TWI799479B - 印刷電路板以及具有該印刷電路板的相機模組 - Google Patents
印刷電路板以及具有該印刷電路板的相機模組 Download PDFInfo
- Publication number
- TWI799479B TWI799479B TW107145536A TW107145536A TWI799479B TW I799479 B TWI799479 B TW I799479B TW 107145536 A TW107145536 A TW 107145536A TW 107145536 A TW107145536 A TW 107145536A TW I799479 B TWI799479 B TW I799479B
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- circuit board
- printed circuit
- camera module
- camera
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Structure Of Printed Boards (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
??10-2018-0001312 | 2018-01-04 | ||
KR10-2018-0001312 | 2018-01-04 | ||
KR1020180001312A KR102550170B1 (ko) | 2018-01-04 | 2018-01-04 | 인쇄회로기판 및 이를 포함하는 카메라 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201931962A TW201931962A (zh) | 2019-08-01 |
TWI799479B true TWI799479B (zh) | 2023-04-21 |
Family
ID=67254131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107145536A TWI799479B (zh) | 2018-01-04 | 2018-12-18 | 印刷電路板以及具有該印刷電路板的相機模組 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7271830B2 (ko) |
KR (1) | KR102550170B1 (ko) |
TW (1) | TWI799479B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021029829A (ja) * | 2019-08-28 | 2021-03-01 | 株式会社三洋物産 | 遊技機 |
KR20220042655A (ko) * | 2020-09-28 | 2022-04-05 | 엘지이노텍 주식회사 | 카메라 모듈 |
KR20230068114A (ko) * | 2021-11-10 | 2023-05-17 | 삼성전자주식회사 | 카메라 모듈 및 이를 포함하는 전자 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102098876A (zh) * | 2006-04-27 | 2011-06-15 | 日本电气株式会社 | 用于电路基板的制造工艺 |
TW201436660A (zh) * | 2012-12-31 | 2014-09-16 | Samsung Electro Mech | 多層基板及其製造方法 |
TW201628469A (zh) * | 2015-01-22 | 2016-08-01 | 三星電機股份有限公司 | 印刷電路板及其製造方法 |
CN107105570A (zh) * | 2016-02-22 | 2017-08-29 | 太阳诱电株式会社 | 电路板及其制造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050029042A (ko) | 2003-09-19 | 2005-03-24 | 주식회사 복스오라테크놀로지코리아 | 고주파 동축 스위치 |
JP4779826B2 (ja) * | 2006-06-29 | 2011-09-28 | パナソニック株式会社 | フレキシブルプリント基板 |
KR20100095760A (ko) * | 2009-02-23 | 2010-09-01 | 삼성전기주식회사 | 카메라 모듈 |
JP2014067975A (ja) | 2012-09-27 | 2014-04-17 | Hitachi Chemical Co Ltd | 多層配線基板の製造方法 |
CN204669479U (zh) | 2013-03-27 | 2015-09-23 | 株式会社村田制作所 | 摄像头模块 |
KR102494333B1 (ko) * | 2016-01-07 | 2023-02-02 | 삼성전기주식회사 | 인쇄회로기판 및 이를 구비한 카메라 모듈 |
KR102494343B1 (ko) * | 2016-01-11 | 2023-02-01 | 삼성전기주식회사 | 인쇄회로기판 |
JP2017130553A (ja) | 2016-01-20 | 2017-07-27 | 株式会社ミマキエンジニアリング | 電子素子設置基材の製造方法、電子部材の製造方法、及び造形装置 |
KR20170105842A (ko) * | 2016-03-10 | 2017-09-20 | 삼성전기주식회사 | 카메라 모듈 |
KR102662856B1 (ko) * | 2016-03-31 | 2024-05-07 | 삼성전기주식회사 | 인쇄회로기판 및 이를 구비한 카메라 모듈 |
-
2018
- 2018-01-04 KR KR1020180001312A patent/KR102550170B1/ko active IP Right Grant
