TWI798529B - Substrate support device - Google Patents

Substrate support device Download PDF

Info

Publication number
TWI798529B
TWI798529B TW109104436A TW109104436A TWI798529B TW I798529 B TWI798529 B TW I798529B TW 109104436 A TW109104436 A TW 109104436A TW 109104436 A TW109104436 A TW 109104436A TW I798529 B TWI798529 B TW I798529B
Authority
TW
Taiwan
Prior art keywords
substrate
plate
mentioned
support
carrier plate
Prior art date
Application number
TW109104436A
Other languages
Chinese (zh)
Other versions
TW202032714A (en
Inventor
福西勇太
小野寺勝也
西岡昌浩
Original Assignee
日商捷太格特熱處理股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商捷太格特熱處理股份有限公司 filed Critical 日商捷太格特熱處理股份有限公司
Publication of TW202032714A publication Critical patent/TW202032714A/en
Application granted granted Critical
Publication of TWI798529B publication Critical patent/TWI798529B/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment

Abstract

本案發明提供一種基板支撐裝置,在具有用於支撐被處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且可容易且廉價地進行承載板的更換作業。 基板支撐裝置6具有:承載板14,其載置被處理基板100;支撐體13,其藉由使承載板14沿著裝卸方向X1移動而可裝卸承載板14;板11、12,其被固定有支撐體13;及移動限制構件15L、15R。移動限制構件15L、15R係被設置成為了允許被處理基板100相對於承載板14進出而限制承載板14相對於支撐體13進行移動,並且,為了於支撐體13裝卸承載板14,移動限制構件15L、15R可自板11、12裝卸。The present invention provides a substrate supporting device, in which, in a substrate supporting device having a carrier plate for supporting a substrate to be processed, the positional displacement of the carrier plate relative to the support for supporting the carrier plate can be reliably suppressed, and the substrate can be easily and inexpensively Carry out replacement of the carrier plate. The substrate supporting device 6 has: a carrier plate 14 on which the substrate to be processed 100 is placed; a support body 13 which can attach and detach the carrier plate 14 by moving the carrier plate 14 in the loading and unloading direction X1; plates 11 and 12 which are fixed There are support body 13; and movement restriction members 15L, 15R. The movement limiting members 15L, 15R are provided to restrict the movement of the carrier plate 14 relative to the support body 13 by allowing the substrate 100 to be processed to enter and exit relative to the carrier plate 14 , and to attach and detach the carrier plate 14 to the support body 13 , the movement limiting members 15L, 15R can be loaded and unloaded from plates 11, 12.

Description

基板支撐裝置Substrate support device

本發明關於一種基板支撐裝置。 The invention relates to a substrate supporting device.

習知有用於對半導體晶圓進行熱處理的裝置(例如,參照專利文獻1)。於專利文獻1所記載的裝置係縱型晶圓支撐裝置。該裝置具有如下構成:在複數個支柱之側面設置有突起,並在該等突起上載置晶圓支撐環。在晶圓支撐環上載置矽晶圓。 An apparatus for heat-treating a semiconductor wafer is known (for example, refer to Patent Document 1). The device described in Patent Document 1 is a vertical wafer support device. This device has a structure in which protrusions are provided on the side surfaces of a plurality of pillars, and a wafer support ring is placed on the protrusions. A silicon wafer is placed on the wafer support ring.

[先前技術文獻] [Prior Art Literature] [專利文獻] [Patent Document]

專利文獻1:日本專利特開平10-50626號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 10-50626

但是,在半導體熱處理製程中,存在有對Fan-Out晶圓(扇出晶圓)進行退火處理等用於矯正樹脂基板之翹曲的退火處理。在如此的半導體熱處理製程中,需要有對晶圓之下表面進行支撐的承載板(基板支撐板)。而且,在分批式熱處理裝置中,為了對複數片晶圓一次熱處理,而需要設置有複數個承載板。另外,在專利文獻1中,沒有具體地揭示如何將支柱與晶圓支撐環固定。 However, in the semiconductor heat treatment process, there is an annealing treatment for correcting the warp of the resin substrate, such as annealing the Fan-Out wafer (fan-out wafer). In such semiconductor heat treatment process, a carrier plate (substrate support plate) is required to support the lower surface of the wafer. Furthermore, in a batch type heat treatment apparatus, in order to heat process a plurality of wafers at one time, it is necessary to install a plurality of carrier plates. In addition, Patent Document 1 does not specifically disclose how to fix the pillars to the wafer support ring.

另一方面,作為將承載板安裝於支柱的方法,可舉出如下方法:(1)將承載板插入至分別形成於複數個支柱的槽,利用支柱對承載板之 外周緣部進行支撐;(2)將承載板焊接固定於複數個支柱。 On the other hand, as a method of mounting the carrier board on the pillars, the following methods can be mentioned: (1) Insert the carrier board into the grooves formed in a plurality of pillars respectively, and utilize the support between the pillars and the carrier board The outer peripheral edge is supported; (2) The bearing plate is welded and fixed to a plurality of pillars.

其中,在上述(1)的方法中,在長期使用熱處理裝置的基板支撐裝置時,振動、氣壓等之外力會使承載板相對於支柱產生位置偏移,而存在有承載板從支柱脫落之虞。另外,因上述之外力會使承載板相對於支柱於俯視觀察時朝順時針之方向或逆時針之方向旋轉,從而存在有晶圓搬送手部等與承載板接觸之虞。 Wherein, in the above-mentioned method (1), when the substrate supporting device of the heat treatment device is used for a long time, external forces such as vibration and air pressure will cause the carrier plate to shift in position relative to the support, and there is a possibility that the carrier plate will fall off the support. . In addition, due to the above-mentioned external force, the carrier plate will rotate clockwise or counterclockwise when viewed from above with respect to the pillars, and there is a possibility that wafer transfer hands and the like may come into contact with the carrier plate.

在上述(2)方法的情況,不會產生承載板相對於支柱的位置偏移。但是,假設一個承載板破損的情況,則亦需要更換包含有支柱及複數個承載板的基板支撐裝置整體。因此,需要在半導體製造工廠中預先保管基板支撐裝置的備品,因此對半導體製造工廠之費用上的負擔變大。另外,即使在對承載板破損的晶舟進行修理的情況,除了新承載板的構件費用之外,亦需要焊接加工費,不僅修理花費工夫,並且費用負擔亦變大。 In the case of the method (2) above, no positional shift of the carrier plate with respect to the pillar occurs. However, assuming that one carrier board is damaged, it is also necessary to replace the entire substrate supporting device including the pillars and the plurality of carrier boards. Therefore, it is necessary to store the equipment of the substrate supporting device in advance in the semiconductor manufacturing factory, and thus the cost burden on the semiconductor manufacturing factory becomes large. In addition, even in the case of repairing a wafer boat with a damaged carrier plate, in addition to the member cost of the new carrier plate, welding processing costs are also required, and not only the repair is time-consuming, but also the cost burden is also increased.

鑒於上述情況,本發明的目的在於,在具備用來支撐晶圓等之處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且可容易且廉價地進行承載板的更換作業者。 In view of the above circumstances, an object of the present invention is to reliably suppress positional displacement of the carrier plate relative to a support for supporting the carrier plate in a substrate supporting device including a carrier plate for supporting a processing substrate such as a wafer, and Replacement work of the carrier plate can be performed easily and at low cost.

(1)為了解決上述課題,本發明的一個態樣的基板支撐裝置具備有:複數個承載板,其等分別載置被處理基板;支撐體,其具有使支撐複數個上述承載板的複數個支撐部沿著縱向排列的構成,並且構成為藉由使上述承載板沿著與上述縱向交叉的既定之裝卸方向移動而使上述承載板可裝卸所對應的上述支撐部;基部板,其被固定有上述支撐體;及移動限制構件,其被設置為用於允許上述被處理基板相對於上述承載板的進出且限制各上述承載板相對於上述支撐體進行移動,並且,為了裝卸上述承載板於上述支撐體,該移動限制構件可自上述基部板裝卸。 (1) In order to solve the above-mentioned problems, a substrate support device according to an aspect of the present invention includes: a plurality of carrier plates on which the substrates to be processed are placed; The supporting parts are arranged along the longitudinal direction, and the supporting parts corresponding to the above-mentioned supporting parts can be attached and detached by moving the above-mentioned carrying board along the predetermined loading and unloading direction intersecting with the above-mentioned longitudinal direction; the base board is fixed There are the support body; and a movement restriction member configured to allow the substrate to be processed to move in and out relative to the carrier plate and to restrict the movement of each carrier plate relative to the support body, and to attach and detach the carrier plate in In the support body, the movement restricting member is detachable from the base plate.

根據該構成,藉由設置有移動限制構件,可抑制承載板相對於支撐體的位置偏移。藉此,即使振動、氣壓等之外力作用於支撐體與承載板之間,亦可更確實地抑制承載板相對於支撐體的位置偏移。藉此,可抑制承載板從支撐體脫落。另外,可抑制承載板於俯視觀察時順時針之方向或逆時針之方向的旋轉,因此可更確實地抑制承載板與晶圓搬送手部等之其他構件產生接觸。此外,移動限制構件被構成為可自基部板裝卸。藉此,在更換破損的承載板時,可藉由將移動限制構件從基部板卸下而將承載板從支撐體卸下。藉此,例如,在更換複數個承載板中之破損的承載板時,可僅將破損的承載板從支撐體卸下。其結果,可容易且廉價地進行承載板的更換作業。 According to this configuration, by providing the movement restricting member, it is possible to suppress the positional displacement of the loading plate relative to the support body. Thereby, even if an external force such as vibration or air pressure acts between the support body and the loading plate, the positional displacement of the loading plate relative to the support body can be more reliably suppressed. Thereby, it can suppress that a carrier board falls off from a support body. In addition, since the carrier plate can be suppressed from rotating clockwise or counterclockwise in plan view, contact between the carrier plate and other members such as wafer transfer hands can be more reliably suppressed. In addition, the movement restricting member is configured to be detachable from the base plate. Thereby, when replacing a damaged carrier plate, the carrier plate can be detached from the support body by detaching the movement restricting member from the base plate. Thereby, for example, when replacing a damaged bearing plate among a plurality of bearing plates, only the damaged bearing plate can be detached from the supporting body. As a result, the carrier plate can be replaced easily and inexpensively.

(2)存在有以下之狀況:上述支撐體包含有被配置為相互地分離且沿著上述縱向延伸的複數個柱構件,藉由各上述柱構件被形成為沿著上述縱向的梳齒狀而形成有複數個上述支撐部,上述移動限制構件包含有沿著上述縱向延伸且可與各上述承載板接觸的棒構件。 (2) There is a case where the above-mentioned supporting body includes a plurality of column members arranged to be separated from each other and extend along the above-mentioned longitudinal direction, and each of the above-mentioned column members is formed in a comb-like shape along the above-mentioned longitudinal direction. A plurality of the support portions are formed, and the movement restricting member includes a bar member extending in the longitudinal direction and capable of contacting each of the carrier plates.

根據該構成,可利用柱構件之梳齒狀部分個別地支撐複數個承載板。而且,藉由棒構件與該等承載板接觸,可抑制承載板相對於柱構件產生位置偏移。 According to this configuration, a plurality of carrier plates can be individually supported by the comb-shaped portion of the column member. Furthermore, since the rod member is in contact with the bearing plates, positional displacement of the bearing plate relative to the column member can be suppressed.

(3)存在有以下之狀況:上述基部板及上述移動限制構件藉由以沿著上述縱向延伸的軸線為中心軸線的錐形結合而被連結。 (3) There may be a case where the base plate and the movement restricting member are connected by tapered coupling with the axis extending along the longitudinal direction as a central axis.

根據該構成,可將移動限制構件牢固地固定於基部板且在正確的位置上。此外,藉由解除錐形結合而可容易地將移動限制構件從基部板卸下。 According to this configuration, the movement restricting member can be firmly fixed to the base plate at a correct position. In addition, the movement restricting member can be easily detached from the base plate by releasing the tapered coupling.

