TWI767603B - Substrate support device - Google Patents
Substrate support device Download PDFInfo
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- TWI767603B TWI767603B TW110108558A TW110108558A TWI767603B TW I767603 B TWI767603 B TW I767603B TW 110108558 A TW110108558 A TW 110108558A TW 110108558 A TW110108558 A TW 110108558A TW I767603 B TWI767603 B TW I767603B
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- substrate
- carrier plate
- plate
- movement restricting
- support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
Abstract
本案發明提供一種基板支撐裝置,在具有用於支撐被處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且可容易且廉價地進行承載板的更換作業。 The present invention provides a substrate support device having a carrier plate for supporting a substrate to be processed, which can reliably suppress positional displacement of the carrier plate relative to a support body that supports the carrier plate, and can easily and inexpensively Carry out the replacement work of the carrier plate.
基板支撐裝置6具有:承載板14,其載置被處理基板100;支撐體13,其藉由使承載板14沿著裝卸方向X1移動而可裝卸承載板14;板11、12,其被固定有支撐體13;及移動限制構件15L、15R。移動限制構件15L、15R係被設置成為了允許被處理基板100相對於承載板14進出而限制承載板14相對於支撐體13進行移動,並且,為了於支撐體13裝卸承載板14,移動限制構件15L、15R可自板11、12裝卸。 The substrate support device 6 includes: a carrier plate 14 on which the substrate to be processed 100 is placed; a support body 13 which can be attached to and detached from the carrier plate 14 by moving the carrier plate 14 in the attaching and detaching direction X1; and plates 11 and 12 which are fixed There are a support body 13; and movement restricting members 15L, 15R. The movement restricting members 15L and 15R are provided so as to allow the substrate to be processed 100 to move in and out with respect to the carrier plate 14 and restrict the movement of the carrier plate 14 relative to the support body 13 . 15L and 15R can be attached and detached from the plates 11 and 12 .
Description
本發明關於一種基板支撐裝置。 The present invention relates to a substrate supporting device.
習知有用於對半導體晶圓進行熱處理的裝置(例如,參照專利文獻1)。於專利文獻1所記載的裝置係縱型晶圓支撐裝置。該裝置具有如下構成:在複數個支柱之側面設置有突起,並在該等突起上載置晶圓支撐環。在晶圓支撐環上載置矽晶圓。
There is known an apparatus for heat-treating a semiconductor wafer (for example, refer to Patent Document 1). The apparatus described in
[先前技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
專利文獻1:日本專利特開平10-50626號公報 Patent Document 1: Japanese Patent Laid-Open No. 10-50626
但是,在半導體熱處理製程中,存在有對Fan-Out晶圓(扇出晶圓)進行退火處理等用於矯正樹脂基板之翹曲的退火處理。在如此的半導體熱處理製程中,需要有對晶圓之下表面進行支撐的承載板(基板支撐板)。而且,在分批式熱處理裝置中,為了對複數片晶圓一次熱處理,而需要設置有複數個承載板。另外,在專利文獻1中,沒有具體地揭示如何將支柱與晶圓支撐環固定。
However, in the semiconductor heat treatment process, there is an annealing treatment for correcting the warpage of the resin substrate, such as annealing treatment of a Fan-Out wafer (fan-out wafer). In such a semiconductor heat treatment process, a carrier plate (substrate support plate) for supporting the lower surface of the wafer is required. Furthermore, in a batch type heat treatment apparatus, in order to heat-process a plurality of wafers at one time, it is necessary to provide a plurality of carrier plates. In addition,
另一方面,作為將承載板安裝於支柱的方法,可舉出如下方法:(1)將承載板插入至分別形成於複數個支柱的槽,利用支柱對承載板之 外周緣部進行支撐;(2)將承載板焊接固定於複數個支柱。 On the other hand, as a method of attaching the carrier plate to the pillar, the following method is exemplified: (1) The carrier board is inserted into the grooves formed in each of the plurality of pillars, and the carrier plate is connected to the carrier plate by the pillar. The outer peripheral portion is supported; (2) the carrier plate is welded and fixed to a plurality of pillars.
其中,在上述(1)的方法中,在長期使用熱處理裝置的基板支撐裝置時,振動、氣壓等之外力會使承載板相對於支柱產生位置偏移,而存在有承載板從支柱脫落之虞。另外,因上述之外力會使承載板相對於支柱於俯視觀察時朝順時針之方向或逆時針之方向旋轉,從而存在有晶圓搬送手部等與承載板接觸之虞。 Among them, in the method of (1) above, when the substrate support device of the heat treatment apparatus is used for a long time, the external force such as vibration and air pressure will cause the positional displacement of the carrier plate relative to the support column, and there is a possibility that the support plate will fall off from the support column. . In addition, due to the above-mentioned external force, the carrier plate is rotated clockwise or counterclockwise with respect to the support column in plan view, and there is a possibility that the wafer transfer hand or the like comes into contact with the carrier plate.
在上述(2)方法的情況,不會產生承載板相對於支柱的位置偏移。但是,假設一個承載板破損的情況,則亦需要更換包含有支柱及複數個承載板的基板支撐裝置整體。因此,需要在半導體製造工廠中預先保管基板支撐裝置的備品,因此對半導體製造工廠之費用上的負擔變大。另外,即使在對承載板破損的晶舟進行修理的情況,除了新承載板的構件費用之外,亦需要焊接加工費,不僅修理花費工夫,並且費用負擔亦變大。 In the case of the above-mentioned method (2), positional displacement of the carrier plate with respect to the support column does not occur. However, if one carrier plate is damaged, it is also necessary to replace the entire substrate support device including the support column and the plurality of carrier plates. Therefore, it is necessary to store the spare parts of the substrate support device in the semiconductor manufacturing plant in advance, and thus the burden on the cost of the semiconductor manufacturing plant increases. In addition, in the case of repairing a wafer boat with a damaged carrier plate, in addition to the component cost of a new carrier plate, a welding processing cost is required, which not only takes time for the repair, but also increases the cost burden.
鑒於上述情況,本發明的目的在於,在具備用來支撐晶圓等之處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且可容易且廉價地進行承載板的更換作業者。 In view of the above-mentioned circumstances, an object of the present invention is to, in a substrate support apparatus including a carrier plate for supporting processing substrates such as wafers, can reliably suppress the positional displacement of the carrier plate with respect to a support body that supports the carrier plate, and The replacement operator of the carrier plate can be performed easily and inexpensively.
