TWI799692B - 靜電吸盤 - Google Patents
靜電吸盤 Download PDFInfo
- Publication number
- TWI799692B TWI799692B TW109111581A TW109111581A TWI799692B TW I799692 B TWI799692 B TW I799692B TW 109111581 A TW109111581 A TW 109111581A TW 109111581 A TW109111581 A TW 109111581A TW I799692 B TWI799692 B TW I799692B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrostatic chuck
- chuck
- electrostatic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-047009 | 2018-03-14 | ||
JP2018047009 | 2018-03-14 | ||
JP2018203725A JP6504532B1 (ja) | 2018-03-14 | 2018-10-30 | 静電チャック |
JP2018-203725 | 2018-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202046443A TW202046443A (zh) | 2020-12-16 |
TWI799692B true TWI799692B (zh) | 2023-04-21 |
Family
ID=66324149
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108107207A TWI693674B (zh) | 2018-03-14 | 2019-03-05 | 靜電吸盤 |
TW109111581A TWI799692B (zh) | 2018-03-14 | 2019-03-05 | 靜電吸盤 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108107207A TWI693674B (zh) | 2018-03-14 | 2019-03-05 | 靜電吸盤 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11018039B2 (zh) |
JP (2) | JP6504532B1 (zh) |
KR (1) | KR102204659B1 (zh) |
CN (1) | CN110277341B (zh) |
TW (2) | TWI693674B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6504532B1 (ja) * | 2018-03-14 | 2019-04-24 | Toto株式会社 | 静電チャック |
JP7441403B2 (ja) * | 2019-03-05 | 2024-03-01 | Toto株式会社 | 静電チャック、および処理装置 |
CN112687602A (zh) * | 2019-10-18 | 2021-04-20 | 中微半导体设备(上海)股份有限公司 | 一种静电吸盘及其制造方法、等离子体处理装置 |
JP7433857B2 (ja) * | 2019-11-25 | 2024-02-20 | 京セラ株式会社 | 試料保持具 |
JP7394661B2 (ja) * | 2020-03-09 | 2023-12-08 | 東京エレクトロン株式会社 | 基板処理装置 |
JP7515583B2 (ja) | 2020-05-28 | 2024-07-12 | 京セラ株式会社 | 通気性プラグ、基板支持アセンブリおよびシャワープレート |
JP7565735B2 (ja) | 2020-09-25 | 2024-10-11 | 日本特殊陶業株式会社 | 基板保持部材、その製造方法、および静電チャック部材 |
JP7565734B2 (ja) | 2020-09-25 | 2024-10-11 | 日本特殊陶業株式会社 | 基板保持部材、およびその製造方法 |
CN114496893B (zh) * | 2020-10-23 | 2024-08-27 | 合肥欣奕华智能机器股份有限公司 | 一种基板夹紧装置及基板作业平台 |
JP7382978B2 (ja) * | 2021-02-04 | 2023-11-17 | 日本碍子株式会社 | 半導体製造装置用部材及びプラグ |
KR20230147691A (ko) | 2021-03-25 | 2023-10-23 | 교세라 가부시키가이샤 | 정전 척 |
CN115732387A (zh) * | 2021-08-31 | 2023-03-03 | Toto株式会社 | 静电吸盘以及处理装置 |
CN115732386A (zh) * | 2021-08-31 | 2023-03-03 | Toto株式会社 | 静电吸盘以及处理装置 |
WO2023190449A1 (ja) * | 2022-03-30 | 2023-10-05 | 京セラ株式会社 | 通気性プラグおよび載置台 |
JP2024119233A (ja) | 2023-02-22 | 2024-09-03 | Toto株式会社 | 静電チャック及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201537673A (zh) * | 2014-03-27 | 2015-10-01 | Toto Ltd | 靜電吸盤 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5720818A (en) | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
JP2003338492A (ja) | 2002-05-21 | 2003-11-28 | Tokyo Electron Ltd | プラズマ処理装置 |
US7697260B2 (en) * | 2004-03-31 | 2010-04-13 | Applied Materials, Inc. | Detachable electrostatic chuck |
JP4390629B2 (ja) * | 2004-06-01 | 2009-12-24 | Necエレクトロニクス株式会社 | 静電吸着装置およびプラズマ処理装置 |
US7667944B2 (en) * | 2007-06-29 | 2010-02-23 | Praxair Technology, Inc. | Polyceramic e-chuck |
US8336891B2 (en) | 2008-03-11 | 2012-12-25 | Ngk Insulators, Ltd. | Electrostatic chuck |
JP5331519B2 (ja) * | 2008-03-11 | 2013-10-30 | 日本碍子株式会社 | 静電チャック |
JP5449750B2 (ja) | 2008-11-19 | 2014-03-19 | 株式会社日本セラテック | 静電チャックおよびその製造方法 |
JP5198226B2 (ja) * | 2008-11-20 | 2013-05-15 | 東京エレクトロン株式会社 | 基板載置台および基板処理装置 |
JP5218865B2 (ja) * | 2010-03-26 | 2013-06-26 | Toto株式会社 | 静電チャック |
US9608549B2 (en) * | 2011-09-30 | 2017-03-28 | Applied Materials, Inc. | Electrostatic chuck |
JP5956379B2 (ja) * | 2012-04-27 | 2016-07-27 | 日本碍子株式会社 | 半導体製造装置用部材 |
JP5633766B2 (ja) * | 2013-03-29 | 2014-12-03 | Toto株式会社 | 静電チャック |
JP6432474B2 (ja) * | 2014-03-27 | 2018-12-05 | Toto株式会社 | 静電チャック |
JP6722518B2 (ja) * | 2016-06-09 | 2020-07-15 | 新光電気工業株式会社 | 焼結体及びその製造方法と静電チャック |
JP6489277B1 (ja) * | 2018-03-14 | 2019-03-27 | Toto株式会社 | 静電チャック |
JP6504532B1 (ja) * | 2018-03-14 | 2019-04-24 | Toto株式会社 | 静電チャック |
-
2018
- 2018-10-30 JP JP2018203725A patent/JP6504532B1/ja active Active
-
2019
- 2019-01-23 KR KR1020190008486A patent/KR102204659B1/ko active IP Right Grant
- 2019-02-28 CN CN201910149165.8A patent/CN110277341B/zh active Active
- 2019-03-05 TW TW108107207A patent/TWI693674B/zh active
- 2019-03-05 TW TW109111581A patent/TWI799692B/zh active
- 2019-03-14 US US16/352,899 patent/US11018039B2/en active Active
- 2019-03-14 JP JP2019046749A patent/JP2019165223A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201537673A (zh) * | 2014-03-27 | 2015-10-01 | Toto Ltd | 靜電吸盤 |
TW201707131A (zh) * | 2014-03-27 | 2017-02-16 | Toto Ltd | 靜電吸盤 |
Also Published As
Publication number | Publication date |
---|---|
KR102204659B1 (ko) | 2021-01-19 |
JP6504532B1 (ja) | 2019-04-24 |
JP2019165223A (ja) | 2019-09-26 |
JP2019165193A (ja) | 2019-09-26 |
TW202046443A (zh) | 2020-12-16 |
TWI693674B (zh) | 2020-05-11 |
KR20190108481A (ko) | 2019-09-24 |
CN110277341A (zh) | 2019-09-24 |
CN110277341B (zh) | 2023-06-20 |
US11018039B2 (en) | 2021-05-25 |
TW201939664A (zh) | 2019-10-01 |
US20190287839A1 (en) | 2019-09-19 |
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