TWI800704B - 用以預測器件製造製程之良率的方法 - Google Patents

用以預測器件製造製程之良率的方法 Download PDF

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Publication number
TWI800704B
TWI800704B TW108148336A TW108148336A TWI800704B TW I800704 B TWI800704 B TW I800704B TW 108148336 A TW108148336 A TW 108148336A TW 108148336 A TW108148336 A TW 108148336A TW I800704 B TWI800704 B TW I800704B
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Taiwan
Prior art keywords
manufacturing process
device manufacturing
predict yield
predict
yield
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TW108148336A
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English (en)
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TW202014809A (zh
Inventor
亞力山大 伊瑪
希拉 艾米爾 塔伯里
果珀 賽門 亨德立克 席林 凡
林晨希
戴格 桑塔格
哈奇 爾金 希可利
桑契斯 魯賓 亞發雷茲
劉士嶔
賽門 飛利浦 史賓斯 海斯汀思
伯瑞斯 曼徹奇可夫
瑞提 克里斯汀 西奧多爾 迪
伯格 彼德 譚
麥可 詹姆士 拉索
段薇
皮耶－伊夫 傑羅姆 伊萬 吉泰
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荷蘭商Ａｓｍｌ荷蘭公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70658—Electrical testing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706839—Modelling, e.g. modelling scattering or solving inverse problems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706839—Modelling, e.g. modelling scattering or solving inverse problems
    • G03F7/706841—Machine learning

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW108148336A 2017-05-05 2018-04-27 用以預測器件製造製程之良率的方法 TWI800704B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762502281P 2017-05-05 2017-05-05
US62/502,281 2017-05-05
US201862645345P 2018-03-20 2018-03-20
US62/645,345 2018-03-20

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TW202014809A TW202014809A (zh) 2020-04-16
TWI800704B true TWI800704B (zh) 2023-05-01

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US (2) US11086229B2 (zh)
KR (2) KR102411813B1 (zh)
CN (2) CN115220311A (zh)
TW (2) TWI683189B (zh)
WO (1) WO2018202361A1 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3396458A1 (en) * 2017-04-28 2018-10-31 ASML Netherlands B.V. Method and apparatus for optimization of lithographic process
WO2020108862A1 (en) 2018-11-26 2020-06-04 Asml Netherlands B.V. Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process
KR102649158B1 (ko) * 2018-12-03 2024-03-20 에이에스엠엘 네델란즈 비.브이. 반도체 제조 공정의 수율을 예측하는 방법
EP3891559A1 (en) 2018-12-07 2021-10-13 ASML Netherlands B.V. Method for determining root cause affecting yield in a semiconductor manufacturing process
US11157661B2 (en) * 2018-12-19 2021-10-26 Applied Materials, Inc. Process development visualization tool
US20220091514A1 (en) * 2019-01-29 2022-03-24 Asml Netherlands B.V. Methods and apparatus for controlling a lithographic process