(1)為了解決上述課題,本發明的一個態樣的基板支撐裝置具備有:複數個承載板,其等分別載置被處理基板;支撐體,其具有使支撐複數個上述承載板的複數個支撐部沿著縱向排列的構成,並且構成為藉由使上述承載板沿著與上述縱向交叉的既定之裝卸方向移動而使上述承載板可裝卸所對應的上述支撐部;基部板,其被固定有上述支撐體;及移動限制構件,其被設置為用於允許上述被處理基板相對於上述承載板的進出且限制各上述承載板相對於上述支撐體進行移動,並且,為了裝卸上述承載板於上述支撐體,該移動限制構件可自上述基部板裝卸。 (1) In order to solve the above-mentioned problems, a substrate support apparatus according to an aspect of the present invention includes a plurality of carrier plates on which the substrates to be processed are placed, respectively, and a support body having a plurality of carrier plates for supporting the plurality of carrier plates. The supporting parts are arranged in the longitudinal direction, and the supporting parts corresponding to the supporting parts can be attached and detached by moving the supporting plate in a predetermined attaching and detaching direction crossing the longitudinal direction; the base plate is fixed The supporting body is provided; and a movement restricting member is provided for allowing the substrate to be processed to enter and exit with respect to the carrier plate and for restricting the movement of each of the carrier plates relative to the support body, and for attaching and detaching the carrier plate to a In the above-mentioned support body, the movement restricting member is detachable from the above-mentioned base plate.
根據該構成,藉由設置有移動限制構件,可抑制承載板相對於支撐體的位置偏移。藉此,即使振動、氣壓等之外力作用於支撐體與承載板之間,亦可更確實地抑制承載板相對於支撐體的位置偏移。藉此,可抑制承載板從支撐體脫落。另外,可抑制承載板於俯視觀察時順時針之方向或逆時針之方向的旋轉,因此可更確實地抑制承載板與晶圓搬送手部等之其他構件產生接觸。此外,移動限制構件被構成為可自基部板裝卸。藉此,在更換破損的承載板時,可藉由將移動限制構件從基部板卸下而將承載板從支撐體卸下。藉此,例如,在更換複數個承載板中之破損的承載板時,可僅將破損的承載板從支撐體卸下。其結果,可容易且廉價地進行承載板的更換作業。 According to this configuration, by providing the movement restricting member, positional displacement of the carrier plate with respect to the support body can be suppressed. Thereby, even if an external force such as vibration and air pressure acts between the support body and the carrier plate, the positional displacement of the carrier plate with respect to the support body can be suppressed more reliably. Thereby, the carrier plate can be suppressed from falling off from the support body. In addition, since the rotation of the carrier plate in the clockwise direction or the counterclockwise direction in plan view can be suppressed, the carrier plate can be more reliably prevented from coming into contact with other members such as the wafer transfer hand. Further, the movement restricting member is configured to be detachable from the base plate. Thereby, when the damaged carrier plate is replaced, the carrier plate can be detached from the support body by detaching the movement restricting member from the base plate. Thereby, for example, when replacing a damaged carrier plate among a plurality of carrier plates, only the damaged carrier plate can be removed from the support body. As a result, the replacement work of the carrier plate can be performed easily and inexpensively.
(2)存在有以下之狀況:上述支撐體包含有被配置為相互地分離且沿著上述縱向延伸的複數個柱構件,藉由各上述柱構件被形成為沿著上述縱向的梳齒狀而形成有複數個上述支撐部,上述移動限制構件包含有沿著上述縱向延伸且可與各上述承載板接觸的棒構件。 (2) There is a situation in which the support body includes a plurality of column members arranged to be separated from each other and extending along the vertical direction, and each of the column members is formed in a comb-like shape along the vertical direction. A plurality of the above-mentioned support portions are formed, and the above-mentioned movement restricting member includes a rod member that extends along the above-mentioned longitudinal direction and can be brought into contact with each of the above-mentioned carrier plates.
根據該構成,可利用柱構件之梳齒狀部分個別地支撐複數個承載板。而且,藉由棒構件與該等承載板接觸,可抑制承載板相對於柱構件產生位置偏移。 According to this configuration, a plurality of carrier plates can be individually supported by the comb-shaped portion of the column member. Moreover, by the rod member being in contact with the carrier plates, positional displacement of the carrier plates with respect to the column members can be suppressed.
(3)存在有以下之狀況:上述基部板及上述移動限制構件藉由以沿著上述縱向延伸的軸線為中心軸線的錐形結合而被連結。 (3) There is a situation in which the base plate and the movement restricting member are connected by a taper coupling having an axis extending along the longitudinal direction as a central axis.
根據該構成,可將移動限制構件牢固地固定於基部板且在正確的位置上。此外,藉由解除錐形結合而可容易地將移動限制構件從基部板卸下。 According to this configuration, the movement restricting member can be firmly fixed to the base plate at a correct position. Furthermore, the movement restricting member can be easily detached from the base plate by releasing the taper coupling.
(4)存在有以下之狀況:設置有底板與頂板作為上述基部板,該底板被配置在上述縱向上的上述支撐體之下端,該頂板被配置在上述縱向的上述支撐體之上端,該基板支撐裝置更具有:第1錐形結合機構,其錐形 結合上述移動限制構件與上述底板;及第2錐形結合機構,其錐形結合上述移動限制構件與上述頂板。 (4) There is a situation in which a bottom plate and a top plate are provided as the base plate, the bottom plate is disposed at the lower end of the support body in the longitudinal direction, the top plate is disposed at the upper end of the support body in the longitudinal direction, and the base plate is disposed. The support device further has: a first conical coupling mechanism whose conical The movement restricting member and the bottom plate are coupled together; and a second taper coupling mechanism that tapers the movement restricting member and the top plate.
根據該構成,可使被配置於支撐體之下部的底板與被配置於支撐體之上部的頂板的各者與移動限制構件錐形結合。藉此,可進一步提高移動限制構件與基部板(底板與頂板)之相互的結合強度。 According to this configuration, each of the bottom plate arranged on the lower part of the support body and the top plate arranged on the upper part of the support body can be taperedly coupled to the movement restricting member. Thereby, the mutual bonding strength of the movement restricting member and the base plate (the bottom plate and the top plate) can be further improved.
(5)存在有以下之狀況:上述承載板包含有:基板配置部,其用於配置上述被處理基板;及擋止,其在與上述裝卸方向交叉的既定之寬度方向從上述基板配置部突出並延伸,且被上述移動限制構件所承接。 (5) There is a case where the carrier plate includes: a substrate arrangement part for arranging the substrate to be processed; and a stopper that protrudes from the substrate arrangement part in a predetermined width direction intersecting with the attachment and detachment direction and extends, and is received by the movement restricting member.
