TWI785379B - 電子機器單元 - Google Patents

電子機器單元 Download PDF

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Publication number
TWI785379B
TWI785379B TW109130861A TW109130861A TWI785379B TW I785379 B TWI785379 B TW I785379B TW 109130861 A TW109130861 A TW 109130861A TW 109130861 A TW109130861 A TW 109130861A TW I785379 B TWI785379 B TW I785379B
Authority
TW
Taiwan
Prior art keywords
substrate
wall
aforementioned
base
support plate
Prior art date
Application number
TW109130861A
Other languages
English (en)
Chinese (zh)
Other versions
TW202126157A (zh
Inventor
太田武志
中島雄二
矢口裕一朗
Original Assignee
日商東芝股份有限公司
日商東芝基礎設施系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東芝股份有限公司, 日商東芝基礎設施系統股份有限公司 filed Critical 日商東芝股份有限公司
Publication of TW202126157A publication Critical patent/TW202126157A/zh
Application granted granted Critical
Publication of TWI785379B publication Critical patent/TWI785379B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Photoreceptors In Electrophotography (AREA)
TW109130861A 2019-12-20 2020-09-09 電子機器單元 TWI785379B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-229997 2019-12-20
JP2019229997A JP6877523B1 (ja) 2019-12-20 2019-12-20 ヒートシンク、および電子機器ユニット

Publications (2)

Publication Number Publication Date
TW202126157A TW202126157A (zh) 2021-07-01
TWI785379B true TWI785379B (zh) 2022-12-01

Family

ID=75961512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109130861A TWI785379B (zh) 2019-12-20 2020-09-09 電子機器單元

Country Status (5)

Country Link
JP (1) JP6877523B1 (ko)
KR (1) KR102642224B1 (ko)
CN (1) CN114223318A (ko)
TW (1) TWI785379B (ko)
WO (1) WO2021124665A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020067599A1 (en) * 2000-12-06 2002-06-06 Mann Kristina L. Single piece heat sink for computer chip
CN101018467A (zh) * 2006-02-11 2007-08-15 富准精密工业(深圳)有限公司 散热装置
TWM324129U (en) * 2007-02-16 2007-12-21 Asia Vital Components Co Ltd Screw based fixing structure for heat dissipation module
TW201301007A (zh) * 2011-06-23 2013-01-01 Hon Hai Prec Ind Co Ltd 電腦散熱系統

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197594A (ja) * 1997-09-19 1999-04-09 Toshiba Corp ヒートシンク固定装置
JP4156132B2 (ja) * 1999-06-15 2008-09-24 株式会社Ｐｆｕ 半導体モジュール装置
CN1443000A (zh) * 2002-03-01 2003-09-17 王松 一种彩色显示屏配套的电子产品的结构设计
ITPR20020040A1 (it) 2002-07-26 2004-01-26 Sig Technology Ltd Procedimento e dispositivo per l'estrazione di succo di mele, pere, pesche e piu' in genere di frutta e vegetali
KR100728212B1 (ko) * 2005-11-30 2007-06-13 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP5068098B2 (ja) * 2007-04-25 2012-11-07 三菱電機株式会社 放熱装置
KR101095868B1 (ko) * 2011-09-08 2011-12-21 이슬기 발광다이오드형 조명 모듈
CN203193781U (zh) * 2013-05-06 2013-09-11 深圳市锐吉电子科技有限公司 一种防水电视
KR102391167B1 (ko) * 2017-06-08 2022-04-27 주식회사 만도 방열 어셈블리
JP6400815B1 (ja) 2017-09-29 2018-10-03 株式会社東芝 電子機器
JP6741257B2 (ja) * 2018-11-20 2020-08-19 Ｎｅｃプラットフォームズ株式会社 電子機器の放熱構造及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020067599A1 (en) * 2000-12-06 2002-06-06 Mann Kristina L. Single piece heat sink for computer chip
CN101018467A (zh) * 2006-02-11 2007-08-15 富准精密工业(深圳)有限公司 散热装置
TWM324129U (en) * 2007-02-16 2007-12-21 Asia Vital Components Co Ltd Screw based fixing structure for heat dissipation module
TW201301007A (zh) * 2011-06-23 2013-01-01 Hon Hai Prec Ind Co Ltd 電腦散熱系統

Also Published As

Publication number Publication date
KR20220047372A (ko) 2022-04-15
JP2021100018A (ja) 2021-07-01
TW202126157A (zh) 2021-07-01
CN114223318A (zh) 2022-03-22
KR102642224B1 (ko) 2024-03-04
WO2021124665A1 (ja) 2021-06-24
JP6877523B1 (ja) 2021-05-26

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