CN113366390B (zh) * 2019-01-29 2024-02-20 Asml荷兰有限公司 半导体制造过程中的决定方法
WO2020167331A1 (en) * 2019-02-15 2020-08-20 Kla-Tencor Corporation Misregistration measurements using combined optical and electron beam technology
EP3767392A1 (en) 2019-07-17 2021-01-20 ASML Netherlands B.V. Method and apparatus for determining feature contribution to performance
CN114174927A (zh) * 2019-07-04 2022-03-11 Asml荷兰有限公司 光刻工艺及关联设备的子场控制
EP3767391A1 (en) * 2019-07-17 2021-01-20 ASML Netherlands B.V. Sub-field control of a lithographic process and associated apparatus
US20220351075A1 (en) 2019-07-04 2022-11-03 Asml Netherlands B.V. Method and apparatus for determining feature contribution to performance
KR20220053029A (ko) * 2019-09-05 2022-04-28 에이에스엠엘 네델란즈 비.브이. 현상 후 이미지에 기초하여 패턴의 결함이 있음을 결정하는 방법
TWI736999B (zh) * 2019-10-07 2021-08-21 財團法人資訊工業策進會 資料分析裝置、資料分析方法以及與其相關的品質提升系統
WO2021165419A1 (en) * 2020-02-21 2021-08-26 Asml Netherlands B.V. Method for calibrating simulation process based on defect-based process window
KR20220149714A (ko) * 2020-03-03 2022-11-08 피디에프 솔루션즈, 인코포레이티드 조기 수명 장애에 취약한 다이 예측
WO2021197717A1 (en) 2020-04-02 2021-10-07 Asml Netherlands B.V. Method and apparatus for predicting a process metric associated with a process
EP3901700A1 (en) 2020-04-20 2021-10-27 ASML Netherlands B.V. Method and apparatus for predicting a process metric associated with a process
CN115427894A (zh) * 2020-04-20 2022-12-02 Asml荷兰有限公司 插补器模型的配置
EP3913435A1 (en) * 2020-05-19 2021-11-24 ASML Netherlands B.V. Configuration of an imputer model
CN111678928B (zh) * 2020-06-09 2021-03-30 长江存储科技有限责任公司 半导体结构的分析方法及分析装置
US20220066410A1 (en) * 2020-08-28 2022-03-03 Pdf Solutions, Inc. Sequenced Approach For Determining Wafer Path Quality
CN112270157A (zh) * 2020-11-09 2021-01-26 全芯智造技术有限公司 用于将设计与工艺协同优化的方法和设备以及存储介质
US20220210525A1 (en) * 2020-12-24 2022-06-30 Applied Materials Israel Ltd. Prediction of electrical properties of a semiconductor specimen
EP4050328A1 (en) 2021-02-25 2022-08-31 ASML Netherlands B.V. Method to predict metrology offset of a semiconductor manufacturing process
CN113433907B (zh) * 2021-06-24 2022-05-10 中国航空综合技术研究所 基于可靠性关键特性的航空机电产品设计可靠性控制方法
EP4120019A1 (en) * 2021-07-12 2023-01-18 ASML Netherlands B.V. Method of determining a correction for at least one control parameter in a semiconductor manufacturing process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866437A (en) * 1997-12-05 1999-02-02 Advanced Micro Devices, Inc. Dynamic process window control using simulated wet data from current and previous layer data
TW201530333A (zh) * 2013-12-17 2015-08-01 Asml Netherlands Bv 良率評估及控制