根據該構成,擋止從基板配置部於寬度方向突出。藉此,可將擋止配置於避開被處理基板之通路的位置。藉此,擋止藉由與移動限制構件接觸來抑制承載板的位置偏移,並且不妨礙被處理基板的進出動作。 According to this configuration, the stopper protrudes from the substrate arrangement portion in the width direction. Thereby, the stopper can be arranged at a position avoiding the passage of the substrate to be processed. Thereby, the positional displacement of the carrier plate is suppressed by the stopper being in contact with the movement restricting member, and the moving in and out of the substrate to be processed is not hindered.
(6)存在有以下之狀況:上述擋止在上述寬度方向分離地設置有一對,各上述擋止包含有第1平行部,上述支撐體包含有可與一對上述第1平行部接觸的一對第2平行部,相互地鄰接的上述第1平行部與上述第2平行部相互平行地延伸。 (6) There is a situation in which a pair of the stoppers are provided apart from each other in the width direction, each of the stoppers includes a first parallel portion, and the support body includes a pair of the first parallel portions that can be brought into contact with each other. Regarding the second parallel portion, the first parallel portion and the second parallel portion adjacent to each other extend parallel to each other.
根據該構成,可使擋止之各第1平行體被支撐部之所對應的第2平行部所承接。藉此,可更確實地抑制承載板相對於支撐體進行旋轉移動的位置偏移之產生。 According to this structure, each 1st parallel body which stops can be received by the corresponding 2nd parallel part of a support part. Thereby, the occurrence of positional deviation of the rotational movement of the carrier plate relative to the support body can be suppressed more reliably.
根據本發明,在具備有用於支撐被處理基板的承載板的基板支撐裝置中,可確實地抑制承載板相對於支撐承載板的支撐體的位置偏移,並且容易且廉價地進行承載板的更換作業。 According to the present invention, in the substrate support apparatus including the carrier plate for supporting the substrate to be processed, positional displacement of the carrier plate with respect to the support body supporting the carrier plate can be reliably suppressed, and replacement of the carrier plate can be performed easily and inexpensively Operation.
1:熱處理裝置 1: Heat treatment device
2:底板 2: Bottom plate
3:加熱器 3: Heater
4:腔室 4: Chamber
5:底部凸緣 5: Bottom flange
6:基板支撐裝置 6: Substrate support device
7:升降機構 7: Lifting mechanism
8:密封構件 8: Sealing member
9:密封構件 9: Sealing member
10:搬送手部 10: Transfer the hand
11:底板(基部板) 11: Bottom plate (base plate)
12:頂板(基部板) 12: Top plate (base plate)
13:支撐體 13: Support body
14:承載板 14: Carrier plate
15a:上端部 15a: upper end
15b:下端部 15b: lower end
15c:中間部 15c: Middle part
15L:移動限制構件 15L: Movement limiting member
15R:移動限制構件 15R: Movement limiting member
16L:第1錐形結合機構 16L: 1st conical coupling mechanism
16R:第1錐形結合機構 16R: 1st conical coupling mechanism
17L:第2錐形結合機構 17L: The second conical coupling mechanism
17R:第2錐形結合機構 17R: 2nd conical coupling mechanism
21:柱構件 21: Column member
21a:支撐部 21a: Support part
21b:凹部 21b: Recess
22:柱構件 22: Column member
22a:支撐部 22a: Support part
22b:凹部 22b: Recess
23:柱構件 23: Column member
23a:支撐部 23a: Support part
23b:凹部 23b: Recess
25:基板配置部 25: Substrate configuration section
25a:外周緣部 25a: Outer peripheral edge
26:切口部 26: Incision part
27L:擋止 27L: stop
27R:擋止 27R: stop
28L:前端部 28L: Front end
28R:前端部 28R: Front end
29L:第1平行部 29L: 1st parallel part
29R:第1平行部
29R:
30L:左側前部 30L: Left front
30R:右側前部 30R: Right Front
32L:第2平行部 32L: 2nd parallel part
32R:第2平行部 32R: 2nd parallel part
33L:左側第1錐形孔部 33L: 1st taper hole on the left
33R:右側第1錐形孔部 33R: Right side 1st tapered hole
34L:左側第1錐形軸部 34L: Left 1st tapered shaft
34R:右側第1錐形軸部 34R: Right side 1st tapered shaft
35L:左側第2錐形孔部 35L: The second taper hole on the left
35R:右側第2錐形孔部 35R: Right second taper hole
36L:左帽 36L: Left cap
36R:右帽 36R: Right cap
37L:左側第2錐形軸部 37L: Left 2nd tapered shaft
37R:右側第2錐形軸部 37R: Right side 2nd tapered shaft
38L:左側插入孔部 38L: Left insertion hole
38R:右側插入孔部 38R: Right insertion hole
100:被處理基板 100: substrate to be processed
X1:裝卸方向 X1: Loading and unloading direction
X11:安裝方向 X11: Installation direction
X12:拆卸方向 X12: Disassembly direction
θ1:第1錐角 θ1: 1st taper angle
θ2:第2錐角 θ2: 2nd taper angle
圖1係本發明之一實施形態之熱處理裝置的剖面圖,顯示從側方觀察包含有基板支撐裝置的熱處理裝置的狀態。 FIG. 1 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention, showing a state of the heat treatment apparatus including a substrate support apparatus as viewed from the side.
圖2係載置有複數個被處理基板的狀態之基板支撐裝置的前視圖。 FIG. 2 is a front view of the substrate support apparatus in a state where a plurality of substrates to be processed are placed.
圖3係放大於圖2所顯示的基板支撐裝置之中間部分的局部剖面圖,顯示省略移動限制構件的狀態。 FIG. 3 is a partial cross-sectional view enlarged in the middle part of the substrate supporting device shown in FIG. 2 , showing a state in which the movement restricting member is omitted.
圖4係沿著圖2、圖3之IV-IV線的剖面圖,顯示俯視觀察基板支撐裝置的狀態。 FIG. 4 is a cross-sectional view taken along the line IV-IV of FIGS. 2 and 3 , showing the state of the substrate support device viewed from above.
圖5係放大於圖2所顯示的基板支撐裝置之上部及下部的主要部分的剖面圖。 FIG. 5 is an enlarged cross-sectional view of the main part of the upper and lower parts of the substrate supporting device shown in FIG. 2 .
圖6係用於對承載板之更換作業進行說明的圖,以省略一部分的方式顯示基板支撐裝置被分解的狀態。 FIG. 6 is a diagram for explaining the replacement operation of the carrier plate, and shows a state in which the substrate support device is disassembled with a part omitted.
以下,參照附圖,對用於實施本發明的形態進行說明。 Hereinafter, embodiments for implementing the present invention will be described with reference to the accompanying drawings.