(4)存在有以下之狀況:設置有底板與頂板作為上述基部板,該底板被配置在上述縱向上的上述支撐體之下端,該頂板被配置在上述縱向的上述支撐體之上端,該基板支撐裝置更具有:下錐形結合機構,其錐形結 合上述移動限制構件與上述底板;及上錐形結合機構,其錐形結合上述移動限制構件與上述頂板。 (4) There is a situation where a bottom plate and a top plate are provided as the base plate, the bottom plate is arranged at the lower end of the support body in the longitudinal direction, the top plate is arranged at the upper end of the support body in the longitudinal direction, and the base plate The supporting device further has: the lower conical joint mechanism, the conical joint the above-mentioned movement limiting member and the above-mentioned bottom plate; and the upper conical coupling mechanism, which conically combines the above-mentioned movement limiting member and the above-mentioned top plate.

根據該構成,可使被配置於支撐體之下部的底板與被配置於支撐體之上部的頂板的各者與移動限制構件錐形結合。藉此,可進一步提高移動限制構件與基部板(底板與頂板)之相互的結合強度。 According to this structure, each of the bottom plate arrange|positioned at the lower part of a support body, and the top plate arrange|positioned at the upper part of a support body can be taper-coupled with a movement restriction member. Thereby, the mutual bonding strength of the movement restricting member and the base plate (bottom plate and top plate) can be further improved.

(5)存在有以下之狀況:上述承載板包含有:基板配置部,其用於配置上述被處理基板;及擋止,其在與上述裝卸方向交叉的既定之寬度方向從上述基板配置部突出並延伸,且被上述移動限制構件所承接。 (5) There is a case where the carrier plate includes: a substrate arrangement portion for arranging the substrate to be processed; and a stopper protruding from the substrate arrangement portion in a predetermined width direction intersecting the loading and unloading direction. And extend, and be accepted by the above-mentioned movement restriction member.

根據該構成,擋止從基板配置部於寬度方向突出。藉此,可將擋止配置於避開被處理基板之通路的位置。藉此,擋止藉由與移動限制構件接觸來抑制承載板的位置偏移,並且不妨礙被處理基板的進出動作。 According to this configuration, the stopper protrudes in the width direction from the substrate arrangement portion. Thereby, the stopper can be arranged at a position avoiding the passage of the substrate to be processed. Thereby, the stopper suppresses positional deviation of the carrier plate by being in contact with the movement limiting member, and does not hinder the movement of the substrate to be processed.

(6)存在有以下之狀況:上述擋止在上述寬度方向分離地設置有一對,各上述擋止包含有第1平行部,上述支撐體包含有可與一對上述第1平行部接觸的一對第2平行部,相互地鄰接的上述第1平行部與上述第2平行部相互平行地延伸。 (6) There is a situation in which a pair of the stoppers are provided separately in the width direction, each stopper includes a first parallel portion, and the support includes a pair that can contact the pair of first parallel portions. Regarding the second parallel portion, the first parallel portion and the second parallel portion adjacent to each other extend parallel to each other.

根據該構成,可使擋止之各第1平行體被支撐部之所對應的第2平行部所承接。藉此,可更確實地抑制承載板相對於支撐體進行旋轉移動的位置偏移之產生。 According to this configuration, each of the blocked first parallel bodies can be received by the corresponding second parallel portion of the supporting portion. Thereby, it is possible to more reliably suppress the occurrence of positional displacement of the bearing plate relative to the supporting body when it rotates and moves.

根據本發明,在具備有用於支撐被處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且容易且廉價地進行承載板的更換作業。 According to the present invention, in the substrate support apparatus including the carrier plate for supporting the substrate to be processed, the positional displacement of the carrier plate relative to the support body supporting the carrier plate can be reliably suppressed, and the carrier plate can be replaced easily and inexpensively. Operation.

1:熱處理裝置 1: Heat treatment device

2:底板 2: Bottom plate

3:加熱器 3: Heater

4:腔室 4: chamber

5:底部凸緣 5: Bottom flange

6:基板支撐裝置 6: Substrate support device

7:升降機構 7: Lifting mechanism

8:密封構件 8: Sealing member

9:密封構件 9: Sealing member

10:搬送手部 10: Moving hands

11:底板(基部板) 11: Bottom plate (base plate)

12:頂板(基部板) 12: Top plate (base plate)

13:支撐體 13: Support body

14:承載板 14: Loading board

15a:上端部 15a: upper end

15b:下端部 15b: lower end

15c:中間部 15c: middle part

15L:移動限制構件 15L: Movement limiting member

15R:移動限制構件 15R: Movement limiting member

16L:下錐形結合機構 16L: Lower conical joint mechanism

16R:下錐形結合機構 16R: Lower conical joint mechanism

17L:上錐形結合機構 17L: Upper taper joint mechanism

17R:上錐形結合機構 17R: Upper conical joint mechanism

21:柱構件 21: column member

21a:支撐部 21a: support part

21b:凹部 21b: concave part

22:柱構件 22: column member

22a:支撐部 22a: support part

22b:凹部 22b: concave part

23:柱構件 23: column member

23a:支撐部 23a: support part

23b:凹部 23b: concave part

25:基板配置部 25: Substrate configuration department

25a:外周緣部 25a: Outer peripheral edge

26:切口部 26: Incision

27L:擋止 27L: stop

27R:擋止 27R: stop

28L:前端部 28L: Front end

28R:前端部 28R: front end

29L:第1平行部 29L: 1st Parallel Section

29R:第1平行部 29R: 1st Parallel Section

30L:左側前部 30L: left front

30R:右側前部 30R: right front

32L:第2平行部 32L: 2nd Parallel Section

32R:第2平行部 32R: 2nd Parallel Section

33L:左側第1錐形孔部 33L: The first tapered hole on the left

33R:右側第1錐形孔部 33R: The first tapered hole on the right side

34L:左側第1錐形軸部 34L: Left 1st tapered shaft

34R:右側第1錐形軸部 34R: The first tapered shaft on the right

35L:左側第2錐形孔部 35L: The second tapered hole on the left

35R:右側第2錐形孔部 35R: The second tapered hole on the right

36L:左帽 36L: left cap

36R:右帽 36R: right cap

37L:左側第2錐形軸部 37L: The second tapered shaft on the left

37R:右側第2錐形軸部 37R: The second tapered shaft on the right

38L:左側插入孔部 38L: left side insertion hole

38R:右側插入孔部 38R: Right side insertion hole

100:被處理基板 100: processed substrate

X1:裝卸方向 X1: loading and unloading direction

X11:安裝方向 X11: Installation direction

X12:拆卸方向 X12: Removal direction

θ1:第1錐角 θ1: 1st cone angle

θ2:第2錐角 θ2: the second cone angle

圖1係本發明之一實施形態之熱處理裝置的剖面圖,顯示從側方觀察包含有基板支撐裝置的熱處理裝置的狀態。 Fig. 1 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention, showing a state of the heat treatment apparatus including a substrate support device viewed from the side.

圖2係載置有複數個被處理基板的狀態之基板支撐裝置的前視圖。 Fig. 2 is a front view of the substrate supporting device in a state where a plurality of substrates to be processed are placed.

圖3係放大於圖2所顯示的基板支撐裝置之中間部分的局部剖面圖,顯示省略移動限制構件的狀態。 FIG. 3 is an enlarged partial cross-sectional view of the middle portion of the substrate supporting device shown in FIG. 2 , showing a state in which a movement limiting member is omitted.

圖4係沿著圖2、圖3之IV-IV線的剖面圖,顯示俯視觀察基板支撐裝置的狀態。 Fig. 4 is a sectional view along line IV-IV of Fig. 2 and Fig. 3, showing the state of the substrate supporting device viewed from above.

圖5係放大於圖2所顯示的基板支撐裝置之上部及下部的主要部分的剖面圖。 FIG. 5 is an enlarged cross-sectional view of main parts of the upper and lower parts of the substrate supporting device shown in FIG. 2 .

圖6係用於對承載板之更換作業進行說明的圖,以省略一部分的方式顯示基板支撐裝置被分解的狀態。 Fig. 6 is a view for explaining the replacement operation of the carrier plate, and shows a disassembled state of the substrate supporting device with a part omitted.

以下,參照附圖,對用於實施本發明的形態進行說明。 Hereinafter, embodiments for implementing the present invention will be described with reference to the drawings.

圖1係本發明之一個實施形態的熱處理裝置1之剖面圖,顯示從側方觀察包含有基板支撐裝置6的熱處理裝置1的狀態。參照圖1,熱處理裝置1構成為可對被處理基板100實施熱處理。作為該熱處理之一例,可舉出退火處理。另外,在熱處理裝置1所進行的熱處理亦可為退火處理以外的其他之一般熱處理。被處理基板100例如Fan-Out晶圓,在本實施形態中形成為圓盤狀。 FIG. 1 is a cross-sectional view of a heat treatment apparatus 1 according to an embodiment of the present invention, showing the state of the heat treatment apparatus 1 including a substrate supporting device 6 viewed from the side. Referring to FIG. 1 , a heat treatment apparatus 1 is configured to perform heat treatment on a substrate 100 to be processed. Annealing treatment is mentioned as an example of this heat treatment. In addition, the heat treatment performed in the heat treatment apparatus 1 may be general heat treatment other than annealing treatment. The substrate 100 to be processed is, for example, a Fan-Out wafer, and is formed in a disc shape in this embodiment.

熱處理裝置1具有底板2、加熱器3、腔室4、底部凸緣5、被安裝於底部凸緣5的基板支撐裝置6及升降機構7。 The heat treatment apparatus 1 has a bottom plate 2 , a heater 3 , a chamber 4 , a bottom flange 5 , a substrate supporting device 6 attached to the bottom flange 5 , and an elevating mechanism 7 .

作為對加熱器3及腔室4進行支撐的構件設置有底板2。在底板2之中央,形成有貫通孔。以從上方封閉該貫通孔之方式配置有加熱器3。加熱器3係例如電熱加熱器,整體形成為箱狀,具有向下開放的形狀。在被 加熱器3所包圍的空間中配置有腔室4。 A bottom plate 2 is provided as a member supporting the heater 3 and the chamber 4 . In the center of the bottom plate 2, a through hole is formed. The heater 3 is arranged so as to close the through hole from above. The heater 3 is, for example, an electrothermal heater, formed in a box shape as a whole, and has a downwardly open shape. being being A chamber 4 is arranged in a space surrounded by the heater 3 .

腔室4形成用於對被處理基板100進行熱處理的處理室。腔室4整體形成為箱狀,具有向下開放的開口部。腔室4之開口部與密封構件8接觸。腔室4內的空間通過底板2之貫通孔而與底板2之下方的空間連續。 The chamber 4 forms a processing chamber for heat-treating the substrate 100 to be processed. The chamber 4 is formed in a box shape as a whole, and has an opening opened downward. The opening of the chamber 4 is in contact with the sealing member 8 . The space in the chamber 4 is continuous with the space below the bottom plate 2 through the through hole of the bottom plate 2 .

在熱處理裝置1的熱處理時,在腔室4內的空間配置有被處理基板100。在本實施形態中,被處理基板100以水平姿勢被基板支撐裝置6(亦稱為晶舟)所支撐。 During heat treatment by the heat treatment apparatus 1 , the substrate to be processed 100 is arranged in the space inside the chamber 4 . In this embodiment, the substrate to be processed 100 is supported by the substrate supporting device 6 (also called a wafer boat) in a horizontal posture.

基板支撐裝置6被安裝於底部凸緣5之上表面。底部凸緣5可與基板支撐裝置6一體地上升及下降。藉由使底部凸緣5封閉底板2之開口部而將腔室4內之空間設為封閉空間。在底板2之外周部的下表面配置有密封構件9。底部凸緣5藉由升降機構7被支撐。藉由升降機構7之動作,使底部凸緣5、基板支撐裝置6及被處理基板100一體地沿著上下方向位移。 The substrate supporting device 6 is mounted on the upper surface of the bottom flange 5 . The bottom flange 5 can be raised and lowered integrally with the substrate support device 6 . The space inside the chamber 4 is made a closed space by making the bottom flange 5 close the opening of the bottom plate 2 . A sealing member 9 is disposed on the lower surface of the outer peripheral portion of the bottom plate 2 . The bottom flange 5 is supported by a lifting mechanism 7 . By the operation of the lifting mechanism 7, the bottom flange 5, the substrate supporting device 6, and the substrate 100 to be processed are integrally displaced in the vertical direction.

