TWI785920B - Test device - Google Patents
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- TWI785920B TWI785920B TW110145712A TW110145712A TWI785920B TW I785920 B TWI785920 B TW I785920B TW 110145712 A TW110145712 A TW 110145712A TW 110145712 A TW110145712 A TW 110145712A TW I785920 B TWI785920 B TW I785920B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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Abstract
Description
本揭露內容是關於一種用於測試半導體或類似待測試目標的電特性的測試裝置。The present disclosure relates to a test device for testing electrical characteristics of semiconductors or similar objects to be tested.
在製造半導體或類似電子產品的過程中,需要一種用於測試最終製造的電子產品的電特性的測試裝置。當測試電子產品時,在測試裝置中產生熱量。在此情況下,所產生熱量藉由在測試期間提高電阻而降低測試的可靠性,且藉由短路內部電路造成產品失效。因此,快速散熱對於測試功率半導體、車載半導體以及系統半導體至關重要。In the process of manufacturing semiconductors or similar electronic products, a test device for testing the electrical characteristics of the finally manufactured electronic products is required. When testing electronic products, heat is generated in the test setup. In this case, the generated heat reduces the reliability of the test by increasing the resistance during the test, and causes product failure by shorting the internal circuit. Therefore, fast heat dissipation is critical for testing power semiconductors, automotive semiconductors, and system semiconductors.
待測試的特定目標需要在極端環境下對電特性進行測試。為此目的,測試裝置包含用以創造極端環境的加熱元件或冷卻元件。當藉由加熱元件或冷卻元件突然改變溫度時,測試裝置可能超出設定的測試溫度。同時,熱空氣或冷空氣可能引入至配置有多個測試裝置的測試室中,以使得測試裝置可快速達到設定的溫度範圍。然而,熱空氣或冷空氣的效果視在測試室中的位置而變化,且因此存在測試室中的多個測試裝置在不同時間達到設定溫度而不同時滿足設定溫度條件的問題。The specific target to be tested requires testing of electrical characteristics in extreme environments. For this purpose, the test rig contains heating or cooling elements to create extreme environments. When the temperature is suddenly changed by the heating element or the cooling element, the test device may exceed the set test temperature. Simultaneously, hot air or cold air may be introduced into a test room equipped with a plurality of test devices, so that the test devices can quickly reach a set temperature range. However, the effect of hot or cold air varies depending on the position in the test room, and thus there is a problem that a plurality of test devices in the test room reach the set temperature at different times without simultaneously satisfying the set temperature condition.
本揭露內容的態樣提供一種可靠的測試裝置。根據本揭露內容的實施例,提供一種用於測試待測試目標的電特性的測試裝置。測試裝置包含:測試插座,包括經組態以將測試信號傳輸至待測試目標的探針;推動器主體,耦接至測試插座;推動器單元,支撐於推動器主體上且按壓及釋放待測試目標;以及熱屏蔽蓋,用以執行屏蔽暴露於推動器主體的頂部的推動器單元以及釋放屏蔽。Aspects of the present disclosure provide a reliable testing device. According to an embodiment of the present disclosure, a testing device for testing electrical characteristics of a target to be tested is provided. The test device includes: a test socket including a probe configured to transmit a test signal to an object to be tested; a pusher body coupled to the test socket; a pusher unit supported on the pusher body and pressed and released to be tested and a heat shield cover for performing shielding of the pusher unit exposed on top of the pusher body and releasing the shield.
推動器單元可包括具有按壓表面的第一側面及具有散熱表面的第二側面的推動器基底,及設置於推動器基底上的散熱表面且散熱的散熱器,且熱屏蔽蓋執行屏蔽暴露於推動器主體的頂部的散熱器以及釋放屏蔽。The pusher unit may include a pusher base having a first side with a pressing surface and a second side with a heat dissipation surface, and a heat sink provided on the heat dissipation surface on the pusher base to dissipate heat, and the heat shield cover performs shielding from exposure to the pusher. heatsink and release shield on top of the radiator body.