圖1係本發明之一個實施形態的熱處理裝置1之剖面圖,顯示從側方觀察包含有基板支撐裝置6的熱處理裝置1的狀態。參照圖1,熱處理裝置1構成為可對被處理基板100實施熱處理。作為該熱處理之一例,可舉出退火處理。另外,在熱處理裝置1所進行的熱處理亦可為退火處理以外的其他之一般熱處理。被處理基板100例如Fan-Out晶圓,在本實施形態中形成為圓盤狀。
1 is a cross-sectional view of a
熱處理裝置1具有底板2、加熱器3、腔室4、底部凸緣5、被安裝於底部凸緣5的基板支撐裝置6及升降機構7。
The
作為對加熱器3及腔室4進行支撐的構件設置有底板2。在底板2之中央,形成有貫通孔。以從上方封閉該貫通孔之方式配置有加熱器3。加熱器3係例如電熱加熱器,整體形成為箱狀,具有向下開放的形狀。在被
加熱器3所包圍的空間中配置有腔室4。
A
腔室4形成用於對被處理基板100進行熱處理的處理室。腔室4整體形成為箱狀,具有向下開放的開口部。腔室4之開口部與密封構件8接觸。腔室4內的空間通過底板2之貫通孔而與底板2之下方的空間連續。
The
在熱處理裝置1的熱處理時,在腔室4內的空間配置有被處理基板100。在本實施形態中,被處理基板100以水平姿勢被基板支撐裝置6(亦稱為晶舟)所支撐。
During the heat treatment of the
基板支撐裝置6被安裝於底部凸緣5之上表面。底部凸緣5可與基板支撐裝置6一體地上升及下降。藉由使底部凸緣5封閉底板2之開口部而將腔室4內之空間設為封閉空間。在底板2之外周部的下表面配置有密封構件9。底部凸緣5藉由升降機構7被支撐。藉由升降機構7之動作,使底部凸緣5、基板支撐裝置6及被處理基板100一體地沿著上下方向位移。
The
關於在熱處理裝置1之熱處理時的動作,首先,在基板支撐裝置6被下降至腔室4之下方的狀態下,將複數個被處理基板100載置於該基板支撐裝置6。具體而言,例如藉由被設置在多軸機器人臂之前端的搬送手部10的動作,將被處理基板100例如從未圖示之匣向基板支撐裝置6每片地搬入。然後,在將複數個被處理基板100載置於基板支撐裝置6之後,升降機構7進行上升動作。藉此,將底部凸緣5、基板支撐裝置6及被處理基板100配置在腔室4內的空間中。
Regarding the operation during the heat treatment of the
接下來,進行加熱器3的加熱動作。藉此,對腔室4內的空間進行加熱,從而進行被處理基板100的熱處理。在被處理基板100之熱處理結束而加熱器3被停止之後,升降機構7進行下降動作。藉此,底部凸緣5、基板支撐裝置6及被處理基板100到達至腔室4之下方。接下來,搬送手部10將被處理基板100例如每片地搬出,從而從基板支撐裝置6取出被處理
基板100。
Next, the heating operation of the
接下來,對基板支撐裝置6之詳細構成進行說明。
Next, the detailed structure of the board|
圖2係載置有複數個被處理基板100之狀態的基板支撐裝置6的前視圖。圖3係放大在圖2所顯示的基板支撐裝置6之中間部分的局部剖面圖,為顯示省略移動限制構件15L、15R的狀態。圖4係沿著圖2、圖3之IV-IV線的剖面圖,顯示俯視觀察基板支撐裝置6的狀態。圖5係放大在圖2所顯示的基板支撐裝置6之上部及下部的主要部分的剖面圖。
FIG. 2 is a front view of the
另外,在本實施形態中,針對上下及左右的方向,以前視觀察基板支撐裝置6的狀態為基準進行說明。另外,在本實施形態中,針對前後的方向,以俯視觀察基板支撐裝置6的狀態為基準進行說明。
In the present embodiment, the vertical and horizontal directions will be described based on the state in which the
參照圖2至圖5,在本實施形態中,基板支撐裝置6以單一材料的石英所形成。如此,藉由以單一材料形成基板支撐裝置6,可使在基板支撐裝置6之各部分的熱膨脹率大致均等。藉此,可抑制在基板支撐裝置6之各部分的相互連結部分於構件之間產生鬆弛。
2 to 5 , in this embodiment, the
基板支撐裝置6具有:底板11及頂板12,其等作為基部板;支撐體13,其被固定於該等板11、12;複數個承載板(基板支撐板)14,其等被支撐於支撐體13;移動限制構件15L、15R,其等用於防止承載板14之位置偏移而被安裝於板11、12;第1錐形結合機構16L、16R,其等用於使移動限制構件15L、15R及底板11相互地結合;及第2錐形結合機構17L、17R,其用於使移動限制構件15L、15R及頂板12相互地結合。
The
底板11被配置於支撐體13之下端。另一方面,頂板12被配置於支撐體13之上端。底板11及頂板12係固定有支撐體13的板。在本實施形態中,底板11及頂板12係平板狀構件,在俯視觀察時外周緣部之形狀及位置被設為相互地相同。另外,底板11之俯視形狀被顯示於圖4,而省略
頂板12之俯視形狀的圖示。底板11及頂板12各自的前部形狀被形成為於左右方向平行地延伸的矩形狀。另外,底板11及頂板12各自的後部形狀被形成為向後方突出的半圓形狀。底板11與頂板12經由支撐體13而被結合為一體,構成為相互地不能分離。
The
支撐體13被設置為用於支撐複數個承載板14。在本實施形態中,支撐體13具有沿著上下方向延伸之作為複數個柱構件的右柱21、左柱22及後柱23。
The
右柱21被配置於底板11及頂板12各自的右前部。左柱22被配置於底板11及頂板12各自的左前部。後柱23被配置於底板11及頂板12各自的後端部。如此,柱21、22、23在板11、12上被配置相互地分離。另外,柱的數量不限定於本實施形態所顯示的3個,亦可2個,也可為4個以上。各柱21、22、23被形成為細長之軸狀。各柱21、22、23之下端部藉由焊接等之固定方法而與底板11一體化。各柱21、22、23之上端部藉由焊接等之固定方法而與頂板12一體化。
The
在右柱21形成有複數個支撐部21a。同樣地,在左柱22形成有複數個支撐部22a。在後柱23形成有複數個支撐部23a。支撐部21a、22a、23a的數量被設定為彼此地相同。在本實施形態中,支撐部21a、22a、23a的數量分別約為30個。支撐部21a、22a、23a被形成於所對應的柱21、22、23之上下方向之中間部分。
A plurality of
支撐部21a係被形成於右柱21之左側部的小片部分。支撐部21a與被形成於圓軸狀之右柱21之左側部的凹部21b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部21a沿著上下方向(縱向)排列。凹部21b係沿著前後方向貫通支撐部21a的部分,朝右柱21之左側開放。如此,右柱21被形成為沿著上下方向的梳齒狀,藉此形成
複數個支撐部21a。
The
支撐部22a係被形成於左柱22之右側部的小片狀部分。支撐部22a與被形成於圓軸狀之左柱22之右側部的凹部22b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部22a沿著上下方向(縱向)排列。凹部22b係沿著前後方向貫通支撐部22a的部分,朝左柱22之右側開放。如此,左柱22被形成為沿著上下方向的梳齒狀,藉此形成複數個支撐部22a。
The
支撐部23a係被形成於後柱23之前側部的小片狀部分。支撐部23a與被形成於圓軸狀之後柱23之前側部的凹部23b交替地被配置於上下方向。藉此,對複數個承載板14進行支撐的複數個支撐部23a沿著上下方向(縱向)排列。凹部23b係沿著左右方向貫通支撐部23a的部分,朝後柱23之前側開放。如此,後柱23被形成為沿著上下方向的梳齒狀,藉此形成複數個支撐部23a。