關於在熱處理裝置1之熱處理時的動作,首先,在基板支撐裝置6被下降至腔室4之下方的狀態下,將複數個被處理基板100載置於該基板支撐裝置6。具體而言,例如藉由被設置在多軸機器人臂之前端的搬送手部10的動作,將被處理基板100例如從未圖示之匣向基板支撐裝置6每片地搬入。然後,在將複數個被處理基板100載置於基板支撐裝置6之後,升降機構7進行上升動作。藉此,將底部凸緣5、基板支撐裝置6及被處理基板100配置在腔室4內的空間中。 As for the heat treatment operation in the heat treatment apparatus 1 , first, a plurality of substrates 100 to be processed are placed on the substrate support apparatus 6 in a state where the substrate support apparatus 6 is lowered below the chamber 4 . Specifically, for example, the substrates 100 to be processed are carried into the substrate support device 6 one by one, for example, from a magazine not shown, by the operation of the transfer hand 10 provided at the front end of the multi-axis robot arm. Then, after the plurality of substrates 100 to be processed are placed on the substrate support device 6 , the lifting mechanism 7 performs a lifting operation. Thereby, the bottom flange 5 , the substrate supporting device 6 and the substrate to be processed 100 are arranged in the space in the chamber 4 .

接下來,進行加熱器3的加熱動作。藉此,對腔室4內的空間進行加熱,從而進行被處理基板100的熱處理。在被處理基板100之熱處理結束而加熱器3被停止之後,升降機構7進行下降動作。藉此,底部凸緣5、基板支撐裝置6及被處理基板100到達至腔室4之下方。接下來,搬送手部10將被處理基板100例如每片地搬出,從而從基板支撐裝置6取出被處理 基板100。 Next, the heating operation of the heater 3 is performed. Thereby, the space in the chamber 4 is heated, and the heat treatment of the substrate 100 to be processed is performed. After the heat treatment of the substrate 100 to be processed is completed and the heater 3 is stopped, the elevating mechanism 7 performs a descending operation. Thereby, the bottom flange 5 , the substrate supporting device 6 and the processed substrate 100 reach below the chamber 4 . Next, the transfer hand 10 carries out the substrates 100 to be processed, for example, one by one, thereby taking out the processed substrates 100 from the substrate support device 6 . Substrate 100.

接下來,對基板支撐裝置6之詳細構成進行說明。 Next, the detailed configuration of the substrate supporting device 6 will be described.

圖2係載置有複數個被處理基板100之狀態的基板支撐裝置6的前視圖。圖3係放大在圖2所顯示的基板支撐裝置6之中間部分的局部剖面圖,為顯示省略移動限制構件15L、15R的狀態。圖4係沿著圖2、圖3之IV-IV線的剖面圖,顯示俯視觀察基板支撐裝置6的狀態。圖5係放大在圖2所顯示的基板支撐裝置6之上部及下部的主要部分的剖面圖。 FIG. 2 is a front view of the substrate support device 6 in a state where a plurality of substrates 100 to be processed are placed. FIG. 3 is an enlarged partial cross-sectional view of the middle portion of the substrate supporting device 6 shown in FIG. 2 , showing a state in which the movement restricting members 15L, 15R are omitted. FIG. 4 is a cross-sectional view taken along line IV-IV of FIGS. 2 and 3 , showing the state of the substrate supporting device 6 viewed from above. FIG. 5 is an enlarged cross-sectional view of main parts of the upper and lower parts of the substrate supporting device 6 shown in FIG. 2 .

另外,在本實施形態中,針對上下及左右的方向,以前視觀察基板支撐裝置6的狀態為基準進行說明。另外,在本實施形態中,針對前後的方向,以俯視觀察基板支撐裝置6的狀態為基準進行說明。 In addition, in this embodiment, the up-down and left-right directions will be described based on the state in which the substrate support device 6 is viewed from the front. In addition, in this embodiment, the front-back direction is demonstrated based on the state which viewed the board|substrate support apparatus 6 from above.

參照圖2至圖5,在本實施形態中,基板支撐裝置6以單一材料的石英所形成。如此,藉由以單一材料形成基板支撐裝置6,可使在基板支撐裝置6之各部分的熱膨脹率大致均等。藉此,可抑制在基板支撐裝置6之各部分的相互連結部分於構件之間產生鬆弛。 2 to 5, in this embodiment, the substrate support device 6 is formed of a single material of quartz. Thus, by forming the substrate supporting device 6 from a single material, the coefficients of thermal expansion in each part of the substrate supporting device 6 can be substantially equalized. Thereby, it is possible to suppress the generation of slack between members at interconnected parts of each part of the substrate supporting device 6 .

基板支撐裝置6具有:底板11及頂板12,其等作為基部板;支撐體13,其被固定於該等板11、12;複數個承載板(基板支撐板)14,其等被支撐於支撐體13;移動限制構件15L、15R,其等用於防止承載板14之位置偏移而被安裝於板11、12;下錐形結合機構16L、16R,其等用於使移動限制構件15L、15R及底板11相互地結合;及上錐形結合機構17L、17R,其用於使移動限制構件15L、15R及頂板12相互地結合。 The substrate support device 6 has: a bottom plate 11 and a top plate 12, which serve as base plates; a support body 13, which is fixed to these plates 11, 12; a plurality of carrier plates (substrate support plates) 14, which are supported on the support body 13; movement limiting members 15L, 15R, which are installed on the plates 11, 12 for preventing the positional deviation of the bearing plate 14; lower tapered coupling mechanisms 16L, 16R, which are used to make the movement limiting members 15L, 15R, etc. 15R and the bottom plate 11 are mutually coupled; and upper tapered coupling mechanisms 17L, 17R for coupling the movement limiting members 15L, 15R and the top plate 12 to each other.

底板11被配置於支撐體13之下端。另一方面,頂板12被配置於支撐體13之上端。底板11及頂板12係固定有支撐體13的板。在本實施形態中,底板11及頂板12係平板狀構件,在俯視觀察時外周緣部之形狀及位置被設為相互地相同。另外,底板11之俯視形狀被顯示於圖4,而省略 頂板12之俯視形狀的圖示。底板11及頂板12各自的前部形狀被形成為於左右方向平行地延伸的矩形狀。另外,底板11及頂板12各自的後部形狀被形成為向後方突出的半圓形狀。底板11與頂板12經由支撐體13而被結合為一體,構成為相互地不能分離。 The bottom plate 11 is disposed at the lower end of the supporting body 13 . On the other hand, the top plate 12 is disposed on the upper end of the support body 13 . The bottom plate 11 and the top plate 12 are plates on which a support body 13 is fixed. In the present embodiment, the bottom plate 11 and the top plate 12 are flat members, and the shapes and positions of the outer peripheral portions are set to be mutually identical in plan view. In addition, the top view shape of the bottom plate 11 is shown in FIG. 4 and omitted. An illustration of the top view shape of the top plate 12. The respective front shapes of the bottom plate 11 and the top plate 12 are formed in a rectangular shape extending parallel to the left-right direction. In addition, each rear portion of the bottom plate 11 and the top plate 12 is formed in a semicircular shape protruding rearward. The bottom plate 11 and the top plate 12 are integrated via the support body 13, and are mutually inseparable.

支撐體13被設置為用於支撐複數個承載板14。在本實施形態中,支撐體13具有沿著上下方向延伸之作為複數個柱構件的右柱21、左柱22及後柱23。 The supporting body 13 is configured to support a plurality of carrying plates 14 . In this embodiment, the support body 13 has the right column 21, the left column 22, and the rear column 23 which are some column members extended in the up-down direction.

右柱21被配置於底板11及頂板12各自的右前部。左柱22被配置於底板11及頂板12各自的左前部。後柱23被配置於底板11及頂板12各自的後端部。如此,柱21、22、23在板11、12上被配置相互地分離。另外,柱的數量不限定於本實施形態所顯示的3個,亦可2個,也可為4個以上。各柱21、22、23被形成為細長之軸狀。各柱21、22、23之下端部藉由焊接等之固定方法而與底板11一體化。各柱21、22、23之上端部藉由焊接等之固定方法而與頂板12一體化。 The right column 21 is disposed on the right front portions of the bottom plate 11 and the top plate 12 , respectively. The left column 22 is disposed on the left front portions of the bottom plate 11 and the top plate 12 , respectively. The rear pillar 23 is arranged at the respective rear ends of the bottom plate 11 and the top plate 12 . In this way, the columns 21 , 22 , 23 are arranged on the plates 11 , 12 to be separated from each other. In addition, the number of columns is not limited to 3 shown in this embodiment, but may be 2 or 4 or more. Each column 21, 22, 23 is formed in the shape of an elongated shaft. The lower ends of the columns 21, 22, 23 are integrated with the bottom plate 11 by fixing methods such as welding. The upper ends of the columns 21, 22, 23 are integrated with the top plate 12 by fixing means such as welding.

在右柱21形成有複數個支撐部21a。同樣地,在左柱22形成有複數個支撐部22a。在後柱23形成有複數個支撐部23a。支撐部21a、22a、23a的數量被設定為彼此地相同。在本實施形態中,支撐部21a、22a、23a的數量分別約為30個。支撐部21a、22a、23a被形成於所對應的柱21、22、23之上下方向之中間部分。 A plurality of support portions 21 a are formed on the right column 21 . Similarly, a plurality of support portions 22 a are formed on the left column 22 . A plurality of support portions 23 a are formed on the rear pillar 23 . The number of support parts 21a, 22a, 23a is set to be the same as each other. In this embodiment, the number of support parts 21a, 22a, and 23a is about 30, respectively. The supporting parts 21a, 22a, and 23a are formed in the middle parts of the corresponding columns 21, 22, and 23 in the vertical direction.

支撐部21a係被形成於右柱21之左側部的小片部分。支撐部21a與被形成於圓軸狀之右柱21之左側部的凹部21b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部21a沿著上下方向(縱向)排列。凹部21b係沿著前後方向貫通支撐部21a的部分,朝右柱21之左側開放。如此,右柱21被形成為沿著上下方向的梳齒狀,藉此形成 複數個支撐部21a。 The support portion 21 a is a small piece formed on the left side of the right column 21 . The support part 21a and the recessed part 21b formed in the left side part of the cylindrical right column 21 are arrange|positioned alternately in an up-down direction. Thereby, the several support part 21a which supports the several loading plate 14 is arranged in the up-down direction (vertical direction). The concave portion 21b is a portion penetrating the support portion 21a along the front-rear direction, and is open to the left side of the right column 21 . In this way, the right column 21 is formed in a comb-tooth shape along the up-down direction, thereby forming A plurality of supporting parts 21a.

支撐部22a係被形成於左柱22之右側部的小片狀部分。支撐部22a與被形成於圓軸狀之左柱22之右側部的凹部22b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部22a沿著上下方向(縱向)排列。凹部22b係沿著前後方向貫通支撐部22a的部分,朝左柱22之右側開放。如此,左柱22被形成為沿著上下方向的梳齒狀,藉此形成複數個支撐部22a。 The support portion 22 a is a small piece-like portion formed on the right side of the left column 22 . The support part 22a and the recessed part 22b formed in the right side part of the left column 22 of circular shaft shape are arrange|positioned alternately in an up-down direction. Thereby, the several support part 22a which supports the several loading plate 14 is arranged in the up-down direction (vertical direction). The concave portion 22b is a portion penetrating through the support portion 22a along the front-rear direction, and opens to the right side of the left column 22 . In this way, the left column 22 is formed in a comb-tooth shape along the up-down direction, thereby forming a plurality of support portions 22a.

支撐部23a係被形成於後柱23之前側部的小片狀部分。支撐部23a與被形成於圓軸狀之後柱23之前側部的凹部23b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部23a沿著上下方向(縱向)排列。凹部23b係沿著左右方向貫通支撐部23a的部分,朝後柱23之前側開放。如此,後柱23被形成為沿著上下方向的梳齒狀,藉此形成複數個支撐部23a。 The support portion 23 a is a small piece-like portion formed on the front side of the rear pillar 23 . The support part 23a and the recessed part 23b formed in the front side part of the circular axis|shaft rear column 23 are arrange|positioned alternately in an up-down direction. Thereby, the several support part 23a which supports the several loading plate 14 is arranged in the up-down direction (vertical direction). The recessed part 23b is a part which penetrates the support part 23a along the left-right direction, and opens toward the front side of the rear pillar 23. As shown in FIG. In this way, the rear pillar 23 is formed in a comb-tooth shape along the up-down direction, thereby forming a plurality of support portions 23a.

