TWI767603B - Substrate support device - Google Patents

Substrate support device Download PDF

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Publication number
TWI767603B
TWI767603B TW110108558A TW110108558A TWI767603B TW I767603 B TWI767603 B TW I767603B TW 110108558 A TW110108558 A TW 110108558A TW 110108558 A TW110108558 A TW 110108558A TW I767603 B TWI767603 B TW I767603B
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Taiwan
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substrate
carrier plate
plate
movement restricting
support
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TW110108558A
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Chinese (zh)
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TW202135222A (en
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福西勇太
小野寺勝也
西岡昌浩
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日商光洋熱系統股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Thin Film Transistor (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)

Abstract

本案發明提供一種基板支撐裝置,在具有用於支撐被處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且可容易且廉價地進行承載板的更換作業。 The present invention provides a substrate support device having a carrier plate for supporting a substrate to be processed, which can reliably suppress positional displacement of the carrier plate relative to a support body that supports the carrier plate, and can easily and inexpensively Carry out the replacement work of the carrier plate.

基板支撐裝置6具有:承載板14,其載置被處理基板100;支撐體13,其藉由使承載板14沿著裝卸方向X1移動而可裝卸承載板14;板11、12,其被固定有支撐體13;及移動限制構件15L、15R。移動限制構件15L、15R係被設置成為了允許被處理基板100相對於承載板14進出而限制承載板14相對於支撐體13進行移動,並且,為了於支撐體13裝卸承載板14,移動限制構件15L、15R可自板11、12裝卸。 The substrate support device 6 includes: a carrier plate 14 on which the substrate to be processed 100 is placed; a support body 13 which can be attached to and detached from the carrier plate 14 by moving the carrier plate 14 in the attaching and detaching direction X1; and plates 11 and 12 which are fixed There are a support body 13; and movement restricting members 15L, 15R. The movement restricting members 15L and 15R are provided so as to allow the substrate to be processed 100 to move in and out with respect to the carrier plate 14 and restrict the movement of the carrier plate 14 relative to the support body 13 . 15L and 15R can be attached and detached from the plates 11 and 12 .

Description

基板支撐裝置 Substrate support device

本發明關於一種基板支撐裝置。 The present invention relates to a substrate supporting device.

習知有用於對半導體晶圓進行熱處理的裝置(例如,參照專利文獻1)。於專利文獻1所記載的裝置係縱型晶圓支撐裝置。該裝置具有如下構成:在複數個支柱之側面設置有突起,並在該等突起上載置晶圓支撐環。在晶圓支撐環上載置矽晶圓。 There is known an apparatus for heat-treating a semiconductor wafer (for example, refer to Patent Document 1). The apparatus described in Patent Document 1 is a vertical wafer support apparatus. The apparatus has the following configuration: protrusions are provided on the side surfaces of a plurality of pillars, and a wafer support ring is placed on the protrusions. The silicon wafer is placed on the wafer support ring.

[先前技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

專利文獻1:日本專利特開平10-50626號公報 Patent Document 1: Japanese Patent Laid-Open No. 10-50626

但是,在半導體熱處理製程中,存在有對Fan-Out晶圓(扇出晶圓)進行退火處理等用於矯正樹脂基板之翹曲的退火處理。在如此的半導體熱處理製程中,需要有對晶圓之下表面進行支撐的承載板(基板支撐板)。而且,在分批式熱處理裝置中,為了對複數片晶圓一次熱處理,而需要設置有複數個承載板。另外,在專利文獻1中,沒有具體地揭示如何將支柱與晶圓支撐環固定。 However, in the semiconductor heat treatment process, there is an annealing treatment for correcting the warpage of the resin substrate, such as annealing treatment of a Fan-Out wafer (fan-out wafer). In such a semiconductor heat treatment process, a carrier plate (substrate support plate) for supporting the lower surface of the wafer is required. Furthermore, in a batch type heat treatment apparatus, in order to heat-process a plurality of wafers at one time, it is necessary to provide a plurality of carrier plates. In addition, Patent Document 1 does not specifically disclose how to fix the pillars and the wafer support ring.

另一方面,作為將承載板安裝於支柱的方法,可舉出如下方法:(1)將承載板插入至分別形成於複數個支柱的槽,利用支柱對承載板之 外周緣部進行支撐;(2)將承載板焊接固定於複數個支柱。 On the other hand, as a method of attaching the carrier plate to the pillar, the following method is exemplified: (1) The carrier board is inserted into the grooves formed in each of the plurality of pillars, and the carrier plate is connected to the carrier plate by the pillar. The outer peripheral portion is supported; (2) the carrier plate is welded and fixed to a plurality of pillars.

其中,在上述(1)的方法中,在長期使用熱處理裝置的基板支撐裝置時,振動、氣壓等之外力會使承載板相對於支柱產生位置偏移,而存在有承載板從支柱脫落之虞。另外,因上述之外力會使承載板相對於支柱於俯視觀察時朝順時針之方向或逆時針之方向旋轉,從而存在有晶圓搬送手部等與承載板接觸之虞。 Among them, in the method of (1) above, when the substrate support device of the heat treatment apparatus is used for a long time, the external force such as vibration and air pressure will cause the positional displacement of the carrier plate relative to the support column, and there is a possibility that the support plate will fall off from the support column. . In addition, due to the above-mentioned external force, the carrier plate is rotated clockwise or counterclockwise with respect to the support column in plan view, and there is a possibility that the wafer transfer hand or the like comes into contact with the carrier plate.

在上述(2)方法的情況,不會產生承載板相對於支柱的位置偏移。但是,假設一個承載板破損的情況,則亦需要更換包含有支柱及複數個承載板的基板支撐裝置整體。因此,需要在半導體製造工廠中預先保管基板支撐裝置的備品,因此對半導體製造工廠之費用上的負擔變大。另外,即使在對承載板破損的晶舟進行修理的情況,除了新承載板的構件費用之外,亦需要焊接加工費,不僅修理花費工夫,並且費用負擔亦變大。 In the case of the above-mentioned method (2), positional displacement of the carrier plate with respect to the support column does not occur. However, if one carrier plate is damaged, it is also necessary to replace the entire substrate support device including the support column and the plurality of carrier plates. Therefore, it is necessary to store the spare parts of the substrate support device in the semiconductor manufacturing plant in advance, and thus the burden on the cost of the semiconductor manufacturing plant increases. In addition, in the case of repairing a wafer boat with a damaged carrier plate, in addition to the component cost of a new carrier plate, a welding processing cost is required, which not only takes time for the repair, but also increases the cost burden.

鑒於上述情況,本發明的目的在於,在具備用來支撐晶圓等之處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且可容易且廉價地進行承載板的更換作業者。 In view of the above-mentioned circumstances, an object of the present invention is to, in a substrate support apparatus including a carrier plate for supporting processing substrates such as wafers, can reliably suppress the positional displacement of the carrier plate with respect to a support body that supports the carrier plate, and The replacement operator of the carrier plate can be performed easily and inexpensively.

(1)為了解決上述課題,本發明的一個態樣的基板支撐裝置具備有:複數個承載板,其等分別載置被處理基板;支撐體,其具有使支撐複數個上述承載板的複數個支撐部沿著縱向排列的構成,並且構成為藉由使上述承載板沿著與上述縱向交叉的既定之裝卸方向移動而使上述承載板可裝卸所對應的上述支撐部;基部板,其被固定有上述支撐體;及移動限制構件,其被設置為用於允許上述被處理基板相對於上述承載板的進出且限制各上述承載板相對於上述支撐體進行移動,並且,為了裝卸上述承載板於上述支撐體,該移動限制構件可自上述基部板裝卸。 (1) In order to solve the above-mentioned problems, a substrate support apparatus according to an aspect of the present invention includes a plurality of carrier plates on which the substrates to be processed are placed, respectively, and a support body having a plurality of carrier plates for supporting the plurality of carrier plates. The supporting parts are arranged in the longitudinal direction, and the supporting parts corresponding to the supporting parts can be attached and detached by moving the supporting plate in a predetermined attaching and detaching direction crossing the longitudinal direction; the base plate is fixed The supporting body is provided; and a movement restricting member is provided for allowing the substrate to be processed to enter and exit with respect to the carrier plate and for restricting the movement of each of the carrier plates relative to the support body, and for attaching and detaching the carrier plate to a In the above-mentioned support body, the movement restricting member is detachable from the above-mentioned base plate.

根據該構成,藉由設置有移動限制構件,可抑制承載板相對於支撐體的位置偏移。藉此,即使振動、氣壓等之外力作用於支撐體與承載板之間,亦可更確實地抑制承載板相對於支撐體的位置偏移。藉此,可抑制承載板從支撐體脫落。另外,可抑制承載板於俯視觀察時順時針之方向或逆時針之方向的旋轉,因此可更確實地抑制承載板與晶圓搬送手部等之其他構件產生接觸。此外,移動限制構件被構成為可自基部板裝卸。藉此,在更換破損的承載板時,可藉由將移動限制構件從基部板卸下而將承載板從支撐體卸下。藉此,例如,在更換複數個承載板中之破損的承載板時,可僅將破損的承載板從支撐體卸下。其結果,可容易且廉價地進行承載板的更換作業。 According to this configuration, by providing the movement restricting member, positional displacement of the carrier plate with respect to the support body can be suppressed. Thereby, even if an external force such as vibration and air pressure acts between the support body and the carrier plate, the positional displacement of the carrier plate with respect to the support body can be suppressed more reliably. Thereby, the carrier plate can be suppressed from falling off from the support body. In addition, since the rotation of the carrier plate in the clockwise direction or the counterclockwise direction in plan view can be suppressed, the carrier plate can be more reliably prevented from coming into contact with other members such as the wafer transfer hand. Further, the movement restricting member is configured to be detachable from the base plate. Thereby, when the damaged carrier plate is replaced, the carrier plate can be detached from the support body by detaching the movement restricting member from the base plate. Thereby, for example, when replacing a damaged carrier plate among a plurality of carrier plates, only the damaged carrier plate can be removed from the support body. As a result, the replacement work of the carrier plate can be performed easily and inexpensively.

(2)存在有以下之狀況:上述支撐體包含有被配置為相互地分離且沿著上述縱向延伸的複數個柱構件,藉由各上述柱構件被形成為沿著上述縱向的梳齒狀而形成有複數個上述支撐部,上述移動限制構件包含有沿著上述縱向延伸且可與各上述承載板接觸的棒構件。 (2) There is a situation in which the support body includes a plurality of column members arranged to be separated from each other and extending along the vertical direction, and each of the column members is formed in a comb-like shape along the vertical direction. A plurality of the above-mentioned support portions are formed, and the above-mentioned movement restricting member includes a rod member that extends along the above-mentioned longitudinal direction and can be brought into contact with each of the above-mentioned carrier plates.

根據該構成,可利用柱構件之梳齒狀部分個別地支撐複數個承載板。而且,藉由棒構件與該等承載板接觸,可抑制承載板相對於柱構件產生位置偏移。 According to this configuration, a plurality of carrier plates can be individually supported by the comb-shaped portion of the column member. Moreover, by the rod member being in contact with the carrier plates, positional displacement of the carrier plates with respect to the column members can be suppressed.