The
根據上述之構成,支撐部21a、22a於前後方向延伸,支撐部23a於左右方向延伸。另外,支撐部21a、22a、23a之上下方向的位置一致。根據該構成,高度位置為相同的支撐部21a、22a、23a協同運作而以水平姿勢支撐一個被處理基板100。在本實施形態中,使承載板14針對於高度位置為相同的支撐部21a、22a、23a沿著與縱向交叉的既定之裝卸方向X1(在本實施形態中為前後方向)移動,藉此可使承載板14針對於支撐部21a、22a、23a進行裝卸。
According to the above-mentioned configuration, the
在本實施形態中,使承載板14對於支撐部21a、22a、23a朝安裝方向X11位移,藉此可將承載板14載置且安裝於支撐部21a、22a、23a。另外,使承載板14對於支撐部21a、22a、23a朝拆卸方向X12位移,藉此可將承載板14從支撐部21a、22a、23a卸下。如此,支撐部21a、22a、
23a對承載板14之外周緣部有3點支撐。
In the present embodiment, the
承載板14係載置被處理基板100的構件。對於高度位置相同的一組支撐部21a、22a、23a安裝有一個承載板14。在本實施形態中,在一部分之組的支撐部21a、22a、23a被安裝有承載板14。另外,承載板14的數量只要1個以上即可,並不限定於具體的數量。承載板14係於水平延伸的平板狀構件。在本實施形態中,承載板14被形成為左右對稱的形狀,在俯視觀察時形成為大致Ω字狀。另外,在圖4中利用陰影線顯示承載板14。
The
承載板14具有:基板配置部25;切口部26,其從基板配置部25之外周緣部25a朝向基板配置部25之中心延伸;及擋止27L、27R,其等從基板配置部25之外周緣部25a突出。
The
基板配置部25係配置被處理基板100的部分。基板配置部25被形成為大致圓形狀。基板配置部25之外周緣部25a之後端部被載置於支撐部23a。
The
在左右方向之基板配置部25的全長(基板配置部25的直徑)被設定為較支撐部21a、22a之整個寬度(從支撐部21a之右端至支撐部22a之左端的長度)短。藉此,可使基板配置部25從支撐體13之前方朝向支撐體13沿著安裝方向X11移動,藉此可通過支撐體13之支撐部21a、22a、23a。
The entire length of the
基板配置部25之整個上表面被規定為用於載置被處理基板100的面。在本實施形態中,藉由搬送手部10將被處理基板100載置於基板配置部25之大致中央。
The entire upper surface of the
為了通過搬送手部10設置有切口部26,切口部26從基板配置部25之前端部向後方延伸。切口部26在左右方向具有較搬送手部10之寬度寬的寬度,在前後方向延伸至比基板配置部25之中央位置更後方的位
置。根據該構成,搬送手部10可將被處理基板100配置於基板配置部25之中央。
The
擋止27L、27R係在與裝卸方向X1交叉(在本實施形態中為正交)的左右方向(寬度方向)從基板配置部25突出地延伸,被所對應的移動限制構件15L、15R及所對應的柱22、21所承接的部分。該等一對之擋止27L、27R在左右方向分離地設置有一對。
The
作為一對擋止27L、27R之一者的右擋止27R從基板配置部25之外周緣部25a之右斜前部向基板配置部25之徑向外側延伸。作為一對擋止27L、27R之另一者的左擋止27L,從基板配置部25之外周緣部25a之左斜前部向基板配置部25之徑向外側延伸。各擋止27L、27R被形成為前尖的形狀。更具體而言,在俯視觀察時,各擋止27L、27R係與外周緣部25a的連接部分在從俯視觀察時形成為彎曲形狀,以隨著從外周緣部25a向基板配置部25之徑向外側遠離而寬度變窄的方式延伸。而且,擋止27L、27R各自之前端部28L、28R的外周緣部在俯視觀察時形成為大致V字狀。
The
在本實施形態中,右擋止27R之前端部28R被配置在從基板配置部25之右端部之位置稍微向右側突出的位置。在本實施形態中,左擋止27L之前端部28L被配置在從基板配置部25之左端部之位置稍微向左側突出的位置。各擋止27L、27R被配置在從基板配置部25之前端部之位置向後方側前進的位置。
In the present embodiment, the
右擋止27R之前端部28R具有右側第1平行部29R與右側前部30R。同樣地,左擋止27L之前端部28L具有左側第1平行部29L與左側前部30L。
The
右側第1平行部29R構成前端部28R之右端部,在本實施形態中,沿著裝卸方向X1呈直線狀延伸。右側第1平行部29R位於基板配置
部25之右端部的前方。右側第1平行部29R與右側第2平行部32R在左右方向上相對。右側第2平行部32R係右柱21之凹部21b的右端面,被配置在載置所對應之右擋止27R的支撐部21a之上方。右側第2平行部32R沿著作為右側第1平行部29R所延伸之方向的裝卸方向X1延伸,與右側第1平行部29R平行地延伸。即,相互地鄰接的右側第1平行部29R與右側第2平行部32R相互平行地延伸。
The right side first
左側第1平行部29L構成前端部28L之左端部,在本實施形態中,沿著裝卸方向X1呈直線狀延伸。左側第1平行部29L位於基板配置部25之左端部的前方。左側第1平行部29L與左側第2平行部32L在左右方向上相對。左側第2平行部32L係左柱22的凹部22b的左端面,被配置在載置所對應之左擋止27L的支撐部22a之上方。左側第2平行部32L沿著作為左側第1平行部29L所延伸之方向的裝卸方向X1延伸,與左側第1平行部29L平行地延伸。即,相互地鄰接的左側第1平行部29L與左側第2平行部32L相互平行地延伸。
The left first
根據上述的構成,支撐體13的左柱22及右柱21具有可與一對第1平行部29L、29R接觸的一對第2平行部32L、32R。另外,在本實施形態中,在右側第1平行部29R與右側第2平行部32R之間形成有些微間隙,另外,在左側第1平行部29L與左側第2平行部32L之間形成有些微間隙。藉此,在將承載板14針對於支撐體13進行裝卸時,可抑制擋止27L、27R接觸於左柱22與右柱21。
According to the above-mentioned configuration, the
右側前部30R係被右側移動限制構件15R所承接的部分。右側前部30R構成前端部28R之前端部,沿著左右方向(寬度方向)延伸。在本實施形態中,右側前部30R之長度與右側第1平行部29R之長度被設定為大致相同。右側前部30R被配置在右側移動限制構件15R之正後方。
The right
左側前部30L係被左側移動限制構件15L所承接的部分。左側前部30L構成前端部28L之前端部,沿著左右方向(寬度方向)延伸。在本實施形態中,左側前部30L之長度與左側第1平行部29L之長度被設定為大致相同。左側前部30L被配置在左側移動限制構件15L之正後方。
The
作為一對移動限制構件15L、15R的右側移動限制構件15R與左側移動限制構件15L,係被設置成在被安裝於底板11及頂板12的狀態下,為了允許被處理基板100相對於承載板14的進出而限制各承載板14相對於支撐體13的移動者。另外,移動限制構件15L、15R係分別從底板11之高度位置延伸至頂板12之高度位置的棒構件,用於在支撐體13上裝卸承載板14而被構成為可自板11、12裝卸者。
The right
