TWI786106B - 樹脂組成物層 - Google Patents

樹脂組成物層 Download PDF

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Publication number
TWI786106B
TWI786106B TW107113146A TW107113146A TWI786106B TW I786106 B TWI786106 B TW I786106B TW 107113146 A TW107113146 A TW 107113146A TW 107113146 A TW107113146 A TW 107113146A TW I786106 B TWI786106 B TW I786106B
Authority
TW
Taiwan
Prior art keywords
resin composition
layer
resin
insulating layer
hole
Prior art date
Application number
TW107113146A
Other languages
English (en)
Chinese (zh)
Other versions
TW201900764A (zh
Inventor
鶴井一彦
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201900764A publication Critical patent/TW201900764A/zh
Application granted granted Critical
Publication of TWI786106B publication Critical patent/TWI786106B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Confectionery (AREA)
  • Materials For Medical Uses (AREA)
  • Medical Preparation Storing Or Oral Administration Devices (AREA)
TW107113146A 2017-05-10 2018-04-18 樹脂組成物層 TWI786106B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017094192 2017-05-10
JP2017-094192 2017-05-10

Publications (2)

Publication Number Publication Date
TW201900764A TW201900764A (zh) 2019-01-01
TWI786106B true TWI786106B (zh) 2022-12-11

Family

ID=64479851

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107113146A TWI786106B (zh) 2017-05-10 2018-04-18 樹脂組成物層

Country Status (3)

Country Link
JP (2) JP7279303B2 (ja)
KR (1) KR102609051B1 (ja)
TW (1) TWI786106B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220074373A (ko) * 2020-11-27 2022-06-03 엘지이노텍 주식회사 회로기판 및 이의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201012652A (en) * 2008-09-01 2010-04-01 Sekisui Chemical Co Ltd Laminate and method for producing laminate
JP2012097283A (ja) * 2005-11-29 2012-05-24 Ajinomoto Co Inc 多層プリント配線板の絶縁層用樹脂組成物
JP2015003952A (ja) * 2013-06-19 2015-01-08 三井化学株式会社 オレフィン重合用触媒およびそれを用いたオレフィン系重合体の製造方法
TW201710366A (zh) * 2015-06-22 2017-03-16 Ajinomoto Kk 樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4983228B2 (ja) * 2005-11-29 2012-07-25 味の素株式会社 多層プリント配線板の絶縁層用樹脂組成物
JP6123152B2 (ja) * 2010-12-08 2017-05-10 味の素株式会社 樹脂組成物
JP2013006893A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
WO2013065758A1 (ja) * 2011-11-02 2013-05-10 日立化成株式会社 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板、プリント配線板及びパワー半導体装置
JP6276499B2 (ja) 2012-08-07 2018-02-07 味の素株式会社 接着フィルム、硬化体の製造方法、硬化体、配線板、及び半導体装置
JP6217165B2 (ja) * 2013-06-20 2017-10-25 住友ベークライト株式会社 プライマー層付きプリプレグ、プライマー層付き金属箔、金属張積層板、プリント配線基板、半導体パッケージおよび半導体装置
JP2016035969A (ja) * 2014-08-01 2016-03-17 味の素株式会社 回路基板及びその製造方法
JP6408847B2 (ja) 2014-09-30 2018-10-17 積水化学工業株式会社 樹脂組成物
JP6413831B2 (ja) * 2015-02-24 2018-10-31 味の素株式会社 回路基板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012097283A (ja) * 2005-11-29 2012-05-24 Ajinomoto Co Inc 多層プリント配線板の絶縁層用樹脂組成物
TW201012652A (en) * 2008-09-01 2010-04-01 Sekisui Chemical Co Ltd Laminate and method for producing laminate
JP2015003952A (ja) * 2013-06-19 2015-01-08 三井化学株式会社 オレフィン重合用触媒およびそれを用いたオレフィン系重合体の製造方法
TW201710366A (zh) * 2015-06-22 2017-03-16 Ajinomoto Kk 樹脂組成物

Also Published As

Publication number Publication date
JP2023033289A (ja) 2023-03-10
KR20180123985A (ko) 2018-11-20
JP2018188625A (ja) 2018-11-29
TW201900764A (zh) 2019-01-01
KR102609051B1 (ko) 2023-12-04
JP7501604B2 (ja) 2024-06-18
JP7279303B2 (ja) 2023-05-23

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