(3)存在有以下之狀況:上述基部板及上述移動限制構件藉由以沿著上述縱向延伸的軸線為中心軸線的錐形結合而被連結。 (3) There is a situation in which the base plate and the movement restricting member are connected by a taper coupling having an axis extending along the longitudinal direction as a central axis.

根據該構成,可將移動限制構件牢固地固定於基部板且在正確的位置上。此外,藉由解除錐形結合而可容易地將移動限制構件從基部板卸下。 According to this configuration, the movement restricting member can be firmly fixed to the base plate at a correct position. Furthermore, the movement restricting member can be easily detached from the base plate by releasing the taper coupling.

(4)存在有以下之狀況:設置有底板與頂板作為上述基部板,該底板被配置在上述縱向上的上述支撐體之下端,該頂板被配置在上述縱向的上述支撐體之上端,該基板支撐裝置更具有:第1錐形結合機構,其錐形 結合上述移動限制構件與上述底板;及第2錐形結合機構,其錐形結合上述移動限制構件與上述頂板。 (4) There is a situation in which a bottom plate and a top plate are provided as the base plate, the bottom plate is disposed at the lower end of the support body in the longitudinal direction, the top plate is disposed at the upper end of the support body in the longitudinal direction, and the base plate is disposed. The support device further has: a first conical coupling mechanism whose conical The movement restricting member and the bottom plate are coupled together; and a second taper coupling mechanism that tapers the movement restricting member and the top plate.

根據該構成,可使被配置於支撐體之下部的底板與被配置於支撐體之上部的頂板的各者與移動限制構件錐形結合。藉此,可進一步提高移動限制構件與基部板(底板與頂板)之相互的結合強度。 According to this configuration, each of the bottom plate arranged on the lower part of the support body and the top plate arranged on the upper part of the support body can be taperedly coupled to the movement restricting member. Thereby, the mutual bonding strength of the movement restricting member and the base plate (the bottom plate and the top plate) can be further improved.

(5)存在有以下之狀況:上述承載板包含有:基板配置部,其用於配置上述被處理基板;及擋止,其在與上述裝卸方向交叉的既定之寬度方向從上述基板配置部突出並延伸,且被上述移動限制構件所承接。 (5) There is a case where the carrier plate includes: a substrate arrangement part for arranging the substrate to be processed; and a stopper that protrudes from the substrate arrangement part in a predetermined width direction intersecting with the attachment and detachment direction and extends, and is received by the movement restricting member.

根據該構成,擋止從基板配置部於寬度方向突出。藉此,可將擋止配置於避開被處理基板之通路的位置。藉此,擋止藉由與移動限制構件接觸來抑制承載板的位置偏移,並且不妨礙被處理基板的進出動作。 According to this configuration, the stopper protrudes from the substrate arrangement portion in the width direction. Thereby, the stopper can be arranged at a position avoiding the passage of the substrate to be processed. Thereby, the positional displacement of the carrier plate is suppressed by the stopper being in contact with the movement restricting member, and the moving in and out of the substrate to be processed is not hindered.

(6)存在有以下之狀況:上述擋止在上述寬度方向分離地設置有一對,各上述擋止包含有第1平行部,上述支撐體包含有可與一對上述第1平行部接觸的一對第2平行部,相互地鄰接的上述第1平行部與上述第2平行部相互平行地延伸。 (6) There is a situation in which a pair of the stoppers are provided apart from each other in the width direction, each of the stoppers includes a first parallel portion, and the support body includes a pair of the first parallel portions that can be brought into contact with each other. Regarding the second parallel portion, the first parallel portion and the second parallel portion adjacent to each other extend parallel to each other.

根據該構成,可使擋止之各第1平行體被支撐部之所對應的第2平行部所承接。藉此,可更確實地抑制承載板相對於支撐體進行旋轉移動的位置偏移之產生。 According to this structure, each 1st parallel body which stops can be received by the corresponding 2nd parallel part of a support part. Thereby, the occurrence of positional deviation of the rotational movement of the carrier plate relative to the support body can be suppressed more reliably.

根據本發明,在具備有用於支撐被處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且容易且廉價地進行承載板的更換作業。 According to the present invention, in the substrate support apparatus including the carrier plate for supporting the substrate to be processed, positional displacement of the carrier plate with respect to the support body supporting the carrier plate can be reliably suppressed, and replacement of the carrier plate can be performed easily and inexpensively Operation.

1:熱處理裝置 1: Heat treatment device

2:底板 2: Bottom plate

3:加熱器 3: Heater

4:腔室 4: Chamber

5:底部凸緣 5: Bottom flange

6:基板支撐裝置 6: Substrate support device

7:升降機構 7: Lifting mechanism

8:密封構件 8: Sealing member

9:密封構件 9: Sealing member

10:搬送手部 10: Transfer the hand

11:底板(基部板) 11: Bottom plate (base plate)

12:頂板(基部板) 12: Top plate (base plate)

13:支撐體 13: Support body

14:承載板 14: Carrier plate

15a:上端部 15a: upper end

15b:下端部 15b: lower end

15c:中間部 15c: Middle part

15L:移動限制構件 15L: Movement limiting member

15R:移動限制構件 15R: Movement limiting member

16L:第1錐形結合機構 16L: 1st conical coupling mechanism

16R:第1錐形結合機構 16R: 1st conical coupling mechanism

17L:第2錐形結合機構 17L: The second conical coupling mechanism

17R:第2錐形結合機構 17R: 2nd conical coupling mechanism

21:柱構件 21: Column member

21a:支撐部 21a: Support part

21b:凹部 21b: Recess

22:柱構件 22: Column member

22a:支撐部 22a: Support part

22b:凹部 22b: Recess

23:柱構件 23: Column member

23a:支撐部 23a: Support part

23b:凹部 23b: Recess

25:基板配置部 25: Substrate configuration section

25a:外周緣部 25a: Outer peripheral edge

26:切口部 26: Incision part

27L:擋止 27L: stop

27R:擋止 27R: stop

28L:前端部 28L: Front end

28R:前端部 28R: Front end

29L:第1平行部 29L: 1st parallel part

29R:第1平行部 29R: Parallel Part 1

30L:左側前部 30L: Left front

30R:右側前部 30R: Right Front

32L:第2平行部 32L: 2nd parallel part

32R:第2平行部 32R: 2nd parallel part

33L:左側第1錐形孔部 33L: 1st taper hole on the left

33R:右側第1錐形孔部 33R: Right side 1st tapered hole

34L:左側第1錐形軸部 34L: Left 1st tapered shaft

34R:右側第1錐形軸部 34R: Right side 1st tapered shaft

35L:左側第2錐形孔部 35L: The second taper hole on the left

35R:右側第2錐形孔部 35R: Right second taper hole

36L:左帽 36L: Left cap

36R:右帽 36R: Right cap

37L:左側第2錐形軸部 37L: Left 2nd tapered shaft

37R:右側第2錐形軸部 37R: Right side 2nd tapered shaft

38L:左側插入孔部 38L: Left insertion hole

38R:右側插入孔部 38R: Right insertion hole

100:被處理基板 100: substrate to be processed

X1:裝卸方向 X1: Loading and unloading direction

X11:安裝方向 X11: Installation direction

X12:拆卸方向 X12: Disassembly direction

θ1:第1錐角 θ1: 1st taper angle

θ2:第2錐角 θ2: 2nd taper angle

圖1係本發明之一實施形態之熱處理裝置的剖面圖,顯示從側方觀察包含有基板支撐裝置的熱處理裝置的狀態。 FIG. 1 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention, showing a state of the heat treatment apparatus including a substrate support apparatus as viewed from the side.

圖2係載置有複數個被處理基板的狀態之基板支撐裝置的前視圖。 FIG. 2 is a front view of the substrate support apparatus in a state where a plurality of substrates to be processed are placed.

圖3係放大於圖2所顯示的基板支撐裝置之中間部分的局部剖面圖,顯示省略移動限制構件的狀態。 FIG. 3 is a partial cross-sectional view enlarged in the middle part of the substrate supporting device shown in FIG. 2 , showing a state in which the movement restricting member is omitted.

圖4係沿著圖2、圖3之IV-IV線的剖面圖,顯示俯視觀察基板支撐裝置的狀態。 FIG. 4 is a cross-sectional view taken along the line IV-IV of FIGS. 2 and 3 , showing the state of the substrate support device viewed from above.

圖5係放大於圖2所顯示的基板支撐裝置之上部及下部的主要部分的剖面圖。 FIG. 5 is an enlarged cross-sectional view of the main part of the upper and lower parts of the substrate supporting device shown in FIG. 2 .

圖6係用於對承載板之更換作業進行說明的圖,以省略一部分的方式顯示基板支撐裝置被分解的狀態。 FIG. 6 is a diagram for explaining the replacement operation of the carrier plate, and shows a state in which the substrate support device is disassembled with a part omitted.

以下,參照附圖,對用於實施本發明的形態進行說明。 Hereinafter, embodiments for implementing the present invention will be described with reference to the accompanying drawings.

圖1係本發明之一個實施形態的熱處理裝置1之剖面圖,顯示從側方觀察包含有基板支撐裝置6的熱處理裝置1的狀態。參照圖1,熱處理裝置1構成為可對被處理基板100實施熱處理。作為該熱處理之一例,可舉出退火處理。另外,在熱處理裝置1所進行的熱處理亦可為退火處理以外的其他之一般熱處理。被處理基板100例如Fan-Out晶圓,在本實施形態中形成為圓盤狀。 1 is a cross-sectional view of a heat treatment apparatus 1 according to an embodiment of the present invention, showing a state of the heat treatment apparatus 1 including the substrate support apparatus 6 viewed from the side. Referring to FIG. 1 , a heat treatment apparatus 1 is configured to perform heat treatment on a substrate 100 to be processed. An example of this heat treatment includes annealing treatment. In addition, the heat treatment performed in the heat treatment apparatus 1 may be other general heat treatment other than the annealing treatment. The substrate 100 to be processed, for example, a Fan-Out wafer, is formed in a disk shape in this embodiment.

熱處理裝置1具有底板2、加熱器3、腔室4、底部凸緣5、被安裝於底部凸緣5的基板支撐裝置6及升降機構7。 The heat treatment apparatus 1 includes a base plate 2 , a heater 3 , a chamber 4 , a bottom flange 5 , a substrate support device 6 and a lift mechanism 7 attached to the bottom flange 5 .

作為對加熱器3及腔室4進行支撐的構件設置有底板2。在底板2之中央,形成有貫通孔。以從上方封閉該貫通孔之方式配置有加熱器3。加熱器3係例如電熱加熱器,整體形成為箱狀,具有向下開放的形狀。在被 加熱器3所包圍的空間中配置有腔室4。 A bottom plate 2 is provided as a member that supports the heater 3 and the chamber 4 . A through hole is formed in the center of the base plate 2 . The heater 3 is arranged so as to close the through hole from above. The heater 3 is, for example, an electrothermal heater, and is formed in a box shape as a whole and has a shape opened downward. being The chamber 4 is arranged in the space surrounded by the heater 3 .

腔室4形成用於對被處理基板100進行熱處理的處理室。腔室4整體形成為箱狀,具有向下開放的開口部。腔室4之開口部與密封構件8接觸。腔室4內的空間通過底板2之貫通孔而與底板2之下方的空間連續。 The chamber 4 forms a processing chamber for heat-treating the substrate 100 to be processed. The chamber 4 is formed in a box shape as a whole, and has an opening that opens downward. The opening of the chamber 4 is in contact with the sealing member 8 . The space in the chamber 4 is continuous with the space below the bottom plate 2 through the through hole of the bottom plate 2 .

