TWI785920B - 測試裝置 - Google Patents
測試裝置 Download PDFInfo
- Publication number
- TWI785920B TWI785920B TW110145712A TW110145712A TWI785920B TW I785920 B TWI785920 B TW I785920B TW 110145712 A TW110145712 A TW 110145712A TW 110145712 A TW110145712 A TW 110145712A TW I785920 B TWI785920 B TW I785920B
- Authority
- TW
- Taiwan
- Prior art keywords
- pusher
- pair
- test
- test device
- tested
- Prior art date
Links
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Undergarments, Swaddling Clothes, Handkerchiefs Or Underwear Materials (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020200185994A KR102433590B1 (ko) | 2020-12-29 | 2020-12-29 | 검사장치 |
KR10-2020-0185994 | 2020-12-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202229891A TW202229891A (zh) | 2022-08-01 |
TWI785920B true TWI785920B (zh) | 2022-12-01 |
Family
ID=82259800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110145712A TWI785920B (zh) | 2020-12-29 | 2021-12-07 | 測試裝置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2024500523A (ko) |
KR (1) | KR102433590B1 (ko) |
CN (1) | CN116670518A (ko) |
TW (1) | TWI785920B (ko) |
WO (1) | WO2022145934A1 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202141744U (zh) * | 2011-06-30 | 2012-02-08 | 上海韬盛电子科技有限公司 | 一种半导体测试座压盖 |
TW201632887A (zh) * | 2015-02-05 | 2016-09-16 | 李諾工業股份有限公司 | 測試裝置 |
CN208432692U (zh) * | 2018-06-20 | 2019-01-25 | 法特迪精密科技(苏州)有限公司 | 一种大电流特殊管脚芯片测试插座 |
US20190207351A1 (en) * | 2016-05-13 | 2019-07-04 | Enplas Corporation | Socket for electrical component |
TW202014719A (zh) * | 2018-10-10 | 2020-04-16 | 黃東源 | 用於測試ic的插座裝置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM350875U (en) * | 2008-07-14 | 2009-02-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
KR20150112425A (ko) * | 2014-03-28 | 2015-10-07 | 한국전자통신연구원 | 반도체 소자 테스트 소켓 |
KR101599049B1 (ko) * | 2014-11-28 | 2016-03-04 | 주식회사 세미코어 | 반도체 칩 검사장치 |
-
2020
- 2020-12-29 KR KR1020200185994A patent/KR102433590B1/ko active IP Right Grant
-
2021
- 2021-12-07 TW TW110145712A patent/TWI785920B/zh active
- 2021-12-27 JP JP2023539101A patent/JP2024500523A/ja active Pending
- 2021-12-27 WO PCT/KR2021/019971 patent/WO2022145934A1/en active Application Filing
- 2021-12-27 CN CN202180088040.4A patent/CN116670518A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202141744U (zh) * | 2011-06-30 | 2012-02-08 | 上海韬盛电子科技有限公司 | 一种半导体测试座压盖 |
TW201632887A (zh) * | 2015-02-05 | 2016-09-16 | 李諾工業股份有限公司 | 測試裝置 |
US20190207351A1 (en) * | 2016-05-13 | 2019-07-04 | Enplas Corporation | Socket for electrical component |
CN208432692U (zh) * | 2018-06-20 | 2019-01-25 | 法特迪精密科技(苏州)有限公司 | 一种大电流特殊管脚芯片测试插座 |
TW202014719A (zh) * | 2018-10-10 | 2020-04-16 | 黃東源 | 用於測試ic的插座裝置 |
Also Published As
Publication number | Publication date |
---|---|
CN116670518A (zh) | 2023-08-29 |
WO2022145934A1 (en) | 2022-07-07 |
KR102433590B1 (ko) | 2022-08-19 |
KR20220094605A (ko) | 2022-07-06 |
JP2024500523A (ja) | 2024-01-09 |
TW202229891A (zh) | 2022-08-01 |
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