右側移動限制構件15R與右擋止27R相對應,左側移動限制構件15L與左擋止27L相對應。各移動限制構件15L、15R係棒構件,在本實施形態中為圓軸構件,沿著上下方向延伸並可與各承載板14所對應的擋止27L、27R接觸。另外,移動限制構件15L、15R亦可被形成為角柱狀。各移動限制構件15L、15R具有如下構成:上端部15a及下端部15b被形成為塊狀,並且在該等上端部15a及下端部15b各自的中心形成有沿著上下方向延伸的貫通孔。另外,各移動限制構件15L、15R之中間部15c形成為圓筒狀,上端部15a及下端部15b被形成為一體。
The right
右側移動限制構件15R被配置在右擋止27R之右側前部30R的正前方,並被安裝在板11、12之右前端部。左側移動限制構件15L被配置在左擋止27L之左側前部30L的正前方,並被安裝在板11、12之左前端部。在本實施形態中,各移動限制構件15L、15R的直徑被設定為與右柱21之直徑(左柱22之直徑)大致相同。
The right
根據上述的構成,藉由移動限制構件15L、15R承接各承載板
14之擋止27L、27R,防止承載板14向前方發生位置偏移及從支撐體13脫落。另外,藉由一對移動限制構件15L、15R承接一對擋止27L、27R,可防止承載板14在俯視觀察時相對於支撐體13朝順時針方向或逆時針方向旋轉位移(旋轉位置偏移)。另外,移動限制構件15L、15R被配置為相鄰於右柱21及左柱22。其結果為,一對第2平行部32L、32R被配置為以夾著一對第1平行部29L、29R的方式相鄰於該一對第1平行部29L、29R。藉此,藉由一對第1平行部29L、29R中之任一者與所對應的第2平行部接觸而限制在俯視觀察時的承載板14之旋轉位移。
According to the above-mentioned configuration, the respective carrier plates are received by the
如此,相互地鄰接配置的右柱21及右側移動限制構件15R與相互地鄰接配置的左柱22及左側移動限制構件15L協同運作。藉此,可防止承載板14於從支撐體13的拆卸方向X12產生位置偏移及承載板14在俯視觀察時於旋轉方向產生位置偏移。另外,藉由後柱23承接承載板14而可防止承載板14相對於支撐體13朝後方的位置偏移。
In this way, the
移動限制構件15L、15R之間的間隔被設定為較被處理基板100之直徑為大。藉此,在藉由搬送手部10所進行之被處理基板100的進出動作時,可防止移動限制構件15L、15R與被處理基板100的接觸。
The interval between the
參照圖2及圖5,在本實施形態中,藉由以沿著上下方向(縱向)延伸的軸線為中心軸線的錐形結合而使板11、12與移動限制構件15L、15R連結。另外,移動限制構件15L、15R被構成為針對於底板11及頂板12可裝卸。具體而言,其設置有使移動限制構件15L、15R與底板11錐形結合的第1錐形結合機構16L、16R。另外,其設置有使移動限制構件15L、15R與頂板12錐形結合的第2錐形結合機構17L、17R。
2 and 5 , in this embodiment, the
關於一對第1錐形結合機構16L、16R之一者的右側第1錐形結合機構16R,具有右側第1錐形孔部33R與右側第1錐形軸部34R。同樣
地,關於一對第1錐形結合機構16L、16R之另一者的左側第1錐形結合機構16L,具有左側第1錐形孔部33L與左側第1錐形軸部34L。
The right first
右側第1錐形孔部33R被形成於底板11中配置右側移動限制構件15R之部位的右前部。左側第1錐形孔部33L被形成於底板11中之配置左側移動限制構件15L之部位的左前部。各第1錐形孔部33L、33R係向底板11之上表面開放的圓錐台錐形狀部分,在本實施形態中,於上下方向貫通底板11。在本實施形態中,以鉛垂方向為基準,各第1錐形孔部33L、33R之錐角的第1錐角θ1被設定為40°。
The right-side first tapered
右側第1錐形軸部34R被形成於右側移動限制構件15R之下端部。左側第1錐形軸部34L被形成於左側移動限制構件15L之下端部。各第1錐形軸部34L、34R係隨著向下方前進而直徑變小的圓錐台錐形狀部分。在本實施形態中,各第1錐形軸部34L、34R之錐角被設定為與各第1錐形孔部33L、33R之錐角相同角度的第1錐角θ1。各第1錐形軸部34L、34R與對應的第1錐形孔部33L、33R錐形嵌合。藉此,各移動限制構件15L、15R與底板11之所對應的第1錐形孔部33L、33R錐形結合。
The right first
一對第2錐形結合機構17L、17R之一者的右側第2錐形結合機構17R,具有右側第2錐形孔部35R與包含右側第2錐形軸部37R的右帽36R。同樣地,一對第2錐形結合機構17L、17R之另一者的左側第2錐形結合機構17L,具有左側第2錐形孔部35L與包含左側第2錐形軸部37L的左帽36L。
The right second
右側第2錐形孔部35R被形成於頂板12中之配置右側移動限制構件15R之部位的右前部。左側第2錐形孔部35L被形成於頂板12中配置左側移動限制構件15L之部位的左前部。各第2錐形孔部35L、35R係圓錐台錐形狀部分,於上下方向貫通頂板12。在本實施形態中,以鉛垂方向為
基準,各第2錐形孔部35L、35R之錐角的第2錐角θ2被設定為30°。
The right-side second tapered
即,第1錐角θ1被設定為比第2錐角θ2為大。如此,藉由使第1錐角θ1較大,首先,可將移動限制構件15L、15R之下端部高精度地定位於第1錐形孔部33L、33R,並且以可調整位置的方式可將移動限制構件15L、15R之上端部配置於第2錐形孔部35L、35R。而且,由於使第2錐角θ2比第1錐角θ1為小,因此藉由使用有帽36L、36R的第2錐形結合機構17L、17R,可實現移動限制構件15L、15R整體姿勢的穩定化。藉此,遠離該第2錐形結合機構17L、17R的移動限制構件15L、15R之下端部亦被定位於第1錐形孔部33L、33R之既定位置,並被限制移動。因此,即使在第1錐角θ1較大的情況下,亦可防止第1錐形軸部34L、34R經由第1錐形孔部33L、33R之傾斜而脫落。因此,可實現移動限制構件15L、15R之位置精度的提高與姿勢之穩定化的兩者。另外,上述第1錐角θ1比第2錐角θ2為大的構成係一個例子,本發明並不被限定於該構成。配合基板支撐裝置6之配置位置、形狀,亦可使第2錐角θ2較第1錐角θ1為大。
That is, the first taper angle θ1 is set to be larger than the second taper angle θ2. In this way, by making the first taper angle θ1 large, first, the lower ends of the
右側移動限制構件15R之上端部15a被配置在右側第2錐形孔部35R內。同樣地,左側移動限制構件15L之上端部15a被配置在左側第2錐形孔部35L內。
The
右帽36R具有:右側第2錐形軸部37R,其被形成於右帽36R之外周面;及右側插入孔部38R,其被形成於右帽36R之內周面,插入右側移動限制構件15R。同樣地,左帽36L具有:左側第2錐形軸部37L,其被形成於左帽36L之外周面;及左側插入孔部38L,其被形成於左帽36L之內周面,插入左側移動限制構件15L。
The
各插入孔部38L、38R之直徑被設定為與移動限制構件15L、15R之外徑大致相同,構成為使各帽36L、36R與所對應的移動限制構件15L、
15R之間不產生晃動。
The diameter of each