在熱處理裝置1的熱處理時,在腔室4內的空間配置有被處理基板100。在本實施形態中,被處理基板100以水平姿勢被基板支撐裝置6(亦稱為晶舟)所支撐。 During the heat treatment of the heat treatment apparatus 1 , the substrate to be processed 100 is arranged in the space in the chamber 4 . In the present embodiment, the substrate 100 to be processed is supported by the substrate support device 6 (also referred to as a wafer boat) in a horizontal position.

基板支撐裝置6被安裝於底部凸緣5之上表面。底部凸緣5可與基板支撐裝置6一體地上升及下降。藉由使底部凸緣5封閉底板2之開口部而將腔室4內之空間設為封閉空間。在底板2之外周部的下表面配置有密封構件9。底部凸緣5藉由升降機構7被支撐。藉由升降機構7之動作,使底部凸緣5、基板支撐裝置6及被處理基板100一體地沿著上下方向位移。 The substrate support device 6 is attached to the upper surface of the bottom flange 5 . The bottom flange 5 can be raised and lowered integrally with the substrate support device 6 . The space in the chamber 4 is made a closed space by closing the opening of the bottom plate 2 with the bottom flange 5 . A sealing member 9 is arranged on the lower surface of the outer peripheral portion of the bottom plate 2 . The bottom flange 5 is supported by a lift mechanism 7 . The bottom flange 5 , the substrate support device 6 and the substrate to be processed 100 are integrally displaced in the vertical direction by the operation of the elevating mechanism 7 .

關於在熱處理裝置1之熱處理時的動作,首先,在基板支撐裝置6被下降至腔室4之下方的狀態下,將複數個被處理基板100載置於該基板支撐裝置6。具體而言,例如藉由被設置在多軸機器人臂之前端的搬送手部10的動作,將被處理基板100例如從未圖示之匣向基板支撐裝置6每片地搬入。然後,在將複數個被處理基板100載置於基板支撐裝置6之後,升降機構7進行上升動作。藉此,將底部凸緣5、基板支撐裝置6及被處理基板100配置在腔室4內的空間中。 Regarding the operation during the heat treatment of the heat treatment apparatus 1 , first, a plurality of substrates to be processed 100 are placed on the substrate support apparatus 6 in a state where the substrate support apparatus 6 is lowered below the chamber 4 . Specifically, for example, by the operation of the transfer hand 10 provided at the front end of the multi-axis robot arm, the substrates 100 to be processed are carried into the substrate support device 6 one by one, for example, from a cassette (not shown). Then, after the plurality of substrates to be processed 100 are placed on the substrate support device 6 , the elevating mechanism 7 performs an ascending operation. Thereby, the bottom flange 5 , the substrate support device 6 , and the substrate to be processed 100 are arranged in the space in the chamber 4 .

接下來,進行加熱器3的加熱動作。藉此,對腔室4內的空間進行加熱,從而進行被處理基板100的熱處理。在被處理基板100之熱處理結束而加熱器3被停止之後,升降機構7進行下降動作。藉此,底部凸緣5、基板支撐裝置6及被處理基板100到達至腔室4之下方。接下來,搬送手部10將被處理基板100例如每片地搬出,從而從基板支撐裝置6取出被處理 基板100。 Next, the heating operation of the heater 3 is performed. Thereby, the space in the chamber 4 is heated, and the heat treatment of the substrate 100 to be processed is performed. After the heat treatment of the substrate 100 to be processed is completed and the heater 3 is stopped, the elevating mechanism 7 performs a lowering operation. Thereby, the bottom flange 5 , the substrate supporting device 6 and the substrate 100 to be processed reach below the chamber 4 . Next, the transport hand 10 transports the substrates 100 to be processed one by one, for example, to take out the substrates to be processed from the substrate support device 6 . Substrate 100 .

接下來,對基板支撐裝置6之詳細構成進行說明。 Next, the detailed structure of the board|substrate support apparatus 6 is demonstrated.

圖2係載置有複數個被處理基板100之狀態的基板支撐裝置6的前視圖。圖3係放大在圖2所顯示的基板支撐裝置6之中間部分的局部剖面圖,為顯示省略移動限制構件15L、15R的狀態。圖4係沿著圖2、圖3之IV-IV線的剖面圖,顯示俯視觀察基板支撐裝置6的狀態。圖5係放大在圖2所顯示的基板支撐裝置6之上部及下部的主要部分的剖面圖。 FIG. 2 is a front view of the substrate support device 6 in a state where a plurality of substrates to be processed 100 are placed. FIG. 3 is an enlarged partial cross-sectional view of the middle portion of the substrate support device 6 shown in FIG. 2 , showing a state in which the movement restricting members 15L and 15R are omitted. FIG. 4 is a cross-sectional view taken along the line IV-IV of FIGS. 2 and 3 , and shows a state of the substrate support device 6 viewed from above. FIG. 5 is an enlarged cross-sectional view of main parts of the upper and lower parts of the substrate support device 6 shown in FIG. 2 .

另外,在本實施形態中,針對上下及左右的方向,以前視觀察基板支撐裝置6的狀態為基準進行說明。另外,在本實施形態中,針對前後的方向,以俯視觀察基板支撐裝置6的狀態為基準進行說明。 In the present embodiment, the vertical and horizontal directions will be described based on the state in which the substrate support device 6 is viewed from the front. In addition, in this embodiment, the front-back direction is demonstrated based on the state which looked at the board|substrate support apparatus 6 in plan view.

參照圖2至圖5,在本實施形態中,基板支撐裝置6以單一材料的石英所形成。如此,藉由以單一材料形成基板支撐裝置6,可使在基板支撐裝置6之各部分的熱膨脹率大致均等。藉此,可抑制在基板支撐裝置6之各部分的相互連結部分於構件之間產生鬆弛。 2 to 5 , in this embodiment, the substrate supporting device 6 is formed of a single material of quartz. In this way, by forming the substrate supporting device 6 with a single material, the thermal expansion coefficients of the respective portions of the substrate supporting device 6 can be made substantially equal. Thereby, it can suppress that the mutual connection part of each part of the board|substrate support apparatus 6 slackens between members.

基板支撐裝置6具有:底板11及頂板12,其等作為基部板;支撐體13,其被固定於該等板11、12;複數個承載板(基板支撐板)14,其等被支撐於支撐體13;移動限制構件15L、15R,其等用於防止承載板14之位置偏移而被安裝於板11、12;第1錐形結合機構16L、16R,其等用於使移動限制構件15L、15R及底板11相互地結合;及第2錐形結合機構17L、17R,其用於使移動限制構件15L、15R及頂板12相互地結合。 The substrate support device 6 has: a bottom plate 11 and a top plate 12, which serve as base plates; a support body 13, which is fixed to the plates 11, 12; and a plurality of carrier plates (substrate support plates) 14, which are supported by the support body 13; movement restricting members 15L, 15R, etc., for preventing positional displacement of the carrier plate 14 and attached to the plates 11, 12; first tapered coupling mechanisms 16L, 16R, etc. for making the movement restricting member 15L , 15R, and the bottom plate 11 are coupled to each other; and second tapered coupling mechanisms 17L, 17R for coupling the movement restricting members 15L, 15R and the top plate 12 to each other.

底板11被配置於支撐體13之下端。另一方面,頂板12被配置於支撐體13之上端。底板11及頂板12係固定有支撐體13的板。在本實施形態中,底板11及頂板12係平板狀構件,在俯視觀察時外周緣部之形狀及位置被設為相互地相同。另外,底板11之俯視形狀被顯示於圖4,而省略 頂板12之俯視形狀的圖示。底板11及頂板12各自的前部形狀被形成為於左右方向平行地延伸的矩形狀。另外,底板11及頂板12各自的後部形狀被形成為向後方突出的半圓形狀。底板11與頂板12經由支撐體13而被結合為一體,構成為相互地不能分離。 The bottom plate 11 is arranged at the lower end of the support body 13 . On the other hand, the top plate 12 is arranged on the upper end of the support body 13 . The bottom plate 11 and the top plate 12 are plates to which the support body 13 is fixed. In the present embodiment, the bottom plate 11 and the top plate 12 are plate-like members, and the shapes and positions of the outer peripheral edge portions in plan view are set to be the same as each other. In addition, the top view shape of the bottom plate 11 is shown in FIG. 4 , and is omitted. An illustration of the top view shape of the top plate 12 . The shape of the front portion of each of the bottom plate 11 and the top plate 12 is formed in a rectangular shape extending parallel to the left-right direction. In addition, the rear shape of each of the bottom plate 11 and the top plate 12 is formed in a semicircular shape protruding rearward. The bottom plate 11 and the top plate 12 are integrally coupled via the support body 13, and are configured to be inseparable from each other.

支撐體13被設置為用於支撐複數個承載板14。在本實施形態中,支撐體13具有沿著上下方向延伸之作為複數個柱構件的右柱21、左柱22及後柱23。 The support body 13 is provided for supporting a plurality of carrier plates 14 . In the present embodiment, the support body 13 has a right column 21, a left column 22, and a rear column 23 as a plurality of column members extending in the up-down direction.

右柱21被配置於底板11及頂板12各自的右前部。左柱22被配置於底板11及頂板12各自的左前部。後柱23被配置於底板11及頂板12各自的後端部。如此,柱21、22、23在板11、12上被配置相互地分離。另外,柱的數量不限定於本實施形態所顯示的3個,亦可2個,也可為4個以上。各柱21、22、23被形成為細長之軸狀。各柱21、22、23之下端部藉由焊接等之固定方法而與底板11一體化。各柱21、22、23之上端部藉由焊接等之固定方法而與頂板12一體化。 The right column 21 is arranged on the right front portion of each of the bottom plate 11 and the top plate 12 . The left pillar 22 is arranged on the left front portion of each of the bottom plate 11 and the top plate 12 . The rear pillar 23 is arranged at the rear end portion of each of the bottom plate 11 and the top plate 12 . In this way, the columns 21 , 22 and 23 are arranged on the plates 11 and 12 to be separated from each other. In addition, the number of columns is not limited to the three shown in this embodiment, and may be two or four or more. Each of the columns 21, 22, and 23 is formed in an elongated shaft shape. The lower ends of the pillars 21 , 22 and 23 are integrated with the bottom plate 11 by a fixing method such as welding. The upper ends of the pillars 21 , 22 and 23 are integrated with the top plate 12 by a fixing method such as welding.

在右柱21形成有複數個支撐部21a。同樣地,在左柱22形成有複數個支撐部22a。在後柱23形成有複數個支撐部23a。支撐部21a、22a、23a的數量被設定為彼此地相同。在本實施形態中,支撐部21a、22a、23a的數量分別約為30個。支撐部21a、22a、23a被形成於所對應的柱21、22、23之上下方向之中間部分。 A plurality of support portions 21 a are formed on the right column 21 . Similarly, a plurality of support portions 22 a are formed on the left column 22 . A plurality of support portions 23 a are formed on the rear pillar 23 . The numbers of the support portions 21a, 22a, 23a are set to be the same as each other. In this embodiment, the number of the support parts 21a, 22a, and 23a is about 30, respectively. The support portions 21a, 22a, and 23a are formed in the middle portions of the corresponding pillars 21, 22, and 23 in the vertical direction.

