TWI799480B - Substrate processing device and temperature control method - Google Patents
Substrate processing device and temperature control method Download PDFInfo
- Publication number
- TWI799480B TWI799480B TW107145845A TW107145845A TWI799480B TW I799480 B TWI799480 B TW I799480B TW 107145845 A TW107145845 A TW 107145845A TW 107145845 A TW107145845 A TW 107145845A TW I799480 B TWI799480 B TW I799480B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing device
- control method
- temperature control
- substrate processing
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017246780A JP7008497B2 (en) | 2017-12-22 | 2017-12-22 | Substrate processing equipment and temperature control method |
JP2017-246780 | 2017-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201937590A TW201937590A (en) | 2019-09-16 |
TWI799480B true TWI799480B (en) | 2023-04-21 |
Family
ID=67165176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107145845A TWI799480B (en) | 2017-12-22 | 2018-12-19 | Substrate processing device and temperature control method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7008497B2 (en) |
KR (1) | KR102273516B1 (en) |
CN (1) | CN110010440B (en) |
TW (1) | TWI799480B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111509952B (en) * | 2020-04-24 | 2021-09-28 | 江苏哈哈社信息科技有限公司 | Intelligent switching power supply |
JPWO2023054531A1 (en) * | 2021-09-29 | 2023-04-06 | ||
JP2023097115A (en) | 2021-12-27 | 2023-07-07 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200705515A (en) * | 2005-05-17 | 2007-02-01 | Tokyo Electron Ltd | Plasma treatment device |
JP2012253347A (en) * | 2011-05-31 | 2012-12-20 | Semes Co Ltd | Apparatus for treating substrate |
JP2014528168A (en) * | 2011-09-20 | 2014-10-23 | ラム リサーチ コーポレーションLam Research Corporation | Heating plate with diode planar heater zone for semiconductor processing |
TW201703137A (en) * | 2015-06-16 | 2017-01-16 | Tokyo Electron Ltd | Film forming apparatus, film forming method and substrate carrying table capable of forming a uniform film and forming the film only on a substrate |
TW201717710A (en) * | 2015-07-22 | 2017-05-16 | Tokyo Electron Ltd | Plasma processing device which is provided with plasma resistance and has a light-weight metal window |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08157296A (en) * | 1994-12-05 | 1996-06-18 | Fujitsu Ltd | Device for supplying raw material or gas |
JP2005260251A (en) * | 1999-04-06 | 2005-09-22 | Tokyo Electron Ltd | Mounting stand, plasma processing apparatus, and manufacturing method for mounting stand |
JP3668079B2 (en) * | 1999-05-31 | 2005-07-06 | 忠弘 大見 | Plasma process equipment |
JP4826483B2 (en) | 2007-01-19 | 2011-11-30 | 東京エレクトロン株式会社 | Plasma processing equipment |
JP5224855B2 (en) * | 2008-03-05 | 2013-07-03 | 東京エレクトロン株式会社 | Electrode unit, substrate processing apparatus, and temperature control method for electrode unit |
US9155134B2 (en) * | 2008-10-17 | 2015-10-06 | Applied Materials, Inc. | Methods and apparatus for rapidly responsive heat control in plasma processing devices |
JP6010433B2 (en) * | 2012-11-15 | 2016-10-19 | 東京エレクトロン株式会社 | Substrate mounting table and substrate processing apparatus |
JP6276919B2 (en) * | 2013-02-01 | 2018-02-07 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus and sample stage |
KR101994874B1 (en) * | 2013-03-14 | 2019-07-01 | 도쿄엘렉트론가부시키가이샤 | Drying apparatus and drying method |
TWI508397B (en) * | 2013-10-18 | 2015-11-11 | Plug electrical connectors, wires and their components | |
JP6456601B2 (en) * | 2014-05-07 | 2019-01-23 | 東京エレクトロン株式会社 | Plasma deposition system |
-
2017
- 2017-12-22 JP JP2017246780A patent/JP7008497B2/en active Active
-
2018
- 2018-12-19 KR KR1020180164974A patent/KR102273516B1/en active IP Right Grant
- 2018-12-19 TW TW107145845A patent/TWI799480B/en active
- 2018-12-21 CN CN201811572973.7A patent/CN110010440B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200705515A (en) * | 2005-05-17 | 2007-02-01 | Tokyo Electron Ltd | Plasma treatment device |
JP2012253347A (en) * | 2011-05-31 | 2012-12-20 | Semes Co Ltd | Apparatus for treating substrate |
JP2014528168A (en) * | 2011-09-20 | 2014-10-23 | ラム リサーチ コーポレーションLam Research Corporation | Heating plate with diode planar heater zone for semiconductor processing |
TW201703137A (en) * | 2015-06-16 | 2017-01-16 | Tokyo Electron Ltd | Film forming apparatus, film forming method and substrate carrying table capable of forming a uniform film and forming the film only on a substrate |
TW201717710A (en) * | 2015-07-22 | 2017-05-16 | Tokyo Electron Ltd | Plasma processing device which is provided with plasma resistance and has a light-weight metal window |
Also Published As
Publication number | Publication date |
---|---|
CN110010440B (en) | 2022-06-07 |
KR20190076872A (en) | 2019-07-02 |
KR102273516B1 (en) | 2021-07-05 |
JP2019114653A (en) | 2019-07-11 |
TW201937590A (en) | 2019-09-16 |
JP7008497B2 (en) | 2022-01-25 |
CN110010440A (en) | 2019-07-12 |
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