- 2018-12-18 TW TW107145536A patent/TWI799479B/zh active
- 2018-12-27 JP JP2018246066A patent/JP7271830B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102098876A (zh) * | 2006-04-27 | 2011-06-15 | 日本电气株式会社 | 用于电路基板的制造工艺 |
TW201436660A (zh) * | 2012-12-31 | 2014-09-16 | Samsung Electro Mech | 多層基板及其製造方法 |
TW201628469A (zh) * | 2015-01-22 | 2016-08-01 | 三星電機股份有限公司 | 印刷電路板及其製造方法 |
CN107105570A (zh) * | 2016-02-22 | 2017-08-29 | 太阳诱电株式会社 | 电路板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102550170B1 (ko) | 2023-07-03 |
KR20190083538A (ko) | 2019-07-12 |
TW201931962A (zh) | 2019-08-01 |
JP2019121803A (ja) | 2019-07-22 |
JP7271830B2 (ja) | 2023-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3804479A4 (en) | PRINTED CIRCUIT BOARD INCLUDING A BENDING PART, AND ELECTRONIC DEVICE INCLUDING THIS | |
EP3903166A4 (en) | FOLDABLE ELECTRONIC DEVICE OF FLEXIBLE CIRCUIT BOARD | |
EP3850922A4 (en) | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE SET INCLUDING THIS | |
EP3632879A4 (en) | CERAMIC PCB AND MODULE THEREFOR | |
EP3897078A4 (en) | PCB | |
EP3797564A4 (en) | MULTI-LAYER PCB AND ELECTRONIC DEVICE WITH IT | |
EP3806592A4 (en) | CIRCUIT BOARD AND ELECTRONIC DEVICE | |
EP3579537A4 (en) | CAMERA MODULE AND SHAPED PCB ARRANGEMENT, PCB AND APPLICATION THEREOF | |
EP3646356A4 (en) | SURFACE MOUNT MULTILAYER COUPLING CAPACITOR AND PRINTED CIRCUIT BOARD THE CONTAINER | |
EP3510844A4 (en) | MULTILAYER CIRCUIT BOARD AND ELECTRONIC DEVICE THEREWITH | |
EP3629681A4 (en) | PCB AND COMMUNICATION DEVICE | |
EP3818790A4 (en) | PRINTED CIRCUIT BOARD INCLUDING AN OVERVOLTAGE PREVENTION ELEMENT AND ELECTRONIC DEVICE INCLUDING IT | |
EP3806330A4 (en) | SWITCHBOARD | |
EP4007456A4 (en) | ELECTRONIC DEVICE COMPRISING A PRINTED CIRCUIT BOARD ASSEMBLY | |
EP3627814A4 (en) | CAMERA MODULE AND ASSOCIATED MOLDED PRINTED CIRCUIT BOARD ASSEMBLY, NETWORK CAMERA MODULE, AND ELECTRONIC DEVICE | |
TWI799479B (zh) | 印刷電路板以及具有該印刷電路板的相機模組 | |
EP3846202A4 (en) | CIRCUIT BOARD, ELECTRONIC DEVICE AND ELECTRONIC MODULE | |
EP3893610A4 (en) | SWITCHBOARD | |
EP3879805A4 (en) | CIRCUIT BOARD, CIRCUIT BOARD, PERISCOPE CAMERA MODULE AND APPLICATION FOR IT | |
EP4052546A4 (en) | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE CONTAINED THEREOF | |
EP3830906A4 (en) | BOARD CONNECTOR AND PRINTED CIRCUIT BOARD ASSEMBLY | |
EP3731390A4 (en) | POWER SUPPLY DEVICE AND PRINTED CIRCUIT BOARD DEVICE INCLUDING IT | |
EP4025019A4 (en) | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE | |
EP3454630A4 (en) | PCB AND HOUSING OF AN ELECTRONIC COMPONENT THEREFOR | |
EP3829271A4 (en) | PRINTED CIRCUIT CARD |