支撐部21a係被形成於右柱21之左側部的小片部分。支撐部21a與被形成於圓軸狀之右柱21之左側部的凹部21b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部21a沿著上下方向(縱向)排列。凹部21b係沿著前後方向貫通支撐部21a的部分,朝右柱21之左側開放。如此,右柱21被形成為沿著上下方向的梳齒狀,藉此形成 複數個支撐部21a。 The support portion 21 a is formed on a small piece portion of the left side portion of the right column 21 . The support part 21a and the recessed part 21b formed in the left part of the circular-shaft-shaped right column 21 are arrange|positioned alternately in an up-down direction. Thereby, the plurality of support portions 21a supporting the plurality of carrier plates 14 are arranged in the up-down direction (vertical direction). The recessed part 21b is a part which penetrates the support part 21a along the front-back direction, and is opened to the left side of the right column 21. As shown in FIG. In this way, the right column 21 is formed in a comb-tooth shape along the vertical direction, thereby forming A plurality of support parts 21a.

支撐部22a係被形成於左柱22之右側部的小片狀部分。支撐部22a與被形成於圓軸狀之左柱22之右側部的凹部22b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部22a沿著上下方向(縱向)排列。凹部22b係沿著前後方向貫通支撐部22a的部分,朝左柱22之右側開放。如此,左柱22被形成為沿著上下方向的梳齒狀,藉此形成複數個支撐部22a。 The support portion 22 a is formed on a small piece portion of the right side portion of the left column 22 . The support part 22a and the recessed part 22b formed in the right side part of the circular-axis-shaped left column 22 are arrange|positioned alternately in an up-down direction. Thereby, the plurality of support portions 22a supporting the plurality of carrier plates 14 are arranged in the up-down direction (vertical direction). The recessed part 22b is a part which penetrates the support part 22a along the front-back direction, and is opened to the right side of the left column 22. As shown in FIG. In this way, the left column 22 is formed in a comb-tooth shape along the vertical direction, thereby forming a plurality of support portions 22a.

支撐部23a係被形成於後柱23之前側部的小片狀部分。支撐部23a與被形成於圓軸狀之後柱23之前側部的凹部23b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部23a沿著上下方向(縱向)排列。凹部23b係沿著左右方向貫通支撐部23a的部分,朝後柱23之前側開放。如此,後柱23被形成為沿著上下方向的梳齒狀,藉此形成複數個支撐部23a。 The support portion 23 a is formed on a small piece portion of the front side portion of the rear pillar 23 . The support portion 23a and the recessed portion 23b formed on the front side of the circular-axis-shaped rear column 23 are alternately arranged in the up-down direction. Thereby, the plurality of support portions 23a supporting the plurality of carrier plates 14 are arranged in the vertical direction (longitudinal direction). The recessed part 23b is a part which penetrates the support part 23a along the left-right direction, and is open to the front side of the rear pillar 23. As shown in FIG. In this way, the rear pillar 23 is formed in a comb-tooth shape along the vertical direction, thereby forming a plurality of support portions 23a.

根據上述之構成,支撐部21a、22a於前後方向延伸,支撐部23a於左右方向延伸。另外,支撐部21a、22a、23a之上下方向的位置一致。根據該構成,高度位置為相同的支撐部21a、22a、23a協同運作而以水平姿勢支撐一個被處理基板100。在本實施形態中,使承載板14針對於高度位置為相同的支撐部21a、22a、23a沿著與縱向交叉的既定之裝卸方向X1(在本實施形態中為前後方向)移動,藉此可使承載板14針對於支撐部21a、22a、23a進行裝卸。 According to the above-mentioned configuration, the support parts 21a and 22a extend in the front-rear direction, and the support part 23a extends in the left-right direction. In addition, the positions of the support parts 21a, 22a, and 23a in the up-down direction are the same. According to this configuration, the support parts 21a, 22a, and 23a having the same height position cooperate to support one substrate 100 to be processed in a horizontal posture. In this embodiment, the carrier plate 14 is moved in a predetermined attaching and detaching direction X1 (in this embodiment, the front-rear direction) that intersects the longitudinal direction with respect to the support parts 21a, 22a, and 23a having the same height position, thereby making it possible to The carrier plate 14 is attached to and detached from the support parts 21a, 22a, and 23a.

在本實施形態中,使承載板14對於支撐部21a、22a、23a朝安裝方向X11位移,藉此可將承載板14載置且安裝於支撐部21a、22a、23a。另外,使承載板14對於支撐部21a、22a、23a朝拆卸方向X12位移,藉此可將承載板14從支撐部21a、22a、23a卸下。如此,支撐部21a、22a、 23a對承載板14之外周緣部有3點支撐。 In the present embodiment, the carrier plate 14 can be placed and mounted on the support portions 21a, 22a, 23a by displacing the carrier plate 14 in the mounting direction X11 with respect to the support portions 21a, 22a, and 23a. Moreover, the carrier plate 14 can be removed from the support parts 21a, 22a, 23a by displacing the carrier plate 14 in the detachment direction X12 with respect to the support parts 21a, 22a, and 23a. In this way, the support parts 21a, 22a, 23a supports the outer peripheral edge of the carrier plate 14 at three points.

承載板14係載置被處理基板100的構件。對於高度位置相同的一組支撐部21a、22a、23a安裝有一個承載板14。在本實施形態中,在一部分之組的支撐部21a、22a、23a被安裝有承載板14。另外,承載板14的數量只要1個以上即可,並不限定於具體的數量。承載板14係於水平延伸的平板狀構件。在本實施形態中,承載板14被形成為左右對稱的形狀,在俯視觀察時形成為大致Ω字狀。另外,在圖4中利用陰影線顯示承載板14。 The carrier plate 14 is a member on which the substrate to be processed 100 is placed. One carrying plate 14 is installed for a set of support parts 21a, 22a, 23a at the same height position. In the present embodiment, the carrier plate 14 is attached to a part of the support portions 21a, 22a, and 23a. In addition, the number of the carrier plates 14 may be one or more, and is not limited to a specific number. The carrier plate 14 is attached to a horizontally extending flat plate-like member. In the present embodiment, the carrier plate 14 is formed in a left-right symmetrical shape, and is formed in a substantially Ω-shape in plan view. In addition, the carrier plate 14 is shown by hatching in FIG. 4 .

承載板14具有:基板配置部25;切口部26,其從基板配置部25之外周緣部25a朝向基板配置部25之中心延伸;及擋止27L、27R,其等從基板配置部25之外周緣部25a突出。 The carrier plate 14 has: a board arrangement part 25 ; a cutout part 26 extending from the outer peripheral edge part 25 a of the board arrangement part 25 toward the center of the board arrangement part 25 ; The edge portion 25a protrudes.

基板配置部25係配置被處理基板100的部分。基板配置部25被形成為大致圓形狀。基板配置部25之外周緣部25a之後端部被載置於支撐部23a。 The substrate arrangement portion 25 is a portion where the substrate to be processed 100 is arranged. The substrate arrangement portion 25 is formed in a substantially circular shape. The rear end portion of the outer peripheral edge portion 25a of the substrate arrangement portion 25 is placed on the support portion 23a.

在左右方向之基板配置部25的全長(基板配置部25的直徑)被設定為較支撐部21a、22a之整個寬度(從支撐部21a之右端至支撐部22a之左端的長度)短。藉此,可使基板配置部25從支撐體13之前方朝向支撐體13沿著安裝方向X11移動,藉此可通過支撐體13之支撐部21a、22a、23a。 The entire length of the substrate arrangement portion 25 in the left-right direction (the diameter of the substrate arrangement portion 25) is set to be shorter than the entire width of the support portions 21a and 22a (the length from the right end of the support portion 21a to the left end of the support portion 22a). Thereby, the board arrangement|positioning part 25 can be moved from the front of the support body 13 toward the support body 13 along the mounting direction X11, and can pass the support part 21a, 22a, 23a of the support body 13 by this.

基板配置部25之整個上表面被規定為用於載置被處理基板100的面。在本實施形態中,藉由搬送手部10將被處理基板100載置於基板配置部25之大致中央。 The entire upper surface of the substrate placement portion 25 is defined as a surface on which the substrate to be processed 100 is placed. In the present embodiment, the substrate 100 to be processed is placed on the substantially center of the substrate placement portion 25 by the conveyance hand 10 .

為了通過搬送手部10設置有切口部26,切口部26從基板配置部25之前端部向後方延伸。切口部26在左右方向具有較搬送手部10之寬度寬的寬度,在前後方向延伸至比基板配置部25之中央位置更後方的位 置。根據該構成,搬送手部10可將被處理基板100配置於基板配置部25之中央。 The notch part 26 is extended from the front end part of the board|substrate arrangement|positioning part 25 to the back in order to provide the notch part 26 by the conveyance hand part 10. As shown in FIG. The cutout portion 26 has a width wider than the width of the conveyance hand portion 10 in the left-right direction, and extends to a position rearward of the center position of the board arrangement portion 25 in the front-rear direction. set. According to this configuration, the transfer hand 10 can arrange the substrate to be processed 100 in the center of the substrate arrangement portion 25 .

擋止27L、27R係在與裝卸方向X1交叉(在本實施形態中為正交)的左右方向(寬度方向)從基板配置部25突出地延伸,被所對應的移動限制構件15L、15R及所對應的柱22、21所承接的部分。該等一對之擋止27L、27R在左右方向分離地設置有一對。 The stoppers 27L and 27R extend so as to protrude from the board arrangement portion 25 in the left-right direction (the width direction) intersecting with the attaching and detaching direction X1 (orthogonal in this embodiment), and are supported by the corresponding movement restricting members 15L and 15R and the corresponding movement restricting members 15L and 15R. The part received by the corresponding columns 22 and 21 . The pair of stoppers 27L and 27R are provided as a pair so as to be separated from each other in the left-right direction.

作為一對擋止27L、27R之一者的右擋止27R從基板配置部25之外周緣部25a之右斜前部向基板配置部25之徑向外側延伸。作為一對擋止27L、27R之另一者的左擋止27L,從基板配置部25之外周緣部25a之左斜前部向基板配置部25之徑向外側延伸。各擋止27L、27R被形成為前尖的形狀。更具體而言,在俯視觀察時,各擋止27L、27R係與外周緣部25a的連接部分在從俯視觀察時形成為彎曲形狀,以隨著從外周緣部25a向基板配置部25之徑向外側遠離而寬度變窄的方式延伸。而且,擋止27L、27R各自之前端部28L、28R的外周緣部在俯視觀察時形成為大致V字狀。 The right stopper 27R, which is one of the pair of stoppers 27L and 27R, extends from the right oblique front portion of the outer peripheral edge portion 25 a of the board arrangement portion 25 to the radially outer side of the board arrangement portion 25 . The left stopper 27L, which is the other of the pair of stoppers 27L and 27R, extends from the left oblique front portion of the outer peripheral edge portion 25 a of the board arrangement portion 25 to the radially outer side of the board arrangement portion 25 . Each stopper 27L, 27R is formed in the shape of a tip. More specifically, in a plan view, the connecting portions of the respective stoppers 27L, 27R and the outer peripheral edge portion 25a are formed in a curved shape so as to follow the diameter from the outer peripheral edge portion 25a to the board arrangement portion 25 in a plan view. Extend in such a way that the width is narrowed away from the outside. Moreover, the outer peripheral edge part of each front-end|tip part 28L, 28R of the stoppers 27L and 27R is formed in substantially V shape in planar view.