右側第2錐形軸部37R被形成在右帽36R之下端側部分。左側第2錐形軸部37L被形成在左帽36L之下端側部分。各第2錐形軸部37L、37R係隨著朝向下方前進而直徑變小的圓錐台錐形狀部分。在本實施形態中,各第2錐形軸部37L、37R之錐角被設定為與各第2錐形孔部35L、35R之錐角相同角度的第2錐角θ2。各第2錐形軸部37L、37R藉由從所對應的第2錐形孔部35L、35R之上方被插入至該等第2錐形孔部35L、35R而進行錐形嵌合。藉此,各移動限制構件15L、15R與頂板12所對應的第2錐形孔部35L、35R進行錐形結合。
The right second
在帽36L、36R分別與第2錐形孔部35L、35R嵌合時,各帽36L、36R之上端部從頂板12向上方突出。藉此,作業人員可利用夾持工具等抓住各帽36L、36R之上端部。藉此,可容易地將各帽36L、36R從頂板12卸下。
When the
以上為熱處理裝置1之概略構成。
The above is the schematic configuration of the
在該熱處理裝置1之基板支撐裝置6中,在更換承載板14時,參照圖6,首先,作業人員將各帽36L、36R從頂板12卸下。接下來,作業人員藉由將移動限制構件15L、15R向上方抬起而將該等之移動限制構件15L、15R從底板11及頂板12卸下。
In the
藉此,從承載板14之前方卸下移動限制構件15L、15R。在該狀態下,作業人員藉由使更換對象的承載板14相對於支撐體13朝拆卸方向X12(圖6的紙面近前側)移動而向前方拔出。然後,新被安裝於支撐體13的承載板14藉由從支撐體13之前方側朝安裝方向X11(圖6的紙面裡側)移動而被載置在支撐體13之所對應的支撐部21a、22a、23a。
Thereby, the
接下來,移動限制構件15L、15R通過頂板12之所對應的第
2錐形孔部35L、35R,進而,與底板11之所對應的第1錐形孔部33L、33R錐形嵌合。之後,各帽36L、36R與所對應的第2錐形孔部35L、35R錐形嵌合。藉由以上的作業,可完成承載板14之更換作業。
Next, the
如以上所說明,根據本實施形態之基板支撐裝置6,藉由設置移動限制構件15L、15R,可抑制承載板14相對於支撐體13的位置偏移。藉此,即使振動、氣壓等之外力作用於支撐體13與承載板14之間,亦可更確實地抑制承載板14相對於支撐體13的位置偏移。藉此,可抑制承載板14從支撐體13脫落。另外,可抑制承載板14在俯視觀察時向順時針方向或逆時針方向旋轉,因此可更確實地抑制承載板14與晶圓搬送手部10等之其他構件接觸。此外,移動限制構件15L、15R被構成為針對於底板11與頂板12可裝卸。藉此,在更換破損的承載板14時,藉由將移動限制構件15L、15R從底板11及頂板12卸下,可將承載板14從支撐體13卸下。藉此,例如在更換複數個承載板14中之破損的承載板14時,可僅將破損的承載板14從支撐體13卸下。其結果為,可容易且廉價地進行承載板14之更換作業。
As described above, according to the
另外,根據基板支撐裝置6,承載板14藉由移動限制構件15L、15R在前後方向上被定位。根據該構成,在將破損的承載板14更換為新的承載板14時,移動限制構件15L、15R對承載板14進行定位。藉此,即使在重複進行承載板14之更換作業的情況下,亦可維持基板支撐裝置6在新的狀態下的基板支撐裝置6之各部分之位置關係。藉此,與作業人員的熟練度無關而可提高伴隨著承載板14之更換作業的承載板14之定位作業之精度。藉此,可進一步減少對作業人員的教育所花費的工夫。
Further, according to the
另外,根據基板支撐裝置6,雖然承載板14未被黏接至支撐體13,但取而代之,藉由設置移動限制構件15L、15R,可防止承載板14從支撐體13脫落。因此,作業人員不需要定期目視是否產生振動、氣壓等所
導致的承載板14發生位置偏移而從支撐體13脫落的現象。其結果為,可進一步延長基板支撐裝置6的維護週期(維護與維護之間的期間)。
Further, according to the
另外,根據基板支撐裝置6,可利用柱構件21、22、23各自的梳齒狀部分(支撐部21a、22a、23a)個別地支撐複數個承載板14。而且,藉由使棒構件的移動限制構件15L、15R與該等之承載板14接觸,可抑制承載板14相對於柱21、22、23產生位置偏移。
Moreover, according to the board|
另外,根據基板支撐裝置6,藉由以沿著上下方向延伸的軸線為中心軸線的錐形結合而使各板11、12與移動限制構件15L、15R連結。根據該構成,可將移動限制構件15L、15R牢固且準確地固定於各板11、12。此外,藉由解除錐形結合,可容易地將移動限制構件15L、15R從各板11、12卸下。
Moreover, according to the board|
另外,根據基板支撐裝置6,設置有第1錐形結合機構16L、16R與第2錐形結合機構17L、17R。根據該構成,可使被配置於支撐體13之下部的底板11與被配置於支撐體13之上部的頂板12分別與移動限制構件15L、15R錐形結合。藉此,可進一步提高移動限制構件15L、15R與各板11、12的相互之結合強度。
Moreover, according to the board|
另外,根據基板支撐裝置6,擋止27L、27R從基板配置部25向左右方向突出。藉此,可將擋止27L、27R配置在避開被處理基板100之通路的位置。因此,擋止27L、27R藉由與移動限制構件15L、15R的接觸來抑制承載板14之位置偏移,並且不妨礙藉由搬送手部10所進行之被處理基板100的進出動作。
Moreover, according to the board|
另外,根據基板支撐裝置6,擋止27L、27R包含有第1平行部29L、29R。此外,左柱22與右柱21包含有第2平行部32L,32R。而且,相互地鄰接的第1平行部29L與第2平行部32L相互平行地延伸,並且
相互地鄰接的第1平行部29R與第2平行部32R相互平行地延伸。根據該構成,擋止27L、27R之各第1平行部29L、29R可被左右之柱22、21所對應的第2平行部32L、32R承接。藉此,可更確實地抑制承載板14相對於各柱21、22、23旋轉移動的位置偏移之產生。
Moreover, according to the board|
以上,已對本發明之實施形態進行說明,但本發明不受限於上述之實施形態。本發明可在申請專利範圍中所記載的範圍內進行各種變更。 The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments. In the present invention, various modifications can be made within the scope described in the claims.
(1)在上述實施形態中,已對在第1錐形結合機構16L、16R中,以移動限制構件15L、15R之下端部被形成為凸狀並且底板11被形成為凹狀的構成為例進行說明。但是,本發明亦可不受限於此。例如,亦可為,在移動限制構件15L、15R之下端設置凹部並且在底板11設置凸部,而使該等之凸部與凹部相互地嵌合,從而使移動限制構件15L、15R與底板11以可拆卸的方式結合。另外,移動限制構件15L、15R與各板11、12亦可藉由錐形結合以外之螺絲連結構造等而被結合。
(1) In the above-described embodiment, in the first