熱屏蔽蓋可包括彼此耦接以相對旋轉的多個蓋葉片。The heat shield cover may include a plurality of cover blades coupled to each other for relative rotation.
多個蓋葉片中的一者可包括固定至推動器主體的頂部的靜止葉片,且多個蓋葉片中的其他者包括藉由軸耦接以相對於靜止葉片可旋轉地打開及關閉的多個可變葉片。One of the plurality of cover blades may include a stationary vane fixed to the top of the pusher body, and the other of the plurality of cover blades may include a plurality of blades coupled by a shaft to rotatably open and close relative to the stationary blade. Variable blades.
多個可變葉片可包括安置於靜止葉片上方的第一可變葉片,及安置於第一可變葉片上方的第二可變葉片,靜止葉片可包括一對第一導向突起,所述一對第一導向突起相對於軸對稱地設置於其頂部上的圓周外端部分的一側處,第一可變葉片可包括一對第一導向凹槽,所述一對第一導向凹槽沿其底部上的圓周外端部分延伸且分別容納一對第一導向突起以可移動。The plurality of variable vanes may include a first variable vane disposed above the stationary vane, and a second variable vane disposed above the first variable vane, and the stationary vane may include a pair of first guide protrusions, the pair of The first guide protrusion is arranged symmetrically with respect to the axis at one side of the circumferential outer end portion on the top thereof, and the first variable vane may include a pair of first guide grooves along which Circumferential outer end portions on the bottom extend and receive a pair of first guide protrusions respectively to be movable.
第一可變葉片可包括一對第二導向突起,所述一對第二導向突起相對於軸對稱地設置於其頂部上的圓周外端部分的一側處,且第二可變葉片可包括一對第二導向凹槽,所述一對第二導向凹槽沿其底部上的圓周外端部分延伸且分別容納一對第二導向突起以可移動。The first variable vane may include a pair of second guide protrusions disposed symmetrically with respect to the axis at one side of the circumferential outer end portion on the top thereof, and the second variable vane may include A pair of second guide grooves extending along the circumferential outer end portion on the bottom thereof and respectively receiving a pair of second guide protrusions to be movable.
多個蓋葉片可包括相對於軸對稱地耦接的一對扇形屏蔽部分,及自扇形屏蔽部分的圓周外端部分彎曲並向下延伸且與推動器主體的頂部接觸的一對裙狀部分。The plurality of cover blades may include a pair of fan-shaped shield portions symmetrically coupled with respect to the axis, and a pair of skirt portions bent from circumferential outer end portions of the fan-shaped shield portions and extending downward and contacting a top of the pusher body.
靜止葉片可包括一對停止器,所述一對停止器自其頂部的徑向端部分向上突起且相對於軸對稱地設置。The stationary blade may include a pair of stoppers protruding upward from a radial end portion of the top thereof and disposed symmetrically with respect to the shaft.
在本發明的測試裝置中,覆蓋推動器單元的散熱器的熱屏蔽蓋可根據安置於單個測試室中的多個測試裝置的位置差異來調節熱屏蔽蓋的打開及關閉量。因此,藉由根據位置差異校正不同溫度,測試可在相同溫度條件下執行。In the test device of the present invention, the heat shield cover covering the heat sink of the pusher unit can adjust the opening and closing amount of the heat shield cover according to the position difference of a plurality of test devices installed in a single test chamber. Therefore, by correcting for different temperatures for positional differences, tests can be performed under the same temperature conditions.
在下文中,將參考隨附圖式詳細地描述本揭露內容的實施例。為便於描述,藉由從圖式或詳細描述中排除與本揭露內容不直接相關的部分,僅描述相關部分來理解本揭露內容,且相同標號通篇指代相同元件。Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. For ease of description, by excluding parts not directly related to the present disclosure from the drawings or detailed description, only relevant parts are described to understand the present disclosure, and the same reference numerals refer to the same elements throughout.