在本實施形態中,右擋止27R之前端部28R被配置在從基板配置部25之右端部之位置稍微向右側突出的位置。在本實施形態中,左擋止27L之前端部28L被配置在從基板配置部25之左端部之位置稍微向左側突出的位置。各擋止27L、27R被配置在從基板配置部25之前端部之位置向後方側前進的位置。 In the present embodiment, the front end portion 28R of the right stopper 27R is arranged at a position slightly protruding to the right from the position of the right end portion of the board arrangement portion 25 . In the present embodiment, the front end portion 28L of the left stopper 27L is arranged at a position slightly protruding to the left from the position of the left end portion of the board arrangement portion 25 . The respective stoppers 27L and 27R are arranged at positions advancing toward the rear side from the position of the front end portion of the board arrangement portion 25 .

右擋止27R之前端部28R具有右側第1平行部29R與右側前部30R。同樣地,左擋止27L之前端部28L具有左側第1平行部29L與左側前部30L。 The front end portion 28R of the right stopper 27R has a right first parallel portion 29R and a right front portion 30R. Similarly, the front end portion 28L of the left stopper 27L has a left first parallel portion 29L and a left front portion 30L.

右側第1平行部29R構成前端部28R之右端部,在本實施形態中,沿著裝卸方向X1呈直線狀延伸。右側第1平行部29R位於基板配置 部25之右端部的前方。右側第1平行部29R與右側第2平行部32R在左右方向上相對。右側第2平行部32R係右柱21之凹部21b的右端面,被配置在載置所對應之右擋止27R的支撐部21a之上方。右側第2平行部32R沿著作為右側第1平行部29R所延伸之方向的裝卸方向X1延伸,與右側第1平行部29R平行地延伸。即,相互地鄰接的右側第1平行部29R與右側第2平行部32R相互平行地延伸。 The right side first parallel portion 29R constitutes the right end portion of the front end portion 28R, and in the present embodiment, extends linearly along the attachment and detachment direction X1. The right first parallel portion 29R is located on the substrate the front of the right end of the portion 25 . The right first parallel portion 29R and the right second parallel portion 32R face each other in the left-right direction. The right second parallel portion 32R is the right end surface of the concave portion 21b of the right column 21, and is disposed above the support portion 21a on which the corresponding right stopper 27R is placed. The right second parallel portion 32R extends in the attaching and detaching direction X1 which is the direction in which the right first parallel portion 29R extends, and extends parallel to the right first parallel portion 29R. That is, the right side first parallel portion 29R and the right side second parallel portion 32R which are adjacent to each other extend parallel to each other.

左側第1平行部29L構成前端部28L之左端部,在本實施形態中,沿著裝卸方向X1呈直線狀延伸。左側第1平行部29L位於基板配置部25之左端部的前方。左側第1平行部29L與左側第2平行部32L在左右方向上相對。左側第2平行部32L係左柱22的凹部22b的左端面,被配置在載置所對應之左擋止27L的支撐部22a之上方。左側第2平行部32L沿著作為左側第1平行部29L所延伸之方向的裝卸方向X1延伸,與左側第1平行部29L平行地延伸。即,相互地鄰接的左側第1平行部29L與左側第2平行部32L相互平行地延伸。 The left first parallel portion 29L constitutes the left end portion of the front end portion 28L, and in the present embodiment, extends linearly along the attachment and detachment direction X1. The left-side first parallel portion 29L is located forward of the left end portion of the board arrangement portion 25 . The left-side first parallel portion 29L and the left-side second parallel portion 32L face each other in the left-right direction. The left second parallel portion 32L is the left end surface of the concave portion 22b of the left column 22, and is disposed above the support portion 22a on which the corresponding left stopper 27L is placed. The left-side second parallel portion 32L extends in the attachment and detachment direction X1 serving as a direction in which the left-side first parallel portion 29L extends, and extends parallel to the left-side first parallel portion 29L. That is, the left-side first parallel portion 29L and the left-side second parallel portion 32L adjacent to each other extend parallel to each other.

根據上述的構成,支撐體13的左柱22及右柱21具有可與一對第1平行部29L、29R接觸的一對第2平行部32L、32R。另外,在本實施形態中,在右側第1平行部29R與右側第2平行部32R之間形成有些微間隙,另外,在左側第1平行部29L與左側第2平行部32L之間形成有些微間隙。藉此,在將承載板14針對於支撐體13進行裝卸時,可抑制擋止27L、27R接觸於左柱22與右柱21。 According to the above-mentioned configuration, the left column 22 and the right column 21 of the support body 13 have the pair of second parallel parts 32L and 32R which can be brought into contact with the pair of first parallel parts 29L and 29R. In addition, in this embodiment, a slight gap is formed between the right first parallel portion 29R and the right second parallel portion 32R, and a slight gap is formed between the left first parallel portion 29L and the left second parallel portion 32L. gap. Thereby, when the carrier plate 14 is attached to and detached from the support body 13 , the stoppers 27L and 27R can be prevented from coming into contact with the left column 22 and the right column 21 .

右側前部30R係被右側移動限制構件15R所承接的部分。右側前部30R構成前端部28R之前端部,沿著左右方向(寬度方向)延伸。在本實施形態中,右側前部30R之長度與右側第1平行部29R之長度被設定為大致相同。右側前部30R被配置在右側移動限制構件15R之正後方。 The right front portion 30R is a portion received by the right movement restricting member 15R. The right front portion 30R constitutes the front end portion of the front end portion 28R, and extends in the left-right direction (width direction). In the present embodiment, the length of the right front portion 30R and the length of the right first parallel portion 29R are set to be substantially the same. The right front portion 30R is disposed right behind the right movement restricting member 15R.

左側前部30L係被左側移動限制構件15L所承接的部分。左側前部30L構成前端部28L之前端部,沿著左右方向(寬度方向)延伸。在本實施形態中,左側前部30L之長度與左側第1平行部29L之長度被設定為大致相同。左側前部30L被配置在左側移動限制構件15L之正後方。 The left front portion 30L is a portion received by the left movement restricting member 15L. The left front portion 30L constitutes the front end portion of the front end portion 28L, and extends in the left-right direction (width direction). In the present embodiment, the length of the left front portion 30L and the length of the left first parallel portion 29L are set to be substantially the same. The left front portion 30L is arranged right behind the left movement restricting member 15L.

作為一對移動限制構件15L、15R的右側移動限制構件15R與左側移動限制構件15L,係被設置成在被安裝於底板11及頂板12的狀態下,為了允許被處理基板100相對於承載板14的進出而限制各承載板14相對於支撐體13的移動者。另外,移動限制構件15L、15R係分別從底板11之高度位置延伸至頂板12之高度位置的棒構件,用於在支撐體13上裝卸承載板14而被構成為可自板11、12裝卸者。 The right movement restricting member 15R and the left movement restricting member 15L, which are a pair of movement restricting members 15L and 15R, are provided in a state of being attached to the bottom plate 11 and the top plate 12 to allow the substrate 100 to be processed relative to the carrier plate 14 . The movement of each carrier plate 14 relative to the support body 13 is restricted. The movement restricting members 15L and 15R are rod members extending from the height position of the bottom plate 11 to the height position of the top plate 12, respectively, and are configured to be detachable from the plates 11 and 12 for attaching and detaching the carrier plate 14 to the support body 13. .

右側移動限制構件15R與右擋止27R相對應,左側移動限制構件15L與左擋止27L相對應。各移動限制構件15L、15R係棒構件,在本實施形態中為圓軸構件,沿著上下方向延伸並可與各承載板14所對應的擋止27L、27R接觸。另外,移動限制構件15L、15R亦可被形成為角柱狀。各移動限制構件15L、15R具有如下構成:上端部15a及下端部15b被形成為塊狀,並且在該等上端部15a及下端部15b各自的中心形成有沿著上下方向延伸的貫通孔。另外,各移動限制構件15L、15R之中間部15c形成為圓筒狀,上端部15a及下端部15b被形成為一體。 The right movement restricting member 15R corresponds to the right stopper 27R, and the left movement restricting member 15L corresponds to the left stopper 27L. Each of the movement restricting members 15L and 15R is a rod member, which is a circular shaft member in the present embodiment, and extends in the vertical direction so as to be in contact with the stoppers 27L and 27R corresponding to the respective carrier plates 14 . In addition, the movement restricting members 15L and 15R may be formed in a square column shape. Each movement restricting member 15L, 15R has a configuration in which the upper end portion 15a and the lower end portion 15b are formed in a block shape, and a through hole extending in the vertical direction is formed at the center of each of the upper end portion 15a and the lower end portion 15b. Moreover, the intermediate part 15c of each movement restricting member 15L, 15R is formed in cylindrical shape, and the upper end part 15a and the lower end part 15b are formed integrally.

右側移動限制構件15R被配置在右擋止27R之右側前部30R的正前方,並被安裝在板11、12之右前端部。左側移動限制構件15L被配置在左擋止27L之左側前部30L的正前方,並被安裝在板11、12之左前端部。在本實施形態中,各移動限制構件15L、15R的直徑被設定為與右柱21之直徑(左柱22之直徑)大致相同。 The right movement restricting member 15R is disposed right in front of the right front portion 30R of the right stopper 27R, and is attached to the right front end portions of the plates 11 and 12 . The left movement restricting member 15L is disposed directly in front of the left front portion 30L of the left stopper 27L, and is attached to the left front end portions of the plates 11 and 12 . In the present embodiment, the diameter of each of the movement restricting members 15L and 15R is set to be substantially the same as the diameter of the right column 21 (the diameter of the left column 22 ).

根據上述的構成,藉由移動限制構件15L、15R承接各承載板 14之擋止27L、27R,防止承載板14向前方發生位置偏移及從支撐體13脫落。另外,藉由一對移動限制構件15L、15R承接一對擋止27L、27R,可防止承載板14在俯視觀察時相對於支撐體13朝順時針方向或逆時針方向旋轉位移(旋轉位置偏移)。另外,移動限制構件15L、15R被配置為相鄰於右柱21及左柱22。其結果為,一對第2平行部32L、32R被配置為以夾著一對第1平行部29L、29R的方式相鄰於該一對第1平行部29L、29R。藉此,藉由一對第1平行部29L、29R中之任一者與所對應的第2平行部接觸而限制在俯視觀察時的承載板14之旋轉位移。 According to the above-mentioned configuration, the respective carrier plates are received by the movement restricting members 15L and 15R The stoppers 27L and 27R of 14 prevent the bearing plate 14 from being displaced forward and falling off from the supporting body 13 . In addition, the pair of movement restricting members 15L and 15R receive the pair of stoppers 27L and 27R, so that the carrier plate 14 can be prevented from being rotationally displaced clockwise or counterclockwise with respect to the support body 13 in a plan view (rotational displacement). ). In addition, the movement restricting members 15L and 15R are arranged adjacent to the right column 21 and the left column 22 . As a result, the pair of second parallel parts 32L and 32R are arranged so as to be adjacent to the pair of first parallel parts 29L and 29R so as to sandwich the pair of first parallel parts 29L and 29R. Thereby, the rotational displacement of the carrier plate 14 in a plan view is regulated by any one of a pair of 1st parallel part 29L, 29R contacting the corresponding 2nd parallel part.