根據上述之構成,支撐部21a、22a於前後方向延伸,支撐部23a於左右方向延伸。另外,支撐部21a、22a、23a之上下方向的位置一致。根據該構成,高度位置為相同的支撐部21a、22a、23a協同運作而以水平姿勢支撐一個被處理基板100。在本實施形態中,使承載板14針對於高度位置為相同的支撐部21a、22a、23a沿著與縱向交叉的既定之裝卸方向X1(在本實施形態中為前後方向)移動,藉此可使承載板14針對於支撐部21a、22a、23a進行裝卸。 According to the above structure, the support parts 21a and 22a extend in the front-back direction, and the support part 23a extends in the left-right direction. Moreover, the position of the up-down direction of support part 21a, 22a, 23a matches. According to this configuration, the support parts 21a, 22a, and 23a having the same height position cooperate to support one substrate 100 to be processed in a horizontal posture. In this embodiment, the support plate 14 is moved along a predetermined attachment and detachment direction X1 (in this embodiment, the front-rear direction) intersecting the longitudinal direction with respect to the support portions 21a, 22a, and 23a whose height positions are the same. The loading plate 14 is attached to and detached from the support portions 21a, 22a, and 23a.

在本實施形態中,使承載板14對於支撐部21a、22a、23a朝安裝方向X11位移,藉此可將承載板14載置且安裝於支撐部21a、22a、23a。另外,使承載板14對於支撐部21a、22a、23a朝拆卸方向X12位移,藉此可將承載板14從支撐部21a、22a、23a卸下。如此,支撐部21a、22a、 23a對承載板14之外周緣部有3點支撐。 In this embodiment, the carrier board 14 can be mounted and attached to the support parts 21a, 22a, 23a by displacing the carrier board 14 in the mounting direction X11 with respect to the support parts 21a, 22a, 23a. In addition, the loading plate 14 can be detached from the supporting portions 21a, 22a, and 23a by displacing the loading plate 14 in the detachment direction X12 with respect to the supporting portions 21a, 22a, and 23a. In this way, the support parts 21a, 22a, 23a supports the outer peripheral portion of the bearing plate 14 at three points.

承載板14係載置被處理基板100的構件。對於高度位置相同的一組支撐部21a、22a、23a安裝有一個承載板14。在本實施形態中,在一部分之組的支撐部21a、22a、23a被安裝有承載板14。另外,承載板14的數量只要1個以上即可,並不限定於具體的數量。承載板14係於水平延伸的平板狀構件。在本實施形態中,承載板14被形成為左右對稱的形狀,在俯視觀察時形成為大致Ω字狀。另外,在圖4中利用陰影線顯示承載板14。 The carrier plate 14 is a member for placing the substrate 100 to be processed. One carrier plate 14 is installed for a group of supporting parts 21a, 22a, 23a having the same height position. In the present embodiment, the carrier plate 14 is attached to a part of the support portions 21a, 22a, and 23a of the set. In addition, the number of carrying plates 14 should just be one or more, and it is not limited to a specific number. The carrying plate 14 is tied to a horizontally extending flat member. In the present embodiment, the carrier plate 14 is formed in a left-right symmetrical shape, and is formed in a substantially Ω-shape when viewed from above. Furthermore, the carrier plate 14 is shown hatched in FIG. 4 .

承載板14具有:基板配置部25;切口部26,其從基板配置部25之外周緣部25a朝向基板配置部25之中心延伸;及擋止27L、27R,其等從基板配置部25之外周緣部25a突出。 The carrier plate 14 has: a substrate arrangement portion 25; a cutout portion 26 extending from the outer peripheral portion 25a of the substrate arrangement portion 25 toward the center of the substrate arrangement portion 25; The edge portion 25a protrudes.

基板配置部25係配置被處理基板100的部分。基板配置部25被形成為大致圓形狀。基板配置部25之外周緣部25a之後端部被載置於支撐部23a。 The substrate placement unit 25 is a part where the substrate 100 to be processed is placed. The substrate placement portion 25 is formed in a substantially circular shape. The rear end portion of the outer peripheral edge portion 25a of the substrate arrangement portion 25 is placed on the support portion 23a.

在左右方向之基板配置部25的全長(基板配置部25的直徑)被設定為較支撐部21a、22a之整個寬度(從支撐部21a之右端至支撐部22a之左端的長度)短。藉此,可使基板配置部25從支撐體13之前方朝向支撐體13沿著安裝方向X11移動,藉此可通過支撐體13之支撐部21a、22a、23a。 The overall length of the substrate arrangement portion 25 in the left-right direction (the diameter of the substrate arrangement portion 25) is set shorter than the entire width of the support portions 21a, 22a (the length from the right end of the support portion 21a to the left end of the support portion 22a). Thereby, the substrate arrangement part 25 can be moved from the front of the support body 13 toward the support body 13 along the installation direction X11, thereby passing the support parts 21a, 22a, 23a of the support body 13.

基板配置部25之整個上表面被規定為用於載置被處理基板100的面。在本實施形態中,藉由搬送手部10將被處理基板100載置於基板配置部25之大致中央。 The entire upper surface of the substrate placement portion 25 is defined as a surface on which the substrate 100 to be processed is placed. In the present embodiment, the substrate to be processed 100 is placed substantially in the center of the substrate placement section 25 by the transfer hand 10 .

為了通過搬送手部10設置有切口部26,切口部26從基板配置部25之前端部向後方延伸。切口部26在左右方向具有較搬送手部10之寬度寬的寬度,在前後方向延伸至比基板配置部25之中央位置更後方的位 置。根據該構成,搬送手部10可將被處理基板100配置於基板配置部25之中央。 The notch part 26 is provided in order to pass the conveyance hand part 10, and the notch part 26 extends rearward from the front end part of the board|substrate arrangement|positioning part 25. As shown in FIG. The notch portion 26 has a width wider than the width of the conveying hand portion 10 in the left-right direction, and extends to a position rearward from the central position of the board arrangement portion 25 in the front-rear direction. place. According to this configuration, the transfer hand 10 can arrange the substrate 100 to be processed at the center of the substrate arrangement part 25 .

擋止27L、27R係在與裝卸方向X1交叉(在本實施形態中為正交)的左右方向(寬度方向)從基板配置部25突出地延伸,被所對應的移動限制構件15L、15R及所對應的柱22、21所承接的部分。該等一對之擋止27L、27R在左右方向分離地設置有一對。 The stoppers 27L, 27R protrude from the board arrangement portion 25 in the left-right direction (width direction) intersecting (orthogonal in the present embodiment) with the attaching and detaching direction X1, and are controlled by the corresponding movement restricting members 15L, 15R and the corresponding movement restricting members 15L, 15R. The part that the corresponding column 22, 21 undertakes. The pair of stoppers 27L, 27R are provided as a pair separated in the left-right direction.

作為一對擋止27L、27R之一者的右擋止27R從基板配置部25之外周緣部25a之右斜前部向基板配置部25之徑向外側延伸。作為一對擋止27L、27R之另一者的左擋止27L,從基板配置部25之外周緣部25a之左斜前部向基板配置部25之徑向外側延伸。各擋止27L、27R被形成為前尖的形狀。更具體而言,在俯視觀察時,各擋止27L、27R係與外周緣部25a的連接部分在從俯視觀察時形成為彎曲形狀,以隨著從外周緣部25a向基板配置部25之徑向外側遠離而寬度變窄的方式延伸。而且,擋止27L、27R各自之前端部28L、28R的外周緣部在俯視觀察時形成為大致V字狀。 The right stopper 27R, which is one of the pair of stoppers 27L, 27R, extends radially outward of the board arrangement portion 25 from the right oblique front portion of the outer peripheral portion 25 a of the board arrangement portion 25 . The left stopper 27L, which is the other of the pair of stoppers 27L, 27R, extends radially outward of the board arrangement portion 25 from the left obliquely front portion of the outer peripheral portion 25 a of the board arrangement portion 25 . Each stopper 27L, 27R is formed in a pointed shape. More specifically, each stopper 27L, 27R is formed in a curved shape when viewed from a plan view, and the connecting portion of each stopper 27L, 27R to the outer peripheral portion 25a is formed in a curved shape as the diameter from the outer peripheral portion 25a to the substrate arrangement portion 25 increases. Extending away from the outside and narrowing in width. Further, the outer peripheral edge portions of the respective front end portions 28L, 28R of the stoppers 27L, 27R are formed in a substantially V-shape when viewed from above.

在本實施形態中,右擋止27R之前端部28R被配置在從基板配置部25之右端部之位置稍微向右側突出的位置。在本實施形態中,左擋止27L之前端部28L被配置在從基板配置部25之左端部之位置稍微向左側突出的位置。各擋止27L、27R被配置在從基板配置部25之前端部之位置向後方側前進的位置。 In the present embodiment, the front end portion 28R of the right stopper 27R is arranged at a position protruding slightly to the right from the position of the right end portion of the substrate arrangement portion 25 . In this embodiment, the front end portion 28L of the left stopper 27L is arranged at a position protruding slightly to the left from the position of the left end portion of the board arrangement portion 25 . The respective stoppers 27L, 27R are disposed at positions advanced from the position of the front end portion of the board arrangement portion 25 to the rear side.

右擋止27R之前端部28R具有右側第1平行部29R與右側前部30R。同樣地,左擋止27L之前端部28L具有左側第1平行部29L與左側前部30L。 The front end portion 28R of the right stopper 27R has a right first parallel portion 29R and a right front portion 30R. Similarly, the front end portion 28L of the left stopper 27L has a left first parallel portion 29L and a left front portion 30L.

右側第1平行部29R構成前端部28R之右端部,在本實施形態中,沿著裝卸方向X1呈直線狀延伸。右側第1平行部29R位於基板配置 部25之右端部的前方。右側第1平行部29R與右側第2平行部32R在左右方向上相對。右側第2平行部32R係右柱21之凹部21b的右端面,被配置在載置所對應之右擋止27R的支撐部21a之上方。右側第2平行部32R沿著作為右側第1平行部29R所延伸之方向的裝卸方向X1延伸,與右側第1平行部29R平行地延伸。即,相互地鄰接的右側第1平行部29R與右側第2平行部32R相互平行地延伸。 The right first parallel portion 29R constitutes the right end portion of the front end portion 28R, and extends linearly along the attaching and detaching direction X1 in the present embodiment. The first parallel portion 29R on the right side is located in the substrate configuration The front of the right end of part 25. The right first parallel portion 29R is opposed to the right second parallel portion 32R in the left-right direction. The right second parallel portion 32R is the right end surface of the concave portion 21b of the right column 21, and is arranged above the supporting portion 21a on which the corresponding right stopper 27R is placed. The right second parallel portion 32R extends along the attaching and detaching direction X1 which is the direction in which the right first parallel portion 29R extends, and extends parallel to the right first parallel portion 29R. That is, the mutually adjacent right first parallel portion 29R and the right second parallel portion 32R extend parallel to each other.

左側第1平行部29L構成前端部28L之左端部,在本實施形態中,沿著裝卸方向X1呈直線狀延伸。左側第1平行部29L位於基板配置部25之左端部的前方。左側第1平行部29L與左側第2平行部32L在左右方向上相對。左側第2平行部32L係左柱22的凹部22b的左端面,被配置在載置所對應之左擋止27L的支撐部22a之上方。左側第2平行部32L沿著作為左側第1平行部29L所延伸之方向的裝卸方向X1延伸,與左側第1平行部29L平行地延伸。即,相互地鄰接的左側第1平行部29L與左側第2平行部32L相互平行地延伸。 The left first parallel portion 29L constitutes the left end portion of the front end portion 28L, and extends linearly along the attaching and detaching direction X1 in the present embodiment. The left first parallel portion 29L is located in front of the left end portion of the substrate arrangement portion 25 . The left first parallel portion 29L and the left second parallel portion 32L face each other in the left-right direction. The left second parallel portion 32L is the left end surface of the concave portion 22b of the left column 22, and is arranged above the supporting portion 22a on which the corresponding left stopper 27L is placed. The left second parallel portion 32L extends along the detachment direction X1 which is the direction in which the left first parallel portion 29L extends, and extends parallel to the left first parallel portion 29L. That is, the left first parallel portion 29L and the left second parallel portion 32L that are adjacent to each other extend parallel to each other.