可不揭露對所屬領域中具有通常知識者顯而易見的詳細描述。在本揭露內容中,術語,諸如第一、第二等用於區分一個元件與另一元件及其之間的實際關係或次序,但並不意指其之間的實際關係或次序。Detailed descriptions that would be obvious to one of ordinary skill in the art may not be disclosed. In the present disclosure, terms such as first, second, etc. are used to distinguish one element from another element and the actual relationship or order therebetween, but do not imply the actual relationship or order therebetween.
圖1示出根據本揭露內容的實施例的測試裝置1中的熱屏蔽蓋40的關閉狀態,圖2示出圖1的測試裝置1中的熱屏蔽蓋40的打開狀態,圖3為自上方查看的圖1的測試裝置1的分解透視圖,以及圖4為自下方查看的圖1的測試裝置1的分解透視圖。Fig. 1 shows the closed state of the
參考圖1至圖4,測試裝置1包含測試插座10、推動器主體20,推動器單元30、熱屏蔽蓋40、加熱器50以及溫度感測器60。Referring to FIGS. 1 to 4 , the
測試插座10包含插座框架11、安裝至插座框架11且支撐多個可彈性伸縮的探針的探針支撐件12以及安置於探針支撐件12上且容納半導體或類似電子產品(在下文稱為「待測試目標」)的插入件13。此測試插座10僅作為描述的實例進行描述,且其結構不僅僅限於前述結構。The
測試插座10包含與推動器主體20絞接的鉸鏈銷14,及推動器主體20(稍後將描述)的插銷22卡在其中的鎖15。The
待測試目標包含待測試的多個凸塊或接觸點,且可利用層疊半導體,如封裝上封裝(package-on-package;POP)半導體。待測試目標容納於插入件13中以使得其端子可對應於藉由探針支撐件12支撐的探針。如上文所容納的待測試目標在藉由推動器單元30(稍後將描述)推動時朝向對應探針移動,且在其端子與探針接觸時進行測試。The target to be tested includes a plurality of bumps or contacts to be tested, and may utilize stacked semiconductors, such as package-on-package (POP) semiconductors. Objects to be tested are accommodated in the
推動器主體20樞轉地耦接至測試插座10的一側以便打開及關閉測試插座10的頂部,亦即插入件13。推動器主體20包含設置於一側處的鉸鏈耦接部分21、設置於另一側處的插銷22以及用於在測試時操作推動器單元30的控制桿23。The
推動器主體20包含推動器容納部分25,以在其中間中容納推動器單元30。The pusher
推動器主體20包含保持銷26以將熱屏蔽蓋40保持且支撐於其頂部上。The
推動器單元30容納且支撐於推動器主體20的推動器容納部分25中,以朝向負載至測試插座10的插入件13中的待測試目標移動且與所述待測試目標分離。The
推動器單元30包含形似板的推動器基底31、設置於推動器基底31的底部上的推動器32以及設置於推動器基底31的頂部上的散熱器33。The
推動器32接近待測試目標且與其接觸,以由此在測試期間按壓待測試目標。在此情況下,待測試目標的端子可與探針接觸。The
散熱器33將在測試期間產生的熱量及藉由加熱器50產生的熱量散發至外部,由此控制測試插座10的溫度。The
推動器單元30包含自推動器基底31的橫向側水平地向內凹陷且在其中容納加熱器50的加熱器容納部分34。The
推動器單元30包含在其中心處豎直凹陷的感測器安裝部分35,溫度感測器60安裝至所述感測器安裝部分35。The
設置熱屏蔽蓋40以屏蔽散熱器33的頂部,換言之,屏蔽推動器容納部分25的頂部。熱屏蔽蓋40可在如圖1中所繪示的關閉位置或如圖2中所繪示的打開位置處操作。換言之,熱屏蔽蓋40可根據打開/關閉程度來調整自測試插座10散發的熱量的量。The
加熱器50加熱推動器單元30以滿足測試溫度條件。The
溫度感測器60感測測試插座10中的溫度。The
圖5為示出分離圖1的熱屏蔽蓋40的透視圖,圖6為自上方查看的圖5的熱屏蔽蓋40的分解透視圖,以及圖7為自下方查看的圖5的熱屏蔽蓋40的分解透視圖。5 is a perspective view showing the
參考圖5至圖7,熱屏蔽蓋40包含藉由軸44彼此耦接的靜止葉片41、第一可變葉片42以及第二可變葉片43。第一可變葉片42及第二可變葉片43耦接至靜止葉片41以便可相對於軸44旋轉。Referring to FIGS. 5 to 7 , the
靜止葉片41藉由保持銷26固定至推動器主體20的頂部。靜止葉片41包含具有相對於軸44對稱的第一扇形屏蔽件及第二扇形屏蔽件的第一屏蔽部分411及第二屏蔽部分412,以及自第一扇形屏蔽件及第二扇形屏蔽件的徑向外端彎曲並向下延伸以形成與推動器主體20的頂部接觸的圓周屏蔽壁的第一裙狀部分413及第二裙狀部分414。The
靜止葉片41包含第一扇形屏蔽件與第二扇形屏蔽件之間的第一軸孔416,軸44穿過所述第一軸孔416。The