如此,相互地鄰接配置的右柱21及右側移動限制構件15R與相互地鄰接配置的左柱22及左側移動限制構件15L協同運作。藉此,可防止承載板14於從支撐體13的拆卸方向X12產生位置偏移及承載板14在俯視觀察時於旋轉方向產生位置偏移。另外,藉由後柱23承接承載板14而可防止承載板14相對於支撐體13朝後方的位置偏移。 In this way, the right column 21 and the right movement restricting member 15R arranged adjacent to each other and the left column 22 and the left movement restricting member 15L arranged adjacent to each other cooperate with each other. In this way, the positional displacement of the carrier plate 14 in the detachment direction X12 from the support body 13 and the positional displacement of the carrier plate 14 in the rotation direction in a plan view can be prevented. In addition, since the rear pillar 23 receives the carrier plate 14 , the rearward position of the carrier plate 14 relative to the support body 13 can be prevented from being displaced.

移動限制構件15L、15R之間的間隔被設定為較被處理基板100之直徑為大。藉此,在藉由搬送手部10所進行之被處理基板100的進出動作時,可防止移動限制構件15L、15R與被處理基板100的接觸。 The interval between the movement restricting members 15L and 15R is set to be larger than the diameter of the substrate to be processed 100 . Thereby, the movement restricting members 15L and 15R can be prevented from coming into contact with the substrate to be processed 100 when the substrate to be processed 100 is moved in and out by the conveyance hand 10 .

參照圖2及圖5,在本實施形態中,藉由以沿著上下方向(縱向)延伸的軸線為中心軸線的錐形結合而使板11、12與移動限制構件15L、15R連結。另外,移動限制構件15L、15R被構成為針對於底板11及頂板12可裝卸。具體而言,其設置有使移動限制構件15L、15R與底板11錐形結合的第1錐形結合機構16L、16R。另外,其設置有使移動限制構件15L、15R與頂板12錐形結合的第2錐形結合機構17L、17R。 2 and 5 , in this embodiment, the plates 11 and 12 are connected to the movement restricting members 15L and 15R by tapered coupling with an axis extending in the vertical direction (longitudinal direction) as the central axis. In addition, the movement restricting members 15L and 15R are configured to be detachable from the bottom plate 11 and the top plate 12 . Specifically, it is provided with the first tapered coupling mechanisms 16L and 16R for taperingly coupling the movement restricting members 15L and 15R to the bottom plate 11 . In addition, it is provided with second tapered coupling mechanisms 17L and 17R for coupling the movement restricting members 15L and 15R to the top plate 12 in a tapered manner.

關於一對第1錐形結合機構16L、16R之一者的右側第1錐形結合機構16R,具有右側第1錐形孔部33R與右側第1錐形軸部34R。同樣 地,關於一對第1錐形結合機構16L、16R之另一者的左側第1錐形結合機構16L,具有左側第1錐形孔部33L與左側第1錐形軸部34L。 The right first tapered coupling mechanism 16R, which is one of the pair of first tapered coupling mechanisms 16L and 16R, has a right first tapered hole portion 33R and a right first tapered shaft portion 34R. same The left first taper coupling mechanism 16L, which is the other of the pair of first taper coupling mechanisms 16L and 16R, has a left first tapered hole portion 33L and a left first tapered shaft portion 34L.

右側第1錐形孔部33R被形成於底板11中配置右側移動限制構件15R之部位的右前部。左側第1錐形孔部33L被形成於底板11中之配置左側移動限制構件15L之部位的左前部。各第1錐形孔部33L、33R係向底板11之上表面開放的圓錐台錐形狀部分,在本實施形態中,於上下方向貫通底板11。在本實施形態中,以鉛垂方向為基準,各第1錐形孔部33L、33R之錐角的第1錐角θ1被設定為40°。 The right-side first tapered hole portion 33R is formed in the right front portion of the base plate 11 where the right-side movement restricting member 15R is arranged. The left-side first tapered hole portion 33L is formed in the left front portion of the portion of the bottom plate 11 where the left-side movement restricting member 15L is arranged. Each of the first tapered hole portions 33L and 33R is a truncated cone-shaped portion open to the upper surface of the bottom plate 11 , and penetrates the bottom plate 11 in the vertical direction in this embodiment. In the present embodiment, the first taper angle θ1 of the taper angle of each of the first taper hole portions 33L and 33R is set to 40° with respect to the vertical direction.

右側第1錐形軸部34R被形成於右側移動限制構件15R之下端部。左側第1錐形軸部34L被形成於左側移動限制構件15L之下端部。各第1錐形軸部34L、34R係隨著向下方前進而直徑變小的圓錐台錐形狀部分。在本實施形態中,各第1錐形軸部34L、34R之錐角被設定為與各第1錐形孔部33L、33R之錐角相同角度的第1錐角θ1。各第1錐形軸部34L、34R與對應的第1錐形孔部33L、33R錐形嵌合。藉此,各移動限制構件15L、15R與底板11之所對應的第1錐形孔部33L、33R錐形結合。 The right first tapered shaft portion 34R is formed on the lower end portion of the right movement restricting member 15R. The left-side first tapered shaft portion 34L is formed at the lower end portion of the left-side movement restricting member 15L. Each of the first tapered shaft portions 34L and 34R is a truncated cone-shaped portion whose diameter decreases as it advances downward. In the present embodiment, the taper angle of each of the first tapered shaft portions 34L and 34R is set to a first taper angle θ1 which is the same angle as the taper angle of each of the first tapered hole portions 33L and 33R. The respective first tapered shaft portions 34L and 34R are taperedly fitted to the corresponding first tapered hole portions 33L and 33R. Thereby, the movement restricting members 15L and 15R are taper-coupled to the corresponding first tapered hole portions 33L and 33R of the bottom plate 11 .

一對第2錐形結合機構17L、17R之一者的右側第2錐形結合機構17R,具有右側第2錐形孔部35R與包含右側第2錐形軸部37R的右帽36R。同樣地,一對第2錐形結合機構17L、17R之另一者的左側第2錐形結合機構17L,具有左側第2錐形孔部35L與包含左側第2錐形軸部37L的左帽36L。 The right second tapered coupling mechanism 17R of one of the pair of second tapered coupling mechanisms 17L and 17R has a right second tapered hole portion 35R and a right cap 36R including a right second tapered shaft portion 37R. Similarly, the left second tapered coupling mechanism 17L of the other of the pair of second tapered coupling mechanisms 17L and 17R has a left second tapered hole portion 35L and a left cap including a left second tapered shaft portion 37L 36L.

右側第2錐形孔部35R被形成於頂板12中之配置右側移動限制構件15R之部位的右前部。左側第2錐形孔部35L被形成於頂板12中配置左側移動限制構件15L之部位的左前部。各第2錐形孔部35L、35R係圓錐台錐形狀部分,於上下方向貫通頂板12。在本實施形態中,以鉛垂方向為 基準,各第2錐形孔部35L、35R之錐角的第2錐角θ2被設定為30°。 The right-side second tapered hole portion 35R is formed in the right front portion of the top plate 12 where the right-side movement restricting member 15R is arranged. The left-side second tapered hole portion 35L is formed in the left front portion of the portion of the top plate 12 where the left-side movement restricting member 15L is arranged. Each of the second tapered hole portions 35L and 35R is a truncated cone-shaped portion, and penetrates the top plate 12 in the up-down direction. In this embodiment, the vertical direction is As a reference, the second taper angle θ2 of the taper angle of each of the second taper hole portions 35L and 35R is set to 30°.

即,第1錐角θ1被設定為比第2錐角θ2為大。如此,藉由使第1錐角θ1較大,首先,可將移動限制構件15L、15R之下端部高精度地定位於第1錐形孔部33L、33R,並且以可調整位置的方式可將移動限制構件15L、15R之上端部配置於第2錐形孔部35L、35R。而且,由於使第2錐角θ2比第1錐角θ1為小,因此藉由使用有帽36L、36R的第2錐形結合機構17L、17R,可實現移動限制構件15L、15R整體姿勢的穩定化。藉此,遠離該第2錐形結合機構17L、17R的移動限制構件15L、15R之下端部亦被定位於第1錐形孔部33L、33R之既定位置,並被限制移動。因此,即使在第1錐角θ1較大的情況下,亦可防止第1錐形軸部34L、34R經由第1錐形孔部33L、33R之傾斜而脫落。因此,可實現移動限制構件15L、15R之位置精度的提高與姿勢之穩定化的兩者。另外,上述第1錐角θ1比第2錐角θ2為大的構成係一個例子,本發明並不被限定於該構成。配合基板支撐裝置6之配置位置、形狀,亦可使第2錐角θ2較第1錐角θ1為大。 That is, the first taper angle θ1 is set to be larger than the second taper angle θ2. In this way, by making the first taper angle θ1 large, first, the lower ends of the movement restricting members 15L and 15R can be positioned in the first tapered hole portions 33L and 33R with high accuracy, and the positions can be adjusted The upper end portions of the movement restricting members 15L and 15R are arranged in the second tapered hole portions 35L and 35R. Furthermore, since the second taper angle θ2 is made smaller than the first taper angle θ1, the overall posture of the movement restricting members 15L and 15R can be stabilized by using the second taper coupling mechanisms 17L and 17R using the caps 36L and 36R. change. Thereby, the lower end portions of the movement restricting members 15L and 15R away from the second tapered coupling mechanisms 17L and 17R are also positioned at predetermined positions of the first tapered hole portions 33L and 33R, and their movement is restricted. Therefore, even when the first taper angle θ1 is large, the first tapered shaft portions 34L and 34R can be prevented from falling off through the inclination of the first tapered hole portions 33L and 33R. Therefore, both the improvement of the positional accuracy of the movement restricting members 15L and 15R and the stabilization of the posture can be achieved. In addition, the above-mentioned configuration in which the first taper angle θ1 is larger than the second taper angle θ2 is an example, and the present invention is not limited to this configuration. According to the arrangement position and shape of the substrate support device 6 , the second taper angle θ2 may be made larger than the first taper angle θ1.

右側移動限制構件15R之上端部15a被配置在右側第2錐形孔部35R內。同樣地,左側移動限制構件15L之上端部15a被配置在左側第2錐形孔部35L內。 The upper end portion 15a of the right movement restricting member 15R is arranged in the right second tapered hole portion 35R. Similarly, the upper end portion 15a of the left movement restricting member 15L is arranged in the left second tapered hole portion 35L.

右帽36R具有:右側第2錐形軸部37R,其被形成於右帽36R之外周面;及右側插入孔部38R,其被形成於右帽36R之內周面,插入右側移動限制構件15R。同樣地,左帽36L具有:左側第2錐形軸部37L,其被形成於左帽36L之外周面;及左側插入孔部38L,其被形成於左帽36L之內周面,插入左側移動限制構件15L。 The right cap 36R has a right second tapered shaft portion 37R formed in the outer peripheral surface of the right cap 36R, and a right insertion hole portion 38R formed in the inner peripheral surface of the right cap 36R into which the right movement restricting member 15R is inserted . Similarly, the left cap 36L has a left second tapered shaft portion 37L formed in the outer peripheral surface of the left cap 36L, and a left insertion hole portion 38L formed in the inner peripheral surface of the left cap 36L, which is inserted and moved to the left The restricting member 15L.