根據上述的構成,支撐體13的左柱22及右柱21具有可與一對第1平行部29L、29R接觸的一對第2平行部32L、32R。另外,在本實施形態中,在右側第1平行部29R與右側第2平行部32R之間形成有些微間隙,另外,在左側第1平行部29L與左側第2平行部32L之間形成有些微間隙。藉此,在將承載板14針對於支撐體13進行裝卸時,可抑制擋止27L、27R接觸於左柱22與右柱21。 According to the structure mentioned above, the left column 22 and the right column 21 of the support body 13 have a pair of 2nd parallel part 32L, 32R which can contact a pair of 1st parallel part 29L, 29R. In addition, in this embodiment, a slight gap is formed between the right first parallel portion 29R and the right second parallel portion 32R, and a slight gap is formed between the left first parallel portion 29L and the left second parallel portion 32L. gap. Thereby, when the loading plate 14 is attached to and detached from the supporting body 13 , the stoppers 27L and 27R can be restrained from contacting the left post 22 and the right post 21 .

右側前部30R係被右側移動限制構件15R所承接的部分。右側前部30R構成前端部28R之前端部,沿著左右方向(寬度方向)延伸。在本實施形態中,右側前部30R之長度與右側第1平行部29R之長度被設定為大致相同。右側前部30R被配置在右側移動限制構件15R之正後方。 The right front portion 30R is a portion received by the right movement limiting member 15R. The right front portion 30R constitutes the front end portion of the front end portion 28R, and extends in the left-right direction (width direction). In the present embodiment, the length of the right front portion 30R and the length of the right first parallel portion 29R are set substantially the same. The right front portion 30R is disposed immediately behind the right movement limiting member 15R.

左側前部30L係被左側移動限制構件15L所承接的部分。左側前部30L構成前端部28L之前端部,沿著左右方向(寬度方向)延伸。在本實施形態中,左側前部30L之長度與左側第1平行部29L之長度被設定為大致相同。左側前部30L被配置在左側移動限制構件15L之正後方。 The left front portion 30L is a portion received by the left movement limiting member 15L. The left front portion 30L constitutes the front end portion of the front end portion 28L, and extends in the left-right direction (width direction). In the present embodiment, the length of the left front portion 30L and the length of the left first parallel portion 29L are set substantially the same. The left front portion 30L is arranged directly behind the left movement restricting member 15L.

作為一對移動限制構件15L、15R的右側移動限制構件15R與左側移動限制構件15L,係被設置成在被安裝於底板11及頂板12的狀態下,為了允許被處理基板100相對於承載板14的進出而限制各承載板14相對於支撐體13的移動者。另外,移動限制構件15L、15R係分別從底板11之高度位置延伸至頂板12之高度位置的棒構件,用於在支撐體13上裝卸承載板14而被構成為可自板11、12裝卸者。 The right movement regulating member 15R and the left movement regulating member 15L, which are a pair of movement regulating members 15L, 15R, are provided so as to allow the substrate 100 to be processed to move relative to the carrier plate 14 in the state mounted on the bottom plate 11 and the top plate 12 . The movement of each carrier plate 14 relative to the support body 13 is restricted by the entry and exit. In addition, the movement restricting members 15L, 15R are rod members respectively extending from the height position of the bottom plate 11 to the height position of the top plate 12, and are configured to be detachable from the plates 11, 12 for attaching and detaching the carrier plate 14 on the support body 13. .

右側移動限制構件15R與右擋止27R相對應,左側移動限制構件15L與左擋止27L相對應。各移動限制構件15L、15R係棒構件,在本實施形態中為圓軸構件,沿著上下方向延伸並可與各承載板14所對應的擋止27L、27R接觸。另外,移動限制構件15L、15R亦可被形成為角柱狀。各移動限制構件15L、15R具有如下構成:上端部15a及下端部15b被形成為塊狀,並且在該等上端部15a及下端部15b各自的中心形成有沿著上下方向延伸的貫通孔。另外,各移動限制構件15L、15R之中間部15c形成為圓筒狀,上端部15a及下端部15b被形成為一體。 The right movement limiting member 15R corresponds to the right stopper 27R, and the left movement limiting member 15L corresponds to the left stopper 27L. Each movement limiting member 15L, 15R is a rod member, which is a circular shaft member in this embodiment, extends in the vertical direction and can contact the corresponding stopper 27L, 27R of each carrier plate 14 . In addition, the movement restricting members 15L, 15R may be formed in a prism shape. Each movement restricting member 15L, 15R has a structure in which the upper end portion 15a and the lower end portion 15b are formed in a block shape, and a through hole extending in the vertical direction is formed at the center of each of the upper end portion 15a and the lower end portion 15b. Moreover, the intermediate part 15c of each movement control member 15L, 15R is formed in cylindrical shape, and the upper end part 15a and the lower end part 15b are integrally formed.

右側移動限制構件15R被配置在右擋止27R之右側前部30R的正前方,並被安裝在板11、12之右前端部。左側移動限制構件15L被配置在左擋止27L之左側前部30L的正前方,並被安裝在板11、12之左前端部。在本實施形態中,各移動限制構件15L、15R的直徑被設定為與右柱21之直徑(左柱22之直徑)大致相同。 The right movement limiting member 15R is arranged directly in front of the right front portion 30R of the right stopper 27R, and is attached to the right front ends of the plates 11 , 12 . The left movement restricting member 15L is arranged directly in front of the left front portion 30L of the left stopper 27L, and is attached to the left front ends of the plates 11 , 12 . In the present embodiment, the diameters of the respective movement restricting members 15L, 15R are set substantially the same as the diameter of the right column 21 (the diameter of the left column 22 ).

根據上述的構成,藉由移動限制構件15L、15R承接各承載板 14之擋止27L、27R,防止承載板14向前方發生位置偏移及從支撐體13脫落。另外,藉由一對移動限制構件15L、15R承接一對擋止27L、27R,可防止承載板14在俯視觀察時相對於支撐體13朝順時針方向或逆時針方向旋轉位移(旋轉位置偏移)。另外,移動限制構件15L、15R被配置為相鄰於右柱21及左柱22。其結果為,一對第2平行部32L、32R被配置為以夾著一對第1平行部29L、29R的方式相鄰於該一對第1平行部29L、29R。藉此,藉由一對第1平行部29L、29R中之任一者與所對應的第2平行部接觸而限制在俯視觀察時的承載板14之旋轉位移。 According to the above-mentioned configuration, each carrier plate is received by the movement restricting members 15L, 15R. The stops 27L and 27R of 14 prevent the bearing plate 14 from shifting forward and falling off from the supporting body 13 . In addition, by receiving a pair of stoppers 27L, 27R through a pair of movement limiting members 15L, 15R, it is possible to prevent the carrier plate 14 from clockwise or counterclockwise rotational displacement (rotational position deviation) relative to the support body 13 when viewed from above. ). In addition, the movement restricting members 15L, 15R are arranged adjacent to the right column 21 and the left column 22 . As a result, the pair of second parallel portions 32L, 32R is disposed adjacent to the pair of first parallel portions 29L, 29R so as to sandwich the pair of first parallel portions 29L, 29R. Thereby, when any one of a pair of 1st parallel part 29L, 29R contacts a corresponding 2nd parallel part, the rotational displacement of the loading plate 14 in planar view is restricted.

如此,相互地鄰接配置的右柱21及右側移動限制構件15R與相互地鄰接配置的左柱22及左側移動限制構件15L協同運作。藉此,可防止承載板14於從支撐體13的拆卸方向X12產生位置偏移及承載板14在俯視觀察時於旋轉方向產生位置偏移。另外,藉由後柱23承接承載板14而可防止承載板14相對於支撐體13朝後方的位置偏移。 In this way, the right column 21 and the right movement regulating member 15R arranged adjacent to each other cooperate with the left column 22 and the left movement regulating member 15L arranged adjacent to each other. Thereby, the bearing plate 14 can be prevented from being displaced in the detachment direction X12 of the supporting body 13 and the bearing plate 14 is prevented from being displaced in the rotation direction when viewed from above. In addition, the supporting board 14 can be prevented from shifting backward relative to the supporting body 13 by the rear column 23 receiving the supporting board 14 .

移動限制構件15L、15R之間的間隔被設定為較被處理基板100之直徑為大。藉此,在藉由搬送手部10所進行之被處理基板100的進出動作時,可防止移動限制構件15L、15R與被處理基板100的接觸。 The distance between the movement limiting members 15L, 15R is set to be larger than the diameter of the substrate 100 to be processed. This prevents the movement limiting members 15L, 15R from coming into contact with the substrate 100 to be processed during the movement of the substrate 100 to be processed by the conveyance hand 10 .

參照圖2及圖5,在本實施形態中,藉由以沿著上下方向(縱向)延伸的軸線為中心軸線的錐形結合而使板11、12與移動限制構件15L、15R連結。另外,移動限制構件15L、15R被構成為針對於底板11及頂板12可裝卸。具體而言,其設置有使移動限制構件15L、15R與底板11錐形結合的下錐形結合機構16L、16R。另外,其設置有使移動限制構件15L、15R與頂板12錐形結合的上錐形結合機構17L、17R。 Referring to FIGS. 2 and 5 , in the present embodiment, the plates 11 , 12 are connected to the movement limiting members 15L, 15R by a tapered connection whose central axis is an axis extending in the vertical direction (longitudinal direction). In addition, the movement restricting members 15L and 15R are configured to be detachably attached to the bottom plate 11 and the top plate 12 . Specifically, it is provided with lower taper coupling mechanisms 16L, 16R that taper-bond the movement restricting members 15L, 15R with the bottom plate 11 . In addition, it is provided with upper taper joint mechanisms 17L, 17R that taper joint the movement restricting members 15L, 15R with the top plate 12 .

關於一對下錐形結合機構16L、16R之一者的右側下錐形結合機構16R,具有右側第1錐形孔部33R與右側第1錐形軸部34R。同樣地, 關於一對下錐形結合機構16L、16R之另一者的左側下錐形結合機構16L,具有左側第1錐形孔部33L與左側第1錐形軸部34L。 The right lower tapered coupling mechanism 16R, one of the pair of lower tapered coupling mechanisms 16L, 16R, has a right first tapered hole portion 33R and a right first tapered shaft portion 34R. Similarly, The left lower tapered coupling mechanism 16L, which is the other of the pair of lower tapered coupling mechanisms 16L, 16R, has a left first tapered hole portion 33L and a left first tapered shaft portion 34L.

右側第1錐形孔部33R被形成於底板11中配置右側移動限制構件15R之部位的右前部。左側第1錐形孔部33L被形成於底板11中之配置左側移動限制構件15L之部位的左前部。各第1錐形孔部33L、33R係向底板11之上表面開放的圓錐台錐形狀部分,在本實施形態中,於上下方向貫通底板11。在本實施形態中,以鉛垂方向為基準,各第1錐形孔部33L、33R之錐角的第1錐角θ1被設定為40°。 The right first tapered hole portion 33R is formed in the right front portion of the bottom plate 11 where the right movement restricting member 15R is arranged. The left first tapered hole portion 33L is formed in the left front portion of the bottom plate 11 where the left movement restricting member 15L is arranged. Each of the first tapered hole portions 33L, 33R is a truncated conical portion open to the upper surface of the bottom plate 11 , and penetrates through the bottom plate 11 in the vertical direction in the present embodiment. In the present embodiment, the first taper angle θ1 of the taper angles of the respective first tapered hole portions 33L, 33R is set to 40° based on the vertical direction.