靜止葉片41包含自第一屏蔽部分411的第一扇形屏蔽件的頂部突起的第一導向突起417,及自第二屏蔽部分412的第二扇形屏蔽件的頂部突起的第二導向突起418。第一導向突起417及第二導向突起418相對於軸44對稱地安置。The
靜止葉片41包含設置於第一扇形屏蔽件的一個徑向端部分且限制第一可變葉片42的旋轉的第一停止器419-1,及設置於第二扇形屏蔽件的另一個徑向端部分且限制第一可變葉片42的旋轉的第二停止器419-2。第一停止器419-1及第二停止器419-2相對於軸44對稱地安置。The
第一可變葉片42藉由軸44可旋轉地耦接至靜止葉片41的第一軸孔416。第一可變葉片42包含相對於軸44對稱地設置且分別具有第三扇形屏蔽件及第四扇形屏蔽件的第三屏蔽部分421及第四屏蔽部分422,以及自第三扇形屏蔽件及第四扇形屏蔽件的徑向外端彎曲並向下延伸以分別與靜止葉片41的圓周端表面接觸且形成圓周屏蔽壁的第三裙狀部分423及第四裙狀部分424。The first
第一可變葉片42包含第三扇形屏蔽件與第四扇形屏蔽件之間的第二軸孔426,軸44穿過所述第二軸孔426。The first
第一可變葉片42包含自第三屏蔽部分421的第三扇形屏蔽件的頂部突起的第三導向突起428,及自第四屏蔽部分422的第四扇形屏蔽件的頂部突起的第四導向突起429。第三導向突起428及第四導向突起429相對於軸44對稱地安置。The first
第一可變葉片42包含沿其圓周外端部分自第三屏蔽部分421的第三扇形屏蔽件的底部凹陷的第一導向凹槽425,及沿其圓周外端部分自第四屏蔽部分422的第四扇形屏蔽件的底部凹陷的第二導向凹槽427。第一導向凹槽425及第二導向凹槽427分別容納靜止葉片41的第一導向突起417及第二導向突起418以可移動。The first
第二可變葉片43藉由軸44可旋轉地耦接至第一可變葉片42的第二軸孔426。第二可變葉片43包含具有相對於軸44對稱地設置的第五扇形屏蔽件及第六扇形屏蔽件的第五屏蔽部分431及第六屏蔽部分432,以及自第五扇形屏蔽件及第六扇形屏蔽件的徑向外端彎曲並向下延伸以分別與第一可變葉片42的圓周端部分接觸且形成圓周屏蔽壁的第五裙狀部分433及第六裙狀部分434。The second
第二可變葉片43包含第五扇形屏蔽件與第六扇形屏蔽件之間的軸突起436,軸44容納且緊固至所述軸突起436中。軸突起436容納於第一可變葉片42的第二軸孔426及靜止葉片41的第一軸孔416中。靜止葉片41、第一可變葉片42以及第二可變葉片43藉由軸突起436彼此耦接。The second
第二可變葉片43包含沿其圓周外端部分自第五屏蔽部分431的第五扇形屏蔽件的底部凹陷的第三導向凹槽435,及沿其圓周外端部分自第六屏蔽部分432的第六扇形屏蔽件的底部凹陷的第四導向凹槽437。第三導向凹槽435及第四導向凹槽437分別容納第一可變葉片42的第三導向突起428及第四導向突起429以可移動。The second
如上文所描述,在根據本揭露內容的實施例的測試裝置中,當第一可變葉片42或第二可變葉片43相對於覆蓋散熱器33的靜止葉片41旋轉時,熱屏蔽蓋40調整散熱器33暴露於外部的程度。因此,根據暴露程度調整散熱器33的散熱效率。As described above, in the test device according to the embodiment of the present disclosure, when the first
在根據本揭露內容的測試裝置中,設置熱屏蔽蓋以覆蓋推動器單元的散熱器,且控制熱屏蔽蓋的打開/關閉程度,由此控制影響測試裝置的外部溫度。因此,配置於單個測試室中的多個測試裝置根據其位置來調整熱屏蔽蓋的打開/關閉程度,以使得可在相同溫度條件下進行測試。In the test device according to the present disclosure, the heat shield cover is provided to cover the heat sink of the pusher unit, and the opening/closing degree of the heat shield cover is controlled, thereby controlling the external temperature affecting the test device. Therefore, a plurality of test devices arranged in a single test chamber adjusts the degree of opening/closing of the heat shield cover according to their positions so that tests can be performed under the same temperature conditions.
