Matrix Semiconductor, Inc. System and method of controlling a three-dimensional memory
WO2009145923A1 (en) 2008-05-30 2009-12-03 Aplus Flash Technology, Inc. Nand string based flash memory device, array and circuit having parallel bit lines and source lines
US7920431B2 (en) 2008-06-02 2011-04-05 Micron Technology, Inc. Asynchronous/synchronous interface
TWI553641B (zh) 2013-12-09 2016-10-11 慧榮科技股份有限公司 資料儲存裝置及其模式偵測方法
US9910594B2 (en) 2015-11-05 2018-03-06 Micron Technology, Inc. Apparatuses and methods for concurrently accessing multiple memory planes of a memory during a memory access operation
JP6753746B2 (ja) 2016-09-15 2020-09-09 キオクシア株式会社 半導体記憶装置
KR102663804B1 (ko) * 2016-11-30 2024-05-07 에스케이하이닉스 주식회사 반도체장치
US10331345B2 (en) 2017-09-29 2019-06-25 Intel Corporation Method and apparatus for reducing silent data errors in non-volatile memory systems
JP2020004465A (ja) 2018-06-26 2020-01-09 キオクシア株式会社 半導体記憶装置
JP2020016954A (ja) 2018-07-23 2020-01-30 キオクシア株式会社 メモリシステム
US11037626B2 (en) * 2018-11-28 2021-06-15 Samsung Electronics Co., Ltd. Nonvolatile memory devices including memory planes and memory systems including the same
US10685722B1 (en) * 2019-01-24 2020-06-16 Western Digital Technologies, Inc. Method and system for improving performance of a storage device using asynchronous independent plane read functionality
US10877696B2 (en) 2019-03-28 2020-12-29 Intel Corporation Independent NAND memory operations by plane
US10957393B2 (en) * 2019-06-27 2021-03-23 Micron Technology, Inc. Apparatus and methods for performing concurrent access operations on different groupings of memory cells
CN113892139A (zh) 2021-03-29 2022-01-04 长江存储科技有限责任公司 存储器器件及其异步多面独立读取操作

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TW200739418A (en) * 2005-11-28 2007-10-16 Atmel Corp Command decoder for microcontroller based flash memory digital controller system
US20160005469A1 (en) * 2008-02-04 2016-01-07 Conversant Intellectual Property Management Inc. Non-volatile memory device having configurable page size
US20170309340A1 (en) * 2016-04-26 2017-10-26 Sandisk Technologies Llc Independent Multi-Plane Read And Low Latency Hybrid Read
CN112513988A (zh) * 2020-11-06 2021-03-16 长江存储科技有限责任公司 伪异步多平面独立读取

Also Published As

Publication number Publication date
US11763892B2 (en) 2023-09-19
JP2023531214A (ja) 2023-07-21
JP7392180B2 (ja) 2023-12-05
CN113892139A (zh) 2022-01-04
TW202238392A (zh) 2022-10-01
KR20230010764A (ko) 2023-01-19
WO2022204850A1 (en) 2022-10-06
US20220310173A1 (en) 2022-09-29

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