各插入孔部38L、38R之直徑被設定為與移動限制構件15L、15R之外徑大致相同,構成為使各帽36L、36R與所對應的移動限制構件15L、 15R之間不產生晃動。 The diameter of each insertion hole portion 38L, 38R is set to be substantially the same as the outer diameter of the movement restricting members 15L, 15R, and the caps 36L, 36R are configured so that the corresponding movement restricting members 15L, 15L No shaking occurs between 15R.

右側第2錐形軸部37R被形成在右帽36R之下端側部分。左側第2錐形軸部37L被形成在左帽36L之下端側部分。各第2錐形軸部37L、37R係隨著朝向下方前進而直徑變小的圓錐台錐形狀部分。在本實施形態中,各第2錐形軸部37L、37R之錐角被設定為與各第2錐形孔部35L、35R之錐角相同角度的第2錐角θ2。各第2錐形軸部37L、37R藉由從所對應的第2錐形孔部35L、35R之上方被插入至該等第2錐形孔部35L、35R而進行錐形嵌合。藉此,各移動限制構件15L、15R與頂板12所對應的第2錐形孔部35L、35R進行錐形結合。 The right second tapered shaft portion 37R is formed on the lower end portion of the right cap 36R. The left second tapered shaft portion 37L is formed on the lower end portion of the left cap 36L. Each of the second tapered shaft portions 37L and 37R is a truncated cone-shaped portion whose diameter decreases as it goes downward. In the present embodiment, the taper angle of each of the second tapered shaft portions 37L and 37R is set to a second taper angle θ2 which is the same angle as the taper angle of each of the second tapered hole portions 35L and 35R. Each of the second tapered shaft portions 37L and 37R is inserted into the second tapered hole portions 35L and 35R from above the corresponding second tapered hole portions 35L and 35R to perform tapered fitting. Thereby, the movement restricting members 15L and 15R are taper-coupled to the second tapered hole portions 35L and 35R corresponding to the top plate 12 .

在帽36L、36R分別與第2錐形孔部35L、35R嵌合時,各帽36L、36R之上端部從頂板12向上方突出。藉此,作業人員可利用夾持工具等抓住各帽36L、36R之上端部。藉此,可容易地將各帽36L、36R從頂板12卸下。 When the caps 36L and 36R are fitted into the second tapered hole portions 35L and 35R, respectively, the upper end portions of the caps 36L and 36R protrude upward from the top plate 12 . Thereby, an operator can grasp|grip the upper end part of each cap 36L, 36R with a gripping tool etc. FIG. Thereby, the caps 36L and 36R can be easily removed from the top plate 12 .

以上為熱處理裝置1之概略構成。 The above is the schematic configuration of the heat treatment apparatus 1 .

在該熱處理裝置1之基板支撐裝置6中,在更換承載板14時,參照圖6,首先,作業人員將各帽36L、36R從頂板12卸下。接下來,作業人員藉由將移動限制構件15L、15R向上方抬起而將該等之移動限制構件15L、15R從底板11及頂板12卸下。 In the substrate support device 6 of the heat treatment apparatus 1 , when replacing the carrier plate 14 , referring to FIG. 6 , first, the operator removes the caps 36L and 36R from the top plate 12 . Next, the operator lifts the movement restricting members 15L and 15R upward to remove the movement restricting members 15L and 15R from the bottom plate 11 and the top plate 12 .

藉此,從承載板14之前方卸下移動限制構件15L、15R。在該狀態下,作業人員藉由使更換對象的承載板14相對於支撐體13朝拆卸方向X12(圖6的紙面近前側)移動而向前方拔出。然後,新被安裝於支撐體13的承載板14藉由從支撐體13之前方側朝安裝方向X11(圖6的紙面裡側)移動而被載置在支撐體13之所對應的支撐部21a、22a、23a。 Thereby, the movement restricting members 15L and 15R are removed from the front of the carrier plate 14 . In this state, the operator pulls out forward by moving the carrier plate 14 to be replaced with respect to the support body 13 in the detachment direction X12 (the front side of the drawing in FIG. 6 ). Then, the carrier plate 14 newly mounted on the support body 13 is placed on the corresponding support portion 21 a of the support body 13 by moving from the front side of the support body 13 to the mounting direction X11 (the back side of the drawing in FIG. 6 ). , 22a, 23a.

接下來,移動限制構件15L、15R通過頂板12之所對應的第 2錐形孔部35L、35R,進而,與底板11之所對應的第1錐形孔部33L、33R錐形嵌合。之後,各帽36L、36R與所對應的第2錐形孔部35L、35R錐形嵌合。藉由以上的作業,可完成承載板14之更換作業。 Next, the movement restricting members 15L and 15R pass through the corresponding first plate 12 . The two tapered hole portions 35L and 35R are further fitted into the first tapered hole portions 33L and 33R corresponding to the bottom plate 11 in a tapered manner. After that, the respective caps 36L and 36R are taperedly fitted to the corresponding second tapered hole portions 35L and 35R. Through the above operations, the replacement operation of the carrier plate 14 can be completed.

如以上所說明,根據本實施形態之基板支撐裝置6,藉由設置移動限制構件15L、15R,可抑制承載板14相對於支撐體13的位置偏移。藉此,即使振動、氣壓等之外力作用於支撐體13與承載板14之間,亦可更確實地抑制承載板14相對於支撐體13的位置偏移。藉此,可抑制承載板14從支撐體13脫落。另外,可抑制承載板14在俯視觀察時向順時針方向或逆時針方向旋轉,因此可更確實地抑制承載板14與晶圓搬送手部10等之其他構件接觸。此外,移動限制構件15L、15R被構成為針對於底板11與頂板12可裝卸。藉此,在更換破損的承載板14時,藉由將移動限制構件15L、15R從底板11及頂板12卸下,可將承載板14從支撐體13卸下。藉此,例如在更換複數個承載板14中之破損的承載板14時,可僅將破損的承載板14從支撐體13卸下。其結果為,可容易且廉價地進行承載板14之更換作業。 As described above, according to the substrate support device 6 of the present embodiment, by providing the movement restricting members 15L and 15R, the positional displacement of the carrier plate 14 with respect to the support body 13 can be suppressed. Thereby, even if an external force such as vibration and air pressure acts between the support body 13 and the carrier plate 14 , the positional displacement of the carrier plate 14 relative to the support body 13 can be suppressed more reliably. Thereby, the carrier plate 14 can be suppressed from falling off from the support body 13 . In addition, since the carrier plate 14 can be prevented from rotating clockwise or counterclockwise in plan view, the carrier plate 14 can be more reliably prevented from coming into contact with other members such as the wafer transfer hand 10 . Further, the movement restricting members 15L and 15R are configured to be detachable from the bottom plate 11 and the top plate 12 . Thereby, when the damaged carrier plate 14 is replaced, the carrier plate 14 can be removed from the support body 13 by removing the movement restricting members 15L and 15R from the bottom plate 11 and the top plate 12 . Thereby, for example, when replacing the damaged carrier plate 14 among the plurality of carrier plates 14 , only the damaged carrier plate 14 can be removed from the support body 13 . As a result, the replacement work of the carrier plate 14 can be performed easily and inexpensively.

另外,根據基板支撐裝置6,承載板14藉由移動限制構件15L、15R在前後方向上被定位。根據該構成,在將破損的承載板14更換為新的承載板14時,移動限制構件15L、15R對承載板14進行定位。藉此,即使在重複進行承載板14之更換作業的情況下,亦可維持基板支撐裝置6在新的狀態下的基板支撐裝置6之各部分之位置關係。藉此,與作業人員的熟練度無關而可提高伴隨著承載板14之更換作業的承載板14之定位作業之精度。藉此,可進一步減少對作業人員的教育所花費的工夫。 Further, according to the substrate support device 6, the carrier plate 14 is positioned in the front-rear direction by the movement restricting members 15L, 15R. According to this configuration, when the damaged carrier plate 14 is replaced with a new one, the movement restricting members 15L and 15R position the carrier plate 14 . Thereby, even when the replacement operation of the carrier plate 14 is performed repeatedly, the positional relationship of each part of the board|substrate support apparatus 6 in the new state of the board|substrate support apparatus 6 can be maintained. Thereby, the accuracy of the positioning operation of the carrier plate 14 accompanying the replacement operation of the carrier plate 14 can be improved regardless of the operator's proficiency. Thereby, the labor required for the education of the worker can be further reduced.

另外,根據基板支撐裝置6,雖然承載板14未被黏接至支撐體13,但取而代之,藉由設置移動限制構件15L、15R,可防止承載板14從支撐體13脫落。因此,作業人員不需要定期目視是否產生振動、氣壓等所 導致的承載板14發生位置偏移而從支撐體13脫落的現象。其結果為,可進一步延長基板支撐裝置6的維護週期(維護與維護之間的期間)。 Further, according to the substrate support device 6 , although the carrier plate 14 is not bonded to the support body 13 , by providing the movement restricting members 15L and 15R instead, the carrier plate 14 can be prevented from falling off the support body 13 . Therefore, the operator does not need to regularly visually check whether vibration, air pressure, etc. The resultant phenomenon is that the carrier plate 14 is displaced from the support body 13 due to positional displacement. As a result, the maintenance cycle (period between maintenance and maintenance) of the substrate support device 6 can be further extended.

另外,根據基板支撐裝置6,可利用柱構件21、22、23各自的梳齒狀部分(支撐部21a、22a、23a)個別地支撐複數個承載板14。而且,藉由使棒構件的移動限制構件15L、15R與該等之承載板14接觸,可抑制承載板14相對於柱21、22、23產生位置偏移。 Moreover, according to the board|substrate support apparatus 6, the some carrier board 14 can be individually supported by the comb-shaped part (support part 21a, 22a, 23a) of each column member 21,22,23. Furthermore, by bringing the movement restricting members 15L and 15R of the rod members into contact with the bearing plates 14, the bearing plates 14 can be suppressed from being displaced relative to the columns 21, 22, and 23.

另外,根據基板支撐裝置6,藉由以沿著上下方向延伸的軸線為中心軸線的錐形結合而使各板11、12與移動限制構件15L、15R連結。根據該構成,可將移動限制構件15L、15R牢固且準確地固定於各板11、12。此外,藉由解除錐形結合,可容易地將移動限制構件15L、15R從各板11、12卸下。 Moreover, according to the board|substrate support apparatus 6, each plate 11,12 and the movement restricting members 15L and 15R are connected to each other by the taper coupling with the axis line extending in an up-down direction as a center axis. According to this configuration, the movement restricting members 15L and 15R can be firmly and accurately fixed to the respective plates 11 and 12 . Further, by releasing the taper coupling, the movement restricting members 15L and 15R can be easily detached from the respective plates 11 and 12 .

另外,根據基板支撐裝置6,設置有第1錐形結合機構16L、16R與第2錐形結合機構17L、17R。根據該構成,可使被配置於支撐體13之下部的底板11與被配置於支撐體13之上部的頂板12分別與移動限制構件15L、15R錐形結合。藉此,可進一步提高移動限制構件15L、15R與各板11、12的相互之結合強度。 Moreover, according to the board|substrate support apparatus 6, the 1st taper coupling mechanism 16L, 16R and the 2nd taper coupling mechanism 17L, 17R are provided. According to this configuration, the bottom plate 11 arranged on the lower part of the support body 13 and the top plate 12 arranged on the upper part of the support body 13 can be taper-connected to the movement restricting members 15L and 15R, respectively. Thereby, the mutual bonding strength of the movement restricting members 15L and 15R and the respective plates 11 and 12 can be further improved.