在前述描述中,本揭露內容的優點已參考特定實施例來描述。然而,對所屬領域中具有通常知識者將顯而易見的是,可在不脫離如所附申請專利範圍中所定義的本揭露內容的範疇的情況下進行各種修改及改變。因此,描述及圖式需要理解為本揭露內容的實例而非本揭露內容的限制。所有此類修改應該在本揭露內容的範疇內進行。In the foregoing description, advantages of the present disclosure have been described with reference to specific embodiments. However, it will be apparent to those of ordinary skill in the art that various modifications and changes can be made without departing from the scope of the present disclosure as defined in the appended claims. Therefore, the description and drawings should be understood as examples of the present disclosure rather than limitations of the present disclosure. All such modifications should be made within the scope of this disclosure.
1:測試裝置 10:測試插座 11:插座框架 12:探針支撐件 13:插入件 14:鉸鏈銷 15:鎖 20:推動器主體 21:鉸鏈耦接部分 22:插銷 23:控制桿 25:推動器容納部分 26:保持銷 30:推動器單元 31:推動器基底 32:推動器 33:散熱器 34:加熱器容納部分 35:感測器安裝部分 40:熱屏蔽蓋 41:靜止葉片 42:第一可變葉片 43:第二可變葉片 44:軸 50:加熱器 60:溫度感測器 411:第一屏蔽部分 412:第二屏蔽部分 413:第一裙狀部分 414:第二裙狀部分 416:第一軸孔 417:第一導向突起 418:第二導向突起 419-1:第一停止器 419-2:第二停止器 421:第三屏蔽部分 422:第四屏蔽部分 423:第三裙狀部分 424:第四裙狀部分 425:第一導向凹槽 426:第二軸孔 427:第二導向凹槽 428:第三導向突起 429:第四導向突起 431:第五屏蔽部分 432:第六屏蔽部分 433:第五裙狀部分 434:第六裙狀部分 435:第三導向凹槽 436:軸突起 437:第四導向凹槽 1: Test device 10: Test socket 11:Socket frame 12: Probe support 13: Insert 14: hinge pin 15: lock 20: Pusher body 21: Hinge coupling part 22: Latch 23: Joystick 25:Accommodating part of the pusher 26: Hold Pin 30: Pusher unit 31: Pusher base 32: Pusher 33: Radiator 34: Heater housing part 35: Sensor installation part 40: heat shield cover 41: Stationary blade 42: The first variable blade 43: The second variable blade 44: axis 50: heater 60: Temperature sensor 411: The first shielding part 412: the second shielding part 413: the first skirt part 414: second skirt part 416: The first shaft hole 417: The first guiding protrusion 418: second guide protrusion 419-1: First Stopper 419-2: Second stopper 421: The third shielding part 422: The fourth shielding part 423: The third skirt part 424: The fourth skirt part 425: the first guide groove 426: Second shaft hole 427: the second guide groove 428: The third guiding protrusion 429: The fourth guiding protrusion 431: The fifth shielding part 432: The sixth shielding part 433: the fifth skirt part 434: The sixth skirt part 435: the third guide groove 436: Axon Protrusion 437: the fourth guide groove
以上及/或其他態樣將自結合隨附圖式而對實施例進行的以下描述變得顯而易見且更易於瞭解,其中: 圖1示出根據本揭露內容的實施例的測試裝置中的熱屏蔽蓋的關閉狀態。 圖2示出圖1的測試裝置中的熱屏蔽蓋的打開狀態。 圖3為自上方查看的圖1的測試裝置的分解透視圖。 圖4為自下方查看的圖1的測試裝置的分解透視圖。 圖5為示出分離圖1的熱屏蔽蓋的透視圖。 圖6為自上方查看的圖5的熱屏蔽蓋的分解透視圖。 圖7為自下方查看的圖5的熱屏蔽蓋的分解透視圖。 