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523193A (en) 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
EP0527166B1 (de) 1990-05-02 1995-06-14 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Belichtungsvorrichtung
US5229872A (en) 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
US6028994A (en) * 1998-05-06 2000-02-22 Advanced Micro Devices Method for predicting performance of microelectronic device based on electrical parameter test data using computer model
JP4312910B2 (ja) * 1999-12-02 2009-08-12 株式会社日立製作所 レビューｓｅｍ
US6622059B1 (en) * 2000-04-13 2003-09-16 Advanced Micro Devices, Inc. Automated process monitoring and analysis system for semiconductor processing
KR20030026735A (ko) 2001-09-28 2003-04-03 엘지.필립스 엘시디 주식회사 필름 전사법에 의한 액정표시장치용 컬러필터 기판 및그의 제조방법
US8185230B2 (en) * 2002-08-22 2012-05-22 Advanced Micro Devices, Inc. Method and apparatus for predicting device electrical parameters during fabrication
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7274429B2 (en) * 2003-12-10 2007-09-25 Asml Netherlands B.V. Integrated lithographic fabrication cluster
US8799830B2 (en) 2004-05-07 2014-08-05 Mentor Graphics Corporation Integrated circuit layout design methodology with process variation bands
KR100610010B1 (ko) 2004-07-20 2006-08-08 삼성전자주식회사 반도체 식각 장치
US7443486B2 (en) * 2005-02-25 2008-10-28 Asml Netherlands B.V. Method for predicting a critical dimension of a feature imaged by a lithographic apparatus
US7239371B2 (en) 2005-10-18 2007-07-03 International Business Machines Corporation Density-aware dynamic leveling in scanning exposure systems
US8146024B2 (en) * 2006-12-18 2012-03-27 Cadence Design Systems, Inc. Method and system for process optimization
US20080319568A1 (en) * 2007-06-22 2008-12-25 International Business Machines Corporation Method and system for creating array defect paretos using electrical overlay of bitfail maps, photo limited yield, yield, and auto pattern recognition code data
NL1036351A1 (nl) 2007-12-31 2009-07-01 Asml Netherlands Bv Alignment system and alignment marks for use therewith cross-reference to related applications.
US8001494B2 (en) 2008-10-13 2011-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Table-based DFM for accurate post-layout analysis
WO2011081645A2 (en) 2009-12-15 2011-07-07 Lam Research Corporation Adjusting substrate temperature to improve cd uniformity
US9177219B2 (en) 2010-07-09 2015-11-03 Asml Netherlands B.V. Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product
NL2009853A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
NL2013249A (en) 2013-08-20 2015-02-23 Asml Netherlands Bv Lithography system and a machine learning controller for such a lithography system.
US9910430B2 (en) * 2013-08-23 2018-03-06 Applied Materials, Inc. K-nearest neighbor-based method and system to provide multi-variate analysis on tool process data
US9412673B2 (en) * 2013-08-23 2016-08-09 Kla-Tencor Corporation Multi-model metrology
NL2013417A (en) 2013-10-02 2015-04-07 Asml Netherlands Bv Methods & apparatus for obtaining diagnostic information relating to an industrial process.
CN105874388B (zh) 2013-12-30 2019-03-15 Asml荷兰有限公司 用于量测目标的设计的方法和设备
NL2013677A (en) 2014-01-24 2015-07-29 Asml Netherlands Bv Method of determining a measurement subset of metrology points on a substrate, associated apparatus and computer program.
US20160148850A1 (en) 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
WO2017060080A1 (en) 2015-10-08 2017-04-13 Asml Netherlands B.V. Methods & apparatus for controlling an industrial process
US11036146B2 (en) 2015-10-19 2021-06-15 Asml Netherlands B. V. Method and apparatus to reduce effects of nonlinear behavior
KR102148280B1 (ko) 2016-02-18 2020-08-27 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치, 디바이스 제조 방법 및 연관된 데이터 처리 장치 및 컴퓨터 프로그램 제품
JP6964591B2 (ja) 2016-02-22 2021-11-10 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジデータへの寄与の分離
WO2017144343A1 (en) 2016-02-23 2017-08-31 Asml Netherlands B.V. Method of controlling a patterning process, lithographic apparatus, metrology apparatus lithographic cell and associated computer program
EP3309617A1 (en) 2016-10-14 2018-04-18 ASML Netherlands B.V. Selecting a set of locations associated with a measurement or feature on a substrate
EP3312693A1 (en) 2016-10-21 2018-04-25 ASML Netherlands B.V. Methods & apparatus for controlling an industrial process
EP3312672A1 (en) 2016-10-21 2018-04-25 ASML Netherlands B.V. Methods of determining corrections for a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus
KR102224672B1 (ko) 2016-10-26 2021-03-08 에이에스엠엘 네델란즈 비.브이. 리소그래피 프로세스의 최적화 방법
WO2019035854A1 (en) * 2017-08-16 2019-02-21 Kla-Tencor Corporation MACHINE LEARNING IN RELATION TO METROLOGY MEASUREMENTS

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866437A (en) * 1997-12-05 1999-02-02 Advanced Micro Devices, Inc. Dynamic process window control using simulated wet data from current and previous layer data
TW201530333A (zh) * 2013-12-17 2015-08-01 Asml Netherlands Bv 良率評估及控制

Also Published As

Publication number Publication date
US11086229B2 (en) 2021-08-10
US20200103761A1 (en) 2020-04-02
KR20190139967A (ko) 2019-12-18
KR102411813B1 (ko) 2022-06-22
US20210325788A1 (en) 2021-10-21
CN110622069A (zh) 2019-12-27
US11714357B2 (en) 2023-08-01
KR20210110896A (ko) 2021-09-09
CN110622069B (zh) 2022-08-09
CN115220311A (zh) 2022-10-21
KR102296942B1 (ko) 2021-09-01
TW202014809A (zh) 2020-04-16
TWI683189B (zh) 2020-01-21
TW201843533A (zh) 2018-12-16
WO2018202361A1 (en) 2018-11-08

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