(2)另外,在上述的實施形態中,雖已以基板支撐裝置6具有各種構件的構成為例進行說明。但是,基板支撐裝置6只要至少具有承載板14、支撐體13、各板11、12中的任一者及移動限制構件15L、15R中之任一者即可。
(2) In addition, in the above-mentioned embodiment, although the structure in which the board|
(產業上之可利用性) (Industrial Availability)
本發明可適用於基板支撐裝置。 The present invention can be applied to a substrate supporting device.
10:搬送手部 10: Transfer the hand
11:底板(基部板) 11: Bottom plate (base plate)
13:支撐體 13: Support body
14:承載板 14: Carrier plate
15L:移動限制構件 15L: Movement limiting member
15R:移動限制構件 15R: Movement limiting member
21:柱構件 21: Column member
21a:支撐部 21a: Support part
21b:凹部 21b: Recess
22:柱構件 22: Column member
22a:支撐部 22a: Support part
22b:凹部 22b: Recess
23:柱構件 23: Column member
23a:支撐部 23a: Support part
23b:凹部 23b: Recess
25:基板配置部 25: Substrate configuration section
25a:外周緣部 25a: Outer peripheral edge
26:切口部 26: Incision part
27L:擋止 27L: stop
27R:擋止 27R: stop
28L:前端部 28L: Front end
28R:前端部 28R: Front end
29L:第1平行部 29L: 1st parallel part
29R:第1平行部
29R:
30L:左側前部 30L: Left front
30R:右側前部 30R: Right Front
32L:第2平行部 32L: 2nd parallel part
32R:第2平行部 32R: 2nd parallel part
100:被處理基板 100: substrate to be processed
X1:裝卸方向 X1: Loading and unloading direction
X11:安裝方向 X11: Installation direction
X12:拆卸方向 X12: Disassembly direction
Claims (6)
Applications Claiming Priority (2)
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JP2019-029750 | 2019-02-21 | ||
JP2019029750A JP7245071B2 (en) | 2019-02-21 | 2019-02-21 | Substrate support device |
Publications (2)
Publication Number | Publication Date |
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TW202135222A TW202135222A (en) | 2021-09-16 |
TWI767603B true TWI767603B (en) | 2022-06-11 |
Family
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TW109104436A TWI798529B (en) | 2019-02-21 | 2020-02-13 | Substrate support device |
TW110108558A TWI767603B (en) | 2019-02-21 | 2020-02-13 | Substrate support device |
Family Applications Before (1)
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TW109104436A TWI798529B (en) | 2019-02-21 | 2020-02-13 | Substrate support device |
Country Status (4)
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JP (1) | JP7245071B2 (en) |
KR (4) | KR102405737B1 (en) |
CN (1) | CN111599735B (en) |
TW (2) | TWI798529B (en) |
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KR102377867B1 (en) | 2020-08-14 | 2022-03-24 | 엘티소재주식회사 | Organic light emitting device, and composition for formation of organic material layer |
TWI775493B (en) * | 2021-06-15 | 2022-08-21 | 力晶積成電子製造股份有限公司 | Wafer boat cassette with twisting knobs |
CN115621181A (en) * | 2021-07-13 | 2023-01-17 | 盛美半导体设备(上海)股份有限公司 | Turning device |
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Also Published As
Publication number | Publication date |
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KR20210124116A (en) | 2021-10-14 |
KR20200102343A (en) | 2020-08-31 |
TW202032714A (en) | 2020-09-01 |
JP7245071B2 (en) | 2023-03-23 |
JP2020136538A (en) | 2020-08-31 |
KR102308761B1 (en) | 2021-10-05 |
TWI798529B (en) | 2023-04-11 |
KR20210075935A (en) | 2021-06-23 |
KR20210097086A (en) | 2021-08-06 |
CN111599735A (en) | 2020-08-28 |
KR102407657B1 (en) | 2022-06-10 |
KR102405737B1 (en) | 2022-06-07 |
TW202135222A (en) | 2021-09-16 |
CN111599735B (en) | 2023-08-15 |
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