右側第1錐形軸部34R被形成於右側移動限制構件15R之下端部。左側第1錐形軸部34L被形成於左側移動限制構件15L之下端部。各第1錐形軸部34L、34R係隨著向下方前進而直徑變小的圓錐台錐形狀部分。在本實施形態中,各第1錐形軸部34L、34R之錐角被設定為與各第1錐形孔部33L、33R之錐角相同角度的第1錐角θ1。各第1錐形軸部34L、34R與對應的第1錐形孔部33L、33R錐形嵌合。藉此,各移動限制構件15L、15R與底板11之所對應的第1錐形孔部33L、33R錐形結合。 The right first tapered shaft portion 34R is formed at the lower end portion of the right movement restricting member 15R. The left first tapered shaft portion 34L is formed at the lower end portion of the left movement restricting member 15L. Each of the first tapered shaft portions 34L, 34R is a truncated conical portion whose diameter becomes smaller as it goes downward. In this embodiment, the taper angle of each of the first tapered shaft portions 34L, 34R is set to a first taper angle θ1 that is the same as the taper angle of each of the first tapered hole portions 33L, 33R. Each of the first tapered shaft portions 34L, 34R is taperedly fitted into the corresponding first tapered hole portion 33L, 33R. Thereby, each movement restricting member 15L, 15R is taper-coupled with the corresponding 1st tapered hole part 33L, 33R of the bottom plate 11. As shown in FIG.

一對上錐形結合機構17L、17R之一者的右側上錐形結合機構17R,具有右側第2錐形孔部35R與包含右側第2錐形軸部37R的右帽36R。同樣地,一對上錐形結合機構17L、17R之另一者的左側上錐形結合機構17L,具有左側第2錐形孔部35L與包含左側第2錐形軸部37L的左帽36L。 The right upper tapered coupling mechanism 17R, one of the pair of upper tapered coupling mechanisms 17L, 17R, has a right second tapered hole portion 35R and a right cap 36R including the right second tapered shaft portion 37R. Similarly, the left upper tapered coupling mechanism 17L, the other of the pair of upper tapered coupling mechanisms 17L, 17R, has a left second tapered hole portion 35L and a left cap 36L including the left second tapered shaft portion 37L.

右側第2錐形孔部35R被形成於頂板12中之配置右側移動限制構件15R之部位的右前部。左側第2錐形孔部35L被形成於頂板12中配置左側移動限制構件15L之部位的左前部。各第2錐形孔部35L、35R係圓錐台錐形狀部分,於上下方向貫通頂板12。在本實施形態中,以鉛垂方向為基準,各第2錐形孔部35L、35R之錐角的第2錐角θ2被設定為30°。 The right second tapered hole portion 35R is formed in the right front portion of the top plate 12 where the right movement restricting member 15R is arranged. The left second tapered hole portion 35L is formed in the left front portion of the top plate 12 where the left movement restricting member 15L is disposed. Each of the second tapered hole portions 35L, 35R is a truncated conical portion, and penetrates through the top plate 12 in the vertical direction. In this embodiment, the second taper angle θ2 of the taper angles of the respective second tapered hole portions 35L, 35R is set to 30° based on the vertical direction.

即,第1錐角θ1被設定為比第2錐角θ2為大。如此,藉由使第1錐角θ1較大,首先,可將移動限制構件15L、15R之下端部高精度地定位於第1錐形孔部33L、33R,並且以可調整位置的方式可將移動限制構件15L、15R之上端部配置於第2錐形孔部35L、35R。而且,由於使第2錐角θ2比第1錐角θ1為小,因此藉由使用有帽36L、36R的上錐形結合機構17L、17R,可實現移動限制構件15L、15R整體姿勢的穩定化。藉此,遠離該上錐形結合機構17L、17R的移動限制構件15L、15R之下端部亦被定位於第1錐形孔部33L、33R之既定位置,並被限制移動。因此,即使在第1錐角θ1較大的情況下,亦可防止第1錐形軸部34L、34R經由第1錐形孔部33L、33R之傾斜而脫落。因此,可實現移動限制構件15L、15R之位置精度的提高與姿勢之穩定化的兩者。另外,上述第1錐角θ1比第2錐角θ2為大的構成係一個例子,本發明並不被限定於該構成。配合基板支撐裝置6之配置位置、形狀,亦可使第2錐角θ2較第1錐角θ1為大。 That is, the first taper angle θ1 is set larger than the second taper angle θ2. In this way, by making the first taper angle θ1 large, first, the lower ends of the movement restricting members 15L, 15R can be positioned with high precision in the first tapered hole portions 33L, 33R, and the positions can be adjusted. The upper ends of the movement restricting members 15L, 15R are disposed in the second tapered hole portions 35L, 35R. Furthermore, since the second taper angle θ2 is made smaller than the first taper angle θ1, by using the upper taper coupling mechanisms 17L, 17R with caps 36L, 36R, the overall posture of the movement limiting members 15L, 15R can be stabilized. . Thereby, the lower ends of the movement restricting members 15L, 15R away from the upper tapered coupling mechanisms 17L, 17R are also positioned at predetermined positions of the first tapered hole portions 33L, 33R, and their movement is restricted. Therefore, even when the first taper angle θ1 is large, the first tapered shaft portions 34L, 34R can be prevented from coming off through the inclination of the first tapered hole portions 33L, 33R. Therefore, it is possible to achieve both the improvement of the positional accuracy of the movement restricting members 15L, 15R and the stabilization of the posture. In addition, the above-mentioned configuration in which the first taper angle θ1 is larger than the second taper angle θ2 is an example, and the present invention is not limited to this configuration. In accordance with the arrangement position and shape of the substrate supporting device 6, the second taper angle θ2 can also be made larger than the first taper angle θ1.

右側移動限制構件15R之上端部15a被配置在右側第2錐形孔部35R內。同樣地,左側移動限制構件15L之上端部15a被配置在左側第2錐形孔部35L內。 The upper end portion 15a of the right movement restricting member 15R is arranged in the right second tapered hole portion 35R. Similarly, the upper end portion 15a of the left movement limiting member 15L is arranged in the left second tapered hole portion 35L.

右帽36R具有:右側第2錐形軸部37R,其被形成於右帽36R之外周面;及右側插入孔部38R,其被形成於右帽36R之內周面,插入右側移動限制構件15R。同樣地,左帽36L具有:左側第2錐形軸部37L,其被形成於左帽36L之外周面;及左側插入孔部38L,其被形成於左帽36L之內周面,插入左側移動限制構件15L。 The right cap 36R has: a right second tapered shaft portion 37R formed on the outer peripheral surface of the right cap 36R; and a right insertion hole portion 38R formed on the inner peripheral surface of the right cap 36R into which the right movement restricting member 15R is inserted. . Similarly, the left cap 36L has: a left second tapered shaft portion 37L formed on the outer peripheral surface of the left cap 36L; The restricting member 15L.

各插入孔部38L、38R之直徑被設定為與移動限制構件15L、15R之外徑大致相同,構成為使各帽36L、36R與所對應的移動限制構件15L、15R之間不產生晃動。 The diameter of each insertion hole 38L, 38R is set to be substantially the same as the outer diameter of the movement restricting member 15L, 15R, and is configured so that rattle does not occur between each cap 36L, 36R and the corresponding movement restricting member 15L, 15R.

右側第2錐形軸部37R被形成在右帽36R之下端側部分。左側第2錐形軸部37L被形成在左帽36L之下端側部分。各第2錐形軸部37L、37R係隨著朝向下方前進而直徑變小的圓錐台錐形狀部分。在本實施形態中,各第2錐形軸部37L、37R之錐角被設定為與各第2錐形孔部35L、35R之錐角相同角度的第2錐角θ2。各第2錐形軸部37L、37R藉由從所對應的第2錐形孔部35L、35R之上方被插入至該等第2錐形孔部35L、35R而進行錐形嵌合。藉此,各移動限制構件15L、15R與頂板12所對應的第2錐形孔部35L、35R進行錐形結合。 The right second tapered shaft portion 37R is formed at the lower end portion of the right cap 36R. The left second tapered shaft portion 37L is formed at the lower end portion of the left cap 36L. Each of the second tapered shaft portions 37L, 37R is a truncated conical portion whose diameter becomes smaller as it goes downward. In this embodiment, the taper angle of each second tapered shaft portion 37L, 37R is set to a second taper angle θ2 that is the same as the taper angle of each second tapered hole portion 35L, 35R. The respective second tapered shaft portions 37L, 37R are inserted into the corresponding second tapered hole portions 35L, 35R from above to perform tapered fitting. Thereby, each movement restricting member 15L, 15R is taper-coupled with the corresponding 2nd tapered hole part 35L, 35R of the top plate 12. As shown in FIG.

在帽36L、36R分別與第2錐形孔部35L、35R嵌合時,各帽36L、36R之上端部從頂板12向上方突出。藉此,作業人員可利用夾持工具等抓住各帽36L、36R之上端部。藉此,可容易地將各帽36L、36R從頂板12卸下。 When the caps 36L, 36R are respectively fitted into the second tapered hole portions 35L, 35R, the upper ends of the caps 36L, 36R protrude upward from the top plate 12 . Thereby, an operator can grasp the upper end part of each cap 36L, 36R with a clamping tool etc. FIG. Thereby, each cap 36L, 36R can be easily detached from the top plate 12. As shown in FIG.

以上為熱處理裝置1之概略構成。 The above is the schematic configuration of the heat treatment apparatus 1 .

在該熱處理裝置1之基板支撐裝置6中,在更換承載板14時,參照圖6,首先,作業人員將各帽36L、36R從頂板12卸下。接下來,作業人員藉由將移動限制構件15L、15R向上方抬起而將該等之移動限制構件15L、15R從底板11及頂板12卸下。 In the substrate supporting device 6 of the thermal processing apparatus 1 , when replacing the carrier plate 14 , referring to FIG. 6 , first, the operator removes the respective caps 36L, 36R from the top plate 12 . Next, the operator removes the movement regulating members 15L, 15R from the bottom plate 11 and the top plate 12 by lifting the movement regulating members 15L, 15R upward.

藉此,從承載板14之前方卸下移動限制構件15L、15R。在該狀態下,作業人員藉由使更換對象的承載板14相對於支撐體13朝拆卸方向X12(圖6的紙面近前側)移動而向前方拔出。然後,新被安裝於支撐體13的承載板14藉由從支撐體13之前方側朝安裝方向X11(圖6的紙面裡側)移動而被載置在支撐體13之所對應的支撐部21a、22a、23a。 Thereby, the movement restricting members 15L, 15R are detached from the front of the loading plate 14 . In this state, the operator moves the carrier plate 14 to be replaced in the detachment direction X12 (the near side of the paper surface in FIG. 6 ) with respect to the support body 13, and pulls it out forward. Then, the carrier plate 14 newly installed on the support body 13 is placed on the corresponding support portion 21a of the support body 13 by moving from the front side of the support body 13 toward the installation direction X11 (the back side of the paper in FIG. 6 ). , 22a, 23a.

接下來,移動限制構件15L、15R通過頂板12之所對應的第2錐形孔部35L、35R,進而,與底板11之所對應的第1錐形孔部33L、33R 錐形嵌合。之後,各帽36L、36R與所對應的第2錐形孔部35L、35R錐形嵌合。藉由以上的作業,可完成承載板14之更換作業。 Next, the movement restricting members 15L, 15R pass through the corresponding second tapered hole portions 35L, 35R of the top plate 12 , and then pass through the corresponding first tapered hole portions 33L, 33R of the bottom plate 11 . Conical fit. Thereafter, the respective caps 36L, 36R are taper-fitted into the corresponding second tapered hole portions 35L, 35R. Through the above operations, the replacement operation of the carrier plate 14 can be completed.

如以上所說明,根據本實施形態之基板支撐裝置6,藉由設置移動限制構件15L、15R,可抑制承載板14相對於支撐體13的位置偏移。藉此,即使振動、氣壓等之外力作用於支撐體13與承載板14之間,亦可更確實地抑制承載板14相對於支撐體13的位置偏移。藉此,可抑制承載板14從支撐體13脫落。另外,可抑制承載板14在俯視觀察時向順時針方向或逆時針方向旋轉,因此可更確實地抑制承載板14與晶圓搬送手部10等之其他構件接觸。此外,移動限制構件15L、15R被構成為針對於底板11與頂板12可裝卸。藉此,在更換破損的承載板14時,藉由將移動限制構件15L、15R從底板11及頂板12卸下,可將承載板14從支撐體13卸下。藉此,例如在更換複數個承載板14中之破損的承載板14時,可僅將破損的承載板14從支撐體13卸下。其結果為,可容易且廉價地進行承載板14之更換作業。 As described above, according to the substrate supporting device 6 of the present embodiment, the displacement of the carrier plate 14 with respect to the supporting body 13 can be suppressed by providing the movement restricting members 15L, 15R. Thereby, even if an external force such as vibration or air pressure acts between the supporting body 13 and the loading plate 14 , the positional displacement of the loading plate 14 relative to the supporting body 13 can be more reliably suppressed. Thereby, it can suppress that the carrier board 14 falls off from the support body 13. As shown in FIG. In addition, since the carrier plate 14 can be suppressed from rotating clockwise or counterclockwise in a plan view, contact between the carrier plate 14 and other members such as the wafer transfer hand 10 can be more reliably suppressed. In addition, the movement restricting members 15L and 15R are configured to be detachably attached to the bottom plate 11 and the top plate 12 . Thereby, when the damaged loading plate 14 is replaced, the loading plate 14 can be detached from the support body 13 by detaching the movement restricting members 15L, 15R from the bottom plate 11 and the top plate 12 . Thereby, for example, when replacing a damaged carrier board 14 among the plurality of carrier boards 14 , only the damaged carrier board 14 can be removed from the supporting body 13 . As a result, the replacement work of the carrier plate 14 can be performed easily and inexpensively.

