TWI799479B - Printed circuit board and camera module having the same - Google Patents

Printed circuit board and camera module having the same Download PDF

Info

Publication number
TWI799479B
TWI799479B TW107145536A TW107145536A TWI799479B TW I799479 B TWI799479 B TW I799479B TW 107145536 A TW107145536 A TW 107145536A TW 107145536 A TW107145536 A TW 107145536A TW I799479 B TWI799479 B TW I799479B
Authority
TW
Taiwan
Prior art keywords
same
circuit board
printed circuit
camera module
camera
Prior art date
Application number
TW107145536A
Other languages
Chinese (zh)
Other versions
TW201931962A (en
Inventor
金智勳
李容直
丘奉完
金範俊
朴永誧
Original Assignee
南韓商三星電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW201931962A publication Critical patent/TW201931962A/en
Application granted granted Critical
Publication of TWI799479B publication Critical patent/TWI799479B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
TW107145536A 2018-01-04 2018-12-18 Printed circuit board and camera module having the same TWI799479B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020180001312A KR102550170B1 (en) 2018-01-04 2018-01-04 Printed circuit board and camera module having the same
??10-2018-0001312 2018-01-04
KR10-2018-0001312 2018-01-04

Publications (2)

Publication Number Publication Date
TW201931962A TW201931962A (en) 2019-08-01
TWI799479B true TWI799479B (en) 2023-04-21

Family

ID=67254131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107145536A TWI799479B (en) 2018-01-04 2018-12-18 Printed circuit board and camera module having the same

Country Status (3)

Country Link
JP (1) JP7271830B2 (en)
KR (1) KR102550170B1 (en)
TW (1) TWI799479B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021029829A (en) * 2019-08-28 2021-03-01 株式会社三洋物産 Game machine
KR20220042655A (en) * 2020-09-28 2022-04-05 엘지이노텍 주식회사 Camera module
KR20230068114A (en) * 2021-11-10 2023-05-17 삼성전자주식회사 Camera module and electronic device including the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098876A (en) * 2006-04-27 2011-06-15 日本电气株式会社 Manufacturing process for circuit substrate
TW201436660A (en) * 2012-12-31 2014-09-16 Samsung Electro Mech Multilayered substrate and method of manufacturing the same
TW201628469A (en) * 2015-01-22 2016-08-01 三星電機股份有限公司 Printed circuit board and method of manufacturing the same
CN107105570A (en) * 2016-02-22 2017-08-29 太阳诱电株式会社 Circuit board and its manufacture method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050029042A (en) 2003-09-19 2005-03-24 주식회사 복스오라테크놀로지코리아 A rf coaxial switch
JP4779826B2 (en) * 2006-06-29 2011-09-28 パナソニック株式会社 Flexible printed circuit board
KR20100095760A (en) * 2009-02-23 2010-09-01 삼성전기주식회사 Camera module
JP2014067975A (en) * 2012-09-27 2014-04-17 Hitachi Chemical Co Ltd Method for manufacturing multilayer wiring board
WO2014156353A1 (en) * 2013-03-27 2014-10-02 株式会社村田製作所 Camera module
KR102494333B1 (en) * 2016-01-07 2023-02-02 삼성전기주식회사 Printed circuit board and camera module having the same
KR102494343B1 (en) * 2016-01-11 2023-02-01 삼성전기주식회사 Printed circuit board
JP2017130553A (en) * 2016-01-20 2017-07-27 株式会社ミマキエンジニアリング Method for manufacturing electronic element installation base material, method for manufacturing electronic component, and molding device
KR20170105842A (en) * 2016-03-10 2017-09-20 삼성전기주식회사 Camera module
KR20170112409A (en) * 2016-03-31 2017-10-12 삼성전기주식회사 Printed circuit board and camera module having the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098876A (en) * 2006-04-27 2011-06-15 日本电气株式会社 Manufacturing process for circuit substrate
TW201436660A (en) * 2012-12-31 2014-09-16 Samsung Electro Mech Multilayered substrate and method of manufacturing the same
TW201628469A (en) * 2015-01-22 2016-08-01 三星電機股份有限公司 Printed circuit board and method of manufacturing the same
CN107105570A (en) * 2016-02-22 2017-08-29 太阳诱电株式会社 Circuit board and its manufacture method

Also Published As

Publication number Publication date
KR102550170B1 (en) 2023-07-03
KR20190083538A (en) 2019-07-12
JP2019121803A (en) 2019-07-22
JP7271830B2 (en) 2023-05-12
TW201931962A (en) 2019-08-01

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