The above and/or other aspects will become apparent and easier to understand from the following description of embodiments in conjunction with the accompanying drawings, wherein: FIG. 1 illustrates a closed state of a heat shield cover in a test device according to an embodiment of the present disclosure. FIG. 2 shows an open state of a heat shield cover in the test device of FIG. 1 . Fig. 3 is an exploded perspective view of the test device of Fig. 1 viewed from above. FIG. 4 is an exploded perspective view of the test device of FIG. 1 viewed from below. FIG. 5 is a perspective view showing detaching the heat shield cover of FIG. 1 . FIG. 6 is an exploded perspective view of the heat shield cover of FIG. 5 viewed from above. FIG. 7 is an exploded perspective view of the heat shield cover of FIG. 5 viewed from below.
1:測試裝置 10:測試插座 20:推動器主體 21:鉸鏈耦接部分 22:插銷 23:控制桿 40:熱屏蔽蓋 1: Test device 10: Test socket 20: Pusher body 21: Hinge coupling part 22: Latch 23: Joystick 40: heat shield cover
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CN202141744U (en) * | 2011-06-30 | 2012-02-08 | 上海韬盛电子科技有限公司 | Semiconductor test seat gland |
TW201632887A (en) * | 2015-02-05 | 2016-09-16 | 李諾工業股份有限公司 | A test device |
CN208432692U (en) * | 2018-06-20 | 2019-01-25 | 法特迪精密科技(苏州)有限公司 | A kind of high current specific pin chip testing socket |
US20190207351A1 (en) * | 2016-05-13 | 2019-07-04 | Enplas Corporation | Socket for electrical component |
TW202014719A (en) * | 2018-10-10 | 2020-04-16 | 黃東源 | Socket device for testing IC |
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TWM350875U (en) * | 2008-07-14 | 2009-02-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
KR20150112425A (en) * | 2014-03-28 | 2015-10-07 | 한국전자통신연구원 | Test socket for semiconductor device |
KR101599049B1 (en) * | 2014-11-28 | 2016-03-04 | 주식회사 세미코어 | Semiconductor chip testing device |
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CN202141744U (en) * | 2011-06-30 | 2012-02-08 | 上海韬盛电子科技有限公司 | Semiconductor test seat gland |
TW201632887A (en) * | 2015-02-05 | 2016-09-16 | 李諾工業股份有限公司 | A test device |
US20190207351A1 (en) * | 2016-05-13 | 2019-07-04 | Enplas Corporation | Socket for electrical component |
CN208432692U (en) * | 2018-06-20 | 2019-01-25 | 法特迪精密科技(苏州)有限公司 | A kind of high current specific pin chip testing socket |
TW202014719A (en) * | 2018-10-10 | 2020-04-16 | 黃東源 | Socket device for testing IC |
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TW202229891A (en) | 2022-08-01 |
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