另外,根據基板支撐裝置6,承載板14藉由移動限制構件15L、15R在前後方向上被定位。根據該構成,在將破損的承載板14更換為新的承載板14時,移動限制構件15L、15R對承載板14進行定位。藉此,即使在重複進行承載板14之更換作業的情況下,亦可維持基板支撐裝置6在新的狀態下的基板支撐裝置6之各部分之位置關係。藉此,與作業人員的熟練度無關而可提高伴隨著承載板14之更換作業的承載板14之定位作業之精度。藉此,可進一步減少對作業人員的教育所花費的工夫。 In addition, according to the substrate supporting device 6 , the carrier plate 14 is positioned in the front-rear direction by the movement restricting members 15L, 15R. According to this configuration, when the damaged loading plate 14 is replaced with a new loading plate 14 , the movement restricting members 15L, 15R position the loading plate 14 . Thereby, even when the replacement|exchange operation of the carrier plate 14 is repeated, the positional relationship of each part of the board|substrate support device 6 in the new state of the board|substrate support device 6 can be maintained. Thereby, regardless of the operator's proficiency, the accuracy of the positioning work of the carrier plate 14 accompanying the replacement work of the carrier plate 14 can be improved. Thereby, it is possible to further reduce the effort required for the education of the workers.

另外,根據基板支撐裝置6,雖然承載板14未被粘接至支撐體13,但取而代之,藉由設置移動限制構件15L、15R,可防止承載板14從支撐體13脫落。因此,作業人員不需要定期目視是否產生振動、氣壓等所導致的承載板14發生位置偏移而從支撐體13脫落的現象。其結果為,可進 一步延長基板支撐裝置6的維護週期(維護與維護之間的期間)。 In addition, according to the substrate supporting device 6 , although the carrier plate 14 is not bonded to the support body 13 , instead, by providing the movement restricting members 15L, 15R, the carrier plate 14 can be prevented from coming off the support body 13 . Therefore, the operator does not need to regularly visually check whether the carrier plate 14 is displaced from the support body 13 due to vibration, air pressure, or the like. As a result, it is possible to The maintenance cycle (period between maintenance and maintenance) of the substrate supporting device 6 is extended by one step.

另外,根據基板支撐裝置6,可利用柱構件21、22、23各自的梳齒狀部分(支撐部21a、22a、23a)個別地支撐複數個承載板14。而且,藉由使棒構件的移動限制構件15L、15R與該等之承載板14接觸,可抑制承載板14相對於柱21、22、23產生位置偏移。 In addition, according to the substrate support device 6 , the plurality of carrier plates 14 can be individually supported by the comb-shaped portions (support portions 21 a , 22 a , 23 a ) of the column members 21 , 22 , 23 . Furthermore, by bringing the movement restricting members 15L, 15R of the bar members into contact with these loading plates 14 , it is possible to suppress the positional displacement of the loading plate 14 relative to the columns 21 , 22 , 23 .

另外,根據基板支撐裝置6,藉由以沿著上下方向延伸的軸線為中心軸線的錐形結合而使各板11、12與移動限制構件15L、15R連結。根據該構成,可將移動限制構件15L、15R牢固且準確地固定於各板11、12。此外,藉由解除錐形結合,可容易地將移動限制構件15L、15R從各板11、12卸下。 In addition, according to the substrate supporting device 6 , the respective plates 11 , 12 are connected to the movement restricting members 15L, 15R by tapered coupling whose central axis is the axis extending in the vertical direction. According to this configuration, the movement restricting members 15L, 15R can be firmly and accurately fixed to the respective plates 11 , 12 . Furthermore, the movement restricting members 15L, 15R can be easily detached from the respective plates 11, 12 by releasing the tapered coupling.

另外,根據基板支撐裝置6,設置有下錐形結合機構16L、16R與上錐形結合機構17L、17R。根據該構成,可使被配置於支撐體13之下部的底板11與被配置於支撐體13之上部的頂板12分別與移動限制構件15L、15R錐形結合。藉此,可進一步提高移動限制構件15L、15R與各板11、12的相互之結合強度。 In addition, according to the substrate support device 6 , the lower tapered bonding mechanisms 16L, 16R and the upper tapered bonding mechanisms 17L, 17R are provided. According to this configuration, the bottom plate 11 disposed on the lower portion of the support body 13 and the top plate 12 disposed on the upper portion of the support body 13 can be taperedly coupled to the movement restricting members 15L and 15R, respectively. Thereby, the mutual bonding strength of movement restricting member 15L, 15R and each plate 11, 12 can be improved further.

另外,根據基板支撐裝置6,擋止27L、27R從基板配置部25向左右方向突出。藉此,可將擋止27L、27R配置在避開被處理基板100之通路的位置。因此,擋止27L、27R藉由與移動限制構件15L、15R的接觸來抑制承載板14之位置偏移,並且不妨礙藉由搬送手部10所進行之被處理基板100的進出動作。 In addition, according to the substrate supporting device 6 , the stoppers 27L, 27R protrude from the substrate arrangement portion 25 in the left-right direction. Thereby, the stoppers 27L, 27R can be arranged at positions avoiding the passage of the substrate 100 to be processed. Therefore, the stoppers 27L, 27R suppress the displacement of the carrier plate 14 by contacting the movement restricting members 15L, 15R, and do not hinder the movement of the substrate 100 to be processed by the transfer hand 10 .

另外,根據基板支撐裝置6,擋止27L、27R包含有第1平行部29L、29R。此外,左柱22與右柱21包含有第2平行部32L,32R。而且,相互地鄰接的第1平行部29L與第2平行部32L相互平行地延伸,並且相互地鄰接的第1平行部29R與第2平行部32R相互平行地延伸。根據該 構成,擋止27L、27R之各第1平行部29L、29R可被左右之柱22、21所對應的第2平行部32L、32R承接。藉此,可更確實地抑制承載板14相對於各柱21、22、23旋轉移動的位置偏移之產生。 In addition, according to the substrate supporting device 6 , the stoppers 27L, 27R include the first parallel portions 29L, 29R. In addition, the left column 22 and the right column 21 include second parallel portions 32L, 32R. Furthermore, the first parallel portion 29L and the second parallel portion 32L that are adjacent to each other extend parallel to each other, and the first parallel portion 29R and the second parallel portion 32R that are adjacent to each other extend parallel to each other. According to the In this configuration, the respective first parallel portions 29L, 29R of the stoppers 27L, 27R can be received by the corresponding second parallel portions 32L, 32R of the left and right columns 22, 21 . Thereby, it is possible to more reliably suppress occurrence of positional displacement of the carrier plate 14 relative to the rotational movement of the columns 21 , 22 , 23 .

以上,已對本發明之實施形態進行說明,但本發明不受限於上述之實施形態。本發明可在申請專利範圍中所記載的範圍內進行各種變更。 As mentioned above, although the embodiment of this invention was described, this invention is not limited to the said embodiment. The present invention can be modified variously within the range described in the claims.

(1)在上述實施形態中,已對在下錐形結合機構16L、16R中,以移動限制構件15L、15R之下端部被形成為凸狀並且底板11被形成為凹狀的構成為例進行說明。但是,本發明亦可不受限於此。例如,亦可為,在移動限制構件15L、15R之下端設置凹部並且在底板11設置凸部,而使該等之凸部與凹部相互地嵌合,從而使移動限制構件15L、15R與底板11以可拆卸的方式結合。另外,移動限制構件15L、15R與各板11、12亦可藉由錐形結合以外之螺絲連結構造等而被結合。 (1) In the above-mentioned embodiment, in the lower tapered coupling mechanisms 16L, 16R, the lower ends of the movement restricting members 15L, 15R are formed in a convex shape and the bottom plate 11 is formed in a concave shape as an example. . However, the present invention is not limited thereto. For example, it is also possible to provide a concave portion at the lower end of the movement limiting members 15L, 15R and a convex portion on the bottom plate 11, and make these convex portions and concave portions fit mutually so that the movement limiting members 15L, 15R and the bottom plate 11 combined in a detachable manner. In addition, the movement restricting members 15L, 15R and the respective plates 11, 12 may be connected by a screw connection structure other than the tapered connection, or the like.

(2)另外,在上述的實施形態中,雖已以基板支撐裝置6具有各種構件的構成為例進行說明。但是,基板支撐裝置6只要至少具有承載板14、支撐體13、各板11、12中的任一者及移動限制構件15L、15R中之任一者即可。 (2) In addition, in the above-mentioned embodiment, the structure which the board|substrate support apparatus 6 has various members was demonstrated as an example. However, the board|substrate support apparatus 6 should just have at least any one of the loading plate 14, the support body 13, each plate 11, 12, and the movement restriction member 15L, 15R.

(產業上之可利用性) (industrial availability)

本發明可適用於基板支撐裝置。 The present invention is applicable to substrate support devices.

10:搬送手部 10: Moving hands

11:底板(基部板) 11: Bottom plate (base plate)

13:支撐體 13: Support body

14:承載板 14: Loading board

15L:移動限制構件 15L: Movement limiting member

15R:移動限制構件 15R: Movement limiting member

21:柱構件 21: column member

21a:支撐部 21a: support part

21b:凹部 21b: concave part

22:柱構件 22: column member

22a:支撐部 22a: support part

22b:凹部 22b: concave part

23:柱構件 23: column member

23a:支撐部 23a: support part

23b:凹部 23b: concave part

25:基板配置部 25: Substrate configuration department

25a:外周緣部 25a: Outer peripheral edge

26:切口部 26: Incision

27L:擋止 27L: stop

27R:擋止 27R: stop

28L:前端部 28L: Front end

28R:前端部 28R: front end

29L:第1平行部 29L: 1st Parallel Section

29R:第1平行部 29R: 1st Parallel Section

30L:左側前部 30L: left front

30R:右側前部 30R: right front

32L:第2平行部 32L: 2nd Parallel Section

32R:第2平行部 32R: 2nd Parallel Section

100:被處理基板 100: processed substrate

X1:裝卸方向 X1: loading and unloading direction

X11:安裝方向 X11: Installation direction

X12:拆卸方向 X12: Removal direction

Claims (6)