另外,根據基板支撐裝置6,擋止27L、27R從基板配置部25向左右方向突出。藉此,可將擋止27L、27R配置在避開被處理基板100之通路的位置。因此,擋止27L、27R藉由與移動限制構件15L、15R的接觸來抑制承載板14之位置偏移,並且不妨礙藉由搬送手部10所進行之被處理基板100的進出動作。 Moreover, according to the board|substrate support apparatus 6, the stoppers 27L and 27R protrude from the board|substrate arrangement|positioning part 25 in the left-right direction. Thereby, the stoppers 27L and 27R can be arranged at positions avoiding the passage of the substrate to be processed 100 . Therefore, the stoppers 27L and 27R are in contact with the movement restricting members 15L and 15R to suppress the positional displacement of the carrier plate 14 and do not interfere with the moving in and out of the substrate to be processed 100 by the transfer hand 10 .

另外,根據基板支撐裝置6,擋止27L、27R包含有第1平行部29L、29R。此外,左柱22與右柱21包含有第2平行部32L,32R。而且,相互地鄰接的第1平行部29L與第2平行部32L相互平行地延伸,並且 相互地鄰接的第1平行部29R與第2平行部32R相互平行地延伸。根據該構成,擋止27L、27R之各第1平行部29L、29R可被左右之柱22、21所對應的第2平行部32L、32R承接。藉此,可更確實地抑制承載板14相對於各柱21、22、23旋轉移動的位置偏移之產生。 Moreover, according to the board|substrate support apparatus 6, the stoppers 27L and 27R contain the 1st parallel parts 29L and 29R. In addition, the left column 22 and the right column 21 include second parallel portions 32L and 32R. Furthermore, the mutually adjacent first parallel portion 29L and the second parallel portion 32L extend parallel to each other, and The adjacent first parallel portion 29R and the second parallel portion 32R extend parallel to each other. According to this configuration, the respective first parallel parts 29L and 29R of the stoppers 27L and 27R can be received by the second parallel parts 32L and 32R corresponding to the left and right columns 22 and 21 . Thereby, the occurrence of positional displacement of the carrier plate 14 relative to the rotational movement of the columns 21 , 22 , and 23 can be suppressed more reliably.

以上,已對本發明之實施形態進行說明,但本發明不受限於上述之實施形態。本發明可在申請專利範圍中所記載的範圍內進行各種變更。 The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments. In the present invention, various modifications can be made within the scope described in the claims.

(1)在上述實施形態中,已對在第1錐形結合機構16L、16R中,以移動限制構件15L、15R之下端部被形成為凸狀並且底板11被形成為凹狀的構成為例進行說明。但是,本發明亦可不受限於此。例如,亦可為,在移動限制構件15L、15R之下端設置凹部並且在底板11設置凸部,而使該等之凸部與凹部相互地嵌合,從而使移動限制構件15L、15R與底板11以可拆卸的方式結合。另外,移動限制構件15L、15R與各板11、12亦可藉由錐形結合以外之螺絲連結構造等而被結合。 (1) In the above-described embodiment, in the first tapered coupling mechanisms 16L and 16R, the lower ends of the movement restricting members 15L and 15R are formed in a convex shape and the bottom plate 11 is formed in a concave shape as an example. Be explained. However, the present invention may not be limited to this. For example, recesses may be provided at the lower ends of the movement restricting members 15L and 15R, and projections may be formed at the bottom plate 11 , and these projections and recesses may be fitted into each other, whereby the movement restricting members 15L and 15R and the base plate 11 may be fitted. Combined in a detachable manner. In addition, the movement restricting members 15L and 15R and the respective plates 11 and 12 may be connected by a screw connection structure or the like other than the tapered connection.

(2)另外,在上述的實施形態中,雖已以基板支撐裝置6具有各種構件的構成為例進行說明。但是,基板支撐裝置6只要至少具有承載板14、支撐體13、各板11、12中的任一者及移動限制構件15L、15R中之任一者即可。 (2) In addition, in the above-mentioned embodiment, although the structure in which the board|substrate support apparatus 6 has various members was demonstrated as an example. However, the substrate support device 6 should just have at least one of the carrier plate 14 , the support body 13 , one of the plates 11 and 12 , and any one of the movement restricting members 15L and 15R.

(產業上之可利用性) (Industrial Availability)

本發明可適用於基板支撐裝置。 The present invention can be applied to a substrate supporting device.

10:搬送手部 10: Transfer the hand

11:底板(基部板) 11: Bottom plate (base plate)

13:支撐體 13: Support body

14:承載板 14: Carrier plate

15L:移動限制構件 15L: Movement limiting member

15R:移動限制構件 15R: Movement limiting member

21:柱構件 21: Column member

21a:支撐部 21a: Support part

21b:凹部 21b: Recess

22:柱構件 22: Column member

22a:支撐部 22a: Support part

22b:凹部 22b: Recess

23:柱構件 23: Column member

23a:支撐部 23a: Support part

23b:凹部 23b: Recess

25:基板配置部 25: Substrate configuration section

25a:外周緣部 25a: Outer peripheral edge

26:切口部 26: Incision part

27L:擋止 27L: stop

27R:擋止 27R: stop

28L:前端部 28L: Front end

28R:前端部 28R: Front end

29L:第1平行部 29L: 1st parallel part

29R:第1平行部 29R: Parallel Part 1

30L:左側前部 30L: Left front

30R:右側前部 30R: Right Front

32L:第2平行部 32L: 2nd parallel part

32R:第2平行部 32R: 2nd parallel part

100:被處理基板 100: substrate to be processed

X1:裝卸方向 X1: Loading and unloading direction

X11:安裝方向 X11: Installation direction

X12:拆卸方向 X12: Disassembly direction

Claims (6)

一種基板支撐裝置,其特徵在於,其具備有:複數個承載板,其等分別載置被處理基板;支撐體,其具有使支撐複數個上述承載板的複數個支撐部沿著縱向排列的構成,並且構成為藉由使上述承載板沿著與上述縱向交叉的既定之裝卸方向移動而使上述承載板可裝卸於所對應的上述支撐部;基部板,其被固定有上述支撐體;及移動限制構件,其被設置為用於允許上述被處理基板相對於上述承載板的進出且限制各上述承載板相對於上述支撐體進行移動,並且,為了裝卸上述承載板於上述支撐體,該移動限制構件可自上述基部板裝卸;上述支撐體係被構成為藉由沿著上述裝卸方向移動上述被處理基板而使上述被處理基板可裝卸於所對應的上述承載板,上述移動限制構件係配置於上述被處理基板所通過的區域之外側,在與上述裝卸方向交叉的方向則配置在承載板之寬度之內側,且配置在上述裝卸方向中之將上述被處理基板自上述承載板取出之拆卸方向的上述承載板之下游側。 A substrate support device, comprising: a plurality of carrier plates on which substrates to be processed are respectively placed; a support body having a configuration in which a plurality of support parts supporting the plurality of the carrier plates are arranged in a longitudinal direction , and is configured so that the carrying plate can be attached to and detached from the corresponding supporting part by moving the carrying plate along a predetermined attaching and detaching direction intersecting with the longitudinal direction; a base plate to which the supporting body is fixed; and a movable A restriction member is provided for allowing the substrate to be processed to enter and exit with respect to the carrier plate and restricting movement of each carrier plate relative to the support body, and for attaching and detaching the carrier plate to the support body, the movement restriction member A member can be attached to and detached from the base plate; the support system is configured so that the substrate to be processed can be attached to and detached from the corresponding carrier plate by moving the substrate to be processed along the attachment and detachment direction, and the movement restricting member is arranged on the The outer side of the area through which the substrate to be processed passes is arranged on the inner side of the width of the carrier plate in the direction intersecting with the above-mentioned loading and unloading direction, and is arranged in the direction of removal of the above-mentioned substrate to be processed from the carrier plate in the above-mentioned loading and unloading direction. The downstream side of the above-mentioned carrier plate. 如請求項1之基板支撐裝置,其中,上述支撐體包含有被配置為相互地分離且沿著上述縱向延伸的複數個柱構件,藉由各上述柱構件被形成為沿著上述縱向的梳齒狀而形成複數個上述支撐部,上述移動限制構件包含有沿著上述縱向延伸且可與各上述承載板接觸的棒構件。 The substrate support device according to claim 1, wherein the support body includes a plurality of column members arranged to be separated from each other and extending along the longitudinal direction, and each of the column members is formed as comb teeth along the longitudinal direction A plurality of the above-mentioned support parts are formed in the shape, and the above-mentioned movement restricting member includes a rod member that extends along the above-mentioned longitudinal direction and can be brought into contact with each of the above-mentioned carrier plates. 如請求項1之基板支撐裝置,其中, 上述基部板及上述移動限制構件藉由沿著上述縱向延伸的軸線為中心軸線的錐形結合而被連結。 The substrate support device of claim 1, wherein, The said base plate and the said movement restricting member are connected by the taper coupling which becomes a center axis along the said longitudinally extending axis. 如請求項3之基板支撐裝置,其中,設置有底板與頂板作為上述基部板,該底板被配置在上述縱向的上述支撐體之下端,該頂板被配置在上述縱向的上述支撐體之上端,該基板支撐裝置更具有:第1錐形結合機構,其錐形結合上述移動限制構件與上述底板;及第2錐形結合機構,其錐形結合上述移動限制構件與上述頂板。 The substrate supporting device according to claim 3, wherein a bottom plate and a top plate are provided as the base plate, the bottom plate is arranged at the lower end of the support body in the vertical direction, the top plate is arranged at the upper end of the support body in the vertical direction, and the The substrate support device further includes: a first tapered coupling mechanism for coupling the movement restricting member and the bottom plate in a tapered manner; and a second tapered coupling mechanism for coupling the movement restricting member and the top plate in a tapered manner. 如請求項1至4中任一項之基板支撐裝置,其中,上述承載板包含有:基板配置部,其用於配置上述被處理基板;及擋止,其在與上述裝卸方向交叉的既定之寬度方向從上述基板配置部突出並延伸,且被上述移動限制構件承接。 The substrate supporting device according to any one of claims 1 to 4, wherein the carrier plate includes: a substrate arranging portion for arranging the substrate to be processed; and a stopper at a predetermined position intersecting the attaching and detaching direction. The width direction protrudes and extends from the substrate arrangement portion, and is received by the movement restricting member. 如請求項5之基板支撐裝置,其中,上述擋止在上述寬度方向分離地設置有一對,各上述擋止包含有第1平行部,上述支撐體包含有可與一對上述第1平行部接觸的一對第2平行部,相互地鄰接的上述第1平行部與上述第2平行部相互平行地延伸。 The substrate supporting device according to claim 5, wherein a pair of the stoppers are provided apart from each other in the width direction, each of the stoppers includes a first parallel portion, and the support body includes a pair of the first parallel portions that can contact the pair of the first parallel portions. The pair of second parallel portions of the pair of the second parallel portions, which are adjacent to each other, extend in parallel to each other.
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