一種基板支撐裝置,其特徵在於,其具備有:複數個承載板,其等分別載置被處理基板;支撐體,其具有使支撐複數個上述承載板的複數個支撐部沿著縱向排列的構成,並且構成為藉由使上述承載板沿著與上述縱向交叉的既定之裝卸方向移動而使上述承載板可裝卸於所對應的上述支撐部;基部板,其被固定有上述支撐體;及移動限制構件,其被設置為用於允許上述被處理基板相對於上述承載板的進出且限制各上述承載板相對於上述支撐體進行移動,並且,為了裝卸上述承載板於上述支撐體,該移動限制構件可自上述基部板裝卸;設置有頂板作為上述基部板,該頂板被配置在上述縱向的上述支撐體之上端,更進一步具備有上錐形結合機構,該上錐形結合機構係藉由以沿著上述縱向延伸的軸線為中心軸線的錐形結合而連結上述移動限制構件與上述頂板。 A substrate supporting device, characterized in that it includes: a plurality of carrier plates on which substrates to be processed are placed; , and is configured to make the above-mentioned carrying plate detachable to the corresponding support portion by moving the above-mentioned carrying plate along a predetermined loading and unloading direction intersecting with the above-mentioned longitudinal direction; the base plate, which is fixed with the above-mentioned support body; and moves a restricting member configured to allow the substrate to be processed to enter and exit relative to the carrier plate and to restrict the movement of each of the carrier plates relative to the support body, and to attach and detach the carrier plate to the support body, the movement restriction The components can be attached and detached from the above-mentioned base plate; a top plate is provided as the above-mentioned base plate. The movement limiting member and the top plate are connected by a taper joint along the axis extending in the longitudinal direction as the central axis. 如請求項1之基板支撐裝置,其中,上述支撐體包含有被配置為相互地分離且沿著上述縱向延伸的複數個柱構件,藉由各上述柱構件被形成為沿著上述縱向的梳齒狀而形成複數個上述支撐部,上述移動限制構件包含有沿著上述縱向延伸且可與各上述承載板接觸的棒構件。 The substrate supporting device according to claim 1, wherein the support includes a plurality of pillar members arranged to be separated from each other and extend along the longitudinal direction, and each of the pillar members is formed as comb teeth along the longitudinal direction A plurality of the above-mentioned supporting parts are formed in a shape, and the above-mentioned movement restricting member includes a rod member extending along the above-mentioned longitudinal direction and capable of contacting each of the above-mentioned carrier plates. 如請求項1之基板支撐裝置,其中,上述上錐形結合機構包含有帽、及被形成於上述頂板的錐形孔部, 上述帽具有錐形軸部與插入孔部,該錐形軸部係被形成於上述帽之外周面,且被構成為可裝卸於上述錐形孔部,並錐形嵌合於上述錐形孔部,該插入孔部係被形成於上述帽之內周面,且插入有上述移動限制構件。 The substrate supporting device according to claim 1, wherein the upper tapered coupling mechanism includes a cap and a tapered hole formed on the top plate, The cap has a tapered shaft portion and an insertion hole portion, the tapered shaft portion is formed on the outer peripheral surface of the cap, is configured to be detachable from the tapered hole portion, and is taper-fitted into the tapered hole An insertion hole portion is formed in the inner peripheral surface of the cap, and the movement restricting member is inserted thereinto. 如請求項1之基板支撐裝置,其中,更進一步設置有底板作為上述基部板,該底板被配置在上述縱向的上述支撐體之下端,該基板支撐裝置更具有:下錐形結合機構,其錐形結合上述移動限制構件與上述底板。 The substrate supporting device according to claim 1, wherein a bottom plate is further provided as the base plate, and the bottom plate is arranged at the lower end of the above-mentioned supporting body in the above-mentioned longitudinal direction, and the substrate supporting device further has: a lower tapered joint mechanism, the The above-mentioned movement restricting member and the above-mentioned base plate are formed together. 如請求項1至4中任一項之基板支撐裝置,其中,上述承載板包含有:基板配置部,其用於配置上述被處理基板;及擋止,其在與上述裝卸方向交叉的既定之寬度方向從上述基板配置部突出並延伸,且被上述移動限制構件承接。 The substrate supporting device according to any one of claims 1 to 4, wherein the carrier plate includes: a substrate arrangement part for arranging the substrate to be processed; The width direction protrudes and extends from the substrate arrangement portion, and is received by the movement restricting member. 如請求項5之基板支撐裝置,其中,上述擋止在上述寬度方向分離地設置有一對,各上述擋止包含有第1平行部,上述支撐體包含有可與一對上述第1平行部接觸的一對第2平行部,相互地鄰接的上述第1平行部與上述第2平行部相互平行地延伸。The substrate supporting device according to claim 5, wherein a pair of the stoppers are provided separately in the width direction, each of the stoppers includes a first parallel portion, and the support body includes a pair of first parallel portions that can be in contact with the pair of first parallel portions. A pair of second parallel portions, the first parallel portion and the second parallel portion adjacent to each other extend parallel to each other.
TW109104436A 2019-02-21 2020-02-13 Substrate support device TWI798529B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-029750 2019-02-21
JP2019029750A JP7245071B2 (en) 2019-02-21 2019-02-21 Substrate support device

Publications (2)

Publication Number Publication Date
TW202032714A TW202032714A (en) 2020-09-01
TWI798529B true TWI798529B (en) 2023-04-11

Family

ID=72181416

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110108558A TWI767603B (en) 2019-02-21 2020-02-13 Substrate support device
TW109104436A TWI798529B (en) 2019-02-21 2020-02-13 Substrate support device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110108558A TWI767603B (en) 2019-02-21 2020-02-13 Substrate support device

Country Status (4)

Country Link
JP (1) JP7245071B2 (en)
KR (4) KR102405737B1 (en)
CN (1) CN111599735B (en)
TW (2) TWI767603B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102377867B1 (en) 2020-08-14 2022-03-24 엘티소재주식회사 Organic light emitting device, and composition for formation of organic material layer
TWI775493B (en) * 2021-06-15 2022-08-21 力晶積成電子製造股份有限公司 Wafer boat cassette with twisting knobs
CN115621181A (en) * 2021-07-13 2023-01-17 盛美半导体设备(上海)股份有限公司 Turning device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144616A (en) * 1996-11-12 1998-05-29 Tekunisuko:Kk Semiconductor wafer supporting port
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
JP2002343730A (en) * 2001-05-11 2002-11-29 Shinetsu Quartz Prod Co Ltd Upright wafer support jig
US20050042568A1 (en) * 2001-12-27 2005-02-24 Shinji Irie Boat for heat treatment and vertical heat treatment equipment
JP2005209875A (en) * 2004-01-22 2005-08-04 Asahi Kasei Microsystems Kk Wafer boat
TW201128734A (en) * 2009-08-05 2011-08-16 Applied Materials Inc CVD apparatus
TW201238416A (en) * 2010-11-05 2012-09-16 Apple Inc Curved touch sensor
TW201401464A (en) * 2012-06-20 2014-01-01 Zhen Ding Technology Co Ltd Package substrate, method for manufacturing same, and package structure
TW201725645A (en) * 2015-10-15 2017-07-16 應用材料股份有限公司 Substrate carrier system
TW201830551A (en) * 2016-11-18 2018-08-16 美商應用材料股份有限公司 Hybrid substrate carrier

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2566340B2 (en) * 1990-11-19 1996-12-25 東芝セラミックス株式会社 Method for manufacturing silicon wafer support boat
JPH0562716U (en) * 1992-02-03 1993-08-20 株式会社ハーモニック・ドライブ・システムズ Fastening device
JPH07292914A (en) * 1994-04-26 1995-11-07 Sekisui Chem Co Ltd Joint structure
JP3388668B2 (en) * 1996-02-29 2003-03-24 東京エレクトロン株式会社 Heat treatment boat and vertical heat treatment equipment
KR980008674U (en) * 1996-07-27 1998-04-30 양재신 Bolted structure for improved assembly
JP3469000B2 (en) 1996-08-02 2003-11-25 三井造船株式会社 Vertical wafer support device
JP3484027B2 (en) * 1996-12-24 2004-01-06 新明和工業株式会社 Flat plate unloading device
JP2003237587A (en) 2002-02-19 2003-08-27 T S Tec Kk Device of mounting steering wheel for vehicle
KR100491161B1 (en) * 2002-11-26 2005-05-24 주식회사 테라세미콘 Semiconductor manufacturing system for thermal process
JP4150963B2 (en) * 2003-02-07 2008-09-17 株式会社ダイフク Supported layer stacking support device
JP4506125B2 (en) * 2003-07-16 2010-07-21 信越半導体株式会社 Vertical boat for heat treatment and manufacturing method thereof
JP2005218230A (en) * 2004-01-29 2005-08-11 I-Pex Co Ltd Jig for aligning wire
JP2008053307A (en) * 2006-08-22 2008-03-06 Toshiba Matsushita Display Technology Co Ltd Substrate storing device and substrate processing device equipped therewith
US7661544B2 (en) * 2007-02-01 2010-02-16 Tokyo Electron Limited Semiconductor wafer boat for batch processing
JP4313401B2 (en) * 2007-04-24 2009-08-12 東京エレクトロン株式会社 Vertical heat treatment apparatus and substrate transfer method
JP5042950B2 (en) * 2008-09-05 2012-10-03 東京エレクトロン株式会社 Vertical heat treatment apparatus and substrate support
JP2010147386A (en) * 2008-12-22 2010-07-01 Lintec Corp Transport device and transport method
JP5361805B2 (en) * 2010-06-15 2013-12-04 信越ポリマー株式会社 Substrate storage container
US10242897B2 (en) * 2015-12-14 2019-03-26 Solarcity Corporation Micro-environment container for photovoltaic cells
CN206658998U (en) * 2017-02-13 2017-11-24 湖北省农业科学院果树茶叶研究所 A kind of full-automatic brick tea former
JP6846993B2 (en) * 2017-06-19 2021-03-24 東京エレクトロン株式会社 Substrate holder and substrate processing device using it
JP6378403B2 (en) * 2017-06-21 2018-08-22 光洋サーモシステム株式会社 Substrate support structure

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
JPH10144616A (en) * 1996-11-12 1998-05-29 Tekunisuko:Kk Semiconductor wafer supporting port
JP2002343730A (en) * 2001-05-11 2002-11-29 Shinetsu Quartz Prod Co Ltd Upright wafer support jig
US20050042568A1 (en) * 2001-12-27 2005-02-24 Shinji Irie Boat for heat treatment and vertical heat treatment equipment
JP2005209875A (en) * 2004-01-22 2005-08-04 Asahi Kasei Microsystems Kk Wafer boat
TW201128734A (en) * 2009-08-05 2011-08-16 Applied Materials Inc CVD apparatus
TW201238416A (en) * 2010-11-05 2012-09-16 Apple Inc Curved touch sensor
TW201401464A (en) * 2012-06-20 2014-01-01 Zhen Ding Technology Co Ltd Package substrate, method for manufacturing same, and package structure
TW201725645A (en) * 2015-10-15 2017-07-16 應用材料股份有限公司 Substrate carrier system
TW201830551A (en) * 2016-11-18 2018-08-16 美商應用材料股份有限公司 Hybrid substrate carrier

Also Published As

Publication number Publication date
JP7245071B2 (en) 2023-03-23
KR102405737B1 (en) 2022-06-07
KR102407657B1 (en) 2022-06-10
TW202032714A (en) 2020-09-01
TW202135222A (en) 2021-09-16
KR20210124116A (en) 2021-10-14
KR20210097086A (en) 2021-08-06
CN111599735A (en) 2020-08-28
JP2020136538A (en) 2020-08-31
KR20200102343A (en) 2020-08-31
CN111599735B (en) 2023-08-15
KR20210075935A (en) 2021-06-23
KR102308761B1 (en) 2021-10-05
TWI767603B (en) 2022-06-11

Similar Documents

Publication Publication Date Title
TWI798529B (en) Substrate support device
JP4467028B2 (en) Vertical wafer support jig
JP5316689B1 (en) Positioning jig and position adjusting method
KR100815640B1 (en) Method of assembling substrate transfer device and transfer system unit for the same
KR20070118546A (en) Transfer system unit for substrate transfer device
US8677925B2 (en) Chamber and film forming apparatus
US20040085038A1 (en) Robot arm mechanism
JPH09237781A (en) Heat treatment boat
KR20090114031A (en) Unit for mounting hood of car manufacturing line and control method of the same
RU2745394C1 (en) Suspension apparatus, suspension method for optic fiber preform and method of manufacture of optic fiber
KR100929022B1 (en) Jig and Buffer System Containing It
KR102615719B1 (en) Automatic panel bolting system and panel bolting method
JP2018062434A (en) Method and structure for attaching roller
KR102195400B1 (en) Ladle device for pouring of molten metal
EP4353395A1 (en) Method for manufacturing joined body, and joining device
TWM588355U (en) Cassette for thin substrate
JP2023043846A (en) Hardware automatic fastening apparatus
JP2007005430A (en) Heat treatment apparatus
JP2005144636A (en) Clip installing device
WO2018150587A1 (en) Processing apparatus
JPH0142341Y2 (en)
KR100575450B1 (en) Fork plate arrangement tool and apparatus for transfer a semiconductor substrate having the same
FR3120613A1 (en) Process for manufacturing a container for packaging a plurality of parts and container obtained by this process
KR20190036395A (en) Nut runner, and camcap assembly device having the same and replacement method of the same
JPH1015755A (en) Automatic assembling method and part inserting device for cathode ray tube